CN108369983A - Using the LED device for the adjustable colour filter for using a variety of neodymiums and fluorine compounds - Google Patents

Using the LED device for the adjustable colour filter for using a variety of neodymiums and fluorine compounds Download PDF

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Publication number
CN108369983A
CN108369983A CN201680072489.0A CN201680072489A CN108369983A CN 108369983 A CN108369983 A CN 108369983A CN 201680072489 A CN201680072489 A CN 201680072489A CN 108369983 A CN108369983 A CN 108369983A
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compounds
equipment according
led
component
compound
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CN108369983B (en
Inventor
K.J.本纳
G.R.艾伦
蔡登科
T.克林
何建民
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Home Lighting Usa Co ltd
Karent Lighting Solutions Co ltd
Saiwante Technology Co ltd
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GE Lighting Solutions LLC
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Priority claimed from US14/966,329 external-priority patent/US10648642B2/en
Application filed by GE Lighting Solutions LLC filed Critical GE Lighting Solutions LLC
Priority to CN202110398384.7A priority Critical patent/CN113130721A/en
Publication of CN108369983A publication Critical patent/CN108369983A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/22—Luminous paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

The description and the appended drawings propose a kind of new equipment, such as lighting apparatus, and the equipment includes：At least one LED (or OLED) module, the module are configured to generate visible light, such as white light；And at least one component, such as optical component, it includes a variety of (two or more) compounds, each compound includes neodymium (Nd) and at least one compound for including fluorine (F), for assigning desired colour filter effect to provide desired spectrum, wherein, the color of the expectation spectrum in color space is determined by the relative quantity of described two or more compounds at least one component.

Description

Using the LED device for the adjustable colour filter for using a variety of neodymiums and fluorine compounds
Cross reference to related applications
The application be on October 6th, 2015 co-pending submitted, jointly owned U.S. Patent Application Serial Number 14/ 876366 part continuation application, teachings are incorporated herein by reference in their entirety.The application is to submit on October 8th, 2014 Co-pending, jointly owned International Application Serial No. PCT/CN2014/088116 part continuation application, teachings are by drawing With being incorporated herein.
Technical field
The present invention relates generally to illumination application and the relevant technologies, and more specifically but not exclusively, the present invention relates to make Desired colour filter effect is assigned in LED illumination device with the multiple compounds comprising neodymium (Nd) and fluorine (F).
Background technology
Light emitting diode (LED) used herein also includes organic LED (OLED), is converted electric energy to including visible The solid-state semiconductor device of the electromagnetic radiation of light (wavelength about 400 to 750nm).LED generally includes the chip (pipe of semi-conducting material Core), doped with impurity to generate p-n junction.LED chip is electrically connected to anode and cathode, and all anode and cathodes are commonly installed In LED encapsulation.Compared with other lamps of such as incandescent lamp or fluorescent lamp, emit the LED of visible light in relatively narrow light beam more Has directionality.
OLED generally includes at least one luminous electroluminescent hair between electrode (at least one electrode is transparent) Photosphere (organic semiconductor film).Electroluminescence layer shines in response to the electric current flowed between the electrodes.
LED/OLED light sources (lamp) provide the various advantages better than conventional incandescent and fluorescent lamp, including but not limited to more Long life expectancy, higher energy efficiency and full brightness is without preheating time.
Although LED/0LED illuminations are attractive at efficiency, service life, flexibility and other advantageous aspects, still need The color characteristics of sustained improvement LED illumination are wanted, especially in the White LED for general lighting and display application/PLED devices In part.
Fig. 1 is suitable for the perspective view of the conventional LED based lighting apparatus 10 of area illumination application.Lighting apparatus (being referred to as " lighting unit " or " lamp ") 10 include transparent or semitransparent lid or sealing cover 12, screw base connector 14 with And the shell between sealing cover 12 and connector 14 or pedestal 16.
LED based light source (not shown) can be the LED array for including multiple LED components, be located under sealing cover 12 It holds and adjacent to pedestal 16.Because LED component emits the visible light of narrowband wavelength, such as green, blue, red etc., in LED light Various light colors, including white light are generated through the combination frequently with different LED components.Alternatively, can be by from blue led Light and phosphor (such as the yttrium-aluminium-garnet that at least some blue lights of blue led are converted into different colours:Cerium is abbreviated as YAG:Ce combination) is rendered as substantially white light to generate；The combination of conversion light and blue light can generate and be rendered as white Or substantially white light.LED component may be mounted on the carrier in pedestal 16, and it includes index matching material that can use The protection cap of material is encapsulated on carrier, to improve the efficiency for extracting visible light from LED component.
