CN101400222A - Printed circuit board assembly and manufacturing method thereof - Google Patents
Printed circuit board assembly and manufacturing method thereof Download PDFInfo
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- CN101400222A CN101400222A CNA2008102170872A CN200810217087A CN101400222A CN 101400222 A CN101400222 A CN 101400222A CN A2008102170872 A CNA2008102170872 A CN A2008102170872A CN 200810217087 A CN200810217087 A CN 200810217087A CN 101400222 A CN101400222 A CN 101400222A
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- circuit board
- pcb
- board
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Abstract
The present invention relates to a printed circuit board assembly and manufacturing method thereof. The printed circuit board assembly includes a first printed circuit board and a second printed circuit board, wherein, one side of the first and second printed circuit boards are both provided with a metal interconnecting piece. The manufacturing method includes: folding the first and second printed circuit boards, so as to cling the two metal interconnecting pieces; and directly bonding together the first and second printed circuit boards, by a welding method without soldering flux in vacuum environment. Because the inventive printed circuit board assembly and manufacturing method thereof adopts a welding method without soldering flux, the affect of soldering flux to the connection performance in the prior art is avoided, and such a combination mode can guarantee the reliable connection in the entire metal interconnecting piece, so that problem such as simple machine connection in the prior art will not appear.
Description
Technical field
The present invention relates to a kind of printed circuit-board assembly and manufacture method thereof.
Background technology
Printed circuit-board assembly has been widely applied in fields such as communication system, personal consumption electron-like and automobile, medical treatment, military project, Aero-Space.Can be divided into Heat-sink plate, rf board, backboard (motherboard), clamp (daughter board) etc. according to function.Can be divided into list/double sided board, multi-layer sheet etc. again according to structure.
The Heat-sink plate generally comprises at least one circuit board and a metal substrate.The combination of the two generally has: tin cream welding manner, not gummosis prepreg mode, heat conduction bonding sheet mode, mechanical connection manners such as rivet, screw etc.The tin cream welding manner easily produces the welding cavity at the interface because of the existence of scaling powder is arranged.The thermal conductivity of gummosis prepreg is not bad, and the cost of heat conduction bonding sheet is very high.Mechanical connection manner such as rivet, screw technical sophistication only is applied to war products at present, can't extensive use on mill run.Multilayer printed board is made up of the multilayer inner plating, can be understood as a lot of sticking the stacking of list/double sided board, the general way of industry is to adopt to drill through hole technology at present, though simple ripe, but with the device density that has reduced plate is cost, just makes the size of plate become big.Motherboard generally adopts connector with being connected of daughter board, owing to be to adopt rectilinear connection, makes whole space hold very big.The general structure of using bonding sheet between many inner platings that adopts of radio frequency multilayer printed board, the signal that can cause because Dk between bonding sheet and the central layer and Df are inconsistent disturbs like this.
Up-to-date method is to adopt a kind of a large amount of conductive particles that are loaded with, and the electroconductive binder of especially silver-colored particle bonds together second printed circuit board (PCB) and first printed circuit board (PCB), and sets up conductive path between the two.Originally the printed circuit-board assembly that this kind mode is made has lower volume resistance really, but under the environment of high temperature, high humidity, electroconductive binder wherein corrodes easily, is aluminium matter at first printed circuit board (PCB) especially, and when containing silver particles in the electroconductive binder, this problem particularly bothers.Corrode because of easily producing at the interface between the electroconductive binder and first printed circuit board (PCB), finally cause the electrical property and the mechanical performance instability of printed circuit-board assembly.
Summary of the invention
Technical problem to be solved by this invention is: a kind of printed circuit-board assembly and manufacture method thereof are provided.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
Printed circuit-board assembly comprises first printed circuit board (PCB) and second printed circuit board (PCB), and the one side of described first printed circuit board (PCB) and second printed circuit board (PCB) all has the metal connecting portion; Described first printed circuit board (PCB) and second printed circuit board (PCB) are superimposed, and both metal connecting portions are close to, and both metal connecting portions are by directly being combined into one with the welding method that need not solder flux under vacuum environment.
