CN101414499A

CN101414499A - Multi-layer type over-current and over-temperature protection structure, and preparation method thereof

Info

Publication number: CN101414499A
Application number: CNA2007101818582A
Authority: CN
Inventors: 黄建豪
Original assignee: Inpaq Technology Co Ltd
Current assignee: Inpaq Technology Co Ltd
Priority date: 2007-10-19
Filing date: 2007-10-19
Publication date: 2009-04-22

Abstract

The invention relates to a multi-layer over-current and over-temperature protection structure, and a fabrication method thereof. Based on a multi-layer circuit board design concept, more than two layers of over-current and over-temperature protection components are integrated on a component structure, and the finished product is adhered to a base plate in a surface adhesion manner. Therefore, the multi-layer over-current and over-temperature protection structure can simultaneously have more than two over-current and over-temperature protection functions. The protection structure has the advantages of being capable of effectively integrating two or more than two over-current and over-temperature protection components to expand the application range thereof, effectively reducing the volume of the over-current and over-temperature protection components on a circuit board, and reducing the number of soldered joints.

Description

The overcurrent of multiple field and over-temperature protection structure and preparation method thereof

Technical field

The present invention relates to a kind of overcurrent and over-temperature protection structure and preparation method thereof, refer to a kind of overcurrent of multiple field and over-temperature protection structure and preparation method thereof especially.

Background technology

Following electronic product will be towards having light, thin, short, little function, so that electronic product can more be tending towards miniaturization.And passive device (passive component) shared area in electronic product is the hugest, so integrated passive element effectively will make that electronic product can reach gently, thin, short, little function.

Yet the design of existing passive device is all based on simple function.Therefore, when the passive device that difference in functionality need be installed when electronic product was protected electronic product, prior art only can be provided with the passive device of a plurality of simple functions in electronic product.Therefore the practice of prior art not only expends the cost of manufacturing, takies the volume of electronic product integral body especially.

Summary of the invention

Technical problem to be solved by this invention, promptly goal of the invention is to propose a kind of overcurrent of multiple field and over-temperature protection structure and preparation method thereof.The present invention utilizes the notion of circuit board multilayer design, will be integrated on the element structure above two-layer above overcurrent and over-temperature protection element, and the finished product of finishing will be adhered on the substrate in the mode of face adhesion.Therefore, the overcurrent of multiple field of the present invention and over-temperature protection structure can have plural overcurrent and over-temperature protection function (over-current and over-temperature protection function) simultaneously.

In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of overcurrent and over-temperature protection structure of multiple field, it comprises: at least two overcurrent and over-temperature protection element, an insulation component, an and side conductive unit.

Wherein, each overcurrent and over-temperature protection element comprise: a upper electrode layer; one lower electrode layer; and a PTC material layer (positive temperature coefficient material layer) that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent and over-temperature protection element have a power input part; one power supply efferent; reach a plurality of current limit only entered and flowed to by this PTC material layer this power supply efferent from this power input part in each overcurrent and over-temperature protection element insulation divisions that are used for.

Moreover this insulation component is arranged between above-mentioned two overcurrent and the over-temperature protection element, so that insulated from each other between above-mentioned two overcurrent and the over-temperature protection element.In addition; this side conductive unit has multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in above-mentioned one of them overcurrent and over-temperature protection element, this insulation component, and the side of above-mentioned another one overcurrent and over-temperature protection element from top to bottom in regular turn, and each layer side conductive layer is electrically connected at an above-mentioned wherein power input part or a power supply efferent.

In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of overcurrent and over-temperature protection structure of multiple field, it comprises: a plurality of overcurrent and over-temperature protection element, a plurality of insulation component, an and side conductive unit.

Moreover described insulation component is arranged at respectively between per two overcurrent and the over-temperature protection element, so that insulated from each other between described overcurrent and the over-temperature protection element.In addition; this side conductive unit has multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in the side of described overcurrent and over-temperature protection element and described insulation component, and each layer side conductive layer is electrically connected at an above-mentioned wherein power input part or a power supply efferent.

In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of overcurrent of multiple field and the manufacture method of over-temperature protection structure are provided, it comprises the following steps: at first, one loam cake insulating barrier is provided, and its upper surface has a plurality of loam cake conductive welding pad insulated from each other; Then; at least two overcurrent and over-temperature protection element are provided; wherein each overcurrent and over-temperature protection element comprise: a upper electrode layer; one lower electrode layer; and a PTC material layer (positive temperaturecoefficient material layer) that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent and over-temperature protection element have a power input part; one power supply efferent; reach a plurality of current limit only entered and flowed to by this PTC material layer this power supply efferent from this power input part in each overcurrent and over-temperature protection element insulation divisions that are used for.

Then, provide an insulation component, it is arranged between above-mentioned two overcurrent and the over-temperature protection element, so that insulated from each other between above-mentioned two overcurrent and the over-temperature protection element; And then, provide a lower cover insulating barrier, its lower surface has a plurality of lower cover conductive welding pad insulated from each other; Next, in regular turn with the combination of this loam cake insulating barrier, described overcurrent and over-temperature protection element and this insulation component, and this lower cover stacked dielectric layer ground (stackedly) combine; At last; form multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in combination, and the side of this lower cover insulating barrier of this loam cake insulating barrier, described overcurrent and over-temperature protection element and this insulation component, and each layer side conductive layer is electrically connected at this corresponding loam cake conductive welding pad, this corresponding lower cover conductive welding pad, and an above-mentioned wherein power input part or a power supply efferent.

In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of overcurrent of multiple field and the manufacture method of over-temperature protection structure are provided, it comprises the following steps: at first, one loam cake insulating barrier is provided, and its upper surface has a plurality of loam cake conductive welding pad insulated from each other; Then; a plurality of overcurrent and over-temperature protection element are provided; wherein each overcurrent and over-temperature protection element comprise: a upper electrode layer; one lower electrode layer; and a PTC material layer (positive temperature coefficientmaterial layer) that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent and over-temperature protection element have a power input part; one power supply efferent; reach a plurality of current limit only entered and flowed to by this PTC material layer this power supply efferent from this power input part in each overcurrent and over-temperature protection element insulation divisions that are used for

Then, provide a plurality of insulation components, it is arranged at respectively between per two overcurrent and the over-temperature protection element, so that insulated from each other between per two overcurrent and the over-temperature protection element; And then, provide a lower cover insulating barrier, its lower surface has a plurality of lower cover conductive welding pad insulated from each other; Next, in regular turn with the combination of this loam cake insulating barrier, described overcurrent and over-temperature protection element and described insulation component, and this lower cover stacked dielectric layer ground (stackedly) combine; At last; form multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in combination, and the side of this lower cover insulating barrier of this loam cake insulating barrier, described overcurrent and over-temperature protection element and described insulation component, and each layer side conductive layer is electrically connected at this corresponding loam cake conductive welding pad, this corresponding lower cover conductive welding pad, and an above-mentioned wherein power input part or a power supply efferent.