In order to improve the ability that lighting apparatus 10 emits visible light in a manner of almost omnidirectional, sealing cover 12 shown in Fig. 1 Can be made of substantially spherical or oval.In order to further increase the illumination capability of almost omnidirectional, sealing cover 12 may include making Sealing cover 12 can be used as the material of optical diffuser.Material for manufacturing diffusing globe may include polyamide (such as nylon), Makrolon (PC), polypropylene (PP) etc..These polymer materials can also include SiO2To promote the refraction of light, to obtain White reflective appearance.The inner surface of sealing cover 12 can be provided with the coating (not shown) comprising phosphor composition.
Although quality white light can be generated to improve LED light using the use of the combination of different LED components and/or phosphor Ability, but optionally or in addition to this, it is expected that other methods improve the color of the white light generated by LED component Characteristic.
Invention content
According to an aspect of the present invention, a kind of equipment includes：At least one light emitting diode (LED) module, by with It is set to generation visible light；And at least one component comprising two or more compounds, each compound include neodymium (Nd), and And at least one of described two or multiple compounds compound also includes fluorine (F), at least one component is configured to The visible light of the generation is filtered to provide desired spectrum by using described two or multiple compounds, wherein in color sky Between in the color of desired spectrum determined by described two or multiple compounds relative quantities at least one component.
Further this aspect according to the present invention, at least one compound in described two or more compounds Can be neodymium fluoride (NdF3).In addition, the other compound of at least one of described two or more compounds can wrap Containing neodymia (Nd2O3).In addition, two or more compounds can include Nd3+Ion and F ion.
The color of further this aspect according to the present invention, the expectation spectrum in color space can be in color space Variation, the presumptive area are at least limited by the absorption vector of described two or more compounds in presumptive area.In addition, color Presumptive area in space can be restricted to about 12 MacAdam's ellipses (s).
Further this aspect according to the present invention, at least one LED module may include organic LED.In addition, described Equipment may include integrated circuit, which includes multiple LED modules with corresponding multiple components.
Further this aspect according to the present invention, at least one component can be deposited at least one LED Encapsulated layer on the top of module.In addition, at least one component can include selected from by TiO2、SiO2And Al2O3Composition The additive of group, to increase the diffusivity of two or more compounds at least one component.In addition, encapsulated layer can Be low temperature glass, polymer, polymer precursor, makrolon, thermoplasticity or thermosetting polymer or resin, siloxanes or Silicone epoxy.In addition, at least one component can also include phosphor.
According further to this aspect of the invention, at least one component can be deposited on including the another of phosphor Encapsulated layer on one encapsulated layer, another encapsulated layer are deposited on the top of at least one LED module.
According further to this aspect of the invention, at least one of described two or more compounds compound can With including one or more in Nd-F and Nd-X-F compounds, wherein X be element O, N, S, Cl, OH, Na, K, Al, Mg, Li, It is one or more in Ca, Sr, Ba and Y.
According further to this aspect of the invention, at least one component can be optical component, the optical component Including transparent, translucent or reflection substrate, it includes described two or more to have coating, the coating on the surface of the substrate Compound by filtering the visible light of the generation to provide desired spectrum.In addition, the thickness of coating can be in about 50nm To in the range of about 1000 μm.In addition, coating can also be comprising high refractive index in the addition of described two or more compounds Agent, and wherein additive is selected from including at least TiO2, SiO2And Al2O3Metal oxide and nonmetal oxide.In addition, Coating can be arranged on an inside surface of the base.In addition, substrate can be selected from described at least one by light bulb, lens and encirclement The diffusing globe of the group of the dome composition of LED module.
Further this aspect according to the present invention, at least one component can use injection molding or similar techniques heavy Product forms.
Description of the drawings
When refer to the attached drawing reads following specific implementation mode, these and other feature and aspect of the disclosure will become It is best understood from, similar label indicates similar component in all figures, in the accompanying drawings：
Fig. 1 is the perspective view of conventional LED based lighting apparatus 10.
Fig. 2 is Nd2O3And NdF3Visible spectrum in transmissivity curve graph；
Fig. 3 is color space figure, shows incorporation optical component (such as siloxanes or makrolon) and is deposited on standard LED encapsulates the Nd on (for example, 80CRI, with 3000K CCT)2O3And NdF3How compound is along by Nd2OaWith NdF3The color dot for the vector movement light source that the spectral absorption of compound limits；
It includes different amounts of Nd that Fig. 4 a, which are according to an embodiment of the invention,2O3And NdF3Nd compound mixtures can The curve graph of transmissivity in light-exposed spectrum；
Fig. 4 b are the filtering according to an embodiment of the invention for utilizing and having various Nd compound mixtures shown in Fig. 4 a The curve graph of the analog transmissions of lamp (such as LED light) in the visible spectrum of device；
Fig. 5 is the color dot according to an embodiment of the invention by standard 3000K LED light and includes respectively in Fig. 4 a and 4b Shown in the filter with various Nd compound mixtures LED light the color space figure that is compared of simulation color dot；
Fig. 6 a-6d are the non-limiting examples of LED based lighting apparatus according to various embodiments of the present invention, simultaneously Enter ND-F compounds (or more generally ND-X-F compounds as described herein) and phosphor to assign advantageous visible suction Receipts/generation characteristic；
Fig. 7 is the sectional view of LED based lighting apparatus according to an embodiment of the invention；
Fig. 8 is the sectional view of LED based lighting apparatus according to another embodiment of the present invention；
Fig. 9 is the perspective view of LED based lighting apparatus according to still another embodiment of the invention；
Figure 10 is the perspective view of LED based lighting apparatus according to still another embodiment of the invention.
