CN101400227B - Glue dropping method of composite conductive sealing adhesive strip - Google Patents
Glue dropping method of composite conductive sealing adhesive strip Download PDFInfo
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- CN101400227B CN101400227B CN2007100304859A CN200710030485A CN101400227B CN 101400227 B CN101400227 B CN 101400227B CN 2007100304859 A CN2007100304859 A CN 2007100304859A CN 200710030485 A CN200710030485 A CN 200710030485A CN 101400227 B CN101400227 B CN 101400227B
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- glue
- conducting resinl
- composite
- conducting
- feed pipe
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Abstract
The invention discloses a composite conductive sealing glue strip and glue dropping method thereof, which is object to provided a composite conductive sealing glue strip with simple manufacturing technique and low cost, and glue dropping method thereof. A conducting resin material packaging stuffing glue material is provide at the external circumstance of the stuffing glue material; and a conducting resin charge-in tube, a stuffing glue charge-in tube and a composite material nozzle are provided in the inventive glue dropping method. At the beginning of the glue dropping, the conducting resin material is spurted out before the stuffing glue material at eh composite material nozzle; and at the end of the glue dropping, the cutoff of the conducting resin material is slower than that of the stuffing glue material. The inventive glue strip and manufacturing method thereof has low-cost, simple production facility and technique, easy implementing and application to the production of conductive sealing glue strips in the communication apparatus.
Description
Technical field
The present invention relates to a kind of conductive seal glue, more particularly, relate to a kind of composite conducting sealing joint strip and dispensing method thereof.
Background technology
At present, a large amount of radiofrequency signal instruments is installed in the base station of mobile communication; In current all kinds of radiofrequency signal instruments, on the substrate that circuit module is installed; Often be provided with the conductive seal adhesive tape of mutual string of energy screened circuit module radiofrequency signal or diffraction between each circuit module; But because the density of conducting resinl is big, so proportion is also big, colloid is owing to be semi-fluid condition, if need the higher adhesive tape of thickness when glue; Adhesive tape can can't form the conductive seal adhesive tape of desired thickness because action of gravity is spread naturally downwards during point glue; Common pure conducting resinl is made the sealing joint strip of column type, the limiting altitude of its glue is 1.2 millimeter, for larger area substrate junction member, because substrate at the processing machining accuracy problem on opportunity and the needs that cut down finished cost, often irregular slit can occur on substrate; In this case, require as the conductive seal adhesive tape of 1.4-2.0 millimeter height, to fill irregular slit on the substrate with thicker conducting resinl.In the prior art, having the technical staff to adopt a kind of cross section is the adhesive tape of three-legged structure, and conducting resinl is done triangularity, has reduced the weight of triangular form upper end, thereby can increase the thickness of adhesive tape aborning.Produce two kinds of methods of the general employing of triangular form adhesive tape, a kind of is the triangular nozzle method of forming, and this method needs special four point gum machine equipment; Another kind is with special nickeliferous conducting resinl, after nickeliferous conduction is done circular colloid, up nickeliferous conducting resinl is inhaled the high triangular structure that forms by special magnetic suction disc device again.Current dispensing technology needs complicated special installation for improving the various technical schemes that conductive seal adhesive tape height is taked, existing, the production process complexity, and technology falls behind, production cost high-technology defective; In current this area, above-mentioned technological deficiency become those skilled in the art an anxious big technical barrier to be solved.
Summary of the invention
Technical purpose of the present invention is to overcome in the prior art, and high thickness conductive seal adhesive tape production process complexity, production technology backward technology problem provide a kind of production technology composite conducting sealing joint strip and dispensing method thereof simple, with low cost.
For realizing above technical purpose, technical scheme of the present invention is:
A kind of composite conducting sealing joint strip; Described composite conducting sealing joint strip is provided with the filling glue material, and the outside of described filling glue material is provided with the conducting resinl material that parcel is filled glue material.
The present invention more provides a kind of dispensing method of producing the composite conducting sealing joint strip.
A kind of dispensing method of composite conducting sealing joint strip; Described method comprises the steps:
A. be provided with the conducting resinl feed pipe and fill the glue feed pipe, and be provided with the composite material jet hole;
When b. putting glue and beginning, at the composite material jet hole, the conducting resinl material is prior to filling the glue material ejection, to guarantee that in the adhesive tape origin or beginning conducting resinl can be filled glue by complete parcel;
During c. more glued the bundle, at the composite material jet hole, the conducting resinl material is slower than fills the glue material cutout; To guarantee that at the adhesive tape end conducting resinl can be filled glue by complete parcel.
In the step C; Adopt some plastic pin tube (promptly being feed pipe) control method to control, promptly be: fill glue and conducting resinl and be contained in respectively in two 50cc syringes, by two pneumatic point gum machine controls, the air pressure size of adjusting two point gum machines can be controlled the plastic emitting ratio of two kinds of materials, the control signal of pneumatic point gum machine is provided by three point gum machines of x-y-z, two the glued bundle of pneumatic point gum machine point time delayed signals, be set to, the time-delay of conduction sebific duct is greater than filling the sebific duct time-delay, purpose is to allow more conductive gelatin be wrapped in fill the colloid outside, make the joint area perfection, do not expose the filling colloid.
