CN101476124B - Film coating method and structure of insulation material - Google Patents
Film coating method and structure of insulation material Download PDFInfo
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- CN101476124B CN101476124B CN2008102193450A CN200810219345A CN101476124B CN 101476124 B CN101476124 B CN 101476124B CN 2008102193450 A CN2008102193450 A CN 2008102193450A CN 200810219345 A CN200810219345 A CN 200810219345A CN 101476124 B CN101476124 B CN 101476124B
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Abstract
The invention provides a method for coating film to insulating material which includes steps: (1) providing an insulating body with a substrate, a first surface and a second surface oppositely arranged on the substrate, a plurality of through holes running through the first surface and the second surface, and a plurality of cantilevers extending from the substrate, arranging a groove at the junction position of each cantilever and the substrate, positioning the first surface portion on the cantilever, programming at least one circuit region and a plurality of film coating regions connected to the circuit region on the first surface and the through holes by using the laser; (2) processing chemical coating to the insulation body along the programmed circuit region and the film coating regions for respectively depositing the circuit region to form a first metal coating layer, and respectively depositing the film coating regions to form a second metal coating layer communicated with the first metal coating layer; (3) conducting the first metal coating layer on the selected circuit region by an electrical power source unit for respectively increasing thickness of the first metal coating layer and the second metal coating layer surfaces; (4) cutting off at the groove position so as to separate the cantilever and the substrate, interrupting the second metal coating layer on the conducting film coating region by the first metal coating layer on the selected circuit region conducted by the electrical power source unit. The method can reduce time cost.
Description
[technical field]
The present invention relates to a kind of insulating material film coating method and structure thereof, refer to a kind of insulating material film coating method and structure thereof that reduces time cost especially.
[background technology]
Along with the progress of society, electronic product is come into people's life gradually, and becomes an indispensable part in the people life gradually, and along with development of times, People more and more requires the electronic product miniaturized and lightening to be convenient for carrying that can become.
Nowadays, electron trade has become a particularly fierce industry of current competition, and in order to comply with development of times, increasing manufacturer does one's utmost is devoted to research and develop little, the frivolous electronic product of volume to seize more market.
The present general electronic products generally used of industry with electric connector, all can comprise a body of being processed by insulating material and be located in a plurality of contact elements in the said body that each said contact element is through punching press formation, in order to electrically connect.
Because the said contact element that this electric connector uses also needs other punching press to form, and is high like production cost if said contact element shape more complicated then can be brought many inconvenience to manufacturing, big and complicate fabrication process of manufacture difficulty or the like.
In order to improve above-mentioned defective, the technician just adopts the plated film mode directly at the inwall metal plated plated film in said body surface or the hole in said body, offered.
The plated film mode that present industry is generally used comprises plating, plated film and physical coating.
Wherein, plating is exactly to utilize electrolysis principle on some metallic surface, to plate the process of skim metal coating.Though the manufacturing processed of metal coating is simpler, electroplating cost is equally also higher, and galvanized material also has restriction, i.e. the direct metal plated plated film in the metallic surface, and direct metal plated plated film on said body.
Plated film is under the katalysis of metal, through controllable redox reaction metallic deposition process on said body, thereby on said body, forms metal coating.Though the cost of plated film is lower, manufacturing processed is simple, and the not restriction of the material of plated film, and the metal coating that forms is thinner, so if form thicker metal coating, the time cost that then need spend also can be than higher.
The physical coating manufacturing processed is also fairly simple, and does not have the restriction of material, and it comprises vacuum evaporation and vacuum splashing and plating dual mode.
Wherein, vacuum evaporation is exactly with the metallic particles melted by heating of preparing the fusion evaporation, makes on metallic particles vapor deposition to the said body of melted by heating, makes said body metal plated plated film.
Vacuum vapour deposition has ladder to cover to drape over one's shoulders not good shortcoming.It is more violent to that is to say that the position that on said body, needs the metallizing plated film rises and falls, and the metal coating that vacuum evaporation forms has the discontinuous defective of fracture.
In addition, the thickness of the metal coating that vacuum evaporation forms also is limited, if form thicker metal coating, then need repeatedly carry out vacuum evaporation, and therefore the time cost of cost is very high.
Vacuum splashing and plating utilizes argon gas electricity slurry, and it is metal that high speed impact is plated target, is that the material splash is come out near the metallic surface with target, drops down onto on the said body, makes said body metal plated plated film.
Equally, thinner through the metal coating of vacuum splashing and plating plating on said body, if form thicker metal coating, also need repeatedly carry out vacuum splashing and plating, therefore the time cost of cost will be very high also.