Therefore; the invention has the advantages that: can integrate two or more above overcurrent and over-temperature protection element effectively and increase its scope of application; moreover the present invention can reduce overcurrent and the shared long-pending body of over-temperature protection element on the circuit board effectively, and reduces the number of solder joint.

Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, go deep into and concrete understanding when getting one thus, yet appended graphic reference and the explanation usefulness of only providing not is to be used for the present invention is limited.

Description of drawings

Figure 1A is the three-dimensional exploded view of first embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure;

Figure 1B is the three-dimensional combination figure of first embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure;

Fig. 1 C is the stereogram of another angle of first overcurrent of first embodiment of the invention and over-temperature protection element;

Fig. 1 D is the stereogram of another angle of second overcurrent of first embodiment of the invention and over-temperature protection element;

Fig. 2 A is the three-dimensional exploded view of second embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure;

Fig. 2 B is the three-dimensional combination figure of second embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure;

Fig. 2 C is the stereogram of another angle of first overcurrent of second embodiment of the invention and over-temperature protection element;

Fig. 2 D is the stereogram of another angle of second overcurrent of second embodiment of the invention and over-temperature protection element;

Fig. 2 E is the stereogram of another angle of the 3rd overcurrent of second embodiment of the invention and over-temperature protection element;

Fig. 3 is the flow chart of first embodiment of the manufacture method of the overcurrent of multiple field of the present invention and over-temperature protection structure;

Fig. 4 is the flow chart of second embodiment of the manufacture method of the overcurrent of multiple field of the present invention and over-temperature protection structure;

Fig. 5 is cut into stereogram before single for first embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure;

Fig. 6 is cut into stereogram before single for second embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure.

Symbol description among the figure

(first embodiment)

1a loam cake insulating barrier

10a loam cake conductive welding pad

2a first overcurrent and over-temperature protection element

21a first upper electrode layer

210a first power input part

211a first insulation division

The 22a first PTC material layer

23a first lower electrode layer

The 230a first power supply efferent

231a first insulation division

3a second overcurrent and over-temperature protection element

31a second upper electrode layer

310a second source input part

311a second insulation division

The 32a second PTC material layer

33a second lower electrode layer

330a second source efferent

331a second insulation division

The 5a insulation component

6a lower cover insulating barrier

60a lower cover conductive welding pad

The 7a side runs through the groove unit

The 70a side runs through groove

The 700a chadless

8a side conductive unit

80a side conductive layer

I _1a, I _2aElectric current

H _aThrough hole

P _aThe overcurrent of multiple field and over-temperature protection structure

(second embodiment)

1b loam cake insulating barrier

10b loam cake conductive welding pad

2b first overcurrent and over-temperature protection element

21b first upper electrode layer

210b first power input part

211b first insulation division

The 22b first PTC material layer

23b first lower electrode layer

The 230b first power supply efferent

231b first insulation division

3b second overcurrent and over-temperature protection element

31b second upper electrode layer

310b second source input part

311b second insulation division

The 32b second PTC material layer

33b second lower electrode layer

330b second source efferent

331b second insulation division

4b the 3rd overcurrent and over-temperature protection element

41b the 3rd upper electrode layer

410b the 3rd power input part

411b the 3rd insulation division

42b the 3rd PTC material layer

43b the 3rd lower electrode layer

430b the 3rd power supply efferent

431b the 3rd insulation division

The 5b insulation component

6b lower cover insulating barrier

60b lower cover conductive welding pad

The 7b side runs through the groove unit

The 70b side runs through groove

The 700b chadless

8b side conductive unit

80b side conductive layer

I _1b, I _2b, I _3bElectric current

H _bThrough hole

P _bThe overcurrent of multiple field and over-temperature protection structure

Embodiment

See also shown in Figure 1A to Fig. 1 D, Figure 1A is the three-dimensional exploded view of first embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure; Figure 1B is the three-dimensional combination figure of first embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure; Fig. 1 C is the stereogram of another angle of first overcurrent of first embodiment of the invention and over-temperature protection element; Fig. 1 D is the stereogram of another angle of second overcurrent of first embodiment of the invention and over-temperature protection element.

Please consult shown in Figure 1A and Figure 1B again; the first embodiment of the present invention provides a kind of overcurrent and over-temperature protection structure of multiple field, and it comprises: a loam cake insulating barrier 1a; one first overcurrent and over-temperature protection element (first over-current and over-temperatureprotection element) 2a; one second overcurrent and over-temperature protection element (secondover-current and over-temperature protection element) 3a; one insulation component 5a; one lower cover insulating barrier 6a; one has the side that four sides insulated from each other run through groove 70a runs through groove unit 7a; and the side conductive unit 8a with four layers of side conductive layer 80a insulated from each other.

Wherein, this loam cake insulating barrier 1a is arranged on this first overcurrent and the over-temperature protection element 2a, and the upper surface of this loam cake insulating barrier 1a have four insulated from each other and be electrically connected at the loam cake conductive welding pad 10a of described side conductive layer 80a respectively.In addition, this loam cake insulating barrier 1a can be made by polypropylene (polypropylene) or glass fibre (fiberglass) material, and described loam cake conductive welding pad 10a can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc.

Moreover this first overcurrent and over-temperature protection element 2a comprise: one first upper electrode layer (first top electrode layer) 21a, one first lower electrode layer (first bottom electrodelayer) 23a, and the first PTC material layer (first positive temperature coefficientmaterial layer) 22a who is arranged between this first upper electrode layer 21a and this first lower electrode layer 23a.Wherein, this first upper electrode layer 21a and this first lower electrode layer 23a all can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc., and this first PTC material layer 22a can be a high molecular positive temperature coefficient (PolymerPositive Temperature Coefficient, PPTC) material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material etc.

In addition, this first overcurrent and over-temperature protection element have one first power input part (first power input portion), one first power supply efferent (first power outputportion), reach a plurality of first insulation divisions (first insulative portion).With first embodiment, the upper surface of this first upper electrode layer 21a has one and is electrically connected at the wherein first power input part 210a and a plurality of first insulation division 211a of a side conductive layer 80a, and consult again shown in Fig. 1 C, the lower surface of this first lower electrode layer 23a has one and is electrically connected at the wherein first power supply efferent 230a and a plurality of first insulation division 231a of a side conductive layer 80a.

Therefore, described first insulation division (211a, 231a) is arranged at the upper surface of this first upper electrode layer 21a and the lower surface of this first lower electrode layer 23a respectively, so that this first upper electrode layer 21a and this first lower electrode layer 23a completely cut off to produce electrically with described side conductive layer 80a by described first insulation division (211a, 231a) respectively.Thus, described first insulation division (211a, 231a) can be used for current limit (as shown by arrows) I _1aIn this first overcurrent and over-temperature protection element 2a, only enter and flow to this first power supply efferent 230a by this first PTC material layer 22a from this first power input part 210a.

