CN101465626A - Wideband low pass high-frequency filter based on embedding capacitance - Google Patents
Wideband low pass high-frequency filter based on embedding capacitance Download PDFInfo
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- CN101465626A CN101465626A CNA2007101798593A CN200710179859A CN101465626A CN 101465626 A CN101465626 A CN 101465626A CN A2007101798593 A CNA2007101798593 A CN A2007101798593A CN 200710179859 A CN200710179859 A CN 200710179859A CN 101465626 A CN101465626 A CN 101465626A
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- electric capacity
- frequency
- imbedding
- low pass
- frequency filter
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- 239000003990 capacitor Substances 0.000 claims abstract description 28
- 238000001914 filtration Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 4
- 230000008901 benefit Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010921 in-depth analysis Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
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Abstract
The utility model relates to a low-pass broadband high-frequency filter. An embedded capacitor has the good characteristics that the spurious inductance and resistance are small, no surface area of a printed circuit board is occupied; the embedded capacitor can operate in high frequency state; the access point is specially designed to enable high-frequency attenuation frequency to be adjustable. An additional capacitor is tightly jointed with the port and connected in parallel to improve low frequency performance, so a required filter is constructed. The filter in the invention is adopted to replace the low-pass filter network in circuit system to save most of the elements; meanwhile, the performance and reliability of the system are improved; the area of printed circuit board is reduced, and the cost is reduced.
Description
Technical field
The present invention relates to electronic technology field, specifically is a kind of based on the wideband low pass high-frequency filter of imbedding electric capacity.
Background technology
Filter network is widely used in the electronic system.Often need a plurality of filter networks in a printed circuit board (PCB) or in the encapsulation, for different applied environments, they can be the power filter networks, the signal filtering network.As being divided into the high-pass filtering network by working frequency range, low-pass filter network, bandpass filtering network and bandreject filtering network.These networks generally are to use passive component, resistance for example, and electric capacity or inductance are formed.For meeting the demands, these passive components often need multi-stage cascade.On the other hand,, can only be operated in a specific frequency range, make the filter network of building with these elements often can not reach desirable effect because all passive components all have parasitic parameter.In order to supply a gap, generally adopt the mode of a plurality of passive component combinations.The problem that these methods are brought is exactly that number of elements increases, the design relative complex, and cost rises.For low-pass filter network, especially in a mixed signal circuit system that comprises from the low frequency to the high frequency, need to GHz about or above frequency filtering difficulty very big.We know that in the time need carrying out the filter network design to such high frequency, the task of a difficulty is the Da Rong value electric capacity of selecting to be operated on the high frequency.Because electric capacity with Da Rong value is owing to the reason of stray inductance can only be operated on the lower frequency range.Though and the mode that adopts a plurality of low-capacitance electric capacity to make up can be dealt with problems to a certain extent, satisfy GHz, even the above High frequency filter that requires of several GHz, this method still is difficult to reach.Add the increase of number of elements, design and the difficulty of making increase, and cost also rises thereupon.If have a kind of low cost and effective method to come to high frequency, especially to about GHz or above frequency carry out filtering, will be to system design, make and to bring convenience, and reduce cost simultaneously.
Imbedding electric capacity is that the mode with film is embedded in electric capacity in the plate in substrate, and it is to be made of last lower metal layer and middle dielectric layer.Be divided into two big class, whole plane type and part plan types.The whole plane type is to imbed electric capacity to occupy certain one deck in the whole base plate or which floor; The part plan type is to imbed electric capacity to occupy certain one deck or which floor regional area in the substrate.This two class is imbedded electric capacity and generally all is used for decoupling, improves the signal integrity and the power integrality of system.And the part plan type also can be used for other aspects, as coupling, and coupling, filtering or the like.The benefit that electric capacity is imbedded in use is that (1) reduces the number of elements of decoupling circuit; (2) improve systematic function; (3) reduce system's area; (4) reliability of increase system; (5) reduce cost.It is accomplished in the product in many companies in decoupling and otherwise application.By to imbedding the in-depth analysis of capacitance principle, we find to imbed electric capacity and are used for substituting low-pass filter network and have unique advantage: (1) can save most passive components; (2) has very wide bandwidth; (3) can be operated on the quite high frequency range.
