CN101479860B - Led package, emitter package and method for emitting light - Google Patents
Led package, emitter package and method for emitting light Download PDFInfo
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- CN101479860B CN101479860B CN2007800243425A CN200780024342A CN101479860B CN 101479860 B CN101479860 B CN 101479860B CN 2007800243425 A CN2007800243425 A CN 2007800243425A CN 200780024342 A CN200780024342 A CN 200780024342A CN 101479860 B CN101479860 B CN 101479860B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0025—Combination of two or more reflectors for a single light source
- F21V7/0033—Combination of two or more reflectors for a single light source with successive reflections from one reflector to the next or following
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector directing at least some of the LED light toward the conversion material; the conversion material down-converting the wavelength of at least some of the reflected LED light. A method for emitting light from an LED package comprising providing an LED, reflector and conversion material, and emitting light from said LED, at least some of the LED light emitted toward the reflector. The method further comprises reflecting at least some of the LED light toward the conversion material, and converting at least some of said reflected LED light at the conversion material. At least some of the converted reflected LED light is emitted by the LED package.
Description
Background of invention
Technical field
The present invention relates to light-emitting diode, relate in particular to a kind of light-emitting diode assembly and be used for producing effectively the method for light from the wavelength down-conversion materials.
Prior art
Light-emitting diode (LED) is for being the solid condition apparatus of light with transformation of electrical energy, and comprises one usually and be sandwiched in two semi-conducting material active regions between the semiconductor material layer that mixes relatively.When on doped layer, applying bias voltage, hole and electronics are injected in the active region, in the active region, it reconfigures to produce light.Light sends from all surface that active layer reaches from LED.The nearest progress of LED (such as, based on the LED of nitride) caused high efficiency light source, these light sources have surmounted the efficient based on the light source of filament, and the light that has equal or bigger brightness with respect to its input power is provided simultaneously.
A shortcoming that is used for the conventional LED of illumination application is: it can not produce white light from its active layer.In order to a kind of mode that produces white light from conventional LED is the different color of combination from different LED.For example, can produce white light from the light of ruddiness, green glow and blue-ray LED or the light that makes up from blue light and yellow light LED through combination.A shortcoming of the method is: it need use a plurality of LED to produce the single color of light, thereby has increased total cost and complexity.The different color of light also is able to produce from dissimilar LED usually, and combination different LED type possibly need complicated manufacturing and possibly need Different control voltage on an equipment.Work because each equipment possibly have different electricity demands and (for example, along with temperature, electric current or time) is possible under the operating condition that changes, so the manufacturing complicacy of the reflector of these types and cost are high differently.
The spectral line of emission of component leds narrow usually (for example, 10-30nm FWHM), and have the wave-length coverage (for example, about 550nm) that is difficult to obtain high efficiency LED.As a result, possibly be difficult to reach high effect and high color rendering index with low cost and high finished product rate.This possibly especially have problem when the spectrum demand needs the high efficiency green light LED; Because these LED only are implemented in (In, Ga, Al) N system; And stand inefficient usually and along with operating condition (such as, drive current and temperature) variation, wavelength and emission can change.Though only can use two LED to realize the white lamp of simplification, in these lamps, extremely be difficult to reach high existing colour system number in complementary hue (for example, blue, yellow) emission down.
Light from single blue light-emitting LED also is transformed to white light through surrounding led chip with yellow phosphor, polymer or dyestuff, and wherein typical phosphor is Ce:YAG.[see the white light LEDs of Nichia Corp., Part No. is NSPW300BS, NSPW312BS, or the like; Also see the United States Patent (USP) No. 5959316 " Multiple Encapsulation ofPhosphor-LED Devices " of Lowrey].The wavelength of at least some in material around " down-conversion " the LED light, thus its color changed.For example, if surrounded by yellow phosphor based on the blue light-emitting LED of nitride, then some blue lights will pass this phosphor and not be changed, and rest of light will be downconverted to yellow.This LED will launch blue light and gold-tinted, and it makes up so that white light to be provided.
A kind of conventional method that is coated with LED with phosphor layer is to utilize the phosphor that syringe or nozzle will contain epoxides to be injected on the LED.Another conventional method that is used to be coated with LED is for passing through mould printing, and it is described among the european patent application EP 1198016A2 of Lowery.Be close between the LED the institute will apart from and with a plurality of emitting semiconductor equipment disposition on substrate.Template with opening of aiming at LED is provided, and wherein hole is a bit larger tham LED and template is thicker than LED.On substrate, wherein each LED is arranged in the corresponding opening of template with Template Location.Then a composition is deposited in the template opening, it covers LED, and wherein in the silicone polymer that can solidify through heat or light, typical composition is a phosphor.After filling hole, remove template from substrate, and it is solid-state that the template group compound is cured to.