So industry has no idea to come on said body, to form enough thick metal coating with lower time cost at present.
Therefore, be necessary to invent a kind of new insulating material film coating method and structure thereof, to overcome above-mentioned defective.
[summary of the invention]
The object of the present invention is to provide a kind of insulating material film coating method and structure thereof, said insulating material film coating method can reduce time cost, thereby the structure that said insulating material film coating method forms is comparatively simple easy to manufacture.
Insulating material film coating method of the present invention; Comprise: (1). an insulating body is provided; One first surface and a second surface are relatively arranged on said insulating body; Most through holes run through said first surface and said second surface, and said insulating body comprises a matrix and is provided with most projections in the said first surface of said matrix; Cook up the end face that at least one circuit zone extends to said projection with laser at said first surface; Or extend most cantilevers by said matrix; Be provided with a groove by each said cantilever and said matrix intersection; And said first surface partly is positioned at said cantilever, cooks up at least one circuit zone with laser at said first surface, and said circuit zone part at least is positioned at said cantilever; Cook up the most coating film area that connect said circuit zone at said through-hole wall with laser in addition; (2). said insulating body is carried out electroless plating along these circuit zones and the said coating film area of planning; Make said circuit zone formation of deposits one first metal plating respectively, and these coating film area one second metal plating of being connected with said first metal plating of formation of deposits respectively; (3). said first metal plating so that a supply unit connects on the selected said circuit zone is electroplated, and makes these first metal plating and these second metal coating surfaces increase thickness respectively; (4). cut off at said groove; Said cantilever is separated with said matrix; Or said projection removed from said matrix; Said projection is separated with said matrix, make said first metal plating on the said selected circuit zone that said supply unit connects interrupt said second metal plating on the said coating film area of conducting respectively.
Insulating material film coating method of the present invention earlier the said first surface through the said insulating body of laser radiation and said through-hole wall with formation circuit zone and coating film area; The back forms said first metal plating through electroless plating at said first surface; Form said second metal plating at said through-hole wall; Make said first metal plating and said second metal plating increase thickness through plating then; Therefore accelerated speed, thereby reduced time cost at said first metal plating of the plating of said first surface and said through-hole wall and said second metal plating.
The structure that insulating material film coating method of the present invention forms; Comprise: a matrix; Said matrix has a first surface and a second surface that is oppositely arranged, and the most through holes and the most hole that run through said first surface and said second surface, and said first surface and said through-hole wall are provided with at least one circuit zone and most coating film area; Said circuit zone has at least one first circuit zone, and each said first circuit zone extends to said coating film area from described hole; One first metal plating is plated on the said first circuit zone; And one second metal plating, be plated in respectively on these coating film area.
The structure that insulating material film coating method of the present invention forms is through being provided with most through holes and most hole on said matrix; And make that disconnection is connected at the described hole place for said second metal plating of said first metal plating and said coating film area in said first circuit zone; Thereby make that two adjacent said coating film area are independently of one another, therefore relatively simple for structure.
The structure that insulating material film coating method of the present invention forms; Comprise: a matrix; Said matrix has a first surface and a second surface that is oppositely arranged; And the most through holes that run through said first surface and said second surface, and most insulating regions of being located at said first surface, said first surface and said through-hole wall are provided with at least one circuit zone and most coating film area; Said circuit zone has at least one first circuit zone, and each said first circuit zone extends to said coating film area from said insulating regions; One first metal plating is plated on the said first circuit zone; And one second metal plating, be plated in respectively on these coating film area.
The structure that insulating material film coating method of the present invention forms is through being provided with most through holes and most hole on said matrix; And make that disconnection is connected at said insulating regions place for said second metal plating of said first metal plating and said coating film area in said first circuit zone; Thereby make that two adjacent said coating film area are independently of one another, therefore relatively simple for structure.
[description of drawings]
Fig. 1 is the part sectioned view of the insulating body among insulating material film coating method of the present invention and structure first embodiment thereof;
Fig. 2 is coated with the part sectioned view of first and second metal plating for insulating body shown in Figure 1;
Fig. 3 is an insulating body shown in Figure 2 partial view when removing cantilever;
Fig. 4 is coated with the partial view of first and second metal plating for the insulating body among insulating material film coating method of the present invention and structure second embodiment thereof;
Fig. 5 is an insulating body shown in Figure 4 partial view when removing projection.
[embodiment]
Below in conjunction with accompanying drawing and specific embodiment insulating material film coating method of the present invention and structure thereof are described further.