Imbed electric capacity after deliberation for many years." printed circuit is imbedded electric capacity " (Printed Circuit Embedded Capacitor, patent No.: US7056800) described structure and the manufacture method of imbedding electric capacity of people such as Robert T.Croswell.Adopt their method to make and imbed capacitor's capacity greater than 1000pF/mm
2, condenser dielectric thickness is only less than 1 micron.But their invention just substitutes surface mount electric capacity or other capacitors with imbedding electric capacity just at electric capacity itself, does not attempt to imbed electric capacity with one and substitutes a filter network." high-k is imbedded electric capacity " (High Dielectric Constant Embedded Capacitors of people such as Michael James Liberatore, the patent No.: US6191934) described a kind of a kind of high dielectric constant materials of available silk screen printing, its dielectric constant can reach 2800 to 4500.Have low-loss angle and lightweight advantage simultaneously.Their invention remains about imbedding the making of electric capacity itself.Another the invention in " with the electric capacity of imbedding of conductor filled vias " (Embedded Capacitors using Conductor Filled Vias, the patent No.: US7154139), people such as Terry M.Provo have introduced a kind of manufacture method of imbedding electric capacity.They have added to make the operation of imbedding electric capacity in the manufacturing process of printed circuit board (PCB).They are also just at electric capacity itself.It is to imbed the connection inductance of electric capacity about reduction that some patents are arranged, " the printed circuit board (PCB) of imbedding electric capacity and application thereof " (Printed Wiring Boards having Low Inductance Embedded Capacitorsand Methods of Making Same Related Applications, patent No.: WO/2004/056160) as people such as William J.Borland with low inductance.Their invention is that the port that electric capacity is imbedded in access is carried out particular design, to reach the effect that reduces inductance.To its objective is the performance of imbedding electric capacity in order improving, not relate to the function that electric capacity is imbedded in expansion.Similarly about imbedding the material of electric capacity, manufacture craft is improved performance or the like patent and is also had a lot.But we also do not find the relevant special multiple spot design of imbedding electric capacity of adopting, and utilize access point the characteristic expansion of the different responses of frequency to be imbedded the patent of invention of the function of electric capacity.All inventions that we can find also rest on to be imbedded on electric capacity itself and the improvement performance.The present invention is the method that inserts with multiple spot, imbeds capacitive function with one and is extended to a filter network effectively, thereby can reduce the number of elements of filter network widely, simplifies design, improves filtering performance, reduces cost.
Summary of the invention
The purpose of this invention is to provide a kind ofly based on the wideband low pass high-frequency filter of imbedding electric capacity, described filter comprises: a multiport imbed electric capacity, be used for intermediate frequency and high fdrequency component filtering to electronic system; The additional capacitor of one or more Da Rong values is parallel to the port of imbedding electric capacity, is used to improve the low frequency characteristic of this filter.
Further, describedly imbed the part that electric capacity is printed circuit board (PCB), occupy one deck or which floor entire area or part area in the printed circuit board (PCB).
Further, the described rectangle that is shaped as of imbedding electric capacity, or be square, or be circular, or be oval.
Further, the described electric capacity of imbedding has two or more connectivity ports, and the position of its connectivity port is by the frequency decision under maximum attenuation requirement and the maximum attenuation.
Further, the described making of electric capacity and the manufacturing process compatibility of printed circuit board (PCB) imbedded adopts lamination or successively structured approach or " extracting-placement " method are embedded in the substrate.
Further, described additional capacitor appearance value is between 10～1000 microfarads.
The present invention becomes a two-port or multiport filter network by selecting two or more access points to imbedding electric capacity, make to imbed electric capacity, to substitute the conventional low-pass filter network with the passive component composition.As cooperating, can obtain the performance of ultra wide bandwidth and High frequency filter with other conventional capacitor.The present invention has simple in structure, stable performance, advantages such as process compatible.
Description of drawings
Fig. 1 contains the single-ended access printed circuit board (PCB) schematic diagram of imbedding electric capacity;
Fig. 2 (a) is an ideal capacitance of the prior art;
Fig. 2 (b) is the filtering characteristic of electric capacity shown in Fig. 2 (a);
Fig. 3 is that the practicality of a needed filter network of integrated circuit is given an example;
Fig. 4 is a conventional filter network characteristic (example among Fig. 3) and imbed the filter network characteristic comparison that electric capacity constitutes with of the present invention.
Description of symbols wherein:
101-imbed the top crown of electric capacity;
102-imbed the bottom crown of electric capacity;
103-imbed the dielectric layer of electric capacity;
104-connect and imbed the capacitor lower electrode incoming end;
The incoming end of electric capacity top electrode is imbedded in 105-connection;
106-other conductor layers;
107-comprise the whole printed circuit board (PCB) of imbedding electric capacity;
108-surface mount electric capacity;
201-ideal capacitance;
The filtering characteristic of 401-desirable filter network;
402-count the network filtering characteristic behind the parasitic parameter;
The filtering characteristic of the filter of imbedding electric capacity that 403-one termination is gone into;
The filtering characteristic of imbedding electric capacity that 404-two ends are inserted;
The input of imbedding electric capacity that 405-two ends are inserted is the filtering characteristic of one 100 microfarad electric capacity of adjunction again.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, be illustrated below in conjunction with instantiation, and with reference to accompanying drawing, the present invention is described in more detail.