Another conventional method that is coated with LED with phosphor is to utilize electrophoretic deposition.Make the coversion material particle suspension in based on electrolytical solution.A plurality of LED are disposed on the electrically-conductive backing plate, then this electrically-conductive backing plate almost completely are immersed in the electrolyte solution.Position in not being immersed in solution will be coupled to electrically-conductive backing plate from the electrode of power supply, and another electrode will be disposed in the electrolyte solution.To put on from the bias voltage of power supply on the electrode, this makes electric current pass solution to substrate and LED thereof.This produces an electric field, makes coversion material be drawn to LED, thereby covers LED with this coversion material.
In these conventional LED encapsulation, the phosphor conversion element is close to led chip tightly, and because the scattering and lambert (Lambertian) emission characteristic of phosphor, most of light is beamed back in LED encapsulation and the led chip.After phosphor layer was passed in transmission, photon also can experience a plurality of scattering events.Stand the light extraction restriction of chip by phosphor layer institute's scattering or emission and the light that is drawn towards led chip.The led chip light extraction efficiency is usually less than one, thereby causes further photon loss.Light through being scattered back to the encapsulation can be reflected back toward, but the reflectivity of encapsulating material is merely 70-90% usually.Scattering and retroeflection have increased the path of the light of being launched in the encapsulation, and have therefore increased the chance of experience loss.
Summary of the invention
In brief and generally speaking, the present invention is directed to and be used for luminous reflector encapsulation and method, and especially to the LED encapsulation and from the method for LED encapsulating light emitting.According to the radiative primary radiator that one embodiment comprises of reflector of the present invention encapsulation, and be away from this primary radiator can conversion reflector light wavelength coversion material.This encapsulation further comprises reflector, and so that in this reflector light at least some are reflected into towards this coversion material, the wavelength of said at least some in the light of reflection carries out conversion by said coversion material.
Individual embodiment according to LED of the present invention encapsulation comprises: be used for the LED of emitting LED light, and one be away from LED the coversion material that is used for the LED light wavelength is carried out down-conversion.This encapsulation comprises further in the LED light at least some is reflected into the reflector towards this coversion material that the wavelength of at least some in the LED light of reflection carries out down-conversion by this coversion material.
Be used for one embodiment comprises of luminous method according to of the present invention: from primary radiator emission primary light, at least some in the reflection primary light.This method further comprises: at least some primary light through reflection of conversion.Emission is through the primary light of conversion, or through the primary light of conversion and the wavelength combination of primary light.
Be used for one embodiment comprises from the method for LED encapsulating light emitting according to of the present invention: LED, reflector and coversion material are provided, and luminous from LED, at least some in the said light are by towards this reflector.This method further comprises: in the LED light at least some is reflected into towards this coversion material, and in coversion material place conversion at least some in the LED light of reflection.At least some in the LED light of reflection through conversion are encapsulated by LED and launch.
Reach the accompanying drawing that exemplarily illustrates characteristic of the present invention according to following detailed description, of the present invention these will become obvious with other aspects and advantage.
Description of drawings
Fig. 1 is the cutaway view according to an embodiment of effective LED encapsulation of the present invention;
Fig. 2 is the cutaway view according to another embodiment of LED encapsulation of the present invention;
Fig. 3 is the cutaway view according to another embodiment of the LED encapsulation with more than reflector according to the present invention;
Fig. 4 is the cutaway view according to an embodiment of the LED encapsulation with the optical element that is used for beam-shaping according to the present invention;
Fig. 5 is the cutaway view according to another embodiment of the LED encapsulation with the optical element that is used for beam-shaping according to the present invention;
Fig. 6 is the cutaway view according to another embodiment of the LED encapsulation with anti-phase LED and dome-shaped reflector according to the present invention;
Fig. 7 is the vertical view of the LED encapsulation among Fig. 7;
Fig. 8 is the cutaway view according to an embodiment of many LED encapsulation of the present invention;
Fig. 9 is the flow chart according to an embodiment of luminescent method of the present invention; And
Figure 10 is the flow chart according to another embodiment of luminescent method of the present invention.