Please referring to figs. 1 through Fig. 3, be first embodiment of insulating material film coating method of the present invention and structure thereof, in the present embodiment, said insulating material film coating method comprises the steps:
(1). an insulating body is provided; Said insulating body has a first surface and a second surface that is oppositely arranged; And the most through holes that run through said first surface and said second surface, cook up at least one circuit zone and be connected the regional most coating film area of said circuit at said first surface and said through-hole wall with laser.
Please referring to figs. 1 through Fig. 3, in this step, at first, but be that material after common insulating material and special organo-metallic are mixed is a raw material with the modification insulating material of laser activation, adopt technology such as common injection molding apparatus, mould to inject an insulating body 1.Said insulating body 1 has a first surface 10 and a second surface 11 that is oppositely arranged, and the most through holes 12 and most holes 13 that run through said first surface 10 and said second surface 11.
Said insulating body 1 comprises a matrix 14 and the most cantilevers 15 that extended by said matrix 14.
Wherein, said matrix 14 is laid with said first surface 10, said second surface 11, said most through holes 12 and said most hole 13.Said matrix 14 has four inwalls 140 and surrounds formation one said through hole 12, and each said inwall 140 is provided with most inclined-planes 1401, is provided with a vertical surface 1402 between the wantonly two said inclined-planes 1401.
Each said cantilever 15 is laid with said first surface 10, and also is laid with one the 3rd surface 150 that is oppositely arranged with said first surface 10.Be provided with a said cantilever 15 between the two adjacent said through holes 12.And each said cantilever 15 extends to described hole 13, makes between each said cantilever 15 and the said matrix 14 to have a gap 16.
Said insulating body 1 further is provided with a groove 17 in each said cantilever 15 with said matrix 14 intersections; In order to connect each said cantilever 15 and said matrix 14; Said groove 17 is actually prejudges groove, with interconnective each said cantilever 15 and the said matrix 14 of conveniently fractureing.In the present embodiment, said groove 17 is arranged with in said cantilever 15 by said the 3rd surface 150 and forms.Certainly, in other embodiments, said groove 17 also can be arranged with formation in said first surface 10 in said cantilever 15.
In addition, said insulating body 1 is concaved with four supply unit contact parts 18 in said first surface 10 in said insulating body 1.These supply unit contact parts 18 all are made as blind hole, are laid in four corners on the said matrix 14.Certainly, in other embodiments, these supply unit contact parts 18 also can some or all ofly be arranged on the region intermediate of said matrix 14.
Then; With laser radiation can the said insulating body 1 of activatory said first surface 10 (the said first surface 10 that comprises said matrix 14 and said most cantilevers 15) and the four said inwalls 140 and four said supply unit contact part 18 inwalls of each said through hole 12; Make the four said inwalls 140 and the four said supply unit contact part 18 inwall activation, coarse of said first surface 10 and each said through hole 12 of said matrix 14 and each said cantilever 15; And the said first surface 10 that makes said matrix 14 and each said cantilever 15 is cooked up interconnective many circuits zone 2; And the four said inwalls 140 that make each said through hole 12 cook up a coating film area 3 that connects said many circuits zone 2, and four said supply unit contact parts 18 are located on the said circuit zone 2.In other embodiments, also can cook up a said coating film area 3 at three said inwalls 140 of each said through hole 12 or two said inwalls 140 or a said inwall 140.
In other embodiments, also can make the said first surface 10 of said matrix 14 and each said cantilever 15 cook up most said coating film area 3, and make four said inwalls 140 of each said through hole 12 cook up said many circuits zone 2.
Said many circuits zone 2 comprises most first circuits zone 20 and most second circuit zone 21.
Wherein, said most first circuits regional 20 are arranged on the said matrix 14 near position intermediate.And extend from the said coating film area 3 of a said through hole 12 in each said first circuit zone 20; And the said first surface 10 through said matrix 14; And further extend to the said first surface 10 of a said cantilever 15; Said first surface 10 from said cantilever 15 further extends then, and passes through the said first surface 10 of said matrix 14, and further extends to the said coating film area 3 of another adjacent said through hole 12.
And said most second circuits zone 21 parts are arranged on more submarginal position on the said matrix 14, and another part is arranged on the said matrix 14 near position intermediate.And each said second circuit zone 21 1 end links to each other with said first circuit regional 20 of said first surface 10 through a said cantilever 15; The other end extends to other zone of the said first surface 10 of said matrix 14, more submarginal position and near position intermediate on the promptly said matrix 14.