Fig. 1 is a basic conception of imbedding electric capacity.In a substrate, there is one deck (or multilayer) to imbed capacitor layers, this schematic diagram has been indicated that the whole plane type is imbedded with the part and has been imbedded two kinds of electric capacity.Among the figure 101,102 are respectively the two-plate up and down of imbedding electric capacity, 103 for imbedding the dielectric layer of electric capacity, 104 is to connect to imbed the capacitor lower electrode incoming end, 105 for connecting the incoming end of imbedding the electric capacity top electrode, 106 is other conductor layers, and 107 for comprising the whole printed circuit board (PCB) of imbedding electric capacity, and 108 are additional Da Rong value capacitor.Imbed electric capacity two or more incoming ends can be arranged for two kinds among the figure.The structure of having only an incoming end is typical capacitor, connects if it is made Fig. 2 (a), and being connected in parallel on the middle itself of a circuit (201) is exactly a low pass filter, and its characteristic is shown in Fig. 2 (b).We know that the commodity capacitor is owing to the effect of stray inductance, resistance, and its filtering characteristic is generally undesirable, frequency range narrow (generally below 300MHz), and decay little (being generally less than 30 40dB).For reaching High frequency filter and high attenuation amount, adopt the mode of many electric capacity, inductance or resistance series and parallel and multi-stage cascade usually, it is complicated to do not only design like this, and element is many, and acts on limited.But, if adopt single-ended access imbed electric capacity frequency range broadening (can reach 1GHz), decay strengthens (generally can reach 60dB).If adopt two-port to insert, according to different access point positions, the frequency range of imbedding electric capacity can further expand to several GHz tens or tens GHz even, and decay simultaneously can further strengthen.If at the capacitor of a Da Rong value of incoming end adjunction, its low frequency filtering performance can well be improved simultaneously.
Below with one typical based on the ultra wide bandwidth high frequency filter example of imbedding electric capacity Benq be the filter network that an integrated circuit (IC) chip is used in the characteristic of the wideband low pass high-frequency filter of imbedding capacitance technology: Fig. 3.It is that its appearance value is respectively 22uF, 10uF, 1000pF, 100pF by two 120uH inductance and 5 capacitors, and a resistance is formed.Its desirable filtering characteristic shown in 401 curves among Fig. 4, the 402nd, consider the resulting network filtering characteristic curve of parasitic parameter of all elements.403 is filtering characteristics of imbedding electric capacity that a termination is gone into, the 404th, and the filtering characteristic of imbedding electric capacity that two ends are inserted, the 405th, the input of imbedding electric capacity that inserts at two ends is the filtering characteristic of a 100uF electric capacity of adjunction again.The parameter of imbedding electric capacity is that dielectric thickness is 12 microns; The medium relative dielectric constant is 24; The upper/lower electrode material is a copper, and thick is 12 microns; Imbedding capacitor size is the 2X2 square centimeter.
Obviously, have significant advantage based on the filter of imbedding electric capacity: the filtering frequency range is wide, and band attenuation is big.What is more important has only been used a capacitor.Reduced number of elements, saved the space of circuit board, reduced design difficulty and reduced cost of processing, because element is few, and the solder joint number is few, reliability improves thereupon simultaneously.
Above example is based on the simulation result of business software HSPICE, and with the mutual demonstration validation of the result of other simulation softwares.
Realization is imbedded electric capacity formation low pass wideband high-frequency filter and is divided into two stages of design and fabrication.
1. design phase: according to the frequency range of required filtering, required decay size in the wave band, electric capacity is imbedded in design.Specific procedure is that (1) determines capacitor's capacity by the highest frequency filtering; (2) by imbedding the capacitance material characteristic, thickness, metal layer material determines to imbed the capacitor size size.Imbed electric capacity and can occupy one deck of printed circuit board (PCB) or which floor; (3) determine that by the highest frequency under maximum attenuation two incoming ends are imbedding the position on the electric capacity, during if desired more than two incoming end, use the same method and determine other incoming end position; (4) determine additional shunt capacitance appearance value according to the low-limit frequency filtering requirements.Can use the same method and determine the appearance value of a plurality of additional capacitors according to the needs of a plurality of incoming ends; (5) according to the designed size of imbedding electric capacity, position, access port or the like parameter designing printed circuit board (PCB).The additional capacitor position should be close to access port.