The manufacture method of printed circuit-board assembly comprises the following steps:
S1, provide one second printed circuit board (PCB), and the one side of described second printed circuit board (PCB) has the metal connecting portion;
S2, provide one first printed circuit board (PCB), and the one side of described first printed circuit board (PCB) has the metal connecting portion;
S3, described second printed circuit board (PCB) and first printed circuit board (PCB) is superimposed, and both metal connecting portions are close to, under vacuum environment, use the welding method that need not solder flux that both metal connecting portions are combined into one then.
The invention has the beneficial effects as follows:
Owing to adopt, first printed circuit board (PCB) and second printed circuit board (PCB) are directly combined, thereby avoided in the prior art solder flux the influence of switching performance with the welding method that need not solder flux; And this kind combination can guarantee on whole joint face all reliably to connect, thereby the problem that has such as simple and mechanical connection in the prior art also can not occur.
Description of drawings
Fig. 1 is first view of the specific embodiment of the invention one printed circuit-board assembly;
Fig. 2 is the structural representation of the specific embodiment of the invention one printed circuit-board assembly;
Fig. 3 is first view of the specific embodiment of the invention two printed circuit-board assemblies;
Fig. 4 is second view of the specific embodiment of the invention two printed circuit-board assemblies;
Fig. 5 is the structural representation of the specific embodiment of the invention two printed circuit-board assemblies;
Fig. 6 is first view of the specific embodiment of the invention three printed circuit-board assemblies;
Fig. 7 is second view of the specific embodiment of the invention three printed circuit-board assemblies;
Fig. 8 is the structural representation of the specific embodiment of the invention three printed circuit-board assemblies;
Fig. 9 is first view of the specific embodiment of the invention four printed circuit-board assemblies;
Figure 10 is second view of the specific embodiment of the invention four printed circuit-board assemblies;
Figure 11 is the third state schematic diagram of the specific embodiment of the invention four printed circuit-board assemblies;
Figure 12 is the structural representation of the specific embodiment of the invention four printed circuit-board assemblies;
Figure 13 is first view of the specific embodiment of the invention five printed circuit-board assemblies;
Figure 14 is second view of the specific embodiment of the invention five printed circuit-board assemblies;
Figure 15 is the structural representation of the specific embodiment of the invention five printed circuit-board assemblies;
Figure 16 is first view of the specific embodiment of the invention six printed circuit-board assemblies;
Figure 17 is second view of the specific embodiment of the invention six printed circuit-board assemblies;
Figure 18 is the third state schematic diagram of the specific embodiment of the invention six printed circuit-board assemblies;
Figure 19 is the structural representation of the specific embodiment of the invention six printed circuit-board assemblies;
Figure 20 is first view of the specific embodiment of the invention seven printed circuit-board assemblies;
Figure 21 is the structural representation of the specific embodiment of the invention seven printed circuit-board assemblies;
Figure 22 is first view of the specific embodiment of the invention eight printed circuit-board assemblies;
Figure 23 is second view of the specific embodiment of the invention eight printed circuit-board assemblies;
Figure 24 is the structural representation of the specific embodiment of the invention eight printed circuit-board assemblies;
Embodiment
Embodiment one
This embodiment as depicted in figs. 1 and 2, its main feature is by heat pressing process second printed circuit board (PCB) and first printed circuit board (PCB) directly to be combined.
As shown in Figure 1, produce first printed circuit board (PCB) and second printed circuit board (PCB) by existing processes earlier.Described first printed circuit board (PCB) is a matrix with dielectric 2, and described dielectric 2 is thermosets or thermoplastic.Upper surface at dielectric 2 has function pads and lines 1, also has pad 5, and its lower surface is a thermal conductive surface 3.Described second printed circuit board (PCB) is the metal substrate that comprises heat radiating metal base 4.Described connecting portion promptly refers to the thermal conductive surface 3 of the first printed circuit board (PCB) lower surface and the upper surface of second printed substrate.The first printed circuit board (PCB) correspondence is placed on second printed circuit board (PCB), and both metal connecting portions are close under the clean situation of both metal connecting portions guaranteeing, under vacuum environment, carry out hot pressing then.Hot pressing temperature is between 150 to 700 degrees centigrade, and hot pressing pressure need reach 10PSI (Pounds persquare inch pound per square inch), is roughly equal to 69 kPas.In general pressure is the bigger the better, but preferred 250～500PSI.Through after about 20～120 minutes, as shown in Figure 2, can find on first printed circuit board (PCB) thermal conductive surface 3 with second printed circuit board (PCB) on heat radiating metal base 4 combined.Because this embodiment adopts heat pressing process that second printed circuit board (PCB) and first printed circuit board (PCB) are directly combined, the printed circuit-board assembly that manufacturing is come out connects reliable, and switching performance can not have bigger change in time, thereby reliable operation, has good quality.