Specific implementation mode
This paper presents a kind of new equipment, such as lighting apparatus, which includes：At least one LED (or OLED) mould Block, the module are configured as generating visible light, such as white light；And at least one component, such as optical component comprising it is a variety of (two or more) compound, each compound includes neodymium (Nd) and at least one compound for including fluorine (F), for assigning Desired colour filter effect is to provide desired spectrum, wherein in color space expectation spectrum color by it is described at least The relative quantity of described two or more compounds in one component determines.
For example, according to one embodiment of present invention, at least one component (optical component) can be comprising two kinds The polymeric substrate (such as siloxanes, makrolon etc.) of compound：First compound can be neodymia (Nd2O3), and the Two compounds can be neodymium fluoride (NdF3), it is as described in detail herein the fact that.Neodymium compound absorbs 560-600nm ranges Interior yellow light, this changes the color dot of LED information display system.Add single compound (can have color along 1931 color spaces of CIE Spend coordinate CCX and CCY) in line move color dot.By using two or more compounds, color dot can be empty in CIE colors Between (hereinafter referred to as " color space ") region in from anywhere in move.This allows the face to LED information display system for specific application Color is greatly customized, as shown in Fig. 3 of this paper.
In other words, neodymium compound (such as the Nd in above-described embodiment2O3And NdF3) can be added with various amounts, to change Become the composition of the optical component of the color dot for controlling gained light.When adding each group of timesharing, two kinds (or more) component Different absorption spectrums lead to color dot (that is, in the CCX and CCY both directions) movement in different directions of LED information display system.Then, The color dot mobile vector of multiple compounds as described herein including Nd and F can define the region in CIE color spaces, at this Inside region, by changing the relative quantity of two or more compounds, any color dot can be realized with identical LED, such as originally Described in text.
It, can will such as titanium dioxide (TiO2), aluminium oxide (Al according to another embodiment2O3), silica (SiO2) Equal dispersing elements are added in polymeric matrix, to increase the diffusivity of a variety of Nd and F compounds in optical component.Three changes Amount is (for example, TiO2, NdF3 and Nd in above-mentioned example2O3Weight load) variation permissible generate a variety of special optical components With spectrum needed for realization and distribution.
In addition, according to one embodiment of present invention, at least one compound (or more than one) can include neodymium (Nd) With the element of fluorine (F), and optionally include one or more other elements.Typically, this compound includes Nd3+Ion and F ion.For the purposes of the present invention, " Nd-F compounds " should be broadly interpreted as encompassing comprising neodymium and fluoride and optionally The compound of other elements.
According to another embodiment, the component may include compound/encapsulation on the surface of LED (OLED) chip Layer so that (dispersion) can be blended in the encapsulation in the multiple compounds including Nd disclosed herein and F for example together with phosphor In layer, to realize that advantageous visible absorption is distributed.Compound/encapsulated layer can use low temperature glass, polymer (such as poly- carbonic acid Ester), polymer precursor, siloxanes (polymer) or the formation such as silicone epoxy or presoma (precursor).
According to another embodiment, optical component can be that transparent, semitransparent reflector or half transmitting (partly reflect and saturating Penetrate) substrate, and the coating on substrate surface includes a variety of Nd and F components as described herein, when visible light passes through optical component When, which can apply the visible light that is generated by LED module colour filter effect, such as filtering yellow wavelengths range (such as wave It is long from about 560nm to about 600nm) in visible light, to provide desired spectrum.
In addition, the transparent or semitransparent substrate of optical component can be diffusing globe, such as light bulb, lens and encirclement at least one The big envelope of a LED chip.In addition, substrate can be reflective substrate, and LED chip can be arranged in the outside of substrate.Polyvoltine Closing object coating (including the more compounds of Nd as described herein and F) can be arranged on the surface of the substrate, and the thickness of coating is answered When being enough to realize colour filter effect.Thickness usually can be in the range of 50nm to 1000 μm, and preferred thickness is at 100nm to 500 μm Between.
Obtained device can show changing for optical parameter by using the filtering of Nd and Nd-F compounds/material Into with Intrinsic Gettering in Nd the and Nd-F compounds/visible light region of the material between about 530nm and 600nm, to increase Strong CSI (color saturation index), CRI (colour rendering index), R9 (colour developing value), degree of showing (illumination preference function, LPI) etc..R9 quilts It is defined as one of not used 6 kinds of saturation testing colors when calculating CRI." degree of showing " is the transmitting light based on LPI versions Parameter, the co-pending submitted on the 9th of September in 2014, jointly owned International Application Serial No. PCT/US2014/054868 (in On March 12nd, 2015 is published as WO2015/035425) in be described, and relevant portion is incorporated herein by reference.