In addition, this second overcurrent and over-temperature protection element 3a comprise: one second upper electrode layer (second top electrode layer) 31a, one second lower electrode layer (second bottomelectrode layer) 33a, and the second PTC material layer (second positive temperaturecoefficient material layer) 32a who is arranged between this second upper electrode layer 31a and this second lower electrode layer 33a.Wherein, this second upper electrode layer 31a and this second lower electrode layer 33a all can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc., and this second PTC material layer 32a can be a high molecular positive temperature coefficient (Polymer Positive Temperature Coefficient, PPTC) material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material etc.

In addition, this second overcurrent and over-temperature protection element have a second source input part (second power input portion), a second source efferent (second power outputportion), reach a plurality of second insulation divisions (second insulative portion).With second embodiment, the upper surface of this second upper electrode layer 31a has one and is electrically connected at wherein second source input part 310a and a plurality of second insulation division 311a of a side conductive layer 80a, and consult again shown in Fig. 1 D, the lower surface of this second lower electrode layer 33a has one and is electrically connected at wherein second source efferent 330a and a plurality of second insulation division 331a of a side conductive layer 80a.

Therefore, described second insulation division (311a, 331a) is arranged at the upper surface of this second upper electrode layer 31a and the lower surface of this second lower electrode layer 33a respectively, so that this second upper electrode layer 31a and this second lower electrode layer 33a completely cut off to produce electrically with described side conductive layer 80a by described second insulation division (311a, 331a) respectively.Thus, described second insulation division (311a, 331a) can be used for current limit (as shown by arrows) I _2aIn this second overcurrent and over-temperature protection element 3a, only enter and flow to this second source efferent 330a by this second PTC material layer 32a from this second source input part 310a.

In addition; this insulation component 5a is arranged between this first overcurrent and over-temperature protection element 2a and this second overcurrent and the over-temperature protection element 3a, so that this first overcurrent and over-temperature protection element 2a and this second overcurrent and over-temperature protection element 3a are insulated from each other.

Moreover this lower cover insulating barrier 6a is arranged at the lower end of this second overcurrent and over-temperature protection element 3a, and the lower surface of this lower cover insulating barrier 6a have four insulated from each other and be electrically connected at the lower cover conductive welding pad 60a of described side conductive layer 80a respectively.In addition, this lower cover insulating barrier 6a can be made by polypropylene (polypropylene) or glass fibre (fiberglass) material, and described lower cover conductive welding pad 60a can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc.

In addition, each side run through groove 70a by the side of side, this second overcurrent and the over-temperature protection element 3a of five sides that are formed separately side, this first overcurrent and over-temperature protection element 2a, this insulation component 5a at this loam cake insulating barrier 1a, and the chadless (half hole) of the side of this lower cover insulating barrier 6a 700a is piled up forms.In other words, each side runs through the side that groove 70a is formed in this loam cake insulating barrier 1a, this first overcurrent and over-temperature protection element 2a, this insulation component 5a, this second overcurrent and over-temperature protection element 3a from top to bottom in regular turn, reaches this lower cover insulating barrier 6a.

In addition, described side conductive layer 80a is formed separately the inner surface that runs through groove 70a in described side, and each layer side conductive layer 80a is electrically connected at this first power input part 210a, this first power supply efferent 230a, this second source input part 310a or this second source efferent 330a.In addition; the present invention also can omit this side and run through groove unit 7a, and makes each layer side conductive layer 80a directly be formed in this loam cake insulating barrier 1a, this first overcurrent and over-temperature protection element 2a, this insulation component 5a, this second overcurrent and over-temperature protection element 3a from top to bottom in regular turn, reaches the side of this lower cover insulating barrier 6a.

Moreover please again with reference to shown in Figure 1A and Fig. 1 C, the arrow among the described figure is represented sense of current.This electric current I _1aFlow path at ground floor overcurrent and over-temperature protection element 2a is as described below:

1, at first, this electric current I _1aBy a side conductive layer 80a wherein, flow to the first upper electrode layer 21a of this first overcurrent and over-temperature protection element 2a by the wherein loam cake conductive welding pad 10a of this loam cake insulating barrier 1a;

2, then, this electric current I _1aEnter and flow to this first lower electrode layer 23a from the first power input part 210a of this first upper electrode layer 21a by this first PTC material layer 22a; And

3, last, this electric current I _1aFlow out and flow to an other side conductive layer 80a from the first power supply efferent 230a of this first lower electrode layer 23a.Thus, so that the present invention can reach the defencive function of ground floor overcurrent and excess temperature.

In addition, please again with reference to shown in Figure 1A and Fig. 1 D, the arrow among the described figure is represented sense of current.This electric current I _2aFlow path at second layer overcurrent and over-temperature protection element 3a is as described below:

1, at first, this electric current I _2aBy a side conductive layer 80a wherein, flow to the second upper electrode layer 31a of this second overcurrent and over-temperature protection element 3a by the wherein loam cake conductive welding pad 10a of this loam cake insulating barrier 1a;

2, then, this electric current I _2aEnter and flow to this second lower electrode layer 33a from the second source input part 310a of this second upper electrode layer 31a by this second PTC material layer 32a; And

3, last, this electric current I _2aFlow out and flow to an other side conductive layer 80a from the second source efferent 330a of this second lower electrode layer 33a.Thus, so that the present invention can reach the defencive function of second layer overcurrent and excess temperature.

Yet, electric current (I recited above _1a, I _2a) a flow direction embodiment wherein just, for example the flow direction of electric current also can with above-mentioned electric current (I _1a, I _2a) flow direction opposite, its function is also identical.Perhaps, overcurrent of the present invention and over-temperature protection structure also can use conversely, that is can select for use the lower cover conductive welding pad 60a of this lower cover insulating barrier 6a to be used as current input terminal.

See also shown in Fig. 2 A to Fig. 2 E, Fig. 2 A is the three-dimensional exploded view of second embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure; Fig. 2 B is the three-dimensional combination figure of second embodiment of the overcurrent of multiple field of the present invention and over-temperature protection structure; Fig. 2 C is the stereogram of another angle of first overcurrent of second embodiment of the invention and over-temperature protection element; Fig. 2 D is the stereogram of another angle of second overcurrent of second embodiment of the invention and over-temperature protection element; Fig. 2 E is the stereogram of another angle of the 3rd overcurrent of second embodiment of the invention and over-temperature protection element.

Please consult again shown in Fig. 2 A and Fig. 2 B; the second embodiment of the present invention provides a kind of overcurrent and over-temperature protection structure of multiple field, and it comprises: a loam cake insulating barrier 1b; one first overcurrent and over-temperature protection element (first over-current and over-temperatureprotection element) 2b; one second overcurrent and over-temperature protection element (secondover-current and over-temperature protection element) 3b; one the 3rd overcurrent and over-temperature protection element (third over-current and over-temperature protectionelement) 4b; two insulation component 5b; one lower cover insulating barrier 6b; one has the side that six sides insulated from each other run through groove 70b runs through groove unit 7b; and the side conductive unit 8b with six layers of side conductive layer 80b insulated from each other.