Specific descriptions of the present invention
The present invention provides a kind of effective LED encapsulation and is used for from the effective luminous method of LED encapsulation.Device and method according to the present invention is away from LED and disposes the reflectivity coversion material.The method allows to use relatively thin and intensive phosphor material layer down-converts to another wavelength with LED light.This has reduced the path of light in the transducer material, and has improved the efficient of LED encapsulation.The color of LED encapsulation emission is by the composition control of reflectivity converter film or thin phosphor layer; Said reflectivity converter film comprises color transformed material and neutral highly reflective material; Said thin phosphor layer possibly have binder (such as; Epoxides or silicone) highly reflective (for example, silver or the aluminium mirror) surface of even coating on.Different embodiments of the invention have an optical arrangement, wherein from the light warp-wise user reflection of coversion material and not to the encapsulation back reflective.The photon that encapsulation allows to be launched towards phosphor by LED according to LED according to the present invention is the low light extraction element back-scattering light significantly of the antiradar reflectivity in lamp not.Therefore for all photons scattering and absorption events are minimized, and along with a small amount of light extraction through taking place to encapsulate from LED.Through making coversion material be away from LED, it is cool that coversion material keeps, thereby further improve lamp efficient.For LED according to the present invention encapsulation, but also pre-fabricated coversion material, and this makes these encapsulation reproducible.
In order to reach these results, LED encapsulation according to the present invention comprise usually primary radiator (such as, LED), reflector and be away from this LED and have the reflectivity converter of optical coversion material.This reflector makes that through locating all LED light reflex to coversion material from reflector basically, and at this coversion material place, the wavelength of at least some in this light is by down-conversion.Light and the transmission of any remaining LED light transformation into itself material through down-conversion.The reflectivity converter can further comprise reflective material or reflecting element, and it is along light and any LED light of desired direction reflection through down-conversion.
Should understand; Be connected to when an element or layer are called as at another element or layer " go up ", " ", " be coupled to " another element or layer; Or with another element or layer when " contact "; It can be directly on another element or layer, directly connect or be coupled to another element or layer, or directly contact with another assembly or layer, perhaps can exist the insertion element or layer." directly " at another assembly or layer " go up ", " is connected directly to ", " couple directly to " another element or layer on the contrary, when an element is called as, or all when " directly with " another element or layer " contact ", do not exist the insertion element or layer.Likewise, when first element or layer are called as and second element or layer when " electrically contacting " or " electric coupling ", the power path that between first element or layer and second element or layer, exists the allowance electric current to pass through.This power path can comprise capacitor, coupling inductor and/or permit other element of electric current (even if not directly contact between the conducting element).
Though should be understood that term first, second or the like in this article in order to describing various assemblies, assembly, zone, layer and/or part, these elements, assembly, zone, layer and/or part should not receive the restriction of these terms.These terms are only in order to differentiate an element, assembly, zone, layer or part and another zone, layer or part.
Fig. 1 shows that it comprises the semiconductor light-emitting-diode (LED) 12 that is mounted to submounts 14 with known associated methods according to an embodiment of LED encapsulation 10 of the present invention.Though described the present invention with reference to semiconductor LED among this paper, can use many different reflectors.As used herein; The term semiconductor LED can comprise one or more LED, laser diode and/or other semiconductor equipment; Said semiconductor equipment comprises one or more semiconductor layers, and said semiconductor layer can comprise silicon, carborundum, gallium nitride and/or other semi-conducting material, substrate, and said substrate can comprise sapphire, silicon, carborundum and/or other microelectronic substrate; And one or more contact layers, said contact layer can comprise metal and/or other conductive layer.Semiconductor light-emitting equipment can be the laser based on the LED of gallium nitride or manufacturing on silicon carbide substrate; Such as; By the Cree of the Durham of NorthCarolina, those equipment that Inc. makes and sells, but also can use other luminaire from other material system.
The operation of conventional LED and manufacturing details are known usually in the art, only discuss briefly.Through known method, can take pride in multi-material system and make conventional LED, wherein suitable method is the manufacturing through Organometallic Chemistry gas deposition (MOCVD).LED has the active region that is sandwiched between two relative doped layers that p type or n type mix usually.The top layer of LED is generally the p type and bottom is generally the n type, but if these layers of reversing, LED also works.P type and n type layer have contact point separately, and each contact point has lead, in order to bias voltage is put on p type and the n type layer.This bias voltage causes active layer luminous from all surface of LED.
For mechanical stability, can use known installation method and LED 12 is mounted to submounts 14.Submounts 14 can comprise circuit, and said circuit is used to control the electric current or the power of the relative quantity that is applied to LED 12, or is used for revising in addition the signal of telecommunication that is applied to LED 12.Submounts 14 also can contain assembly and the circuit that makes lamp opposing electrostatic impact.