In the present embodiment, four said supply unit contact parts 18 are located at respectively on the said most second circuits zone 21 that is positioned at the position that keeps to the side on the said matrix 14.Certainly, in other embodiments, four said supply unit contact parts 18 also can be located on the said matrix 14 than on the said most second circuits zone 21 near the mid-way.
(2). said insulating body is carried out electroless plating along these circuit zones of planning with these coating film area; Make these circuits zone formation of deposits one first metal plating respectively, and these coating film area one second metal plating of being connected with said first metal plating of formation of deposits respectively.
Please referring to figs. 1 through Fig. 3; In this step; Said insulating body 1 is carried out electroless plating along said many circuits zone 2 (comprising 20 and second circuit zone, first circuit zone 21) and said most coating film area 3 of planning; Make said many circuits zone 2 (comprising first circuit zone, 20 and second circuit regional 21) of the said first surface 10 of said matrix 14 and each said cantilever 15 go up one first thin metal plating 4 of deposition rate respectively, and the one second thin metal plating 5 of said coating film area 3 difference deposition rates that makes four said inwalls 140 of each said through hole 12.In other embodiments, also can be at the three said inwalls 140 of each said through hole 12 or the one second thin metal plating 5 of said coating film area 3 deposition rates of two said inwalls 140 or a said inwall 140.
Because of each said first circuit zone 20 links to each other with each said second circuit zone 21, so said first metal plating 4 of the said first surface 10 of each said cantilever 15 is connected with said first metal plating 4 of the said first surface 10 of said matrix 14.Because of each said first circuit zone 20 is connected with the said coating film area 3 of four said inwalls 140 of each said through hole 12, so said first metal plating 4 is connected with said second metal plating 5.Because of said supply unit contact part 18 is located on said second circuit zone 21, so said supply unit contact part 18 inwalls also are provided with said first metal plating 4.
Formed said first metal plating 4 is identical with said second metal plating, 5 materials in this step, and is all copper.
(3). said first metal plating so that a supply unit connects on the selected said circuit zone is electroplated, and makes these first metal plating and these second metal coating surfaces increase thickness respectively.
Please referring to figs. 1 through Fig. 3; In this step; At first; The said insulating body 1 that deposits said first metal plating 4 and said second metal plating 5 is placed electroplate liquid, one or more supply units (not shown) are provided then, in the selected one or more said supply unit contact part 18 that connects on said second circuit zone 21 of said supply unit (not shown); And electrically conduct with said supply unit contact part 18 inwalls sedimentary said first metal plating 4 in said step (2), so that the said insulating body 1 that deposits said first metal plating 4 and said second metal plating 5 is electroplated.Because of said first metal plating 4 is interconnected with said second metal plating 5; So after connecting said supply unit (not shown); Can form and said first metal plating 4 and the identical or different metal level of said second metal plating, 5 materials on said first metal plating 4 and said second metal plating 5 surfaces respectively fast, so that said first metal plating 4 increases thickness respectively with said second metal plating 5 surfaces.
In other embodiments, said supply unit (not shown) also can connect one or more current conducting rods (not shown), makes said current conducting rod (not shown) connect said first metal plating 4 of one or more said supply unit contact part 18 inwalls.Said current conducting rod (not shown) can also can be conducting metal for the conductive carbon rod, also can be other conductive material.
In other embodiments; Said supply unit (not shown) also can connect one or more conductive clips (not shown), said second circuit zone 21 sedimentary said first metal plating 4 in said step (2) in the said step of said conductive clip (not shown) clamping (1).Said conductive clip (not shown) can be processed by conducting metal, but also can be processed by other conducting material.
In the present embodiment; Increasing thickness said first metal plating 4 afterwards forms by single metallic element with said second metal plating 5; Said single metallic element is a copper, is that said first metal plating 4 of copper and the material of the metal level of said second metal plating 5 surface thickenings are copper in material promptly.
In other embodiments, increase thickness said first metal plating 4 afterwards and be formed by stacking by the single metallic element of multilayer, following several kinds of situation are arranged with said second metal plating 5:
Said first metal plating 4 forms by copper layer and gold layer are folded mutually respectively with said second metal plating 5, is that said first metal plating 4 of copper and the material of the metal level of said second metal plating 5 surface thickenings are gold in material promptly.
Said first metal plating 4 forms by copper layer, nickel dam and gold layer are folded mutually respectively with said second metal plating 5; Be that said first metal plating 4 of copper and the material of the metal level of said second metal plating 5 surface thickenings are nickel and gold in material promptly, nickel dam is between copper layer and gold layer.
