CN101426356A - Construction for heat radiating device - Google Patents
Construction for heat radiating device Download PDFInfo
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- CN101426356A CN101426356A CNA2007101821000A CN200710182100A CN101426356A CN 101426356 A CN101426356 A CN 101426356A CN A2007101821000 A CNA2007101821000 A CN A2007101821000A CN 200710182100 A CN200710182100 A CN 200710182100A CN 101426356 A CN101426356 A CN 101426356A
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- radiating
- heat
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- fin
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Abstract
A heat radiator structure increases the spacing distance between the radiating fins through designing the shape of radiating fin to the conical body, thereby the air convection can take off more heat. Additionally a heat absorbing part is provided on the bottom with a projection mode for absorbing more heat from a heating component on a printed circuit board for increasing the heat absorbed in unit time. Furthermore an extending part is increased for increasing the heat radiating efficiency in unit time. The technical facility according to the invention can settle the problem that the heat radiating requirement can be satisfied through additionally arranging an additional radiating assembly on the radiating fins in the heat radiator in the prior art, thereby a technical efficacy of increasing the heat radiating efficiency can be obtained.
Description
Technical field
A kind of construction for heat radiating device, mean especially especially a kind of to radiating fin shape and configuration, and the construction for heat radiating device improved of heat abstractor body construction.
Background technology
Along with the progress of science and technology, the usefulness of electronic product strengthens day by day.Yet during owing to the electronic product running, the not in addition suitably dissipation of these heat energy all can produce heat energy, if can cause electronic product usefulness to reduce, can cause burning of electronic product more even, so heat abstractor has become one of outfit indispensable in the electronic product now.
Heat abstractor in the past be all at central processing unit (Central Processing Unit CPU) designs, but since now the image quality and the fluency of Games Software constantly promote, the display card that usefulness is powerful is also brought in constant renewal in.The 3D figure extremely present by Hercules the earliest quickens display card, and Industry Standard Architecture standard (Industry Standard Architecture bus is gone through in the design of display card, ISAbus), image electronic engineering ANSI local bus (Video Electronic Standard AssociationLocal bus, VESA Local bus), Peripheral Component Interconnect bus (Peripheral ComponentInterconnect bus, PCI bus), advance rank/Accelerated Graphics Port bus (Advanced/AcceleratedGraphics Port bus, AGP bus) up to present PCI Express bus (PeripheralComponent Interconnect Express bus, PCI-E bus), utilize above-mentioned various distinct interface design, to overcome the demand of high-order demonstration to document circulation.Therefore, also must do corresponding design, make the processing speed of shows wafer can meet the demand of high-order demonstration document circulation in shows wafer.
Yet, along with the operating frequency of shows wafer increases, and cooperate more jumbo display-memory, make display card can handle a large amount of data computings, to deal with the work of high-order graphic operation.But incident is that the caloric value of shows wafer and display-memory greatly increases, cause temperature too high and influence the usefulness of whole system running easily, so in order to help the heat radiation of heater elements such as shows wafer and display-memory, the practice of prior art ties up to the mode of using radiating fin to add the extra heat dissipation assembly on the heat abstractor and satisfies the demand of heat radiation rapidly, this type of heat abstractor includes: the combination of the combination of radiating fin and radiator fan, radiating fin and heat pipe, or radiating fin, heat pipe and radiator fan three's combination.
With Fig. 1 is example, and Fig. 1 is the heat abstractor schematic diagram of prior art.In Fig. 1, it is high heat-conduction coefficient metal fin 13 (being radiating fin) to be provided with many fin shapes, be close to printed circuit board (PCB) (Printed Circuit Board, PCB) heater element 12 on 11, using increases the area that heater element 12 contacts with air, and in conjunction with radiator fan 14, extracts or blow to air-flow out high thermal conductivity coefficient metal fin 13 by the rotation of radiator fan 14, the heat energy that heater element 12 is produced is taken away, and then reached the effect of rapid heat radiation.
This kind radiating mode, mainly be the design of radiating fin itself, because radiating fin is designed to the rectangular planes shape, therefore working as air-flow is entered by the top, can vertically hit and produce the turbulent flow and the pressure loss to the bottom, cause the reduction heat exchanger effectiveness, causing must be by collocation extra heat dissipation element, can be at short notice rapidly with heat energy dissipation that heater element produced.But, but because increase extra heat dissipation element, can cause power consumption to increase, noise, cost increase the problem that takes up space.