LED encapsulation 10 further comprises the reflector 16 that is installed on the LED 12, and it can be processed by arbitrary reflective material (such as, metal), or can by have the layer of reflective material of being coated with (such as, silver or aluminium) the material on one or more surfaces process.Reflector 16 is generally dish and has the basal surface 18 towards LED 12.Basal surface 18 has hyperbola taper 20, the wherein edge of curved surface orientating reflex device 16 at the center.However, it should be understood that reflector can have many difformities and size, and reflector surface can have many difformities, with reverberation in different directions.Reflector 16 is configured on the LED 12, and wherein basal surface 18 is towards LED 12, and taper 20 is on the LED 12, and in a preferred embodiment, approximately be in LED 12 in the heart, to reflect all elementary LED light basically.
LED encapsulation 10 also has reflectivity converter 22, and it is at least in part around LED and submounts 14 and through being configured to be away from LED.In preferred embodiment, the reflectivity converter is in around all LED and the submounts, and as shown in the figure, through being mounted to submounts 14.Should be understood that can many different modes and at many diverse locations place reflectivity converter 22 is mounted to the LED encapsulation.For example, in one embodiment, can and the reflectivity converter be installed under the situation that has a space between reflectivity converter and the LED encapsulation with different angles.
In LED encapsulation 10, reflectivity converter 22 comprises the coversion material 24 that is installed on the reflex components 26 usually.Can use many distinct methods and coversion material 24 is mounted to reflex components 26, such as, by the coversion material thin slice is provided in binder, wherein this thin slice can cut with permission a plurality of parts are attached on the reflex components 26.In other embodiments, can use electrophoretic deposition or silk screen printing and coversion material 24 is formed on the reflex components 26, and then make it remain in the appropriate location by binder (such as, epoxides).Other method is included in excessive mold phosphor conversion material on the reflex components 26.
In other embodiments, reflectivity converter 22 can comprise coversion material 24, wherein is mixed with neutral highly reflective material, and it gives its reflection characteristic to the reflectivity converter.Can use many different neutral highly reflective materials, such as, titanium dioxide or barium sulfate.Can use the highly reflective material separately or can use the highly reflective material reflectivity converter 22 is given its best reflection characteristic in combination with reflex components 26.
Reflector 16, LED 12 and 22 cooperations of reflectivity converter make from least some (and preferably, great majority) in the light of LED 12 from 22 reflections of reflector basal surface 18 orientating reflex property converters.For example, 28 light is launched from LED 12 orientating reflex devices 16 along the path, and 22 reflections of orientating reflex property converter.Coversion material 24 absorbing light, and launch again than the light in the low frequency spectrum (through down-conversion), wherein light is launched the pattern emission with lambert.Launch forward towards the user from reflectivity converter 22 through the light of down-conversion.Reflector and converter geometry are through preferably being designed to make great majority be extracted towards the user from lamp from the light of reflectivity converter.
The most of light of reflector 16 orientating reflex property converters, 22 reflections; And reflectivity converter 22 can have the thickness or the concentration of coversion material 24; Make some through the light of reflection by coversion material 24 down-conversions, and some light pass coversion material 24 and by reflex components 26 reflected backs.In the light of reflection at least some are also returned to passing coversion material without down-conversion, make some LED light be reflected and launch from the reflectivity converter.In this embodiment, beam back from the reflectivity converter through the light and the LED light of down-conversion, wherein LED encapsulation 10 emissions are through the light and the combination of LED light wavelength of down-conversion.
In other embodiments, reflectivity converter 22 can have the thickness or the concentration of coversion material, make basically all through the light of reflection by coversion material 24 down-conversions.In this embodiment, be in the wave spectrum of down-conversion from the light that reflectivity converter 22 is launched back is elementary.Reflector 16 can reflect all light basically from LED 12 with orientating reflex property converter 22 through sizing and location, makes and launches from the reflectivity converter from all light basically of LED encapsulation.In other embodiments, reflector 16 can make it to reflex to reflectivity converter 22 from a part of light of LED 12 through sizing, and remaining LED light is walked around reflector 16 and launched from the LED encapsulation.In this embodiment, LED 12, reflector 16 and reflectivity converter 22 can be through sizing and configurations, make elementary LED light launch with mixing from the lamp encapsulation through reflection or through the expectation of the light of conversion.