In the step C; Adopt glue valve control method to carry out, promptly be: conducting resinl and filling glue, be transported to the valve body inlet by the pressure pot device, the material pressure size of two pressure pots of control, material proportion with regard to the may command manufactured goods, the reciprocating motion of valve body, i.e. the break-make of may command glue, the valve body control signal is provided by the x-y-z point gum machine, conveying pipeline between valve body and composite material nozzle, select the conducting resinl conveying pipeline to be longer than and fill glue conveying pipeline 20%-30%, after the glue valve cut out, the volume in the conducting resinl conveying pipeline was greater than the volume of fluid sealant conveying pipeline like this, because differential pressure action, have more conducting resinl and flow out, be wrapped in fully and fill the colloid outside, make the joint area perfection.
Useful technique effect of the present invention is: be provided with the less filling glue material of density owing to adopted in the conducting resinl material, in process of production, because whole averag density is low, can not cause the semifluid material former thereby spread out, thereby can produce highly higher conductive seal adhesive tape to the too much expansion of substrate because of gravity; Because the cost of packing material is well below the conducting resinl material, thereby can reduce material cost well; And production method of the present invention is simple; Do not need special production equipment, the sealing of opening end and end of Composite sealing adhesive tape is complete; The present invention is with low cost, and is easy to implement.
Description of drawings
Accompanying drawing 1 is the material cross-section structural representation of composite conducting sealing joint strip of the present invention;
Accompanying drawing 2 is structural representations of equipment in the one embodiment of the invention point plastic pin tube control method;
Accompanying drawing 3 is structural representations of equipment in the one embodiment of the invention glue valve control method.
Embodiment
Following execution mode only is preferred embodiment of the present invention, does not limit maximum interest field of the present invention; In material structure of the present invention, the conductive seal adhesive tape is provided with the filling glue material, and is provided with the conducting resinl material that parcel is filled glue material.
Embodiment 1
Be provided with and fill glue feed pipe 4 and conducting resinl feed pipe 5, described feed pipe is communicated to composite material jet hole 9; When point glue began, at composite material jet hole 9, conducting resinl material 2 was prior to filling glue material 1 ejection, to guarantee that in the adhesive tape origin or beginning conducting resinl material 2 can be filled glue material 1 by complete parcel; During point gluing bundle, can adopt a plastic pin tube control method, promptly be: fill glue material 1 and conducting resinl material 2 and be contained in respectively in two 50cc syringes, and respectively by two pneumatic point gum machine controls, the air pressure size of adjusting two point gum machines can be controlled the plastic emitting ratio of two kinds of materials, the control signal of pneumatic point gum machine is provided by three point gum machines of x-y-z, two the glued bundle of pneumatic point gum machine point time delayed signals, be set to, the time-delay that drives filling glue feed pipe 4 is longer than in the pneumatic point gum machine time-delay that drives conducting resinl feed pipe 5, purpose is to allow the fluid of more conducting resinl material 2 be wrapped in the outside of filling colloidal materials 1, makes the joint area perfection, can not expose the colloid of filling glue.Because at composite material jet hole 9, conducting resinl material 2 is slower than fills glue material 1 cutout; To guarantee that at the adhesive tape end conducting resinl material 2 can be filled glue material 1 by complete parcel.
Embodiment 2
In conjunction with Fig. 3; In the present embodiment, be provided with filling glue feed pipe 4 and conducting resinl feed pipe 5; Fill to be provided with between glue feed pipe 4 and the composite material jet hole 9 and fill glue conveying pipeline 6; Be provided with conducting resinl conveying pipeline 7 between conducting resinl feed pipe 5 and the composite material jet hole 9; And, filling glue feed pipe 4 and filling between the glue conveying pipeline 6, and between conducting resinl feed pipe 5 and conducting resinl conveying pipeline 7, be provided with application valve body 8 by air cylinder driven; Application valve body 8 can be controlled simultaneously and fill opening or closure of glue conveying pipeline 6 and conducting resinl conveying pipeline 7; In the present embodiment, the length of conducting resinl conveying pipeline 7 is greater than the length of filling the glue conveying pipeline; When a glue began, at composite material jet hole 9, conducting resinl material 2 was prior to filling glue material 1 ejection, to guarantee that in the adhesive tape origin or beginning conducting resinl material 2 can be filled glue material 1 by complete parcel; When a gluing is restrainted, can adopt glue valve control method, described glue valve promptly is meant application valve body 8; Promptly be: conducting resinl material 2 and filling glue material 1, be transported to two material inlets of application valve body 8 by the pressure pot device, the material pressure size of two pressure pots of control, material proportion with regard to the may command manufactured goods, the reciprocating motion of air cylinder driven application valve body 8, it is the on-off of may command sizing material, the control signal of the driving cylinder of application valve body 8 is provided by the x-y-z point gum machine, two conveying pipelines 9 of application valve body 8 and composite material jet holes, conducting resinl conveying pipeline 7 is set than filling glue conveying pipeline 6 long 20%-30%, like this, when a glue is prepared to finish, and after application valve body 8 is closed, material volume in the conducting resinl conveying pipeline 7 is greater than the material volume of fluid sealant conveying pipeline 6, because differential pressure action has more conducting resinl material 2 and flows out, be wrapped in the outside of filling glue material 1 fully, make the joint area perfection.Because at composite material jet hole 9, conducting resinl material 2 is slower than fills glue material 1 cutout; To guarantee that at the adhesive tape end conducting resinl material 2 can be filled glue material 1 by complete parcel.
