CN101460006B - Signal shunt and signal transmission equipment - Google Patents
Signal shunt and signal transmission equipment Download PDFInfo
- Publication number
- CN101460006B CN101460006B CN2007100324547A CN200710032454A CN101460006B CN 101460006 B CN101460006 B CN 101460006B CN 2007100324547 A CN2007100324547 A CN 2007100324547A CN 200710032454 A CN200710032454 A CN 200710032454A CN 101460006 B CN101460006 B CN 101460006B
- Authority
- CN
- China
- Prior art keywords
- signal
- shunt
- pcb board
- resistance
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the invention discloses a signal shunt arranged in a PCB plate, comprising a shunting transmission line arranged in the PCB plate. The shunting transmission line comprises three ends and a node, wherein each end and the node are located with distance, and the three ends are led out to the surface of the PCB plate. Correspondingly, the embodiment of the invention also discloses a signal transmission device. The signal shunt and the signal transmission device can obviously improve electrical characteristics, increase reliability of circuit, and reduce cost of circuit.
Description
Technical field
The present invention relates to splitter technologies, relate in particular to a kind of signal shunt and signal transmission apparatus.
Background technology
Splitter is a kind of very common device, in the prior art, utilizes discrete resistors to realize that signal is the common method of circuit design along separate routes, and its principle can be referring to shown in Figure 1.In Fig. 1, show a kind of passive signal splitter network of forming by three discrete resistors.Wherein, the resistance of three discrete resistors R1, R2, R3 be 50 ohm 1/3rd, promptly 16.7 ohm, make like this in three ports (port one, port 2, port 3) of signal shunt, when any two port end are connected with 50 ohm standard termination, its impedance that looks from the 3rd port all is 50 ohm, has so just realized impedance matching, makes the signal transmission be in optimum state.In Fig. 1, resistance R 1, R2, R3 are for constituting three resistance of signal shunt, and resistance R 4, R5, R6 are the build-out resistors of splitter termination, suppose that signal is from the port one feed-in, port 2 and port 3 meet matched load resistance R4 and R5, port one this moment connecting resistance R6 not; Then the input impedance of this splitter of seeing into from port one is: 16.7+ (16.7+50) // (16.7+50)=50 ohm.Because from the port one to the port 2 and are complete symmetries, export from port 2 and port 3 after so just the signal of exporting from port one can being divided into fully two parts to port 3 two-way circuit.Because three ports are symmetrical fully, therefore, the sort signal distributor is a reciprocal network, and any one road signal input can be divided into two paths of signals output.Above-mentioned what illustrate is a kind of splitter of five equilibrium, if make the resistance among resistance R 1, R2, the R3 incomplete same, then can form the signal shunt of non-five equilibrium.
Because the signal shunt principle is simple, it is convenient to realize, application is all arranged, common implementation such as Fig. 2, shown in Figure 3 in a lot of circuit of event.In these two figure, all be that three discrete resistors R1, R2, R3 are coupled together with transmission line, and form three ports.The difference of Fig. 2 and Fig. 3 is that mainly R1 is different to the distance of R2 and R3, i.e. the length difference of transmission line.
Consider the influence of transmission line, Fig. 1 can be deformed into structure shown in Figure 4.
In some applications, when transmitting high-frequency signal, also need to be applied to signal shunt.But, because high speed signal is a wideband digital signal, its signal spectrum is very wide, the structure applications of utilizing above-mentioned Fig. 2 or Fig. 3 is when high speed transmission of signals, because the influence of transmission line effect, if the transmission line between the resistance is oversize, then can cause very big reflection and loss, cause the signal quality variation of output signal.Wherein, transmission line effect mainly refers to the phenomenons such as specular scattering that taken place in the time of can comparing such as the length of signal wavelength and transmission line.For this transmission line effect is described, can be referring to the eye pattern of the signal simulation among Fig. 5.
At the layout type among Fig. 2 for example, when R1 to the length of transmission line between R2 and the R3 not simultaneously, can obtain different simulation results, Fig. 5 shows when total transmission line is identical, and R1 is to the receiving end eye pattern of 4 kinds of different line lengths (20mil, 100mil, 200mil, 500mil) between R2 and the R3.Be not difficult to find out that therefrom the long more signal quality of transmission line is poor more, so the length of the transmission line in the performance of existing signal shunt and the PCB design has confidential relation.