2. production phase: owing to imbed a flow process in the manufacturing process that electric capacity is printed circuit board (PCB), the technology of electric capacity own is relevant with imbedding, and can roughly be divided into laminating, successively structured approach or the like.(1) laminating goes up lower metal layer with capacitance material (metal level-medium-metal level) and carves needed figure by design, with it with other each layers made or respectively pressing, pass through conventional boring again, metallization or the like flow process is promptly finished the preliminary making of imbedding electric capacity; (2) successively structured approach is made lower electrode layer on corresponding multilayer board, can adopt the method for plating or lamination, after etching figure by design, the topped again capacitance material film of going up, etch figure again by designing requirement, and then with electroplating or the method for lamination is made top electrode, needle drawing shape, thus the preliminary making of imbedding electric capacity finished.After whole print circuit plates making is finished, imbed electric capacity and also finish thereupon.(can finish with the postorder Reflow Soldering) behind the additional capacitor of burn-oning, this low pass wideband high-frequency filter is promptly finished.
The above; only be the embodiment among the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with the people of this technology in the disclosed technical scope of the present invention; the conversion that can expect easily or replacement all should be encompassed in of the present invention comprising within the scope.Therefore, protection scope of the present invention should be as the criterion with the protection range of claims.
Claims (6)
1. one kind based on the wideband low pass high-frequency filter of imbedding electric capacity, it is characterized in that, comprising: a multiport imbed electric capacity, be used for intermediate frequency and high fdrequency component filtering to electronic system; The additional capacitor of one or more Da Rong values is parallel to the port of imbedding electric capacity, is used to improve the low frequency characteristic of this filter.
2. wideband low pass high-frequency filter according to claim 1 is characterized in that, describedly imbeds the part that electric capacity is printed circuit board (PCB), occupies one deck or which floor entire area or part area in the printed circuit board (PCB).
3. wideband low pass high-frequency filter according to claim 1 is characterized in that, the described rectangle that is shaped as of imbedding electric capacity, or be square, or be circular, or be oval.
4. wideband low pass high-frequency filter according to claim 1 and 2 is characterized in that, the described electric capacity of imbedding has two or more connectivity ports, and the position of its connectivity port is by the frequency decision under maximum attenuation requirement and the maximum attenuation.
5. wideband low pass high-frequency filter according to claim 1 and 2 is characterized in that, the described making of electric capacity and the manufacturing process compatibility of printed circuit board (PCB) imbedded adopts lamination or successively structured approach or " extracting-placement " method are embedded in the substrate.
6. wideband low pass high-frequency filter according to claim 1 is characterized in that, described additional capacitor appearance value is between 10～1000 microfarads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101798593A CN101465626B (en) | 2007-12-19 | 2007-12-19 | Wideband low pass high-frequency filter based on embedding capacitance |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101798593A CN101465626B (en) | 2007-12-19 | 2007-12-19 | Wideband low pass high-frequency filter based on embedding capacitance |
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| CN101465626A true CN101465626A (en) | 2009-06-24 |
| CN101465626B CN101465626B (en) | 2010-08-25 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002652A (en) * | 2011-09-08 | 2013-03-27 | 德州仪器公司 | Apparatus for broadband matching |
| CN104576583A (en) * | 2013-10-18 | 2015-04-29 | 北大方正集团有限公司 | Power supply chip, printed circuit board and manufacturing method of printed circuit board |
| CN105743455A (en) * | 2016-02-02 | 2016-07-06 | 中国振华（集团）新云电子元器件有限责任公司 | Distribution parameter RLC integrated low-pass filter and manufacturing method thereof |
| CN107683032A (en) * | 2017-08-31 | 2018-02-09 | 江苏普诺威电子股份有限公司 | Two-sided etching burying capacitance circuit board manufacture craft |
-
2007
- 2007-12-19 CN CN2007101798593A patent/CN101465626B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002652A (en) * | 2011-09-08 | 2013-03-27 | 德州仪器公司 | Apparatus for broadband matching |
| CN103002652B (en) * | 2011-09-08 | 2017-07-18 | 德州仪器公司 | Equipment for Broadband Matching |
| CN104576583A (en) * | 2013-10-18 | 2015-04-29 | 北大方正集团有限公司 | Power supply chip, printed circuit board and manufacturing method of printed circuit board |
| CN105743455A (en) * | 2016-02-02 | 2016-07-06 | 中国振华（集团）新云电子元器件有限责任公司 | Distribution parameter RLC integrated low-pass filter and manufacturing method thereof |
| CN105743455B (en) * | 2016-02-02 | 2018-10-09 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of distributed constant RLC integrates low-pass filter and its manufacturing method |
| CN107683032A (en) * | 2017-08-31 | 2018-02-09 | 江苏普诺威电子股份有限公司 | Two-sided etching burying capacitance circuit board manufacture craft |
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| Publication number | Publication date |
|---|---|
| CN101465626B (en) | 2010-08-25 |
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