Wherein, this loam cake insulating barrier 1b is arranged on this first overcurrent and the over-temperature protection element 2b, and the upper surface of this loam cake insulating barrier 1b have six insulated from each other and be electrically connected at the loam cake conductive welding pad 10b of described side conductive layer 80b respectively.In addition, this loam cake insulating barrier 1b can be made by polypropylene (polypropylene) or glass fibre (fiberglass) material, and described loam cake conductive welding pad 10b can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc.

Moreover this first overcurrent and over-temperature protection element 2b comprise: one first upper electrode layer (first top electrode layer) 21b, one first lower electrode layer (first bottom electrodelayer) 23b, and the first PTC material layer (first positive temperature coefficientmaterial layer) 22b who is arranged between this first upper electrode layer 21b and this first lower electrode layer 23b.Wherein, this first upper electrode layer 21b and this first lower electrode layer 23b all can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc., and this first PTC material layer 22b can be a high molecular positive temperature coefficient (PolymerPositive Temperature Coefficient, PPTC) material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material etc.

In addition, this first overcurrent and over-temperature protection element have one first power input part (first power input portion), one first power supply efferent (first power outputportion), reach a plurality of first insulation divisions (first insulative portion).With second embodiment, the upper surface of this first upper electrode layer 21b has one and is electrically connected at the wherein first power input part 210b and a plurality of first insulation division 211b of a side conductive layer 80b, and consult again shown in Fig. 1 C, the lower surface of this first lower electrode layer 23b has one and is electrically connected at the wherein first power supply efferent 230b and a plurality of first insulation division 231b of a side conductive layer 80b.

Therefore, described first insulation division (211b, 231b) is arranged at the upper surface of this first upper electrode layer 21b and the lower surface of this first lower electrode layer 23b respectively, so that this first upper electrode layer 21b and this first lower electrode layer 23b completely cut off to produce electrically with described side conductive layer 80b by described first insulation division (211b, 231b) respectively.Thus, described first insulation division (211b, 231b) can be used for current limit (as shown by arrows) I _1bIn this first overcurrent and over-temperature protection element 2b, only enter and flow to this first power supply efferent 230b by this first PTC material layer 22b from this first power input part 210b.

In addition, this second overcurrent and over-temperature protection element 3b comprise: one second upper electrode layer (second top electrode layer) 31b, one second lower electrode layer (second bottomelectrode layer) 33b, and the second PTC material layer (second positive temperaturecoefficient material layer) 32b who is arranged between this second upper electrode layer 31b and this second lower electrode layer 33b.Wherein, this second upper electrode layer 31b and this second lower electrode layer 33b all can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc., and this second PTC material layer 32b can be a high molecular positive temperature coefficient (Polymer Positive Temperature Coefficient, PPTC) material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material etc.

In addition, this second overcurrent and over-temperature protection element have a second source input part (second power input portion), a second source efferent (second power outputportion), reach a plurality of second insulation divisions (second insulative portion).With second embodiment, the upper surface of this second upper electrode layer 31b has one and is electrically connected at wherein second source input part 310b and a plurality of second insulation division 311b of a side conductive layer 80b, and consult again shown in Fig. 2 D, the lower surface of this second lower electrode layer 33b has one and is electrically connected at wherein second source efferent 330b and a plurality of second insulation division 331b of a side conductive layer 80b.

Therefore, described second insulation division (311b, 331b) is arranged at the upper surface of this second upper electrode layer 31b and the lower surface of this second lower electrode layer 33b respectively, so that this second upper electrode layer 31b and this second lower electrode layer 33b completely cut off to produce electrically with described side conductive layer 80b by described second insulation division (311b, 331b) respectively.Thus, described second insulation division (311b, 331b) can be used for current limit (as shown by arrows) I _2bIn this second overcurrent and over-temperature protection element 3b, only enter and count material layer 32b and flow to this second source efferent 330b by this second positive temperature from this second source input part 310b.

In addition, the 3rd overcurrent and over-temperature protection element 4b comprise: one the 3rd upper electrode layer (third top electrode layer) 41b, one the 3rd lower electrode layer (third bottomelectrode layer) 43b, and the 3rd PTC material layer (third positive temperaturecoefficient material layer) 42b who is arranged between the 3rd upper electrode layer 41b and this second lower electrode layer 43b.Wherein, the 3rd upper electrode layer 41b and the 3rd lower electrode layer 43b all can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc., and the 3rd PTC material layer 42b can be a high molecular positive temperature coefficient (Polymer Positive Temperature Coefficient, PPTC) material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material etc.

In addition, the 3rd overcurrent and over-temperature protection element have one the 3rd power input part (third power input portion), one the 3rd power supply efferent (third power outputportion), reach a plurality of the 3rd insulation divisions (third insulative portion).With the 3rd embodiment, the upper surface of the 3rd upper electrode layer 41b has one and is electrically connected at wherein the 3rd power input part 410b and a plurality of the 3rd insulation division 411b of a side conductive layer 80b, and consult again shown in Fig. 2 E, the lower surface of the 3rd lower electrode layer 43b has one and is electrically connected at wherein the 3rd power supply efferent 430b and a plurality of the 3rd insulation division 431b of a side conductive layer 80b.

Therefore, described the 3rd insulation division (411b, 431b) is arranged at the upper surface of the 3rd upper electrode layer 41b and the lower surface of the 3rd lower electrode layer 43b respectively, so that the 3rd upper electrode layer 41b and the 3rd lower electrode layer 43b completely cut off to produce electrically with described side conductive layer 80b by described the 3rd insulation division (411b, 431b) respectively.Thus, described the 3rd insulation division (411b, 431b) can be used for current limit (as shown by arrows) I _3bIn the 3rd overcurrent and over-temperature protection element 4b, only enter and count material layer 42b and flow to the 3rd power supply efferent 430b by the 3rd positive temperature from the 3rd power input part 410b.

In addition; described insulation component 5b is arranged at " between this first overcurrent and over-temperature protection element 2b and this second overcurrent and the over-temperature protection element 3b " respectively and reaches " between this second overcurrent and over-temperature protection element 3b and the 3rd overcurrent and the over-temperature protection element 4b ", and is insulated from each other so that " between this first overcurrent and over-temperature protection element 2b and this second overcurrent and the over-temperature protection element 3b " reaches " between this second overcurrent and over-temperature protection element 3b and the 3rd overcurrent and the over-temperature protection element 4b ".

Moreover this lower cover insulating barrier 6b is arranged at the lower end of the 3rd overcurrent and over-temperature protection element 4b, and the lower surface of this lower cover insulating barrier 6b have six insulated from each other and be electrically connected at the lower cover conductive welding pad 60b of described side conductive layer 80b respectively.In addition, this lower cover insulating barrier 6b can be made by polypropylene (polypropylene) or glass fibre (fiberglass) material, and described lower cover conductive welding pad 60b can be metal forming (tinsel), for example: copper (copper) or nickel (nickel) etc.