Many different coversion materials can be used in the LED encapsulation according to the present invention.Preferable coversion material comprises one or more phosphors, and following be can be alone or in combination as the tabulation of some phosphors of coversion material, its color of launching again by the following warp that excites of each emission divides into groups.
Red
Y
2O
2S:Eu
3+，Bi
3+
YVO4:Eu
3+，Bi
3+
SrS:Eu
2+
SrY
2S
4:Eu
2+
CaLa
2S
4:Ce
3+
(Ca，Sr)S:Eu
2+
Y
2O
3:Eu
3+，Bi
3+
Lu
2O
3:Eu
3+
(Sr
2-xLa
x)(Ce
1-xEu
x)O
4
Sr
2Ce
1-xEu
xO
4
Sr
2-xEu
xCeO
4
Sr
2CeO
4
SrTiO
3:Pr
3+，Ga
3+
Orange
SrSiO
3:Eu，Bi
Yellow/green
Y
3Al
5O
12:Ce
3+
YBO
3:Ce
3+，Tb
3+
BaMgAl
10O
17:Eu
2+，Mn
2+
(Sr，Ca，Ba)(Al，Ga)
2S
4:Eu
2+
ZnS:Cu
+，Al
3+
LaPO
4:Ce，Tb
Ca8Mg(SiO
4)
4Cl
2:Eu
2+，Mn
2+
((Gd，Y，Lu，Se，La，Sm)
3{Al，Ga，In)
5O
12:Ce
3+
((Gd，Y)
1-xSm
x)
3(Al
1-yGa
y)
5O
12:Ce
3+
(Y
1-p-q-rGd
pCe
qSm
r)
3(Al
1-yGa
y)
5O
12
Y
3(Al
1-sGa
s)
5O
12:Ce
3+
(Y，Ga，La)
3Al
5O
12:Ce
3+
Gd
3In
5O
12:Ce
3+
(Gd，Y)
3Al
5O
12:Ce
3+，Pr
3+
Ba
2(Mg，Zn)Si
2O
7:Eu
2+
(Y，Ca，Sr)
3(Al，Ga，Si)
5(O，S)
12
Gd
0.46Sr
0.31Al
1.23O
xF
1.38:Eu
2+ 0.06
(Ba
1-x-ySr
xCa
y)SiO
4:Eu
Ba
2SiO
4:Eu
2+
Blue
ZnS:Ag，Al
Yellow/the redness of combination
Y
3Al
5O
12:Ce
3+，Pr
3+
White
SrS:Eu
2+，Ce
3+，K
+
From above tabulation, following phosphor is preferable for being used as for the coversion material of specific required characteristic.Each is excited, provides required peak emission, has effective light conversion in blueness and/or UV wave spectrum, and has acceptable stoke shift (Stokes shift).
Red
Lu
2O
3:Eu
3+
(Sr
2-xLa
x)(Ce
1-xEu
x)O
4
Sr
2Ce
1-xEu
xO
4
Sr
2-xEu
xCeO
4
SrTiO
3:Pr
3+，Ga
3+
Yellow/green
Y
3Al
5O
12:Ce
3+
(Sr，Ca，Ba)(Al，Ga)
2S
4:Eu
2+
Ba
2(Mg，Zn)Si
2O
7:Eu
2+
Gd
0.46Sr
0.31Al
1.23O
xF
1.38:Eu
2+ 0.06
(Ba
1-x-y?Sr
xCa
y)SiO
4:Eu
Ba
2SiO
4:Eu
2+
In order further to improve the photoemissive homogeneity from the LED that is covered, coversion material 24 can comprise that also scattering particles is to reflect it randomly when light passes.For scattered light effectively, the diameter of scattering particles should be approximately half the through the light wavelength of scattering.From the light of LED pass particle and through refraction to mix and expansion light.Preferable scattering particles does not absorb LED light basically and has extremely material (for example, epoxides) basically different refractive index embedded with it.In one embodiment, scattering particles should have than the high refractive index of its embedded material extremely.Suitable scattering particles can be by the titanium dioxide (TiO with high index of refraction (n=2.6 to 2.9)
2) process.Other material such as celelular silica with little space or micropore also can be used to scattered light.
Mentioned like preceding text, LED can launch the light in the different wave length spectrum in LED encapsulation according to the present invention.In one embodiment, LED 12 can launch the light in the blue wavelength spectrum, and coversion material 24 can contain the down-conversion blue light and launch the phosphor of gold-tinted again.The white light combination of blue light and gold-tinted can be then launched in LED encapsulation 10.In other embodiments, coversion material can absorb all blue LED lights and launch monochromatic gold-tinted.If use dissimilar phosphors, then encapsulate 10 and can launch different monochromatic light again, such as, green.In another embodiment, LED can launch in the UV wave spectrum, and coversion material can contain different phosphors, and said different phosphor down-conversion UV light and emission can be combined to the different wave length of light of other wavelength of white light or light.