In sum, prior art has existed the extra heat dissipation assembly of all must arranging in pairs or groups in addition on radiating fin on the heat abstractor can satisfy the problem of radiating requirements always since the midium or long term as can be known, therefore is necessary to propose improved technological means, solves this problem.
Summary of the invention
Because prior art exists the extra heat dissipation assembly of all must arranging in pairs or groups in addition on radiating fin on the heat abstractor can satisfy the problem of radiating requirements, the present invention discloses a kind of construction for heat radiating device then, wherein:
The disclosed construction for heat radiating device of the present invention is fixed on the printed circuit board (PCB) with heater element and a plurality of electronic components, and in order to heater element is dispelled the heat, it comprises: bottom, extension, first group of radiating fin and second group of radiating fin.Wherein, the one side that the bottom is fixed on printed circuit board (PCB) more convexes with the endothermic section, and the endothermic section directly is contacted with heater element and absorbs heat; Extension from the bottom one side extend it; First group of radiating fin is located at the bottom another side, comprises a plurality of radiating fins, and the shape of each radiating fin is cone-shaped; Second group of radiating fin is located on this extension with this first group of identical one side of radiating fin, comprises a plurality of radiating fins.
The disclosed construction for heat radiating device of the present invention as above, and the difference between the prior art is that the present invention passes through the endothermic section, can increase the heat that the spontaneous heating element is absorbed in the unit interval, to promote endothermic heat; By pyramidal radiating fin, can increase the spacing distance between the radiating fin, make cross-ventilation can take away more thermal energy, to promote radiating efficiency; More on the heat abstractor body, increase extension, can increase the heat energy dissipation in the unit interval, promote radiating efficiency.
Therefore, construction for heat radiating device of the present invention can leave heat energy at short notice by above-mentioned technological means, can can also reach the technology effect that radiating efficiency increases not needing additionally to increase the radiating requirements that can satisfy under the prerequisite of radiating subassembly on the printed circuit board (PCB) now.
By above-mentioned technological means, the present invention can reach the technology effect that radiating efficiency increases.
Description of drawings
Fig. 1 is a heat abstractor cutaway view of the prior art.
Fig. 2 is a construction for heat radiating device stereogram of the present invention.
Fig. 3 is a construction for heat radiating device side view of the present invention.
Fig. 4 is the present invention bottom and first group of radiating fin partial enlarged drawing.
Fig. 5 is extension of the present invention and second group of radiating fin partial enlarged drawing.
Fig. 6 is construction for heat radiating device of the present invention and printed circuit board (PCB) three-dimensional exploded view.
Fig. 7 is construction for heat radiating device of the present invention and printed circuit board (PCB) stereo appearance figure.
Fig. 8 is construction for heat radiating device of the present invention and printed circuit board (PCB) cutaway view.
Fig. 9 is the local amplification view of fixed form of the present invention.
Embodiment
Below describe conjunction with figs. and embodiment in detail embodiments of the present invention, by this to the present invention how the application technology means implementation procedure that solves technical problem and reach technique effect can fully understand and implement according to this.
At first introduce construction for heat radiating device of the present invention, please refer to shown in Figure 2ly, Fig. 2 is a construction for heat radiating device stereogram of the present invention.The disclosed construction for heat radiating device of the present invention, it comprises: bottom 20, extension 30, first group of radiating fin 40 and second group of radiating fin 50.
Construction for heat radiating device of the present invention, can be applied to having on the printed circuit board (PCB) of computing wafer and a plurality of electronic component, as a rule, the computing wafer is main heater element place, can the heater element on the printed circuit board (PCB) be dispelled the heat by heat abstractor.
Described printed circuit board (PCB) can be motherboard or interface card, with motherboard, the computing wafer of motherboard be central processing unit (Central Processing Unit, CPU); With interface card, interface card can be display card or drafting card, the computing wafer of interface card be graphic process unit (GraphicProcessing Unit, GPU), for above-mentioned computing wafer, heater elements that can dispel the heat for construction for heat radiating device of the present invention all.
First group of radiating fin 40 is located at bottom 20 another sides, comprise a plurality of radiating fins 41, and the shape of each radiating fin 41 is cone-shaped.
Second group of radiating fin 50 is located on the extension 30 with first group of radiating fin 40 identical one side, comprises a plurality of radiating fins 51.
Then further specify the present invention to radiating fin shape and configuration by Fig. 3 to Fig. 5, and the technical characterictic improved of heat abstractor body construction.
At first, convex with endothermic section 21, and first group of radiating fin 40 shape and configuration describe at bottom 20.At this, please also refer to Fig. 3 and Fig. 4, Fig. 3 is a construction for heat radiating device end view of the present invention; Fig. 4 is the present invention bottom and first group of local enlarged diagram of radiating fin.