In addition, each side run through groove 70b by the side of side, the 3rd overcurrent and the over-temperature protection element 4b of the side of side, this second overcurrent and the over-temperature protection element 3b of seven sides that are formed separately side, this first overcurrent and over-temperature protection element 2b, this first insulation component 5b, this second insulation component 5b at this loam cake insulating barrier 1b, and the chadless (half hole) of the side of this lower cover insulating barrier 6b 700b is piled up forms.In other words, each side runs through the side that groove 70b is formed in this loam cake insulating barrier 1b, this first overcurrent and over-temperature protection element 2b, this first insulation component 5b, this second overcurrent and over-temperature protection element 3b, this second insulation component 5b, the 3rd overcurrent and over-temperature protection element 4b from top to bottom in regular turn, reaches this lower cover insulating barrier 6b.

In addition, described side conductive layer 80b is formed separately the inner surface that runs through groove 70b in described side, and each layer side conductive layer 80b is electrically connected at this first power input part 210b, this first power supply efferent 230b, this second source input part 310b, this second source efferent 330b, the 3rd power input part 410b or the 3rd power supply efferent 430b.In addition; the present invention also can omit this side and run through groove unit 7b, and makes each layer side conductive layer 80b directly be formed in this loam cake insulating barrier 1b, this first overcurrent and over-temperature protection element 2b, this first insulation component 5b, this second overcurrent and over-temperature protection element 3b, this second insulation component 5b, the 3rd overcurrent and over-temperature protection element 4b from top to bottom in regular turn, reaches the side of this lower cover insulating barrier 6b.

Moreover please again with reference to shown in figure 2A and Fig. 2 C, the arrow among the described figure is represented sense of current.This electric current I _1bFlow path at ground floor overcurrent and over-temperature protection element 2b is as described below:

1, at first, this electric current I _1bBy a side conductive layer 80b wherein, flow to the first upper electrode layer 21b of this first overcurrent and over-temperature protection element 2b by the wherein loam cake conductive welding pad 10b of this loam cake insulating barrier 1b;

2, then, this electric current I _1bEnter and flow to this first lower electrode layer 23b from the first power input part 210b of this first upper electrode layer 21b by this first PTC material layer 22b; And

3, last, this electric current I _1bFlow out and flow to an other side conductive layer 80b from the first power supply efferent 230b of this first lower electrode layer 23b.Thus, so that the present invention can reach the defencive function of ground floor overcurrent and excess temperature.

In addition, please again with reference to shown in figure 2A and Fig. 2 D, the arrow among the described figure is represented sense of current.This electric current I _2bFlow path at second layer overcurrent and over-temperature protection element 3b is as described below:

1, at first, this electric current I _2bBy a side conductive layer 80b wherein, flow to the second upper electrode layer 31b of this second overcurrent and over-temperature protection element 3b by the wherein loam cake conductive welding pad 10b of this loam cake insulating barrier 1b;

2, then, this electric current I _2bEnter and flow to this second lower electrode layer 33b from the second source input part 310b of this second upper electrode layer 31b by this second PTC material layer 32b; And

3, last, this electric current I _2bFlow out and flow to an other side conductive layer 80b from the second source efferent 330b of this second lower electrode layer 33b.Thus, so that the present invention can reach the defencive function of second layer overcurrent and excess temperature.

In addition, please again with reference to shown in figure 2A and Fig. 2 E, the arrow among the described figure is represented sense of current.This electric current I _3bFlow path at the 3rd layer of overcurrent and over-temperature protection element 4b is as described below:

1, at first, this electric current I _3bBy a side conductive layer 80b wherein, flow to the 3rd upper electrode layer 41b of the 3rd overcurrent and over-temperature protection element 4b by the wherein loam cake conductive welding pad 10b of this loam cake insulating barrier 1b;

2, then, this electric current I _3bEnter and flow to the 3rd lower electrode layer 43b from the 3rd power input part 410b of the 3rd upper electrode layer 41b by the 3rd PTC material layer 42b; And

3, last, this electric current I _3bFlow out and flow to an other side conductive layer 80b from the 3rd power supply efferent 430b of the 3rd lower electrode layer 43b.Thus, so that the present invention can reach the defencive function of the 3rd layer of overcurrent and excess temperature.

Yet, electric current (I recited above _1b, I _2b, I _3b) a flow direction embodiment wherein just, for example the flow direction of electric current also can with above-mentioned electric current (I _1b, I _2b, I _3b) flow direction opposite, its function is also identical.Perhaps, overcurrent of the present invention and over-temperature protection structure also can use conversely, that is can select for use the lower cover conductive welding pad 60b of this lower cover insulating barrier 6b to be used as current input terminal.

Moreover; the quantity that above-mentioned first embodiment and second embodiment disclosed " electric current and over-temperature protection element " reach " insulation component " is non-in order to limit the present invention; such as utilize a plurality of electric currents and the overcurrent that cooperates the multiple field that is produced and the over-temperature protection structure of over-temperature protection element, be all the category that the present invention protects with a plurality of insulation components.

See also shown in Figure 3ly, it is the flow chart of first embodiment of the manufacture method of the overcurrent of multiple field of the present invention and over-temperature protection structure.Cooperate Figure 1A as can be known by Fig. 3 flow chart, the overcurrent of a kind of multiple field provided by the present invention and the manufacture method of over-temperature protection structure, its step comprises:

Step S100: a loam cake insulating barrier 1a is provided, and its upper surface has a plurality of loam cake conductive welding pad 10a insulated from each other;

Step S102: at least two overcurrent and over-temperature protection element (2a, 3a) are provided; wherein each overcurrent and over-temperature protection element (2a, 3a) comprising: a upper electrode layer (21a, 31a), a lower electrode layer (23a, 33a), an and PTC material layer (22a, 32a) that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent has a power input part (210a, 310a), a power supply efferent (230a, 330a) with over-temperature protection element (2a, 3a), reaches a plurality of current limit (I that are used for _1a, I _2a) in each overcurrent and over-temperature protection element (2a, 3a), only enter and flow to the insulation division (211a, 231a, 311a, 331a) of this power supply efferent (230a, 330a) by this PTC material layer (22a, 32a) from this power input part (210a, 310a);

Step S104: an insulation component 5a is provided, and it is arranged between above-mentioned two overcurrent and the over-temperature protection element (2a, 3a), so that insulated from each other between above-mentioned two overcurrent and the over-temperature protection element (2a, 3a);

Step S106: a lower cover insulating barrier 6a is provided, and its lower surface has a plurality of lower cover conductive welding pad 60a insulated from each other;

Step S108: in regular turn with the combination of this loam cake insulating barrier 1a, described overcurrent and over-temperature protection element (2a, 3a) and this insulation component 5a, and this lower cover insulating barrier 6a pile up ground (stackedly) and combine;

Step S110: form multilayer side conductive layer 80a insulated from each other; wherein each layer side conductive layer 80a is formed in combination, and the side of this lower cover insulating barrier 6a of this loam cake insulating barrier 1a, described overcurrent and over-temperature protection element (2a, 3a) and this insulation component 5a, and each layer side conductive layer 80a is electrically connected at this corresponding loam cake conductive welding pad 10a, this corresponding lower cover conductive welding pad 60a, and an above-mentioned wherein power input part (210a, 310a) or a power supply efferent (230a, 330a).