In using the embodiment of different phosphors, can be in whole coversion material hybrid phosphor equably, or coversion material can have the zones of different that the concentration of specific phosphors can be bigger.In other embodiments, can coversion material be divided into the zone that one of has in the different phosphors.Should be understood that from LED 12 can comprise encapsulant at least some sections, like epoxides or silicone from the light path of the extraction point of lamp.Can dispose continuously or with the form of lens or film it.
Fig. 2 shows that it has the LED 42 that is mounted to submounts 44 according to another embodiment of LED encapsulation 40 of the present invention, and both all are similar to shown in Figure 1 and described LED 12 of preceding text and submounts 14 for this.This LED encapsulation also comprises the reflector 46 that is installed on the LED 42, and wherein reflector is processed by reflective material and through being configured to reflect the light from LED, and is as indicated above.The LED encapsulation further comprises reflectivity converter 52, and it has and the shown in Figure 1 and described coversion material 24 similar coversion materials 54 of preceding text.Coversion material 54 can comprise many different materials, comprises one or more in the above listed phosphor.Coversion material 54 also can comprise neutral reflex components or scattering particles as indicated above.Reflectivity converter 52 also can have reflex components 56, especially in not having those embodiment of neutral reflex components.Reflectivity converter 52 is formed in the combination cup on every side of LED 52, submounts 44 and reflector 46.
Outside the opening of the shape of reflectivity converter 52 in reflectivity converter 52 more oriented light beam is provided.Its design can allow to catch by reflector 46 with the shape of reflector 46 and reflex to all light basically on the reflectivity converter 52.Different shapes can be used for reflectivity converter 52, such as, have the hemisphere or the box-like of opening, wherein LED 42 is disposed at the bases of hemisphere or box.
Should be understood that according to LED according to the present invention encapsulation can have an above LED and one with upper reflector.Fig. 3 shows that it has first and second LED 72,74 that is mounted to submounts 76 according to another embodiment of LED encapsulation 70 of the present invention, and these both all similar with described LED of preceding text and submounts.LED encapsulation 70 further comprises first and second reflector 78,80, and wherein first reflector arrangement is on a LED 72, and second reflector 80 is disposed on the 2nd LED 74.In other embodiments, can be on LED 72,74 with single reflector arrangement.
LED encapsulation 70 further comprises reflectivity converter 82, and it comprises transducer material 84 and reflex components 86, and these both all similar with the transducer material and the reflex components of preceding text, and both all can comprise same material these.Reflectivity converter 82 unevennesses have angle part to the light that encapsulates 70 emissions certainly a certain directionality to be provided and have one on the contrary.
In operation, the light from LED 72,74 reflexes to reflectivity converter 82 from reflector 78,80.Light can be absorbed and can be through down-conversion by coversion material 84 whole or in part.When through the part down-conversion, LED encapsulation 70 emissions are from the combination of coversion material 84 with the light of LED 72,74.When light when all absorbing, whether reflect all or some light (as indicated above) according to reflector 78,80 and decide, LED encapsulation 10 can only be launched from the light of coversion material 84 perhaps from the light of coversion material 84 and LED 72,74.This embodiment provides two LED and combined transmit from the emission of coversion material 84.
Fig. 4 shows that it has additional features and is shaped with auxiliary beam according to another embodiment of LED encapsulation 100 of the present invention.LED encapsulation 100 comprises the LED 102 that is mounted to submounts 104, can have an above LED but encapsulate 100.Cup 106 is mounted to submounts 104, preferably, and around LED 102.On LED 102, hemispherical lens 108 is mounted to cup 106.Space 110 remains between LED 102 and lens 108 bottoms, and this space 110 is filled with a transparent or light transmissive material, such as, transparent epoxides or silicone.Reflector 112 is disposed on the LED 102, and wherein lens focus on all LED light basically on the reflector 112 through being configured to.Can use many different erecting devices that reflector 112 is installed on the LED 102, maybe can make reflector 112 be attached to optical module 118.