Heat abstractor of the prior art 20 there is no and is convexly equipped with endothermic section 21 in the bottom, and therefore the cumulative volume that can absorb heat in the unit interval is restricted.And heat abstractor of the present invention absorbs the heat energy of the heater element 61 on the printed circuit board (PCB) 60 via endothermic section 21, because the endothermic section 21 that bottom 20 is convexly equipped with increases bottom 20 cumulative volumes that can absorb heat in the unit interval, therefore, then can increase the heat that heater element 61 absorbs on printed circuit board (PCB) 60.As sponge sucks in water principle, the sponge that volume is big more, the absorbent water yield of institute is also many more.Therefore, the bottom 20 that volume is big more, the absorbent heat of institute is also many more, promotes endothermic heat.
Heat abstractor of the present invention utilizes heat-conduction principle to absorb the heat energy of the heater element 61 on the printed circuit board (PCB) 60 via endothermic section 21, and is transmitted to bottom 20, first groups of radiating fins 40, extension 30 and second group of radiating fin 50.Because the shape of first group of radiating fin 40 each radiating fin 41 is cone-shaped, therefore, as shown in Figure 4, can be near spacing between the radiating fin 41 of bottom 20 less than spacing between radiating fin 41 tops, can avoid prior art because radiating fin is designed to the rectangular planes shape, therefore can vertically hit to the bottom 20 and produce the turbulent flow and the pressure loss when air-flow is entered by the top, cause the problem that reduces heat exchanger effectiveness.
And design of the present invention just can make air-flow slip into bottom 20 in the inclination mode, makes air-flow reduce turbulent flow and produces and the pressure loss, and then promote heat exchanger effectiveness.In addition the geometry of radiating fin 41 can have influence on air fluid by the time can take away the number of heat, because the shape of radiating fin 41 of the present invention is cone-shaped, therefore, the air capacity that can pass through increases, when making air stream through radiating fin, can take away heat increases.
In order to make the air radiating fin 41 of can flowing through more smoothly, reducing turbulent flow produces and the pressure loss, and then lifting heat exchanger effectiveness, spacing can make that spacing is circular-arc between the radiating fin 41 through design between the radiating fin 41 of bottom 20, the design of fit circular arc shape, then make air-flow slip into bottom 20 in the inclination mode, it is circular-arc to flow through, and more can reduce turbulent flow and produce and the pressure loss, more promotes heat exchanger effectiveness.
Because first group of radiating fin 40 must be positioned at heater element 61 tops on the printed circuit board (PCB) 60, causes first group of radiating fin 40 can be confined to space factor.Therefore, the radiating fin 41 that first group of radiating fin 40 comprised only can be provided with each radiating fin 41 with parallel mode, and is uniformly-spaced to be provided with between the radiating fin 41 of first group of radiating fin 40.
Then, please be simultaneously with reference to Fig. 3 and shown in Figure 5, Fig. 5 is extension of the present invention and second group of local enlarged diagram of radiating fin.As shown in the figure, second group of radiating fin 50 is located on the extension 30 with first group of radiating fin 40 identical one side, comprises a plurality of radiating fins 51; And extension 30 20 is stretched to an epitaxial lateral overgrowth of electronic component 62 from the bottom with the height that is higher than electronic component 62, because all higher electronic component 62 can be arranged around the heater element 61, so so the main system of design is used for avoiding at heater element 61 other electronic components 62 on every side.
Can know according to radiating principle, big more area, radiating efficiency is good more, therefore, heat abstractor of the present invention more increases the extension 30 that 20 1 sides are extended from the bottom except the bottom 20 of heater element top, the design of extension 30 more increases the area of dissipation of heat abstractor, more help heat energy that the heater element on the printed circuit board (PCB) 60 61 is produced, by heat abstractor of the present invention with heat energy dissipation.
The shape of second group of radiating fin 50 each radiating fin 51 and first group of radiating fin 40 are identical to be cone-shaped, and the radiating effect that it reached does not repeat them here as previously mentioned, and only second group of radiating fin 50 is to take radial setting at radiating fin 51.Because first group of radiating fin 40 be confined to space factor, but second group of radiating fin 50 there is no the limiting factor on the space, therefore, takes radial setting more can increase air capacity, and heat that can dissipation also increases.