Said first metal plating 4 forms by copper layer and nickel dam are folded mutually respectively with said second metal plating 5, is that said first metal plating 4 of copper and the material of the metal level of said second metal plating 5 surface thickenings are nickel in material promptly.
(4). the said circuit of local failure is regional at least, uses said first metal plating on the said selected circuit zone that connects for said supply unit to interrupt these second metal plating on these coating film area of conducting respectively.
Please referring to figs. 1 through Fig. 3; In this step; With each said first circuit zone 20 and each said second circuit zone 21 local failure; The mode of destroying each said first circuit zone 20 and each said second circuit zone 21 makes each said cantilever 15 separate with said matrix 14 for each said cantilever 15 is cut off from each said groove 17 place, only is provided with a described hole 13 and make between the two adjacent said through holes 12.
So; Each said first circuit zone 20 that connects two adjacent said coating film area 3 connects in each described hole 13 places disconnection; And each said first circuit zone 20 is divided into two; Thereby between the two adjacent said coating film area 3, have two said first circuits zones 20 and extend to each said coating film area 3 from a described hole 13 respectively; And said second circuit zone 21 that connects each first circuit zone 20 also is connected with each first circuit zone, 20 disconnection at each described hole 13 place, and 21 in said second circuit of each of this moment zone extends to described hole 13.Thereby use said first metal plating 4 on said selected said second circuit zone 21 that connects for said supply unit (not shown) to interrupt said second metal plating 5 on each said coating film area 3 of conducting respectively; And make said second metal plating 5 of wantonly two said coating film area 3 not be conducted, the promptly said matrix 14 two adjacent said through holes 12 of taking up an official post are independently of one another.
Machine the structure that said insulating material film coating method forms with this.The structure that said insulating material film coating method forms comprises said first metal plating 4 and said second metal plating 5 that forms respectively on said coating film area 3 and the said circuit zone 2 and the said coating film area 3 of said inwall 140 of said circuit zone 2, said through hole 12 of said first surface 10 and said supply unit contact part 18 inwalls of said matrix 14, said matrix 14.
Two adjacent two said through holes 12 are independently of one another because said matrix 14 is taken up an official post; When being used as the electric connector use so in each said through hole 12 of said matrix 14, conducting terminal (not shown) is set; The said coating film area 3 of four said inwalls 140 of two adjacent said through holes 12 can form good shielding because be provided with said first metal plating 4 with said second metal plating 5, thereby can prevent that the two said conducting terminals of being located in the two adjacent said through holes 12 (not shown) from cross-talk taking place.
In the present embodiment; Elder generation is through the said inwall 140 of said first surface 10, said supply unit contact part 18 inwalls and the said through hole 12 of said matrix 14 of laser radiation and said cantilever 15; Make said first surface 10 form said circuit zone 2; The said inwall 140 of said supply unit contact part 18 inwalls and said through hole 12 forms said coating film area 3; The back forms said first metal plating 4 through electroless plating at the said inwall 140 and said supply unit contact part 18 inwalls of said first surface 10 and said through hole 12; Form said second metal plating 5 through electroplating then on said first metal plating 4 surfaces; To increase the thickness of said first metal plating 4, therefore accelerated to comprise the speed of said first metal plating 4 and said second metal plating 5, thereby reduced time cost at the said inwall 140 of said first surface 10 and said through hole 12 and the metal lining plated film of said supply unit contact part 18 inwalls.
Please with reference to Fig. 4 to Fig. 5, be second embodiment of insulating material film coating method of the present invention and structure thereof, the difference of present embodiment and above-mentioned first embodiment is:
In said step (1), the said insulating body 1 that provides comprises a said matrix 14 and a most projection 15 '.
Each said projection 15 ' is located at the said first surface 10 of said matrix 14, is provided with a said projection 15 ' between the two adjacent said through holes 12.Each said projection 15 ' has an end face 150 ', and said end face 150 ' is provided with said first circuit zone 20.
Extend from the said coating film area 3 of a said through hole 12 in each said first circuit zone 20; At first pass through the said first surface 10 of said matrix 14; Next extends to the said end face 150 ' of a said projection 15 '; Pass through the said first surface 10 of said matrix 14 once more; And then extend to the said end face 150 ' of another said projection 15 ', then, further extend to the said coating film area 3 of another adjacent said through hole 12 at last again through the said first surface 10 of said matrix 14.
Each said second circuit zone 21 connects in said first circuit zone of being located between the two adjacent said projections 15 ' 20.