In addition, in existing splitter, the parasitic parameter of each discrete device has very significantly influence to the splitter performance.The parasitic parameter of discrete device is that its encapsulation is introduced, and is the attribute of device itself, can only reduce and can not eliminate.In the high speed circuit design, need to consider that the device parasitic parameter is to the entire circuit Effect on Performance.The high speed signal splitter that utilizes discrete device to design can be subjected to the influence of resistance parasitic parameter equally.Utilize existing high-frequency structure simulation software (as, HFSS) discrete resistors is carried out modeling, come the simulate signal splitter with this model, result shown in can obtaining as shown in Figure 6, wherein Zuo Ce eye pattern is the simulation result that does not have parasitic parameter, and the eye pattern on the right then is an eye pattern of having considered the discrete resistors parasitic parameter.Be not difficult to find out that the parasitic parameter of resistance is to the signal quality obvious effect of high speed signal.
And, in existing signal system splitter, need each discrete device that constitute splitter being welded, multiple working procedures such as assembling can reduce the unreliability of circuit and the higher reliability that reduces circuit simultaneously of assembly cost like this.
Summary of the invention
In view of this, embodiment of the invention technical problem to be solved is, a kind of signal shunt and high speed transmission of signals equipment are provided, and the parasitic parameter that can eliminate transmission line, discrete device is to the signal shunt Effect on Performance, and the circuit reliability height.
A kind of signal shunt, be arranged in the pcb board, this signal shunt comprises the shunt transmission line that is arranged on pcb board inside, described shunt transmission line comprises three resistances of burying that are embedded in pcb board inside, described three are buried resistance and all have an end directly to be electrically connected at the node place, described three other ends that bury resistance form the end of described signal shunt, comprise an input and two outputs.
A kind of signal transmission apparatus, comprise pcb board, be arranged on the signal shunt on the described pcb board, wherein, described signal shunt comprises the shunt transmission line that is arranged on pcb board inside, and described shunt transmission line comprises three resistances of burying that are embedded in pcb board inside, and described three are buried resistance and all have an end directly to be electrically connected at the node place, described three other ends that bury resistance form the end of described signal shunt, comprise an input and two outputs.
The signal shunt of the embodiment of the invention and signal transmission apparatus, owing to adopt the transmission line that is embedded in pcb board inside to replace discrete device to realize signal function along separate routes, reduce even eliminate the influence of the parasitic parameter of discrete device, can obviously improve electrical characteristic, and improve the reliability of circuit and reduce circuit cost.
Fig. 1 is a kind of passive splitter structural principle schematic diagram of being made up of discrete component in the prior art;
Fig. 2 is the schematic layout pattern of a kind of signal shunt in the prior art;
Fig. 3 is the schematic layout pattern of another kind of signal shunt in the prior art;
Fig. 4 is the structural representation that adds transmission line among Fig. 1;
Fig. 5 is the signal simulation eye pattern of a kind of layout of a kind of signal shunt in the prior art;
Fig. 6 is the signal simulation eye pattern of discrete device in a kind of signal shunt in the prior art;
Fig. 7 is the vertical view of an embodiment of signal shunt of the present invention;
Fig. 8 is an A-A cross section view among Fig. 7;
Fig. 9 is that a kind of bending shape is buried the resistance schematic diagram in the prior art;
Figure 10 is the schematic diagram of another embodiment of signal shunt of the present invention.
Embodiment
The present invention is described in detail with preferred embodiment below in conjunction with accompanying drawing.
As shown in Figure 7, be the vertical view among the embodiment of signal shunt of the present invention, and in conjunction with the profile among Fig. 8; Therefrom as can be seen, this signal shunt 1 is arranged on the inside of one deck pcb board 2, this signal shunt 1 comprises the shunt transmission line 14 that is arranged on pcb board inside, described shunt transmission line 14 has three ends 10 and a node 12, distance between this each end 10 and the node 12 is all non-vanishing, as having certain distance, the surface of this pcb board 1 is drawn and extended in these three ends, wherein this signal shunt 1 is represented by dotted lines in the drawings in the part of pcb board 2 inside, represents with solid line in the part on pcb board 2 surfaces.
