CN101474728A - 无铅软钎焊料 - Google Patents
无铅软钎焊料 Download PDFInfo
- Publication number
- CN101474728A CN101474728A CNA2009100364882A CN200910036488A CN101474728A CN 101474728 A CN101474728 A CN 101474728A CN A2009100364882 A CNA2009100364882 A CN A2009100364882A CN 200910036488 A CN200910036488 A CN 200910036488A CN 101474728 A CN101474728 A CN 101474728A
- Authority
- CN
- China
- Prior art keywords
- percent
- solder
- copper
- weight percentage
- scolder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title description 3
- 238000005219 brazing Methods 0.000 title 1
- 239000010949 copper Substances 0.000 claims abstract description 23
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000005476 soldering Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 229910052738 indium Inorganic materials 0.000 claims abstract description 10
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 10
- 229910052732 germanium Inorganic materials 0.000 claims description 9
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 22
- 238000003466 welding Methods 0.000 abstract description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000003026 anti-oxygenic effect Effects 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000005755 formation reaction Methods 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 14
- 239000000956 alloy Substances 0.000 description 14
- 239000010931 gold Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010792 warming Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910001074 Lay pewter Inorganic materials 0.000 description 2
- 229910008433 SnCU Inorganic materials 0.000 description 2
- 241000282887 Suidae Species 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910005728 SnZn Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008621 organismal health Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100364882A CN101474728B (zh) | 2009-01-07 | 2009-01-07 | 无铅软钎焊料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100364882A CN101474728B (zh) | 2009-01-07 | 2009-01-07 | 无铅软钎焊料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101474728A true CN101474728A (zh) | 2009-07-08 |
CN101474728B CN101474728B (zh) | 2011-06-01 |
Family
ID=40835549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100364882A Active CN101474728B (zh) | 2009-01-07 | 2009-01-07 | 无铅软钎焊料 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101474728B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103921010A (zh) * | 2012-11-21 | 2014-07-16 | 拉曼大学 | 焊接合金 |
CN105252164A (zh) * | 2015-11-30 | 2016-01-20 | 苏州龙腾万里化工科技有限公司 | 一种抗氧化焊锡条 |
CN112322929A (zh) * | 2020-10-28 | 2021-02-05 | 云南锡业集团(控股)有限责任公司研发中心 | 一种用于提高焊料抗氧化性的中间合金 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1040303C (zh) * | 1995-06-30 | 1998-10-21 | 三星电机株式会社 | 通用无铅焊料 |
US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
SG139507A1 (en) * | 2001-07-09 | 2008-02-29 | Quantum Chem Tech Singapore | Improvements in or relating to solders |
JP2005103645A (ja) * | 2004-10-29 | 2005-04-21 | Hitachi Metals Ltd | はんだボールおよびその製造方法 |
-
2009
- 2009-01-07 CN CN2009100364882A patent/CN101474728B/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103921010A (zh) * | 2012-11-21 | 2014-07-16 | 拉曼大学 | 焊接合金 |
CN103921010B (zh) * | 2012-11-21 | 2019-01-22 | 拉曼大学 | 焊接合金 |
CN105252164A (zh) * | 2015-11-30 | 2016-01-20 | 苏州龙腾万里化工科技有限公司 | 一种抗氧化焊锡条 |
CN112322929A (zh) * | 2020-10-28 | 2021-02-05 | 云南锡业集团(控股)有限责任公司研发中心 | 一种用于提高焊料抗氧化性的中间合金 |
Also Published As
Publication number | Publication date |
---|---|
CN101474728B (zh) | 2011-06-01 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220411 Address after: 516000 Yuan Zhou Zhen Tian tou Cun Hong Bian Tian (local name), BOLUO County, Huizhou City, Guangdong Province Patentee after: Huizhou Chengli Industry Co.,Ltd. Address before: 516123 Nangang Road, lower South Industrial Zone, Garden Town, Huizhou County, Boluo, Guangdong Patentee before: Gaoxin Tin Industry (Huizhou) Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240116 Address after: 516123 Yuan Zhou Zhen Xia Nan Cun Nan Jiang Lu, Boluo County, Huizhou City, Guangdong Province Patentee after: Guangdong Chengli New Material Technology Co.,Ltd. Address before: 516000 Yuan Zhou Zhen Tian tou Cun Hong Bian Tian (local name), BOLUO County, Huizhou City, Guangdong Province Patentee before: Huizhou Chengli Industry Co.,Ltd. |
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TR01 | Transfer of patent right |