In said step (2), the said end face 150 ' of said projection 15 ' deposits said first metal plating 4.
In said step (3), said end face 150 ' sedimentary said first metal plating 4 surfaces of said projection 15 ' increase thickness.
In said step (4); With each said first circuit zone 20 local failure, the mode of destroying each said first circuit zone 20 makes said projection 15 ' separate with said matrix 14 for removing said projection 15 '; At this moment, form an insulating regions 16 ' between the adjacent two said through holes 12.
So; Connection is located to break off at each said insulating regions 16 ' in each said first circuit zone 20 that connects two adjacent said coating film area 3; And make each said first circuit zone 20 1 be divided into three; Thereby between the two adjacent said coating film area 3, have two said first circuits zones 20 and extend to each said coating film area 3 from a said insulating regions 16 ' respectively; And another said first circuit zone 20 still is connected with said second circuit zone 21.Thereby use said first metal plating 4 on said second circuit zone 21 that connects for said supply unit (not shown) to interrupt said second metal plating 5 on each said coating film area 3 of conducting respectively; And make said second metal plating 5 of wantonly two said coating film area 3 not be conducted, the promptly said matrix 14 two adjacent said through holes 12 of taking up an official post are independently of one another.
The mode of removing said projection 15 ' can be to be struck off, and can be grinding, also can be corrosion.
Said insulating regions 16 ' is a uneven surface, also can be smooth flat.
Because of present embodiment adopts plating identical with above-mentioned first embodiment and the method for thickening said first metal plating 4 and said second metal plating 5, so can reach identical effect with above-mentioned first embodiment.
In sum; Insulating material film coating method of the present invention and structure elder generation thereof are through said first surface or said lug surface, said supply unit contact part inwall and the said through-hole wall of the said first surface of the said matrix of laser radiation, said cantilever; Make said first surface or said lug surface and the said supply unit contact part inwall of the said first surface of said matrix, said cantilever form said circuit zone, and make the said inwall of said through hole form said coating film area; The back forms said first metal plating through electroless plating on the said circuit zone of the said first surface of the said first surface of said matrix, said cantilever or said lug surface and said supply unit contact part inwall, and on the said coating film area of the said inwall of said through hole, forms said second metal plating; Increase thickness through electroplating then at said first metal plating and said second metal coating surface; Therefore accelerated to comprise the speed of said the first layer metal coating and said second layer metal plated film, thereby reduced time cost at the said first surface of the said first surface of said matrix, said cantilever or the metal lining plated film of said lug surface, said through-hole wall and said supply unit contact part inwall.
And the structure that this insulating material film coating method forms directly is provided with most through holes and most hole or insulating regions on said matrix; And make said first metal plating in said first circuit zone be connected at described hole or the disconnection of insulating regions place with said second metal plating of said coating film area; Thereby make that two adjacent said coating film area are independently of one another; Therefore relatively simple for structure, thus make more convenient.
Claims (42)
1. an insulating material film coating method is characterized in that, comprising:
(1). an insulating body is provided; One first surface and a second surface are relatively arranged on said insulating body; Most through holes run through said first surface and said second surface, and said insulating body comprises a matrix and is provided with most projections in the said first surface of said matrix; Cook up the end face that at least one circuit zone extends to said projection with laser at said first surface; Or extend most cantilevers by said matrix; Be provided with a groove by each said cantilever and said matrix intersection; And said first surface partly is positioned at said cantilever, cooks up at least one circuit zone with laser at said first surface, and said circuit zone part at least is positioned at said cantilever; Cook up the most coating film area that connect said circuit zone at said through-hole wall with laser in addition;
(2). said insulating body is carried out electroless plating along each said circuit zone of planning with each said coating film area; Make each said circuit zone formation of deposits one first metal plating respectively, and each said coating film area one second metal plating of being connected with said first metal plating of formation of deposits respectively;
(3). said first metal plating so that a supply unit connects on the selected said circuit zone is electroplated, and makes said first metal plating and said second metal coating surface increase thickness respectively;
(4). cut off at said groove; Said cantilever is separated with said matrix; Or said projection removed from said matrix; Said projection is separated with said matrix, make said first metal plating on the said selected circuit zone that said supply unit connects interrupt said second metal plating on the said coating film area of conducting respectively.
2. insulating material film coating method as claimed in claim 1 is characterized in that: in said step (4), separate said matrix and said cantilever or said projection after, said second metal plating of wantonly two said coating film area is not conducted.