In one embodiment, at least one of multiple compounds as described herein can include Nd3+Ion and F- from Son, and can be Nd-F compounds or Nd-X-F compounds.As used herein, " Nd-F compounds " should be broadly interpreted as wrapping Include the compound for including neodymium and fluoride and optionally other elements.This compound comprising neodymium and fluoride can include Neodymium fluoride or neodymium oxide fluoride are (for example, NdOxFy, wherein 2x+y=3, such as Nd4O3F6) or fluorination comprising indefinite water and/or oxygen Neodymium or hydrogen-oxygen neodymium fluoride are (for example, Nd (OH)aFb, wherein a+b=3), or a variety of other compounds comprising neodymium and fluoride, this A little compounds will become obvious from following description.
In some embodiments, one kind in multiple compounds can be NdF3 or NdFO.For Nd-X-F compounds, X It is selected from consisting of the following group of at least one element：The element of compound, such as oxygen, nitrogen, sulphur and chlorine are formed with neodymium；Or with Fluorine forms at least one metallic element of compound, such as the group of Na, K, Al, Mg, Li, Ca, Sr, Ba and Y or these elements It closes, the metallic element is different from neodymium.The specific example of Nd-X-F compounds may include：Neodymium oxide fluoride (Nd-O-F) compound； Wherein x can be Mg and Ca or can be Mg, Ca and O Nd-X-F compounds；And other compounds comprising Nd-F, packet Include the perovskite structure of doping neodymium.Certain Nd-X-F compounds can advantageously realize broader suction under the wavelength of about 580nm It receives.
As described above, a kind of component/optical component can be polymeric substrate (such as siloxanes, makrolon etc.), Including such as two kinds of compound N d2O3And NdF3.Fig. 2 is the Nd indicated by curve 222O3(1.3mm for being 1.54 in refractive index is thick NdF in siloxanes 1.0%) and by curve 20 to indicate3(being 2.9% in the 1.3mm thickness siloxanes that refractive index is 1.54) The curve graph of transmissivity in the visible spectrum.As can be seen that a variety of materials share many similar Absorption Characteristics, especially exist In the region yellow (for example, about 570nm- about 600nm).Each component in difference absorption peak driving color space shown in Fig. 2 (Nd2O3And NdF3) different gamut vectors, as further shown in figure 3.By combining both compounds, can obtain single Nd compounds or neodymium glass (SiO2In Nd2O3) not obtainable color dot.
In use, can use sealant (for example, siloxanes, epoxy resin, acrylic resin etc.) packaging LED chips/ Tube core；Sealant may include Nd2O3And NdF3Material or usually Nd and F based compounds as described herein so that such as siloxanes In Nd2O3And NdF3Can be directly deposited in LED chip or LED chip array (such as chip on board array, COB arrays) on, As further described herein.
Fig. 3 is color space figure, shows incorporation optical component (such as siloxanes or makrolon) and is deposited on standard LED encapsulates the Nd on (for example, 80CRI, with 3000K CCT)2O3And NdF3How compound is along respectively by Nd2O3 And NdF3The vector 30 and 32 that the spectral absorption of compound limits moves the color dot of light source.
From the figure in Fig. 3 it can be clearly seen that by changing Nd2O3And NdF3The correlative of compound, that is, along Respectively by Nd2P3And NdF3The color dot for the vector 30 and 32 mobile transmitters that the spectral absorption of compound limits, in the Systems Theory It can allow any color dot in the triangle ABC generated by standard 3000KLED.However, due to big energy caused by being filtered by height Amount loss is undesirable, therefore the system can essentially be restricted to smaller region 34, such as 12 MacAdam's ellipses, Or LPW (every watt of lumen) is sacrificed based on application and end user and is appointed very far off the wish of the color dot of starting color with realizing Meaning selects some other area sizes.Region 34 is limited by line BD, BE and curve 36.Any actual color point in region 34 can be with In Nd2O3And NdF3It is realized in the relative quantity and diffusion levels of the wide scope of compound, permission is needing not sharing the same light for optical device Using given color dot in the different LED information display systems of beam forming characteristics.In contrast, addition neodymium glass (conventional method) only allows color dot It is moved to a single point 38 (or being moved along vector if the thickness change of glass).Fig. 4 a, 4b and 5 are shown for putting into practice The further example of embodiment disclosed herein.