The LED encapsulation further comprises the reflectivity converter 116 that is installed on optical element 118 lower surfaces.Reflectivity converter 116 comprises coversion material 120, its can be in the above-mentioned material any one or a plurality of.In order to make coversion material 120 tool reflectivity, in one embodiment, it can comprise neutral reflex components, or as shown in Figure 4, can comprise reflex components 122 at coversion material 120 rear portions.In encapsulation 100, coversion material does not extend the inner surface that covers optical element 118, but in other embodiments, its comparable diagram is extended far or be few.Do not cover among some embodiment of inner surface at coversion material, reflex components 122 can continue across coversion material 120 and finish part.Optical module 118 has light beam focus features 124 to be shaped from the light that encapsulates 100 emissions.
Fig. 5 shows another embodiment according to LED encapsulation 130 of the present invention, and it has many description with preceding text and LED encapsulation 100 similar characteristics shown in Figure 4, and operates in a similar manner.Encapsulation comprises the LED 132 that is mounted to submounts 134, and wherein around LED 132, a cup 136 is on submounts 134.Reflector 138 is installed on the LED 132.LED encapsulation 130 further comprises optical element 142, and it has reflectivity converter 144.
According to the present invention, can dispose LED and reflector by many different modes.Fig. 6 and Fig. 7 show according to another embodiment of LED encapsulation 160 of the present invention, wherein make LED anti-phase on the reflectivity converter.The encapsulation 160 comprise with Fig. 4 in LED 102 similar LED 162, wherein LED 162 is mounted to submounts 164.Cup 166 is mounted to submounts 164 around LED 162, and on LED 162, optional lens 168 are mounted to cup 166.Lens 168 focus on or are shaped from the light of LED 162.
In operation, 170 guiding of orientating reflex property converter are from the light of LED 162, and at reflectivity converter 170 places, some or all of LED light are through down-conversion., in those embodiment of down-conversion, be reflected back toward on the direction of LED 162 through the light of down-conversion at all LED light, wherein LED encapsulation 160 emissions are through the light of down-conversion., in the embodiment of down-conversion, be reflected back toward on the direction of LED 162 through the light and the LED light of down-conversion at some light, wherein LED encapsulation 160 emissions are made up with the LED light wavelength through the light of down-conversion.
Also can be in equipment with a plurality of LED and/or LED encapsulation with above-mentioned LED package arrangements.Fig. 8 shows that it comprises the circuit board 192 that a plurality of LED 194 are installed according to an embodiment of many LED encapsulation 190 of the present invention.Can many different modes LED 194 be mounted to circuit board 192, but the preferable submounts 196 that is mounted to, this submounts 196 is mounted to circuit board 192 again.Circuit board 192 preferably has conductive trace, and its permission is applied to circuit board 192 with a signal, and this signal is conducted to LED 194, thereby makes these LED 194 luminous.
A plurality of reflectivity converters 198 also are mounted to circuit board, and wherein each reflectivity converter 198 is between contiguous LED.Each reflectivity converter 198 can comprise coversion material as indicated above and reflection subassembly.Encapsulation 190 further comprises a plurality of reflectors 200, and wherein each reflector 200 is gone up so that LED light is reflexed to reflectivity converter 198 through being disposed at a LED194.Encapsulation 190 also can comprise the diffuser/lens element 202 that is installed on the circuit board 192.
In operation, a signal is applied to circuit board 192, thereby makes LED 194 luminous.From 198 reflections of reflector 200 orientating reflex property converters, at reflectivity converter 198 places, all or some light is through down-conversion from the light of LED 194.Through the light of down-conversion (and LED light) reflexing to diffuser/lens subassembly through reflectivity conversion part, at Qi Chu, under the situation of diffuser through diffusion, or line focus under the situation of lens.
Should be understood that and can come configuration packages 190 by many different modes, it has the LED and the reflectivity converter of different numbers.Should be understood that also that according to the present invention reflector and reflectivity converter can have many different shapes and size.Encapsulation 190 allows to use together a plurality of LED forming difform light source, such as, elongated, circular, or the like.
Should be understood that and to use distinct methods known in the art to make above-mentioned LED encapsulation.Therefore, only discuss the details of manufacturing approach among this paper briefly.
Fig. 9 shows an embodiment who is used for effectively luminous method 220 according to of the present invention, though and showed by a certain order and the particular step of method should be understood that other method according to the present invention can have the different step by different order.In 222, at first luminous from primary radiator, and in 224, guide the light of being launched towards wavelength shifter, such as, by a reflector.Light makes its major part not be reflected back toward primary radiator through preferably guiding (reflection).In 226, with conversion at least some the wavelength wavelength shifter in the primary light, said wavelength shifter is located away from primary radiator.In 228, luminous from wavelength shifter, it comprises at least all through the light of down-conversion, or through the light and the combination of primary radiator light wavelength of down-conversion.