3. insulating material film coating method as claimed in claim 1 is characterized in that: in said step (1), said insulating body is provided with most holes in said matrix, and said cantilever extends to described hole.
4. insulating material film coating method as claimed in claim 1 is characterized in that: the mode of removing said projection is for striking off.
5. insulating material film coating method as claimed in claim 1 is characterized in that: the mode of removing said projection is for grinding.
6. insulating material film coating method as claimed in claim 1 is characterized in that: the mode of removing said projection is corrosion.
7. insulating material film coating method as claimed in claim 1 is characterized in that: in said step (1), said insulating body is concaved with most power supply contact parts in said first surface, and each said power supply contact part is located on the said circuit zone.
8. insulating material film coating method as claimed in claim 7; It is characterized in that: in said step (1); Said power supply contact part is set to blind hole; In said step (3), said supply unit places in the said blind hole and said first metal plating of said step (2) formation of deposits electrically conducts.
9. insulating material film coating method as claimed in claim 1 is characterized in that: in said step (3), and said first metal plating of the said circuit of said supply unit clamping zone formation of deposits in said step (2).
10. insulating material film coating method as claimed in claim 1 is characterized in that: in said step (1), each said through-hole wall is provided with most inclined-planes, is provided with a vertical surface between the wantonly two said inclined-planes.
11. insulating material film coating method as claimed in claim 1 is characterized in that: in said step (3), said first metal plating and said second metal plating are made up of single metallic element respectively.
12. insulating material film coating method as claimed in claim 11 is characterized in that: said single metallic element is a copper.
13. insulating material film coating method as claimed in claim 1 is characterized in that: in said step (3), said first metal plating and said second metal plating are formed by stacking by the single metallic element of multilayer respectively.
14. insulating material film coating method as claimed in claim 13 is characterized in that: said first metal plating is built up with the gold layer by the copper layer respectively with said second metal plating at least mutually.
15. insulating material film coating method as claimed in claim 14 is characterized in that: be provided with a nickel dam between said copper layer and the said gold layer.
16. insulating material film coating method as claimed in claim 13 is characterized in that: said first metal plating is built up with nickel dam by the copper layer respectively with said second metal plating at least mutually.
17. the structure that the insulating material film coating method described in claim 1 forms is characterized in that, comprising:
One matrix; Said matrix has a first surface and a second surface that is oppositely arranged; And the most through holes and the most hole that run through said first surface and said second surface; Said first surface is provided with at least one circuit zone and is provided with most coating film area at said through-hole wall, and said circuit zone has at least one first circuit zone, and each said first circuit zone extends to said coating film area from described hole;
One first metal plating is plated on the said first circuit zone; And
One second metal plating is plated in respectively on the said coating film area.
18. the structure that the insulating material film coating method described in claim 1 as claimed in claim 17 forms is characterized in that: said circuit zone has at least one second circuit zone, and each said second circuit zone extends to described hole.
19. the structure that the insulating material film coating method described in claim 1 as claimed in claim 18 forms, it is characterized in that: said first metal plating is plated on the said second circuit zone.
20. the structure that the insulating material film coating method described in claim 1 as claimed in claim 17 forms is characterized in that: two adjacent said coating film area are connected respectively to described hole through the two regional said first circuit zones of a said circuit.
21. the structure that the insulating material film coating method described in claim 1 as claimed in claim 17 forms, it is characterized in that: each said through-hole wall is provided with most inclined-planes, is provided with a vertical surface between the wantonly two said inclined-planes.
22. the structure that the insulating material film coating method described in claim 1 as claimed in claim 17 forms, it is characterized in that: said matrix is concaved with most blind holes in said first surface, and said blind hole is located on the said circuit zone.
23. the structure that the insulating material film coating method described in claim 1 as claimed in claim 17 forms, it is characterized in that: said first metal plating and said second metal plating are made up of single metallic element respectively.
24. the structure that the insulating material film coating method described in claim 1 as claimed in claim 24 forms, it is characterized in that: said single metallic element is a copper.
25. the structure that the insulating material film coating method described in claim 1 as claimed in claim 17 forms, it is characterized in that: said first metal plating and said second metal plating are formed by stacking by the single metallic element of multilayer respectively.
26. the structure that the insulating material film coating method described in claim 1 as claimed in claim 25 forms is characterized in that: said first metal plating is built up with the gold layer by the copper layer respectively with said second metal plating at least mutually.
27. the structure that the insulating material film coating method described in claim 1 as claimed in claim 26 forms is characterized in that: be provided with a nickel dam between said copper layer and the said gold layer.
