CN101482937A - 一种薄型非接触模块的制造方法 - Google Patents
一种薄型非接触模块的制造方法 Download PDFInfo
- Publication number
- CN101482937A CN101482937A CNA2008102032336A CN200810203233A CN101482937A CN 101482937 A CN101482937 A CN 101482937A CN A2008102032336 A CNA2008102032336 A CN A2008102032336A CN 200810203233 A CN200810203233 A CN 200810203233A CN 101482937 A CN101482937 A CN 101482937A
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- CN
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- microns
- chip
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- carrier band
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 16
- 229910000570 Cupronickel Inorganic materials 0.000 claims abstract description 11
- 241000218202 Coptis Species 0.000 claims abstract description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- 229920006335 epoxy glue Polymers 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 241001050985 Disco Species 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- 239000003205 fragrance Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000206 moulding compound Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000000465 moulding Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 101100130927 Caenorhabditis elegans moa-2 gene Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102032336A CN101482937B (zh) | 2009-03-22 | 2009-03-22 | 一种薄型非接触模块的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102032336A CN101482937B (zh) | 2009-03-22 | 2009-03-22 | 一种薄型非接触模块的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101482937A true CN101482937A (zh) | 2009-07-15 |
CN101482937B CN101482937B (zh) | 2011-04-27 |
Family
ID=40880037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102032336A Active CN101482937B (zh) | 2009-03-22 | 2009-03-22 | 一种薄型非接触模块的制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN101482937B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102074534B (zh) * | 2009-11-24 | 2013-05-29 | 上海长丰智能卡有限公司 | 一种微型pcb射频模块及其封装方法 |
CN108172552A (zh) * | 2018-01-09 | 2018-06-15 | 木林森股份有限公司 | 一种支架式电子标签的封装结构及其封装方法 |
CN110620047A (zh) * | 2019-09-18 | 2019-12-27 | 纽威仕微电子(无锡)有限公司 | 一种基于陶瓷基板的小尺寸集成电路封装工艺 |
CN111863634A (zh) * | 2019-04-28 | 2020-10-30 | 无锡华润安盛科技有限公司 | 超薄封装结构的制作方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1203447C (zh) * | 2002-05-30 | 2005-05-25 | 上海长丰智能卡有限公司 | 一种非接触智能标签、筹码的制造方法 |
US7727854B2 (en) * | 2003-12-19 | 2010-06-01 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
-
2009
- 2009-03-22 CN CN2008102032336A patent/CN101482937B/zh active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102074534B (zh) * | 2009-11-24 | 2013-05-29 | 上海长丰智能卡有限公司 | 一种微型pcb射频模块及其封装方法 |
CN108172552A (zh) * | 2018-01-09 | 2018-06-15 | 木林森股份有限公司 | 一种支架式电子标签的封装结构及其封装方法 |
CN111863634A (zh) * | 2019-04-28 | 2020-10-30 | 无锡华润安盛科技有限公司 | 超薄封装结构的制作方法 |
CN111863634B (zh) * | 2019-04-28 | 2023-10-27 | 无锡华润安盛科技有限公司 | 超薄封装结构的制作方法 |
CN110620047A (zh) * | 2019-09-18 | 2019-12-27 | 纽威仕微电子(无锡)有限公司 | 一种基于陶瓷基板的小尺寸集成电路封装工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN101482937B (zh) | 2011-04-27 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190703 Address after: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee after: Shanghai Inore Information Electronics Co.,Ltd. Address before: No. 1755 Hongmei South Road, Minhang District, Shanghai, 200237 Patentee before: SHANGHAI ETERNAL INFORMATION TECHNOLOGY Co.,Ltd. |
|
CP03 | Change of name, title or address |
Address after: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee after: Lianxin (Shanghai) Microelectronics Technology Co.,Ltd. Country or region after: China Address before: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee before: Shanghai Inore Information Electronics Co.,Ltd. Country or region before: China |