But the radiating fin 51 that the rectangular shape of shape of second group of radiating fin 50 each radiating fin 51, second group of radiating fin 50 are comprised is for be arrangeding in parallel, and is uniformly-spaced to be provided with between the radiating fin 51 of second group of radiating fin 50; Because, first group of radiating fin 40 is confined to space factor, but second group of radiating fin 50 there is no and be confined to space factor, so that above-mentioned radiating fin 51 shapes can be is cone-shaped or rectangular-shaped, radiating fin 51 is for radial setting or be arranged in parallel, notion with permutation and combination, comprise four kinds of combinations altogether, all can be included in the scope of design of second group of radiating fin 50 of the present invention.
Because heat abstractor in the past there is no crashproof design, therefore, radiating fin when the outside (for example: the collision when interface card drops ground) is subjected to the external force influence, can make that radiating fin is easy to generate deformation, and have influence on spacing distance between the radiating fin, and then have influence on the radiating efficiency of integral heat dissipation means.Therefore, the present invention increases the thickness crashproof design bigger than other radiating fins in the part of first group of radiating fin 40 and second group of radiating fin 50 outer most edge more respectively.As shown in Figure 3, the radiating fin 41 of first group of radiating fin 40 outer most edge is defined as the first crashproof fin 42 on the bottom 20, the radiating fin 51 of second group of radiating fin 50 outer most edge is defined as the second crashproof fin 52 on the extension 30, and the thickness of the first crashproof fin 42 and the second crashproof fin 52 is greater than all the other first group of radiating fin, 40 radiating fins 41 and second group of radiating fin 50 radiating fin 51.
Because the first crashproof fin 42 and second crashproof fin 52 thickness increase; the rigidity of the first crashproof fin 42 and the second crashproof fin 52 is increased; can have the precipitate external impulsive force of absorption; so; can reach crashproof effect, and then protect beyond the first crashproof fin 42 and the second crashproof fin 52 other radiating fins can not be subjected to external force to influence.
By shown in Figure 6, Fig. 6 is construction for heat radiating device of the present invention and printed circuit board (PCB) three-dimensional exploded view again.
Because the present invention is applied to the heat radiation of heater element 61 on the printed circuit board (PCB) 60, therefore bottom 20 must be fixed on the printed circuit board (PCB) 60 by retaining element 70, the disclosed retaining element 70 of accompanying drawing adopts screw-in version that bottom 20 and printed circuit board (PCB) 60 are connected to a fixed, stereo appearance figure after its combination has as shown in Figure 7, further specifies as follows:
Please be simultaneously with reference to Fig. 8 and shown in Figure 9, Fig. 8 is construction for heat radiating device of the present invention and printed circuit board (PCB) cutaway view; Fig. 9 is the local amplification view of fixed form of the present invention.
Wherein, retaining element 70 comprises: the double-screw bolt 71 that height is identical with endothermic section 21, and a side of double-screw bolt 71 convexes with first projection 72 and first projection 72 has external screw thread, and the opposite side of double-screw bolt 71 convexes with second projection 73 and second projection 73 has internal thread.
60 second projection, 73 relative positions according to above-mentioned double-screw bolt 71 of printed circuit board (PCB) are provided with hole, and be provided with shim elements 74, use screws or second projection 73 of nut and double-screw bolt 71 is screwed by hole and shim elements 74,20 are fixed on the printed circuit board (PCB) 60 by retaining element 70 bottom making.
In order to make the closely heater element 61 on the contact print circuit board 60 of endothermic section 21, and have concurrently and stablize construction for heat radiating device of the present invention, and promote endothermic effect, therefore, retaining element 70 outsides more are coated with cushion 75, in order to the element 70 that is coated and fixed.
Above-mentioned retaining element is only with embodiment explanation, but do not limit to the present invention with this, any fixed form that can reach fixed effect, for example: clamping, fastening ... etc. fixed form, the scopes that can protect for this patent all.
In sum, the difference between the present invention and the prior art is that the present invention by being cone-shaped with the radiating fin shaped design, increases the spacing distance between the radiating fin as can be known, makes cross-ventilation can take away more thermal energy; Be convexly equipped with the heater element of endothermic section on printed circuit board (PCB) in addition again in the bottom and absorb more heat, to promote the endothermic heat in the unit interval; And the increase extension is to promote the radiating efficiency in the unit interval.Can solve the existing in prior technology problem by this technological means, and then reach the technique effect that radiating efficiency increases.
Though the disclosed execution mode of the present invention as above, described content is not in order to direct qualification scope of patent protection of the present invention.Any persond having ordinary knowledge in the technical field of the present invention under the prerequisite that does not break away from the disclosed spirit and scope of the present invention, can do a little change and retouching what implement in form and on the details.Scope of patent protection of the present invention, still must with appending claims the person of being defined be as the criterion.