28. the structure that the insulating material film coating method described in claim 1 as claimed in claim 25 forms, it is characterized in that: said first metal plating is built up with nickel dam by the copper layer respectively with said second metal plating at least mutually.
29. the structure that the insulating material film coating method described in claim 1 forms is characterized in that, comprising:
One matrix; Said matrix has a first surface and a second surface that is oppositely arranged; And the most through holes that run through said first surface and said second surface, and most insulating regions of being located at said first surface, said first surface is provided with at least one circuit zone and is provided with most coating film area at said through-hole wall; Said circuit zone has at least one first circuit zone, and each said first circuit zone extends to said coating film area from said insulating regions;
One first metal plating is plated on the said first circuit zone; And
One second metal plating is plated in respectively on the said coating film area.
30. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms, it is characterized in that: said circuit zone has at least one second circuit zone and extends to said insulating regions.
31. the structure that the insulating material film coating method described in claim 1 as claimed in claim 30 forms, it is characterized in that: said first metal plating is plated on the said second circuit zone.
32. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms is characterized in that: two adjacent said coating film area are connected to said insulating regions respectively through the two regional said first circuit zones of a said circuit.
33. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms, it is characterized in that: each said through-hole wall is provided with most inclined-planes, is provided with a vertical surface between the wantonly two said inclined-planes.
34. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms, it is characterized in that: said matrix is concaved with most blind holes in said first surface, and said blind hole is located on the said circuit zone.
35. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms, it is characterized in that: said insulating regions is a uneven surface.
36. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms, it is characterized in that: said insulating regions is a smooth flat.
37. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms, it is characterized in that: said first metal plating and said second metal plating are made up of single metallic element respectively.
38. the structure that the insulating material film coating method described in claim 1 as claimed in claim 37 forms, it is characterized in that: said single metallic element is a copper.
39. the structure that the insulating material film coating method described in claim 1 as claimed in claim 29 forms, it is characterized in that: said first metal plating and said second metal plating are formed by stacking by the single metallic element of multilayer respectively.
40. the structure that the insulating material film coating method described in claim 1 as claimed in claim 39 forms is characterized in that: said first metal plating is built up with the gold layer by the copper layer respectively with said second metal plating at least mutually.
41. the structure that the insulating material film coating method described in claim 1 as claimed in claim 40 forms is characterized in that: be provided with a nickel dam between said copper layer and the said gold layer.
42. the structure that the insulating material film coating method described in claim 1 as claimed in claim 39 forms, it is characterized in that: said first metal plating is built up with nickel dam by the copper layer respectively with said second metal plating at least mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102193450A CN101476124B (en) | 2008-11-24 | 2008-11-24 | Film coating method and structure of insulation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102193450A CN101476124B (en) | 2008-11-24 | 2008-11-24 | Film coating method and structure of insulation material |
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| Publication Number | Publication Date |
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| CN101476124A CN101476124A (en) | 2009-07-08 |
| CN101476124B true CN101476124B (en) | 2012-07-04 |
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| CN2008102193450A Active CN101476124B (en) | 2008-11-24 | 2008-11-24 | Film coating method and structure of insulation material |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1008786B (en) * | 1988-03-23 | 1990-07-11 | 梁植林 | The manufacture method of printed substrate |
| CN1551319A (en) * | 2003-05-12 | 2004-12-01 | �¹������ҵ��ʽ���� | Method of production of semiconductor device |
| CN1717158A (en) * | 2004-06-29 | 2006-01-04 | 台湾吉德门国际股份有限公司 | Method for improving high quality ratio of circuit board process |
| CN1758829A (en) * | 2004-10-05 | 2006-04-12 | 三星电机株式会社 | Printed circuit board and method of fabricating same |
-
2008
- 2008-11-24 CN CN2008102193450A patent/CN101476124B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1008786B (en) * | 1988-03-23 | 1990-07-11 | 梁植林 | The manufacture method of printed substrate |
| CN1551319A (en) * | 2003-05-12 | 2004-12-01 | �¹������ҵ��ʽ���� | Method of production of semiconductor device |
| CN1717158A (en) * | 2004-06-29 | 2006-01-04 | 台湾吉德门国际股份有限公司 | Method for improving high quality ratio of circuit board process |
| CN1758829A (en) * | 2004-10-05 | 2006-04-12 | 三星电机株式会社 | Printed circuit board and method of fabricating same |
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| Publication number | Publication date |
|---|---|
| CN101476124A (en) | 2009-07-08 |
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