In some embodiments of the invention, the transmission line of this formation signal shunt 1 can adopt to bury to hinder and realize, so be necessary before will describing these embodiment of the present invention, carries out brief description to burying the resistance technology.
Bury resistance, claim planar resistor (Planar Resistor) or film resistor (Thin Film Resistor) again.It is that resistance is made in the internal layer of printed circuit board (pcb board) with the form of film, is used for substituting the function that realizes discrete resistors.
The resistance shape of burying commonly used has bar shaped (BAR) and bending shape (MEANDER), also can use ring resistance in some cases.Wherein, the resistance stability of bar shaped and bending shape is better than ring resistance.
Fig. 9 shows the schematic diagram that buries resistance of a kind of bending shape (MEANDER) in the prior art.It comprises a plurality of turnings resistance and square resistance, wherein, two similar sides of turning resistance respectively with different square resistance combinations, thereby form the resistance of burying of difform bending shape.The resistance computing formula of burying resistance of this bending shape is R=(0.559M+N) * Rs, and wherein, M is a turning resistance quantity; N is a square resistance quantity; Rs is the square resistance of material.The resistance of each piece turning resistance is 0.559 times of every square resistance.Like this, given resistance just can calculate the value of M, N according to top formula, thereby designs size and shape that concrete bending shape is buried resistance.。
As shown in figure 10, be the schematic diagram of another embodiment of the present invention, wherein show and adopt three to bury the structure that resistance realizes signal shunt.For ease of understanding, please in the lump in conjunction with aforesaid Fig. 7 and Fig. 8.
Signal shunt in the embodiment of the invention, its shunt transmission line 14 comprise three be embedded in described pcb board 2 inside bury resistance (R1, R2 and R3), these three are buried resistance and all have an end directly to be electrically connected at the node place, these three ends 10 of burying the other end (port one, port and port 3) the formation signal shunt of resistance, wherein, comprise an input and two outputs, for example, in an instantiation, signal can be exported from port one, from port 2 and port 3 outputs, in other enforcement, signal also may be from port 2 inputs, from port one and port 3 outputs; Perhaps from port 3 inputs, from port one and port 2 outputs.Show the structural representation of an embodiment of signal shunt of the present invention.This signal shunt 1 comprises that three are buried resistance, and these three are buried the inside that resistance is embedded in a pcb board 2; Described three are buried resistance and all have an end directly to be electrically connected, described three other ends that bury resistance form three port ones 0 of described signal shunt, comprising an input and two outputs, this pcb board 2 surfaces are drawn and extended to these three port end 10, is electrically connected with the copper sheet layer on the surface of this pcb board 2.In other embodiment, this pcb board can be a multi-layer PCB board, and this splitter 1 is embedded in wherein among one deck PCB, for example can be embedded in ground floor or last one deck of this multi-layer PCB board; Described three port ones 0 draw and extend to this layer of this pcb board the surface (as, ground floor or last one deck middle berth have the one side of copper sheet in this pcb board).
Above-mentioned three resistance are bending shape and bury resistance, and its shape and big I obtain by calculating according to the resistance of the above-mentioned formula of mentioning in conjunction with designing requirement.Change by the shape (as length) of burying resistance these three, can change the resistance of burying resistance at an easy rate, thereby design the unlike signal splitter, such as the five equilibrium signal shunt, five equilibrium signal shunt (as the power output of 4: 9 ratios) is not fit to the signal shunt of unlike signal coupling and power division etc.
Only burying resistance with bending shape among Figure 10 is that example describes, and also adopts the resistance (as bar shaped or annular etc.) of burying of other shapes to constitute signal shunt of the present invention in other embodiment.