Embodiment two
This embodiment is shown in Fig. 3 to 5, be with the difference of embodiment one, before carrying out hot pressing, under the clean situation of the metal connecting portion that guarantees second printed circuit board (PCB) and first printed circuit board (PCB), as shown in Figure 4, on both metal connecting portions,, form layer of metal dielectric layer 6 by physics or chemical methods such as plating, depositions.Both can be the same or different by the material composition of metallic dielectric layer 6, can be single metals, also can be alloys, but need generally to guarantee that its conductance needs greater than 10
-7(Ω cm)
-1, and do not have radioactivity.At last the first printed circuit board (PCB) correspondence is placed on second printed circuit board (PCB), and both metallic dielectric layers 6 are close to, use thermal pressure weldering, supersonic welding or magnetic discharge welding etc. to need not the welding method of solder flux then, make both metallic dielectric layers 6 combine, form structure as shown in Figure 5.The metallic dielectric layer 6 that contains intermetallic compound by one deck between second printed circuit board (PCB) and first printed circuit board (PCB) combines, thereby has guaranteed to be electrically connected reliably between the two.Embodiment one adopts same metal to merge, and the PCB product in the industry cycle generally adopts the media of copper as conducting and signal transmission, this for press with conditional request relative higher, and then also higher relatively to the requirement of equipment; Embodiment two has adopted the method that increases metal clad, and the fusing point of this metal clad can be selected relatively low type, as tin, lead etc., simultaneously, if when adopting two kinds of different metal clads, the information that can provide according to alloy phase diagram is selected to be easier to process and metallic combination that the alloy reliability is higher, as tin+nickel, silver+nickel etc.
Embodiment three
This embodiment is shown in Fig. 6 to 8, be with the difference of embodiment one, second printed circuit board (PCB) no longer is a simple metal substrate, but one and the similar printed circuit board (PCB) of first printed circuit board (PCB), it is substrate with dielectric 2 also, at least simultaneously be provided with pad 5 at it, this pad 5 is connecting portion.At first adopt existing processes to produce first printed circuit board (PCB) and second printed circuit board (PCB) during making.The first printed circuit board (PCB) correspondence is placed on second printed circuit board (PCB), and both pads 5 are close under all clean prerequisite of both pads 5 guaranteeing then, under vacuum environment, carry out hot pressing then.The condition of hot pressing is identical with embodiment one, can form printed circuit-board assembly as shown in Figure 7, can find on first printed circuit board (PCB) pad 5 with second printed circuit board (PCB) on pad 5 combined.At last as shown in Figure 8, in the space around the pad 5, fill sealing 7 final product.This sealing with components and parts be welded to PCB go up after the purpose of sealing is similar again.After embodiment three finished the metal fusion, owing to adopted the heat cured insulation medium, the space around the pad can not be filled, and in order to protect the pad that merges, need protect with sealing.
Embodiment four
This embodiment is with the difference of embodiment three, before carrying out hot pressing shown in Fig. 9 to 12, also as among the embodiment two, by physics or chemical methods such as plating, depositions, form layer of metal dielectric layer 6 on both pads 5, its structure as shown in figure 10.Be that both metallic dielectric layer 6 combines by hot pressing then, promptly form structure as shown in figure 11.Also to fill sealing 7 at last, form structure as shown in figure 12, final product.