Moreover; before this step S110; manufacture method of the present invention further comprises: by the mode of boring (drilling) or punching press (punching); form a plurality of sides insulated from each other and run through groove 70a; wherein each side runs through groove 70a and is formed in this loam cake insulating barrier 1a from top to bottom in regular turn; this first overcurrent and over-temperature protection element 2a; this insulation component 5a; this second overcurrent and over-temperature protection element 3a; and the side of this lower cover insulating barrier 6a, and described side conductive layer 80a is formed separately the inner surface that runs through groove 70a in described side.

See also shown in Figure 4ly, it is the flow chart of second embodiment of the manufacture method of the overcurrent of multiple field of the present invention and over-temperature protection structure.Cooperate Fig. 2 A as can be known by Fig. 4 flow chart, the overcurrent of a kind of multiple field provided by the present invention and the manufacture method of over-temperature protection structure, its step comprises:

Step S200: a loam cake insulating barrier 1b is provided, and its upper surface has a plurality of loam cake conductive welding pad 10b insulated from each other;

Step S202: a plurality of overcurrent and over-temperature protection element (2b are provided; 3b; 4b); wherein each overcurrent and over-temperature protection element (2b; 3b; 4b) comprising: a upper electrode layer (21b; 31b; 41b); one lower electrode layer (23b; 33b; 43b); an and PTC material layer (22b who is arranged between this upper electrode layer and this lower electrode layer; 32b; 42b), and each overcurrent and over-temperature protection element (2b; 3b; 4b) has a power input part (210b; 310b; 410b); one power supply efferent (230b; 330b; 430b); and a plurality of current limit (I that are used for _1b, I _2b, I _3b) in each overcurrent and over-temperature protection element (2b, 3b, 4b), only enter and flow to the insulation division (211b, 231b, 311b, 331b, 411b, 431b) of this power supply efferent (230b, 330b, 430b) by this PTC material layer (22b, 32b, 42b) from this power input part (210b, 310b, 410b);

Step S204: a plurality of insulation component 5b are provided, and it is arranged at respectively between per two overcurrent and the over-temperature protection element (2b, 3b, 4b), so that insulated from each other between per two overcurrent and the over-temperature protection element (2b, 3b, 4b);

Step S206: a lower cover insulating barrier 6b is provided, and its lower surface has a plurality of lower cover conductive welding pad 60b insulated from each other;

Step S208: in regular turn with the combination of this loam cake insulating barrier 1b, described overcurrent and over-temperature protection element (2b, 3b, 4b) and described insulation component 5b, and this lower cover insulating barrier 6b pile up ground (stackedly) and combine;

Step S210: form multilayer side conductive layer 80b insulated from each other; wherein each layer side conductive layer 80b is formed in combination, and the side of this lower cover insulating barrier 6b of this loam cake insulating barrier 1b, described overcurrent and over-temperature protection element (2b, 3b, 4b) and described insulation component 5b, and each layer side conductive layer 80b is electrically connected at this corresponding loam cake conductive welding pad 10b, this corresponding lower cover conductive welding pad 60b, and an above-mentioned wherein power input part (210b, 310b, 410b) or a power supply efferent (230b, 330b, 430b).

Moreover; before this step step S210; manufacture method of the present invention further comprises: by the mode of boring (drilling) or punching press (punching); form a plurality of sides insulated from each other and run through groove 70b; wherein each side runs through combination that groove 70b is formed in this loam cake insulating barrier 1b, described overcurrent and over-temperature protection element (2b, 3b, 4b) and described insulation component 5b, and the side of this lower cover insulating barrier 6b, and described side conductive layer 80b is formed separately the inner surface that runs through groove 70b in described side.

See also shown in Figure 5ly, its first embodiment for the overcurrent of multiple field of the present invention and over-temperature protection structure is cut into the stereogram before single.By among the figure as can be known; at first; mode by boring (drilling) or punching press (punching) runs through this loam cake insulating barrier 1a, this first overcurrent and over-temperature protection element 2a, this insulation component 5a, this second overcurrent and over-temperature protection element 3a in regular turn, reaches this lower cover insulating barrier 6a, to form a plurality of through hole H _aThen, again conductive layer is formed in described through hole H _aInner surface, last again with the overcurrent and the over-temperature protection structure P of single multiple field _aProduction method of the present invention cuts down (shown in Figure 1B), so that once can be finished the overcurrent and the over-temperature protection structure P of a plurality of multiple fields simultaneously _a

See also shown in Figure 6ly, its second embodiment for the overcurrent of multiple field of the present invention and over-temperature protection structure is cut into the stereogram before single.By among the figure as can be known; at first; mode by boring (drilling) or punching press (punching) runs through this loam cake insulating barrier 1b, this first overcurrent and over-temperature protection element 2b, this insulation component 5a, this second overcurrent and over-temperature protection element 3b, this insulation component 5a, the 3rd overcurrent and over-temperature protection element 4b and this lower cover insulating barrier 6b in regular turn, to form a plurality of through hole H _bThen, again conductive layer is formed in described through hole H _bInner surface, last again with the overcurrent and the over-temperature protection structure P of single multiple field _bProduction method of the present invention cuts down (shown in Figure 1B), so that once can be finished the overcurrent and the over-temperature protection structure P of a plurality of multiple fields simultaneously _b

In sum, the present invention utilizes the notion of circuit board multilayer design, will be integrated on the element structure above two-layer above overcurrent and over-temperature protection element, and the finished product of finishing will be adhered on the substrate in the mode of face adhesion.Therefore, the overcurrent of multiple field of the present invention and over-temperature protection structure can have plural overcurrent and over-temperature protection function (over-current and over-temperature protection function) simultaneously.

So; the invention has the advantages that: can integrate two or more above overcurrent and over-temperature protection element effectively and increase its scope of application; moreover the present invention can reduce overcurrent and the shared long-pending body of over-temperature protection element on the circuit board effectively, and reduces the number of solder joint.

The above; only be the detailed description and the accompanying drawing of the specific embodiment of one of the best of the present invention; feature of the present invention is not limited thereto; be not in order to restriction the present invention; all protection ranges of the present invention should be as the criterion with the scope of claims; all closing in the embodiment of the spirit variation similar of claims of the present invention with it; all should be contained in the category of the present invention; any those skilled in the art in the field of the invention, can think easily and variation or modify all can be encompassed in the following claim of the present invention.