It includes different amounts of Nd in siloxanes band that Fig. 4 a, which are according to an embodiment of the invention,2O3And NdF3Neodymium The exemplary graph of transmissivity in the visible spectrum of compound mixture.Curve 42a, which corresponds to, includes 4%NdF3With 1% Nd2O31.3mm thickness siloxanes bands, curve 44a correspond to includes 5%NdF3And 0.5%Nd2O31.3mm thickness siloxanes bands, it is bent Line 46a, which corresponds to, includes 3.%NdF3And 0.5%Nd2O31.3mm thickness siloxanes bands, curve 48a correspond to includes 3.5% NdF3With 1.8% Nd2O31.3mm thickness siloxanes bands.
Fig. 4 b are the filtering according to an embodiment of the invention for utilizing and having various Nd compound mixtures shown in Fig. 4 a The curve graph of the analog transmissions of lamp (such as LED light) in the visible spectrum of device.In fig. 4b, curve 42b be used for have comprising 4%NdF3And 1%Nd2O31.3mm thickness siloxanes bands simulation LED light, curve 44b be used for have includes 5%NdF3With 0.5%Nd2O31.3mm thickness siloxanes bands simulation LED light, curve 46b be used for have includes 3%NdF3And 0.5%Nd2O3's The simulation LED light of 1.3mm thickness siloxanes bands, curve 48b, which is used to have, includes 3.5%NdF3And 1.8%Nd2O31.3mm thickness silicon The simulation LED light of oxygen alkane band.
Fig. 5 is the color dot according to an embodiment of the invention by standard 3000K LED light and includes respectively in Fig. 4 a and 4b Shown in the filter with various Nd compound mixtures LED light the color space figure that is compared of color dot.In Fig. 5 In, color dot 52, which is used to have, includes 4%NdF3And 1%Nd2O31.3mm thickness siloxanes bands simulation LED light, color dot 54 is used for With including 5%NdF3And 0.5%Nd2O31.3mm thickness siloxanes bands simulation LED light, color dot 56 be used for have includes 3% NdF3And 0.5%Nd2O31.3mm thickness siloxanes bands simulation LED light, color dot 58 be used for have includes 3.5%NdF3With 1.8%Nd2O31.3mm thickness siloxanes bands simulation LED light.
Fig. 4 a, 4b and 5 show the NdF in the filter part of change (LED) lamp3And Nd2O3Relative quantity how to change Become the colour temperature of lamp and change its emission spectrum (such as absorption peak near 570-600nm wave-length coverages), it is expected with providing to have The expectation light of colour temperature and transmission lumen power horizontal enough spectrum (such as " albefaction " of light source), so as to further improve Other optical parameters of such as CSI, CRI, R9 and degree of showing." degree of showing " is the parameter of the transmitting light based on LPI versions, The co-pending submitted on the 9th of September in 2014, jointly owned International Application Serial No. PCT/US2014/054868 are (March 12 in 2015 Day be published as WO2015/035425) in be described, and relevant portion is incorporated herein by reference.
In another embodiment, multiple Nd and F compounds of corresponding relative quantity can be with one or more luminescent materials (such as phosphor) is blended into encapsulating material together.For example, Nd the and F multiple compounds of corresponding relative quantity can be with yellow green Phosphor and/or red-emitting phosphor are blended.For example, multiple Nd and F compounds can with Ce adulterate YAG phosphor and/or often Nitride red phosphor (such as the Eu of rule2+The CaAlSiN red-emitting phosphors of doping) it is blended.In another example, Nd and F are more Kind compound can be with YAG:Ce phosphors and nitride red phosphor are blended in siloxanes, encapsulation blue/UV transmitting LED。
Fig. 6 a-6d respectively illustrate LED based lighting apparatus 60a, 60b, 60c according to various embodiments of the present invention The different non-limiting examples with 60d's, are incorporated to Nd and F multiple compounds, and as described herein and phosphor is advantageous to realize Visible absorption/generation characteristic.In Fig. 6 a-6d, LED based lighting apparatus 60a, 60b, 60c or 60d include dome 62, dome 62 can be the optical clear for surrounding the LED chip 65 being mounted on printed circuit board (PCB) 66 or translucent base Bottom.Lead provides electric current to LED chip 65, to make its transmitting radiation.LED chip can be any semiconductor light source, especially It is the blue light or ultraviolet source that white light can be generated when the radiation of its transmitting is directed on phosphor.Particularly, semiconductor Light source can be based on being generalized to IniGajAlkThe blue/UV (UV) of the nitride compound semiconductor of N emits LED, wherein I, j and k are respective (including such as InGaN, AlN, AlGaN, AlGaInN device junctions of the integer with value 1 or 0 Structure), launch wavelength is greater than about 200nm and is less than about 550nm.More specifically, chip can be had from about 400nm to about The nearly UV or blue emission LED of the peak emission wavelength of 500nm.Even more specifically, chip can be had in about 440- The blue emission LED of peak emission wavelength within the scope of 460nm.This LED semiconductors are as known in the art.