Splitter in the embodiment of the invention can be applied in the multiple field that relates to high speed transmission of signals.An alternative embodiment of the invention can provide a kind of signal transmission apparatus, it comprises pcb board, be arranged on the signal shunt on the described pcb board, wherein, this signal shunt comprises the shunt transmission line that is arranged on pcb board inside, and this shunt transmission line has three ends and a node, the distance between each end and the described node non-vanishing (as, have certain distance), and the surface of this pcb board is drawn and extended in three ends.When specific implementation, this shunt transmission line comprises three resistances of burying that are embedded in this pcb board inside, these three are buried resistance and all have an end directly to be electrically connected at the node place, and these three other ends that bury resistance form the end of this signal shunt, comprise an input and two outputs.More details can be referring to above-mentioned introduction to splitter.In the application of some reality, this signal transmission apparatus can all high-end in this way optical module single-board devices, and for example its photoelectricity, electro-optical signal switching rate are at 10Gbps or the optical module product more than the 40Gbps.The signal to 10Gbps and above speed thereof at other carries out in the equipment of power division, adopts the scheme of the realization signal shunt of example of the present invention can obviously be better than adopting discrete resistors to realize the scheme of signal shunt.The above-mentioned application scenario of mentioning only be one for example, the present invention includes but be not limited only to this.Embodiments of the invention adopt to bury to hinder to replace discrete resistors in can designing for the PCB of other circuit equally.
To sum up, as can be seen, signal shunt and signal transmission apparatus that the embodiment of the invention proposes, compared following advantage with the splitter or the relevant device that adopt discrete device to realize:
The design of the shunt transmission line (burying resistance) in the pcb board is buried in employing underground, can obviously improve electrical characteristic, owing to there is not discrete device, the stray inductance value is little, has reduced surperficial EMI and has polluted;
Three resistance resistance that bury that are electrically connected directly connect, and its shortening or removed length of transmission line between the three further can improve the signal quality of splitter;
Three are buried resistance and draw three ends altogether to the pcb board surface, have reduced the number of welds on it, can improve anti-knock shock resistance; Simultaneously, save PCB veneer top layer area, improve board integration;
Resistance is embedded in the pcb board, has reduced contaminated chance, thereby has improved the reliability of circuit; And reduced assembly process, reduce PCB processed complex degree, thereby can reduce the PCB cost.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. signal shunt, be arranged in the pcb board, it is characterized in that, described signal shunt comprises the shunt transmission line that is arranged on pcb board inside, described shunt transmission line comprises three resistances of burying that are embedded in pcb board inside, described three are buried resistance and all have an end directly to connect at the node place, and described three other ends that bury resistance form the end of described signal shunt, comprise an input and two outputs.
2. signal shunt as claimed in claim 1 is characterized in that, the end of the described signal shunt that described three other ends that bury resistance form extends to the surface of this pcb board.
3. signal shunt as claimed in claim 2 is characterized in that, three ends of described signal shunt are drawn and extended to this pcb board surface, is electrically connected with the copper sheet on described pcb board surface.
4. as claim 2 or 3 described signal shunts, it is characterized in that, describedly bury resistance and be bar shaped, bending ring shape.
5. a signal transmission apparatus comprises pcb board, is arranged on the signal shunt on the described pcb board, it is characterized in that,
Described signal shunt comprises the shunt transmission line that is arranged on pcb board inside, described shunt transmission line comprises three resistances of burying that are embedded in pcb board inside, described three are buried resistance and all have an end directly to connect at the node place, described three other ends that bury resistance form the end of described signal shunt, comprise an input and two outputs.
6. signal transmission apparatus as claimed in claim 5 is characterized in that, the end of the described signal shunt that described three other ends that bury resistance form extends to the surface of this pcb board.
7. signal transmission apparatus as claimed in claim 6 is characterized in that, three ends of described signal shunt are drawn and extended to this pcb board surface, is electrically connected with the copper sheet on described pcb board surface.
8. signal transmission apparatus as claimed in claim 7 is characterized in that, described pcb board is a multi-layer PCB board, and burying of described splitter hinders in the ground floor or last one deck that is embedded in described multi-layer PCB board.
9. as each described signal transmission apparatus of claim 6 to 8, it is characterized in that, describedly bury resistance and be bar shaped, bending ring shape.