Claims

1. the overcurrent of a multiple field and over-temperature protection structure is characterized in that, comprising:

At least two overcurrent and over-temperature protection element, wherein each overcurrent and over-temperature protection element comprise: a upper electrode layer, a lower electrode layer, an and PTC material layer that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent and over-temperature protection element have a power input part, a power supply efferent, and a plurality ofly are used for current limit entered and flowed to by this PTC material layer this power supply efferent in each overcurrent and over-temperature protection element from this power input part insulation divisions;

One insulation component, it is arranged between above-mentioned two overcurrent and the over-temperature protection element, so that insulated from each other between above-mentioned two overcurrent and the over-temperature protection element; And

One side conductive unit; it has multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in above-mentioned one of them overcurrent and over-temperature protection element, this insulation component, and the side of above-mentioned another one overcurrent and over-temperature protection element from top to bottom in regular turn, and each layer side conductive layer is electrically connected at an above-mentioned wherein power input part or a power supply efferent.

2. the overcurrent of multiple field as claimed in claim 1 and over-temperature protection structure; it is characterized in that; further comprise: a loam cake insulating barrier and a lower cover insulating barrier; it is arranged at respectively on above-mentioned two overcurrent and the over-temperature protection element; and each layer side conductive layer forms in the side of this loam cake insulating barrier and this lower cover insulating barrier; wherein the upper surface of this loam cake insulating barrier has a plurality of insulated from each otherly and be electrically connected at the loam cake conductive welding pad of described side conductive layer respectively, and the lower surface of this lower cover insulating barrier has a plurality of insulated from each other and be electrically connected at the lower cover conductive welding pad of described side conductive layer respectively.

3. the overcurrent of multiple field as claimed in claim 2 and over-temperature protection structure, it is characterized in that: this loam cake insulating barrier and this lower cover insulating barrier are all polypropylene or glass fiber material.

4. the overcurrent of multiple field as claimed in claim 2 and over-temperature protection structure, it is characterized in that: described loam cake conductive welding pad and described lower cover conductive welding pad are all metal forming.

5. the overcurrent of multiple field as claimed in claim 1 and over-temperature protection structure; it is characterized in that; further comprise: a side runs through the groove unit; it has a plurality of sides insulated from each other and runs through groove; wherein each side runs through the side that groove is formed in this loam cake insulating barrier, above-mentioned one of them overcurrent and over-temperature protection element, this insulation component, above-mentioned another one overcurrent and over-temperature protection element from top to bottom in regular turn, reaches this lower cover insulating barrier, and described side conductive layer is formed separately the inner surface that runs through groove in described side.

6. the overcurrent of multiple field as claimed in claim 5 and over-temperature protection structure is characterized in that: each side run through groove by the side of five sides that are formed separately the side at this loam cake insulating barrier, above-mentioned two overcurrent and over-temperature protection element, this insulation component, and the chadless of the side of this lower cover insulating barrier piled up and formed.

7. the overcurrent of multiple field as claimed in claim 1 and over-temperature protection structure, it is characterized in that: this upper electrode layer and this lower electrode layer are all metal forming.

8. the overcurrent of multiple field as claimed in claim 1 and over-temperature protection structure, it is characterized in that: this PTC material layer is a high molecular positive temperature coefficient material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material.

9. the overcurrent of multiple field as claimed in claim 1 and over-temperature protection structure; it is characterized in that: described insulation division is arranged at the upper surface of each upper electrode layer and the lower surface of each lower electrode layer respectively, so that each upper electrode layer and each lower electrode layer completely cut off to produce electrically with described side conductive layer by described insulation division respectively.

10. the overcurrent of a multiple field and over-temperature protection structure is characterized in that, comprising:

A plurality of overcurrent and over-temperature protection element, wherein each overcurrent and over-temperature protection element comprise: a upper electrode layer, a lower electrode layer, an and PTC material layer that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent and over-temperature protection element have a power input part, a power supply efferent, and a plurality ofly are used for current limit entered and flowed to by this PTC material layer this power supply efferent in each overcurrent and over-temperature protection element from this power input part insulation divisions;

A plurality of insulation components, it is arranged at respectively between per two overcurrent and the over-temperature protection element, so that insulated from each other between described overcurrent and the over-temperature protection element; And

One side conductive unit; it has multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in the side of described overcurrent and over-temperature protection element and described insulation component, and each layer side conductive layer is electrically connected at an above-mentioned wherein power input part or a power supply efferent.

11. the overcurrent of multiple field as claimed in claim 10 and over-temperature protection structure; it is characterized in that; further comprise: a loam cake insulating barrier and a lower cover insulating barrier; it is arranged at respectively on the superiors and undermost overcurrent and the over-temperature protection element; and each layer side conductive layer forms in the side of this loam cake insulating barrier and this lower cover insulating barrier; wherein the upper surface of this loam cake insulating barrier has a plurality of insulated from each otherly and be electrically connected at the loam cake conductive welding pad of described side conductive layer respectively, and the lower surface of this lower cover insulating barrier has a plurality of insulated from each other and be electrically connected at the lower cover conductive welding pad of described side conductive layer respectively.

12. the overcurrent of multiple field as claimed in claim 11 and over-temperature protection structure is characterized in that: this loam cake insulating barrier and this lower cover insulating barrier are all polypropylene or glass fiber material.

13. the overcurrent of multiple field as claimed in claim 11 and over-temperature protection structure is characterized in that: described loam cake conductive welding pad and described lower cover conductive welding pad are all metal forming.

14. the overcurrent of multiple field as claimed in claim 10 and over-temperature protection structure; it is characterized in that; further comprise: a side runs through the groove unit; it has a plurality of sides insulated from each other and runs through groove; wherein each side runs through the side that groove is formed in this loam cake insulating barrier, described overcurrent and over-temperature protection element, described insulation component, reaches this lower cover insulating barrier, and described side conductive layer is formed separately the inner surface that runs through groove in described side.

15. the overcurrent of multiple field as claimed in claim 14 and over-temperature protection structure is characterized in that: each side run through groove by a plurality of sides that are formed separately the side at this loam cake insulating barrier, described overcurrent and the side of over-temperature protection element, described insulation component, and the chadless of the side of this lower cover insulating barrier piled up and formed.

16. the overcurrent of multiple field as claimed in claim 10 and over-temperature protection structure is characterized in that: this upper electrode layer and this lower electrode layer are all metal forming.

17. the overcurrent of multiple field as claimed in claim 10 and over-temperature protection structure is characterized in that: this PTC material layer is a high molecular positive temperature coefficient material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material.

18. the overcurrent of multiple field as claimed in claim 10 and over-temperature protection structure; it is characterized in that: described insulation division is arranged at the upper surface of each upper electrode layer and the lower surface of each lower electrode layer respectively, so that each upper electrode layer and each lower electrode layer completely cut off to produce electrically with described side conductive layer by described insulation division respectively.