According to one embodiment shown in Fig. 6 a, polymer composite layer (sealer compound) 64a may include more kinds of Nd and F Compound is blended with phosphor and is inhaled according to the advantageous visible light of various embodiments described herein with assigning as described herein Receipts/generation characteristic.Compound layer 64a, which can be arranged directly on the surface of LED chip 65 and radiate, is coupled to chip. " radiation coupling " refers to the radiation transmission from LED chip to phosphor, and the radiation of phosphor emission different wave length.In spy Determine in embodiment, LED chip 65 can be blue led, and polymer composite layer may include multiple Nd of corresponding relative quantity With F compounds and yellow-green phosphor (such as the yttrium-aluminium-garnet of cerium dopping, Ce:YAG blend).What LED chip was sent out Blue light is mixed with the yellow-green light that the phosphor of polymer composite layer is sent out, and transmitting is presented by more kinds of chemical combination of Nd and F only The white light of object filtering.Therefore, LED chip 65 can be surrounded by sealant material layer 64a.Sealant material can be low temperature glass Glass, thermoplasticity or thermosetting polymer or resin or siloxanes or epoxy resin.LED chip 65 and sealant material layer 64a can To be encapsulated in shell and (be limited by dome 62).Alternatively, LED device 60a can be only including sealant layer 64a without including outside Shell/dome 62.In addition, as described herein, scattering particles can in embedding sealing agent material to increase Nd and F multiple compounds Diffusivity.Scattering particles can be such as aluminium oxide (Al2O3), silica (SiO2) or titanium dioxide (TiO2).In addition, Scattering particles can effectively scatter the directional light emitted from LED chip, it is therefore preferred to have insignificant uptake.
In order to form multiple Nd and F compounds comprising corresponding relative quantity as described herein on the surface of LED chip Polymer composite layer, particle can be dispersed in polymer or polymer precursor, especially siloxanes, makrolon, silica In alkane epoxy resin or its presoma.This material is well known for LED encapsulation.Dispersed mixture can be by any suitable Technique be coated on chip, such as using injection molding (or casting and squeeze out optical component or similar techniques), and have Greater density or granularity or greater density and the particle of larger granularity are preferentially deposited in the region near LED chip, form tool The layer being made of gradient.Sedimentation can occur during the coating or solidification of polymer or presoma, and can pass through ability Centrifuging process known to domain promotes.It shall yet further be noted that the scattering parameter of phosphor and Nd and F multiple compounds, such as including Grain density and granularity and technological parameter can be selected as providing the phosphorus closer to LED chip 65 than Nd and F multiple compounds Body of light material provides filtering appropriate will pass through Nd and F multiple compounds to the light that phosphor component generates.
In the alternative exemplary embodiment shown in Fig. 6 b, phosphor layer 64b can be conventionally fabricated sealant layer, and And the independent sealant layer 68b with Nd and F multiple compounds can be deposited on the top of phosphor layer 64b, such as： Common deposition appropriate/particle dispersion technology is used in polymer or polymer precursor.
In the another exemplary embodiment shown in Fig. 6 c, including the composite layer 68c of Nd and F multiple compounds can be coated On the outer surface of dome (shell) 62.The performance of coat 68b is similar to the sealing with Nd and F multiple compounds in Fig. 6 b The performance of oxidant layer 68b.Alternatively, the coating 68c in Fig. 6 c can be deposited on the inner surface of dome 62.It will be discussed with reference to Fig. 7-10 More implementation details of coating about dome/substrate.Note that dome 62 itself can be transparent or translucent.
In yet another exemplary embodiment, as shown in fig 6d, dome (shell) 62 can be used on the outer surface of dome 62 Deposit multiple Nd and F compounds composite layer/coating 68d, and the deposit of phosphor coating 64d on the inner surface of dome 62.Also It should be noted that this method can have different modifications.For example, coating 64d and 68d can be deposited on a surface of dome 62 On (outer surface or inner surface), wherein phosphor coating 64d is than coating 68d closer to LED chip 65.In addition, coating 64d and 68d can be combined (when on a surface for being deposited on dome 62) in one layer, the sealer compound being similar in Fig. 6 a Layer 64a.Note that dome 62 itself can be transparent, translucent or half transmitting, so as to realize shown in Fig. 6 d it is exemplary not Same modification.
Here be using the coating described herein comprising Nd and F multiple compounds LED based lighting apparatus it is several Non-limiting example, the coating lead to desired colour filter effect.
Fig. 7 is the LED based lighting apparatus according to an embodiment of the invention suitable for area illumination application.Base It is arranged to provide the illumination capability of almost omnidirectional in the lighting apparatus (it can also be referred to as " lighting unit " or " lamp ") of LED LED light 70.As shown in fig. 7, LED light 70 includes light bulb 72, connector 74 and the base between light bulb 72 and connector 74 Seat 76, and the coating 78 on the outer surface of light bulb 72.Coating 78 includes Nd and F multiple compounds as described herein.At it In its embodiment, light bulb 72 can be replaced by other transparent or semitransparent substrates.Alternatively, coating 78 can be coated in the interior of light bulb 72 On surface, which can be transparent or translucent.