Claims (13)
1, a kind of construction for heat radiating device, in order to be fixed on the printed circuit board (PCB) with a heater element and a plurality of electronic components, this heat abstractor dispels the heat to this heater element, and it comprises:
The one side that this printed circuit board (PCB) is fixed in one bottom, this bottom more convexes with an endothermic section, and this endothermic section is in order to contact this heater element;
One extension, this bottom one side is extended it certainly;
One first group of radiating fin is located on this bottom another side, comprises a plurality of radiating fins, and each radiating fin is cone-shaped; And
One second group of radiating fin is located on this extension with this first group of identical one side of radiating fin, comprises a plurality of radiating fins.
2, construction for heat radiating device as claimed in claim 1, wherein this printed circuit board (PCB) is a motherboard or an interface card.
3, construction for heat radiating device as claimed in claim 2, wherein this interface card is a display card or a drafting card.
4, construction for heat radiating device as claimed in claim 1 wherein is uniformly-spaced to be provided with one between those radiating fins of this first group of radiating fin.
5, construction for heat radiating device as claimed in claim 1, wherein each radiating fin of this second group of radiating fin is cone-shaped or rectangular-shaped.
6, construction for heat radiating device as claimed in claim 1, wherein this first group of radiating fin and this second group of those radiating fin that radiating fin comprised are for be arrangeding in parallel.
7, construction for heat radiating device as claimed in claim 1, wherein these second group of those radiating fin that radiating fin comprised is radial setting.
8, construction for heat radiating device as claimed in claim 1 wherein is uniformly-spaced to be provided with one between those radiating fins of this second group of radiating fin.
9, construction for heat radiating device as claimed in claim 1 wherein is that the bottom is circular-arc between those radiating fins of this first group of radiating fin and this second group of radiating fin.
10, construction for heat radiating device as claimed in claim 1, wherein this extension with the height that is higher than those electronic components from this bottom the epitaxial lateral overgrowth to those electronic components stretch.
11, construction for heat radiating device as claimed in claim 1, wherein the radiating fin of last this first group of radiating fin outer most edge in this bottom is defined as one first crashproof fin, the radiating fin of this second group of radiating fin outer most edge is defined as one second crashproof fin on this extension, and the thickness of this first crashproof fin and this second crashproof fin is greater than all the other those radiating fins.
12, construction for heat radiating device as claimed in claim 1, wherein this bottom is provided with a plurality of retaining elements around this endothermic section.
13, construction for heat radiating device as claimed in claim 12, wherein those retaining element outsides more are coated with a cushion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101821000A CN101426356A (en) | 2007-10-31 | 2007-10-31 | Construction for heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101821000A CN101426356A (en) | 2007-10-31 | 2007-10-31 | Construction for heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101426356A true CN101426356A (en) | 2009-05-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101821000A Pending CN101426356A (en) | 2007-10-31 | 2007-10-31 | Construction for heat radiating device |
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| Country | Link |
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| CN (1) | CN101426356A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102340970A (en) * | 2010-07-26 | 2012-02-01 | 富瑞精密组件（昆山）有限公司 | Heat dissipation apparatus |
| CN106712366A (en) * | 2017-01-09 | 2017-05-24 | 成都聚立汇信科技有限公司 | Generator heat radiation housing structure |
| CN104156046B (en) * | 2014-08-21 | 2017-12-29 | 深圳市杰和科技发展有限公司 | Radiator and video card |
| JP2022174590A (en) * | 2021-05-11 | 2022-11-24 | 株式会社ゴフェルテック | Heat sink and manufacturing method thereof |
-
2007
- 2007-10-31 CN CNA2007101821000A patent/CN101426356A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102340970A (en) * | 2010-07-26 | 2012-02-01 | 富瑞精密组件（昆山）有限公司 | Heat dissipation apparatus |
| CN104156046B (en) * | 2014-08-21 | 2017-12-29 | 深圳市杰和科技发展有限公司 | Radiator and video card |
| CN106712366A (en) * | 2017-01-09 | 2017-05-24 | 成都聚立汇信科技有限公司 | Generator heat radiation housing structure |
| JP2022174590A (en) * | 2021-05-11 | 2022-11-24 | 株式会社ゴフェルテック | Heat sink and manufacturing method thereof |
| JP7454247B2 (en) | 2021-05-11 | 2024-03-22 | 株式会社ゴフェルテック | heat sink |
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Open date: 20090506 |