19. the overcurrent of a multiple field and the manufacture method of over-temperature protection structure is characterized in that, comprise the following steps:

One loam cake insulating barrier is provided, and its upper surface has a plurality of loam cake conductive welding pad insulated from each other;

At least two overcurrent and over-temperature protection element are provided, wherein each overcurrent and over-temperature protection element comprise: a upper electrode layer, a lower electrode layer, an and PTC material layer that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent and over-temperature protection element have a power input part, a power supply efferent, and a plurality ofly are used for current limit entered and flowed to by this PTC material layer this power supply efferent in each overcurrent and over-temperature protection element from this power input part insulation divisions;

One insulation component is provided, and it is arranged between above-mentioned two overcurrent and the over-temperature protection element, so that insulated from each other between above-mentioned two overcurrent and the over-temperature protection element;

One lower cover insulating barrier is provided, and its lower surface has a plurality of lower cover conductive welding pad insulated from each other;

In regular turn with the combination of this loam cake insulating barrier, described overcurrent and over-temperature protection element and this insulation component, and this lower cover stacked dielectric layer combine; And

Form multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in combination, and the side of this lower cover insulating barrier of this loam cake insulating barrier, described overcurrent and over-temperature protection element and this insulation component, and each layer side conductive layer is electrically connected at this corresponding loam cake conductive welding pad, this corresponding lower cover conductive welding pad, and an above-mentioned wherein power input part or a power supply efferent.

20. the overcurrent of multiple field as claimed in claim 19 and the manufacture method of over-temperature protection structure is characterized in that: this loam cake insulating barrier and this lower cover insulating barrier are all polypropylene or glass fiber material.

21. the overcurrent of multiple field as claimed in claim 19 and the manufacture method of over-temperature protection structure is characterized in that: described loam cake conductive welding pad and described lower cover conductive welding pad are all metal forming.

22. the overcurrent of multiple field as claimed in claim 19 and the manufacture method of over-temperature protection structure; it is characterized in that: before the step of the described side conductive layer insulated from each other of above-mentioned formation; further comprise: form a plurality of sides insulated from each other and run through groove; wherein each side runs through groove and is formed in this loam cake insulating barrier from top to bottom in regular turn; above-mentioned one of them overcurrent and over-temperature protection element; this insulation component; above-mentioned another one overcurrent and over-temperature protection element; and the side of this lower cover insulating barrier, and described side conductive layer is formed separately the inner surface that runs through groove in described side.

23. the overcurrent of multiple field as claimed in claim 22 and the manufacture method of over-temperature protection structure is characterized in that: each side run through groove by the side of five sides that are formed separately the side at this loam cake insulating barrier, above-mentioned two overcurrent and over-temperature protection element, this insulation component, and the chadless of the side of this lower cover insulating barrier piled up and formed.

24. the overcurrent of multiple field as claimed in claim 19 and the manufacture method of over-temperature protection structure is characterized in that: this upper electrode layer and this lower electrode layer are all metal forming.

25. the overcurrent of multiple field as claimed in claim 19 and the manufacture method of over-temperature protection structure is characterized in that: this PTC material layer is a high molecular positive temperature coefficient material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material.

26. the overcurrent of multiple field as claimed in claim 19 and the manufacture method of over-temperature protection structure; it is characterized in that: described insulation division is arranged at the upper surface of each upper electrode layer and the lower surface of each lower electrode layer respectively, so that each upper electrode layer and each lower electrode layer completely cut off to produce electrically with described side conductive layer by described insulation division respectively.

27. the overcurrent of a multiple field and the manufacture method of over-temperature protection structure is characterized in that, comprise the following steps:

A plurality of overcurrent and over-temperature protection element are provided, wherein each overcurrent and over-temperature protection element comprise: a upper electrode layer, a lower electrode layer, an and PTC material layer that is arranged between this upper electrode layer and this lower electrode layer, and each overcurrent and over-temperature protection element have a power input part, a power supply efferent, and a plurality ofly are used for current limit entered and flowed to by this PTC material layer this power supply efferent in each overcurrent and over-temperature protection element from this power input part insulation divisions;

A plurality of insulation components are provided, and it is arranged at respectively between per two overcurrent and the over-temperature protection element, so that insulated from each other between per two overcurrent and the over-temperature protection element;

In regular turn with the combination of this loam cake insulating barrier, described overcurrent and over-temperature protection element and described insulation component, and this lower cover stacked dielectric layer combine; And

Form multilayer side conductive layer insulated from each other; wherein each layer side conductive layer is formed in combination, and the side of this lower cover insulating barrier of this loam cake insulating barrier, described overcurrent and over-temperature protection element and described insulation component, and each layer side conductive layer is electrically connected at this corresponding loam cake conductive welding pad, this corresponding lower cover conductive welding pad, and an above-mentioned wherein power input part or a power supply efferent.

28. the overcurrent of multiple field as claimed in claim 27 and the manufacture method of over-temperature protection structure is characterized in that: this loam cake insulating barrier and this lower cover insulating barrier are all polypropylene or glass fiber material.

29. the overcurrent of multiple field as claimed in claim 27 and the manufacture method of over-temperature protection structure is characterized in that: described loam cake conductive welding pad and described lower cover conductive welding pad are all metal forming.

30. the overcurrent of multiple field as claimed in claim 27 and the manufacture method of over-temperature protection structure; it is characterized in that: before the step of the described side conductive layer insulated from each other of above-mentioned formation; further comprise: form a plurality of sides insulated from each other and run through groove; wherein each side runs through combination that groove is formed in this loam cake insulating barrier, described overcurrent and over-temperature protection element and described insulation component, and the side of this lower cover insulating barrier, and described side conductive layer is formed separately the inner surface that runs through groove in described side.

31. the overcurrent of multiple field as claimed in claim 30 and the manufacture method of over-temperature protection structure is characterized in that: each side run through groove by seven sides that are formed separately the combination of the side at this loam cake insulating barrier, described overcurrent and over-temperature protection element and described insulation component, and the chadless of the side of this lower cover insulating barrier piled up and formed.

32. the overcurrent of multiple field as claimed in claim 27 and the manufacture method of over-temperature protection structure is characterized in that: this upper electrode layer and this lower electrode layer are all metal forming.

33. the overcurrent of multiple field as claimed in claim 27 and the manufacture method of over-temperature protection structure is characterized in that: this PTC material layer is a high molecular positive temperature coefficient material layer, resistance elements, capacitance material layer or the electrical sensative material bed of material.

34. the overcurrent of multiple field as claimed in claim 27 and the manufacture method of over-temperature protection structure; it is characterized in that: described insulation division is arranged at the upper surface of each upper electrode layer and the lower surface of each lower electrode layer respectively, so that each upper electrode layer and each lower electrode layer completely cut off to produce electrically with described side conductive layer by described insulation division respectively.