Fig. 8 is LED based lighting apparatus 80 according to another embodiment of the present invention.As shown in figure 8, LED based Lighting apparatus is pendent lamp 80 (LED chip is not shown).Pendent lamp 80 includes hemispherical substrate 82 and more comprising Nd as described herein and F The coating 88 of kind compound；Coating 88 is on the inner surface of hemispherical substrate 82.Alternatively, coating 88 can be coated in hemispherical base On the outer surface at bottom 82, which can be transparent or translucent.
Fig. 9 is LED based lighting apparatus according to another embodiment of the present invention.As shown in figure 9, LED based is shone Bright equipment is lens 90, and lens 90 include flat base 92.In this embodiment, flat base 92 is wrapped on its outer surface Include Nd and F multiple compounds coating (not shown).
Figure 10 is LED based lighting apparatus 100 according to another embodiment of the present invention.LED based lighting apparatus 100 include light bulb 102, at least one LED chip 105 and reflective substrate 106.Reflective substrate 106 is configured as reflection by LED core The visible light that piece 105 generates.In certain embodiments, reflective substrate 106 includes that Nd and F multiple compounds apply on its outer surface Layer (not shown), for providing desired filtering.In Fig. 10, dome (102) can be made of diffuse material so that be come from A certain amount of light of LED will pass through, and a certain amount of light will be reflected back toward in cavity (expansion of these amounts depending on dome material The rate of dissipating is how high).Depending on the diffusivity of dome 102, reflected light will specularly or diffusely.These are from dome 102 Diffusing reflection and/or mirror-reflection by be incident on according to embodiment described herein one of coating reflective substrate 106 on.Alternatively, Dome 102 can be constructed by broadband semi-reflective material to provide identical function.
Coating material as described herein includes the compound comprising Nd3+ ions and F ion, may be with the optics of very little Scatter (diffusion) effect；Or it is alternatively possible to cause sizable optical scattering on by light therein.It is scattered in order to increase Firing angle, coating may include the discrete particle of organic or inorganic material.Alternatively, organic or inorganic material can be individually by as described herein The discrete particles of Nd and F multiple compounds forms, and/or by Nd and F multiple compounds discrete particle and by it is at least one its The mixture composition for the particle that its different materials is formed.
In one embodiment, the suitable particle size of organic or inorganic material can be about 1nm to about 10 μm.For Fig. 7 institutes Granularity selection can be remote to enable angle of scattering to maximize so that LED light 70 realizes omnidirectional lighting by the LED light 70 shown Less than 300nm so that the efficiency of Rayleigh scattering maximizes.
Although being not intended to limit, Nd and F multiple compounds coating can be for example, by spraying, roller coating (roller Coating), meniscus (meniscus) or dip-coating, punching press, silk screen coating, distribution (dispensing), roller coating (rolling), Brushing, bonding, electrostatic coating can provide any other method of uniform thickness coating to apply.It how is described below in base Three non-limiting examples of Nd and F multiple compounds coatings are provided on bottom.
In one embodiment, as shown in fig. 7, coating 37 can be coated in by adhesive method on light bulb 72.LED light 70 May include the binder course (not shown) between light bulb 72 and coating 78, and binder course may include organic bond or inorganic Adhesive.Organic bond may include epoxy resin, organic siliconresin adhesive, acrylic resin etc..Inorganic bond May include Silicate Inorganic Binding Material, sulfate adhesive, phosphate binder, oxide adhesive, borate adhesive Deng.
In another embodiment, as shown in fig. 7, coating 78 can be coated in the outer surface of light bulb 72 by spraying method On.First, liquid mixture is formed, it includes the Nd for for example corresponding to relative quantity2O3And NdF3Compound, silica, such as Dispersant, water and the optionally TiO of DISPEX A402Or Al2O3.Then, the liquid mixture of formation is ejected into light bulb 72 On.Finally, light bulb 72 is cured to obtain the LED light 70 of coating.
In one embodiment, as shown in fig. 7, coating 78 can be coated to the appearance of light bulb 72 by electrostatic coating method On face.First, the Nd by for example corresponding to relative quantity is prepared2O3And NdF3Compound, SiO2And Al2O3The charged powder of composition.With Afterwards, powder is applied on the light bulb 72 of oppositely charged.
In another embodiment of the present invention, spraying method and electrostatic coating method, which can use, is free of organic solvent Or the material of organic compound, this can extend the service life of LED illumination device and be avoided usually changing colour caused by sulfonation.