10. signal transmission apparatus as claimed in claim 9 is characterized in that, described signal transmission apparatus is the optical module single-board device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100324547A CN101460006B (en) | 2007-12-14 | 2007-12-14 | Signal shunt and signal transmission equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100324547A CN101460006B (en) | 2007-12-14 | 2007-12-14 | Signal shunt and signal transmission equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101460006A CN101460006A (en) | 2009-06-17 |
| CN101460006B true CN101460006B (en) | 2010-12-08 |
Family
ID=40770556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100324547A Active CN101460006B (en) | 2007-12-14 | 2007-12-14 | Signal shunt and signal transmission equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101460006B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114492291B (en) * | 2022-04-06 | 2022-07-15 | 飞腾信息技术有限公司 | Method and device for designing high-speed serial link, electronic equipment and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4789845A (en) * | 1988-01-20 | 1988-12-06 | Prabhakara Reddy | Broad band hybrid signal splitter |
| US5021755A (en) * | 1989-11-08 | 1991-06-04 | Radio Frequency Systems, Inc. | N-way signal splitter with isolated outputs |
| EP0504850B1 (en) * | 1991-03-18 | 1996-09-04 | Hitachi, Ltd. | Laser machining method and apparatus therefor |
| CN2814696Y (en) * | 2005-06-23 | 2006-09-06 | 武汉凡谷电子技术股份有限公司 | Large power circuit combiner |
-
2007
- 2007-12-14 CN CN2007100324547A patent/CN101460006B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4789845A (en) * | 1988-01-20 | 1988-12-06 | Prabhakara Reddy | Broad band hybrid signal splitter |
| US5021755A (en) * | 1989-11-08 | 1991-06-04 | Radio Frequency Systems, Inc. | N-way signal splitter with isolated outputs |
| EP0504850B1 (en) * | 1991-03-18 | 1996-09-04 | Hitachi, Ltd. | Laser machining method and apparatus therefor |
| CN2814696Y (en) * | 2005-06-23 | 2006-09-06 | 武汉凡谷电子技术股份有限公司 | Large power circuit combiner |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101460006A (en) | 2009-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101714681B (en) | Electro-magnetic bandgap structure | |
| CN110782035B (en) | Multi-coupling-cavity superconducting quantum bit layout structure and quantum chip | |
| CN100556243C (en) | The transmission hole of high-frequency wideband impedance matching | |
| CN102307142A (en) | Back plate system | |
| CN203760616U (en) | Power divider multilayer microstrip circuit | |
| WO2013181494A1 (en) | Communication connector with crosstalk compensation | |
| CN102945996B (en) | Multilayer three-dimensional balun and balanced/imbalanced signal conversion network | |
| CN101460006B (en) | Signal shunt and signal transmission equipment | |
| CN103067315B (en) | A kind of analog cable is from the method for crosstalk and device | |
| CN104053299A (en) | Differential passive equalizer | |
| US8536456B2 (en) | Printed circuit board | |
| CN204045707U (en) | Novel combiner | |
| CN203277596U (en) | Phase shifter | |
| CN102686027A (en) | Flexible circuit board and manufacturing method thereof | |
| CN102761314B (en) | Single-chip power divider and manufacture method thereof and single-chip power combiner | |
| CN100561487C (en) | Printed circuit board (PCB) with multi-load topology cabling architecture | |
| CN103455104B (en) | A kind of power board and blade server | |
| CN114501796B (en) | Vehicle-mounted gateway printed circuit board | |
| CN103037614B (en) | A kind of backboard and method for designing thereof improving High speed rear panel crosstalk performance | |
| CN213937964U (en) | PCB (printed circuit board) compatible with network port and router | |
| CN104934665A (en) | Ultrahigh frequency wave band selective microwave filter bank | |
| CN101154998A (en) | Bus system | |
| CN105027518A (en) | Interconnection system for communications device | |
| CN109155451A (en) | For the carrier wave configuration of electro-optic module, the electro-optic module using it, the interconnection structure for electronic unit to be coupled to optical device | |
| CN207491126U (en) | A kind of data distribution system available for LED display |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |