CN101442880A - Conversion method for layer-exchange hole-through conductive capability in PCB - Google Patents
Conversion method for layer-exchange hole-through conductive capability in PCB Download PDFInfo
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- CN101442880A CN101442880A CNA2008101581393A CN200810158139A CN101442880A CN 101442880 A CN101442880 A CN 101442880A CN A2008101581393 A CNA2008101581393 A CN A2008101581393A CN 200810158139 A CN200810158139 A CN 200810158139A CN 101442880 A CN101442880 A CN 101442880A
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- copper foil
- thickness
- pcb
- hole
- copper
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000011889 copper foil Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 3
- 150000001879 copper Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a conversion method for conducting power of layer exchanging through hole in PCB. In the method, d is defined as a through hole diameter, where the through hole is a copper foil cylinder which can be developed into a copper foil cuboid with the width as pid. In PCB design, the through hole is identical with a copper foil with the thickness of pid, where pi=3.14. The thickness of copper foil cover in PCB is 1/2oz, 1oz and 2oz, where oz is thickness unit, 1oz=35um. The conducting power of copper foil increases with its thickness, but the copper thickness in the through hole is indefinite, so a margin calculation is necessary. The through hole is equal to a copper foil electric conductor with a width of pid and thickness of 1/2oz; the conducting power is proportional to d and oz; thus a conversion formula of through hole diameter d, copper foil thickness oz and conducting current A is acquired: A=1/2pidoz; and a fast polling list of layer exchanging through hole diameter, copper foil cover thickness and width, and conducting power under different temperature in PCB is required through the formula.
Description
Technical field
The present invention relates to the method for designing of layer-exchange hole-through and conductive capability among a kind of PCB, the conversion method of layer-exchange hole-through conductive capability among specifically a kind of PCB.
Background technology
In present circuit design, the operating voltage of chip is more and more lower, and by formula P=UI, U is a voltage under the situation of input power conservation, and I is an electric current, has also just caused input current increasing.Therefore the problem of handling big electric current becomes the problem that the designer must face.When in PCB design, handling the big electric current with layer, can adopt overstriking conductor width or increase to cover the width of copper and the method for thickness solves; But on one deck, circulate incessantly with a kind of power supply, often need stride layer connects, (for example, power supply is segmented in internal layer, and chip is at skin, then chip need be from the internal layer power taking), when striding layer, power supply connects by via hole (Via), and therefore is the problem that occurs how to add via hole? add much via holes? what via holes does this add? striding layer at power supply connects by via hole, bottleneck will occur if via hole is too small or number is very few, cause system's electricity shortage; The hole is excessive or number is too much, can cause pcb board space of planes deficiency again, or the problems such as the copper layer batters down of covering of internal layer, good solution is not also arranged at present.
Summary of the invention
The objective of the invention is to solve problem how to utilize via hole to strengthen the ducting capacity of big electric current when in PCB power supply changes layer, the conversion method of layer-exchange hole-through conductive capability among a kind of PCB is provided.
The objective of the invention is to realize in the following manner, setting d is a via diameter, and the true stereo shape of via hole is exactly a Copper Foil cylinder, and drum diameter is d, can learn from solid geometry knowledge, and cylinder can expand into one and widely be the thin cuboid of π d; Therefore we can be equal to via hole substantially one and widely are the Copper Foil of π d in the PCB design, π=3.14 wherein, the thickness that covers copper among the general PCB has 1/2oz, 1oz, 2oz etc., and wherein oz is the unit of the expression copper thickness among the PCB, 1oz=35um, Copper Foil is thick more, conductive capability is strong more, because the filling copper thickness in the reason via hole of PCB production technology is indefinite, calculates so we do the surplus of insuring most, via hole is equal to a wide π d of being, thickness is the Copper Foil of 1/2oz.
Beneficial effect: according to above setting, as long as determine in the PCB design employing hole size just can converse size by electric current, otherwise determine size by electric current, just can converse the size of employing via diameter.Can calculate the conductive capability of used via hole fast by converting or tabling look-up, how utilize via hole to strengthen the problem of the ducting capacity of big electric current thereby solved easily in PCB when power supply changes layer.