In another embodiment, in order to promote the refraction of light to obtain white reflective appearance, coating can also include phase There is the additive of higher refractive index for a variety of Nd and F compounds.Additive can be selected from metal oxide or nonmetallic oxidation At least one of object, such as TiO2、SiO2And Al2O3。
Unless otherwise defined, technical and scientific terms used herein has the common skill with disclosure fields The normally understood identical meanings of art personnel.Terms used herein " first ", " second " etc. do not indicate that any sequence, quantity or again The property wanted, but for distinguishing an element and another element.In addition, term "one" and "an" do not indicate that quantitative limit System, but indicate that there are at least one of cited projects.Herein to "include", "comprise" or " having " and its modification Using being intended to cover items listed thereafter and its equivalent and additional project.Term " connection " and " connection " are not limited to object Reason or mechanical connection or connection, and may include electricity and light connects or connection, regardless of being direct or indirect.
In addition, technical staff will be recognized that the interchangeability of the various features from different embodiments.This field is common Technical staff can be mixed and matched the other known equivalent of described various features and each feature, with according to this public affairs The principle opened constructs additional system and technology.
When describing the alternative embodiment of equipment claimed, specific term is for the sake of clarity used.However, The present invention is not intended to be limited to the specific term so selected.It will thus be appreciated that each particular element includes with similar side Formula is operated to realize all technically equivalent ones of similar functions.
It should be appreciated that the description of front is intended to illustrate and not limit the scope of the present invention, the scope of the present invention is by appended The scope of the claims limits.Other embodiments are within the scope of the appended claims.
It should be noted that various non-limiting embodiments described and claimed herein can be used alone, combine or select Combine for specific application to property.
Furthermore, it is possible to some in the various features of above-mentioned non-limiting embodiment be advantageously used, without correspondingly Use other described features.Therefore, the description of front should be regarded as merely to the principle of the present invention, introduction and example The explanation of property embodiment, rather than limitation ot it.

Claims (20)

1. a kind of equipment, including：
At least one light emitting diode (LED) module is configured to generate visible light；With
Include at least one component of two or more compounds, each compound includes neodymium (Nd), and it is described two or At least one of more compounds compound also includes fluorine (F), and at least one component is configured to by using institute The visible light that is generated described in two or more Compound Filters is stated to provide desired spectrum.
2. equipment according to claim 1, wherein at least one chemical combination in described two or more compounds Object is neodymium fluoride (NdF3)。
3. equipment according to claim 1, wherein the other change of at least one of described two or more compounds It includes neodymia (Nd to close object2O3)。
4. equipment according to claim 1, wherein the color of the expectation spectrum in the color space is in the face Variation in presumptive area in the colour space, the presumptive area are at least limited by the absorption vector of described two or more compounds It is fixed.
5. equipment according to claim 4, wherein the presumptive area in the color space is restricted to about 12 MacAdam's ellipse.
6. equipment according to claim 1, wherein described two or more compounds include Nd3+Ion and F-Ion.
7. equipment according to claim 1, wherein the color of the expectation spectrum in color space by it is described at least The relative quantity of described two or more compounds in one component determines.
8. equipment according to claim 1, wherein at least one component is deposited at least one LED moulds Encapsulated layer on the top of block.
9. equipment according to claim 8, wherein the encapsulated layer be low temperature glass, polymer, polymer precursor, Makrolon, thermoplasticity or thermosetting polymer or resin, siloxanes or silicone epoxy.
10. equipment according to claim 8, wherein at least one component further includes phosphor.
11. equipment according to claim 1, wherein at least one component is deposited on including the another of phosphor Encapsulated layer on encapsulated layer, another encapsulated layer are deposited on the top of at least one LED module.
12. equipment according to claim 1, wherein at least oneization in described two or more compounds Close object include it is one or more in Nd-F and Nd-X-F compounds, wherein x be element O, N, S, Cl, OH, Na, K, Al, Mg, It is one or more in Li, Ca, Sr, Ba and Y.
13. equipment according to claim 1, wherein at least one component is optical component, the optical component packet Transparent, translucent or reflection substrate is included, and there is coating on the surface of the substrate, the coating includes described two or more Multiple compounds by filtering the visible light of the generation to provide the desired spectrum.
14. equipment according to claim 13, wherein model of the thickness of the coating at about 50 nanometers to about 1000 microns In enclosing.
15. equipment according to claim 14, wherein the coating also includes high refractive index in described two or more The additive of compound, and wherein, the additive, which is selected from, includes at least TiO2、SiO2And Al2O3Metal oxide and non- Metal oxide.
16. equipment according to claim 14, wherein the coating is arranged on the inner surface of the substrate.
17. equipment according to claim 14, wherein the substrate is diffusing globe, and the diffusing globe is selected from by light bulb, thoroughly The group that mirror and the dome for surrounding at least one LED module form.
18. equipment according to claim 1, wherein the equipment includes integrated circuit, and the integrated circuit includes to have Multiple LED modules of corresponding multiple components.
19. equipment according to claim 1, wherein at least one component includes selected from by TiO2、SiO2And Al2O3 The additive of the group of composition, to increase the diffusivity of described two or more compounds at least one component.
20. equipment according to claim 1, wherein at least one component is deposited using injection molding.
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