Figure 10 shows another embodiment that is used for effectively luminous method 240 according to of the present invention.In 242, LED, reflector and coversion material are provided, wherein this coversion material preferably is away from this LED.In certain embodiments, coversion material can be away from LED, and as indicated above and Fig. 1 is to shown in Figure 7.In 244, luminous from LED.In 246, from the light of LED at least some, wherein most of light are not reflected back toward LED towards coversion material guiding.In 248, the coversion material down-conversion is some light at least, and or launch all light through down-conversion, or emission make up through the light of down-conversion and elementary LED light wavelength.In 250, want the light beam of emission angle to extract light and primary light or all light from lamp or through being configured as through down-conversion through down-conversion.Under down-conversion of mixing and elementary photoemissive situation, can a hybrid element be added into 250 to guarantee the light beam color of homogeneous.
Though the present invention is able to describe in detail with reference to its certain preferred configuration, other version also is possible.Mentioned like preceding text, the different LED of emission under different color capable of using and dispose LED encapsulation with many different modes.Provide among those embodiment of the light in the specific wavelength spectrum in that a reflector is described as, can use two or more reflectors.Above-mentioned coversion material can use light absorbing different wave length and launch the many dissimilar material of the different wave length that exceeds above-mentioned wavelength again.Therefore, the spirit of appended claim and category its preferred versions that should not be limited to wherein to be contained.
Claims (11)
1. a light-emitting diode (LED) encapsulation comprises:
LED is used for emitting LED light;
First and second reflectors;
On said second reflector and be away from the coversion material of said LED, be used for said LED light wavelength is carried out down-conversion;
Wherein said first reflector is reflected into towards said coversion material and said second reflector away from said coversion material and said LED and with in the said LED light at least some, and said coversion material carries out down-conversion at least some the wavelength in the LED light of reflection.
2. LED encapsulation as claimed in claim 1, wherein said coversion material are to all carry out down-conversion through the LED light that reflect basically, and said LED encapsulation emission is through the LED of elementary down-conversion light.
3. LED as claimed in claim 1 encapsulation, wherein said coversion material carries out down-conversion in the LED light of reflection some, the said LED light of said LED encapsulation emission with make up through the LED of down-conversion light wavelength.
4. LED encapsulation as claimed in claim 1, wherein said coversion material comprises one or more phosphors.
5. LED as claimed in claim 1 encapsulation, wherein said coversion material further comprise reflex components with reflection through the LED of down-conversion light and without the LED light of down-conversion.
6. LED encapsulation as claimed in claim 1, wherein said first reflector is reflected into all basically LED light away from said LED.
7. LED encapsulation as claimed in claim 1, wherein said coversion material contains scattering particles.
8. LED encapsulation as claimed in claim 1, wherein said coversion material comprise that neutral reflecting element is with LED light and any the light through reflection without conversion through reflection of reflection through conversion.
9. LED as claimed in claim 1 encapsulation comprises that further optical element is to be used for light extraction or beam-shaping or both.
10. reflector encapsulation comprises:
Primary radiator, emission light;
The reflectivity converter is away from said primary radiator, ability conversion reflector light wavelength;
Reflector is reflected in the reflector light at least some towards said reflectivity converter, and the wavelength of said at least some in the light of reflection carries out conversion by said reflectivity converter.
11. one kind is used for luminous method, comprises:
From primary radiator emission primary light;
Use first reflector that in the said primary light at least some are reflected into and be away from said primary radiator;
Use at least some primary light of coversion material conversion through reflection;
With second at least some said conversion of reflector reflects primary light;
Emission is through the primary light of conversion, perhaps through the primary light of conversion and the wavelength combination of primary light.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/476,520 | 2006-06-27 | ||
| US11/476,520 US7703945B2 (en) | 2006-06-27 | 2006-06-27 | Efficient emitting LED package and method for efficiently emitting light |
| PCT/US2007/011759 WO2008002362A1 (en) | 2006-06-27 | 2007-05-16 | Efficient emitting led package and method for efficiently emitting light |
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| CN101479860B true CN101479860B (en) | 2012-12-19 |
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| CN2007800243425A Active CN101479860B (en) | 2006-06-27 | 2007-05-16 | Led package, emitter package and method for emitting light |
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| EP (1) | EP2038939B1 (en) |
| JP (1) | JP2009543335A (en) |
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| US20070297179A1 (en) | 2007-12-27 |
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