The present invention adopts two kinds of made to go out a kind of composite rubber strip, and in Fig. 1, conducting resinl material 2 parcels are filled glue material 1 and formed the composite conducting sealing joint strip, firmly are adhered on the substrate 3 after the moulding of described composite conducting sealing joint strip; The common silver-bearing copper electric silica gel that described conducting resinl material selection electric conductivity is good, volume resistance are filled glue material and are selected for use the dealcoholized type adhesive property good generally at 0.08ohm-cm, resist and subside the silicone adhesive of excellent spring.The outfit ratio of two kinds of materials is conducting resinl: fill glue: 1: 1 or 1: 3; When the adhesive tape material height require colloid at 1mm-2mm adopt 1: 1 join the glue ratio, the ratio that adopted 1: 3 when the adhesive tape material height requires height at 3mm-5mm is joined glue.Guarantee that conducting resinl solidifies the back crust and has the thick conducting resinl material of 0.3mm--0.6mm just can play good shield effectiveness.Two kinds of materials can adopt room temperature curing type, also can adopt thermohardening type, and two kinds of material cured character must be consistent, and promptly are cold curing simultaneously, or are thermosetting material simultaneously.
Claims (3)
1. the dispensing method of a composite conducting sealing joint strip; It is characterized in that described method comprises the steps:
A. be provided with the conducting resinl feed pipe and fill the glue feed pipe, and be provided with the composite material jet hole; Described conducting resinl feed pipe is enclosed within fills glue feed pipe periphery;
When b. putting glue and beginning, at the composite material jet hole, the conducting resinl material is prior to filling the glue material ejection, to guarantee that in the adhesive tape origin or beginning conducting resinl can be filled glue by complete parcel;
During c. more glued the bundle, at the composite material jet hole, the conducting resinl material is slower than fills the glue material cutout; To guarantee that at the adhesive tape end conducting resinl can be filled glue by complete parcel.
2. according to the dispensing method of the composite conducting sealing joint strip of claim 1; It is characterized in that: in the step C, adopt some plastic pin tube control method to control.
3. according to the dispensing method of the composite conducting sealing joint strip of claim 1; It is characterized in that: in the step C, adopt glue valve control method to control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100304859A CN101400227B (en) | 2007-09-24 | 2007-09-24 | Glue dropping method of composite conductive sealing adhesive strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100304859A CN101400227B (en) | 2007-09-24 | 2007-09-24 | Glue dropping method of composite conductive sealing adhesive strip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101400227A CN101400227A (en) | 2009-04-01 |
| CN101400227B true CN101400227B (en) | 2011-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100304859A Expired - Fee Related CN101400227B (en) | 2007-09-24 | 2007-09-24 | Glue dropping method of composite conductive sealing adhesive strip |
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| Country | Link |
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| CN (1) | CN101400227B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110509478A (en) * | 2019-08-26 | 2019-11-29 | 深圳市道丰宁科技有限公司 | A kind of dispensing processing method of water-proof sealing rubber strip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2601814Y (en) * | 2003-02-21 | 2004-02-04 | 成都市依迈电子化工实业有限公司 | Conductive sealed pad |
| CN1741891A (en) * | 2003-01-23 | 2006-03-01 | 东洋制罐株式会社 | Method and device for forming composite synthetic resin material |
| CN2834900Y (en) * | 2005-09-15 | 2006-11-08 | 成都市依迈电子化工实业有限公司 | Composite electro-conductive rubber strip |
| CN2883237Y (en) * | 2006-03-10 | 2007-03-28 | 北京中石伟业技术有限公司 | Injection conductive glue package |
-
2007
- 2007-09-24 CN CN2007100304859A patent/CN101400227B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1741891A (en) * | 2003-01-23 | 2006-03-01 | 东洋制罐株式会社 | Method and device for forming composite synthetic resin material |
| CN2601814Y (en) * | 2003-02-21 | 2004-02-04 | 成都市依迈电子化工实业有限公司 | Conductive sealed pad |
| CN2834900Y (en) * | 2005-09-15 | 2006-11-08 | 成都市依迈电子化工实业有限公司 | Composite electro-conductive rubber strip |
| CN2883237Y (en) * | 2006-03-10 | 2007-03-28 | 北京中石伟业技术有限公司 | Injection conductive glue package |
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| Publication number | Publication date |
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| CN101400227A (en) | 2009-04-01 |
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