Description of drawings
Accompanying drawing is the section structure schematic diagram of layer-exchange hole-through among the PCB.
Execution mode
Explain below with reference to Figure of description conversion method of the present invention being done.
The conversion method of layer-exchange hole-through conductive capability among a kind of PCB of the present invention, as shown in drawings, one via hole is in four layers of pcb board, d is a via diameter, the true stereo shape of via hole is exactly a Copper Foil cylinder in fact, drum diameter is d, can learn from solid geometry knowledge, and cylinder can expand into one and widely be the thin cuboid of π d; Therefore we can be equal to via hole substantially one and widely are the Copper Foil of π d (π=3.14) in the PCB design.The thickness that covers copper among the general PCB has 0.5oz, 1oz, 2oz etc., and (oz is the unit of the expression copper thickness among the PCB, 1oz=35um, Copper Foil is thick more, conductive capability is strong more), because the filling copper thickness in the reason via hole of PCB production technology is indefinite, so we do the surplus of insuring most and calculate, via hole is equal to a wide π d of being, thickness is the Copper Foil of 0.5oz.
By above processing, obtain the conductive capability question blank of the Copper Foil of different in width and thickness, according to the hole size of crossing in the own PCB design, can calculate the conductive capability of used via hole, how utilize via hole to strengthen the problem of the ducting capacity of big electric current thereby solved in PCB when power supply changes layer.What influence conductive capability covers Copper Foil width and temperature factor in addition, and correspondence is all arranged in the conversion table.
Embodiment 1: in certain PCB design, there is source current size to be 10A, when connecting cabling, need change to the second layer from ground floor, then this power supply need connect by via hole when changing layer, the hole size excessively that needs in design is diameter d=0.010inch, then calculate the Copper Foil that each via hole is equivalent to π d=3.14 * 0.010inch=0.0314inch ≈ 0.030inch, determine that with the surplus of insuring most this copper thickness is 0.5oz according to method described herein.The Copper Foil conductive capability that checks in 0.030inch by the hole-through conductive capability conversion table is 1.1A, and the conductive capability that promptly is equivalent to each via hole is 1.1A, therefore, the electric current of water conservancy diversion 10A to need to make a call to 10 such via holes at least.
Embodiment 2: in certain PCB design, there is source current size to be 20A, when connecting cabling, need change to the second layer from ground floor, then this power supply need connect by via hole when changing layer, the hole size excessively that needs in design is diameter d=0.025inch, then calculate the Copper Foil that each via hole is equivalent to π d=3.14 * 0.025inch=0.0785inch ≈ 0.075inch, determine that with the surplus of insuring most this copper thickness is 0.5oz according to method described herein.The Copper Foil conductive capability that checks in 0.075inch by conversion table is 2A, and the conductive capability that promptly is equivalent to each via hole is 2A, therefore, the electric current of water conservancy diversion 20A to need to make a call to 10 such via holes at least.
The hole-through conductive capability conversion table
Claims (1)
1. the conversion method of layer-exchange hole-through conductive capability among the PCB is characterized in that setting d is a via diameter, and via hole is a Copper Foil cylinder, and cylinder expands into one and widely is the Copper Foil cuboid of π d; In PCB design, via hole is equal to one and widely is the Copper Foil of π d, π=3.14 wherein, the thickness that covers Copper Foil among the PCB has 1/2oz, 1 oz, three kinds of 2oz, wherein oz is the unit of copper thickness among the expression PCB, 1oz=35um, Copper Foil is thick more, conductive capability is strong more, because of the filling copper thickness in the via hole indefinite, therefore doing surplus calculates, via hole is equal to a wide π d of being, thickness is the Copper Foil electric conductor of 1/2 oz, conductive capability is directly proportional with the size of d and oz, draws via diameter d with this, the reduction formula A=1/2 π d oz of copper thickness oz and conductive current A, the aperture that draws layer-exchange hole-through among the PCB by reduction formula equally, cover copper thickness, the quick search table of conductive capability under width and the different temperatures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101581393A CN101442880B (en) | 2008-10-24 | 2008-10-24 | Conversion method for layer-exchange hole-through conductive capability in PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101581393A CN101442880B (en) | 2008-10-24 | 2008-10-24 | Conversion method for layer-exchange hole-through conductive capability in PCB |
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| Publication Number | Publication Date |
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| CN101442880A true CN101442880A (en) | 2009-05-27 |
| CN101442880B CN101442880B (en) | 2010-09-08 |
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| CN2008101581393A Active CN101442880B (en) | 2008-10-24 | 2008-10-24 | Conversion method for layer-exchange hole-through conductive capability in PCB |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427663A (en) * | 2011-09-13 | 2012-04-25 | 四川卫士通信息安全平台技术有限公司 | Control method of high speed PCB design signal impedance |
| CN102548205A (en) * | 2012-01-19 | 2012-07-04 | 华为技术有限公司 | Golden finger and plate edge interconnection device |
| CN105912783A (en) * | 2016-04-12 | 2016-08-31 | 浪潮集团有限公司 | Method and device for detection of PCB design scheme |
| CN108112165A (en) * | 2018-01-25 | 2018-06-01 | 郑州云海信息技术有限公司 | A kind of power vias structure and power vias put design method |
| CN108925045A (en) * | 2018-07-05 | 2018-11-30 | 深圳市鑫晨丰电子有限公司 | A kind of method of flexible circuit board route low resistance control |
| CN113391187A (en) * | 2020-03-13 | 2021-09-14 | 浙江宇视科技有限公司 | Standard detection method, system and device for circuit board routing through flow |
| CN114184831A (en) * | 2021-11-04 | 2022-03-15 | 苏州浪潮智能科技有限公司 | Method and system for detecting through-current capacity of power copper sheet |
-
2008
- 2008-10-24 CN CN2008101581393A patent/CN101442880B/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427663A (en) * | 2011-09-13 | 2012-04-25 | 四川卫士通信息安全平台技术有限公司 | Control method of high speed PCB design signal impedance |
| CN102548205A (en) * | 2012-01-19 | 2012-07-04 | 华为技术有限公司 | Golden finger and plate edge interconnection device |
| US9699901B2 (en) | 2012-01-19 | 2017-07-04 | Huawei Technologies Co., Ltd. | Golden finger and board edge interconnecting device |
| CN105912783A (en) * | 2016-04-12 | 2016-08-31 | 浪潮集团有限公司 | Method and device for detection of PCB design scheme |
| CN105912783B (en) * | 2016-04-12 | 2019-07-02 | 山东浪潮人工智能研究院有限公司 | The method and device that a kind of pair of PCB design scheme is detected |
| CN108112165A (en) * | 2018-01-25 | 2018-06-01 | 郑州云海信息技术有限公司 | A kind of power vias structure and power vias put design method |
| CN108925045A (en) * | 2018-07-05 | 2018-11-30 | 深圳市鑫晨丰电子有限公司 | A kind of method of flexible circuit board route low resistance control |
| CN113391187A (en) * | 2020-03-13 | 2021-09-14 | 浙江宇视科技有限公司 | Standard detection method, system and device for circuit board routing through flow |
| CN113391187B (en) * | 2020-03-13 | 2023-09-15 | 浙江宇视科技有限公司 | Method, system and device for detecting standard of wiring throughput of circuit board |
| CN114184831A (en) * | 2021-11-04 | 2022-03-15 | 苏州浪潮智能科技有限公司 | Method and system for detecting through-current capacity of power copper sheet |
| CN114184831B (en) * | 2021-11-04 | 2024-01-26 | 苏州浪潮智能科技有限公司 | Method and system for detecting current capacity of power copper sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101442880B (en) | 2010-09-08 |
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