Embodiment five
This embodiment is shown in Figure 13 to 15, be with the difference of embodiment three, it is not to recharge sealing after hot pressing, but be as Figure 14, to be clipped between second printed circuit board (PCB) and first printed circuit board (PCB) in the curing adhesive sheet 8 of the semi-cured state of the relevant position hollow out of the pad that needs merge before the hot pressing, carry out hot pressing then, promptly form structure as shown in figure 15.Mostly the sheet material that present industry is common PCB is that thermosets (is cured as irreversible reaction, later stage can not got back to the rising of temperature and be solidified preceding state), draw materials conveniently, be widely used, settable cementitious piece performance is identical with second printed circuit board (PCB) with first printed circuit board (PCB); Simultaneously, increase settable cementitious after, just solved and pressed and the problem of back sealing, because prepreg can fill up all slits when solidifying.So the dielectric 2 in this embodiment adopts thermosets.
Embodiment six
This embodiment is shown in Figure 16 to 19, be with the difference of embodiment five, before the curing adhesive sheet 8 of placing semi-cured state is carried out hot pressing, also on pad 5 surfaces of second printed circuit board (PCB) and first printed circuit board (PCB), by physics or chemical methods such as plating, depositions, form layer of metal dielectric layer 6, its structure as shown in figure 17.Then as shown in figure 18, the curing adhesive sheet 8 of semi-cured state on the folder.Carry out hot pressing at last, form the final products of structure as shown in figure 19.Dielectric 2 in this embodiment adopts thermosets.
Embodiment seven
This embodiment is with the difference of embodiment three shown in Figure 20,21, does not fill sealing 7 after the hot pressing.Industry is when doing the high frequency product, use thermoplastic, its characteristics are exactly that dielectric can the repeatedly deliquescing with the rising of temperature, do not have curing reaction more, the ability that blind is arranged to a certain extent is so the dielectric 2 in this embodiment adopts thermoplastic.
Embodiment eight
This embodiment is with the difference of embodiment seven shown in Figure 22 to 24, before hot pressing, also forms layer of metal dielectric layers 6 on both pad 5 surfaces, and then carries out hot pressing, and both metallic dielectric layers 6 are combined.Dielectric 2 in this embodiment adopts thermoplastic.
What need supplementary notes is that described herein first printed circuit board (PCB) and second printed circuit board (PCB) not only comprise common ordinary circuit board, IC support plate, also comprise embedded circuit board.One of first printed circuit board (PCB) wherein and second printed circuit board (PCB) can also be metal substrate, passive device, mount device etc.For the Heat-sink printed board, adopt this inventive method, can effectively solve welding cavity, gummosis prepreg thermal conductivity is not bad; The cost of heat conduction bonding sheet is very high; Rivet, screw etc. are used problems such as not extensive.For multi-layer sheet, simplified the interconnected technology of random layer to a great extent.Be connected with daughter board for motherboard, increase the printed board reliability, reduce shared space, directly reduced client's material quantity simultaneously, management cost and whole cost effect are obvious for reducing.For the radio frequency printed board, because the dielectric constant (Dk) of bonding sheet and central layer is different, the interference of the signal of telecommunication can appear influencing in traditional printed board manufacture craft.The present invention has avoided this problem.For the passive original paper of buying in, connect by face, allow and imbed real components and parts the function of components and parts---rather than realize---to be achieved with PCB, avoid simultaneously to realizing that device holes with being connected on device of plate.
And the present invention is not limited only to the circuit board assemblies that is combined together to form by " first printed circuit board (PCB) " and " second printed circuit board (PCB) ", this technology also can be used for many core materials are pressed into a multi-layer sheet, can promote the density of circuit board equally to a great extent, reduce total number of plies, thereby reached the purpose that reduces cost.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1, printed circuit-board assembly, comprise first printed circuit board (PCB) and second printed circuit board (PCB), the one side of described first printed circuit board (PCB) and second printed circuit board (PCB) all has the metal connecting portion, it is characterized in that: described first printed circuit board (PCB) and second printed circuit board (PCB) are superimposed, and both metal connecting portions are close to, and both metal connecting portions are by directly being combined into one with the welding method that need not solder flux under vacuum environment.
2, printed circuit-board assembly as claimed in claim 1 is characterized in that: the described welding method that need not solder flux is thermal pressure weldering or supersonic welding or magnetic discharge welding.
3, printed circuit-board assembly as claimed in claim 1 is characterized in that: described printed circuit-board assembly also comprises metallic dielectric layer, and described metallic dielectric layer is covering on the metal connecting portion of first printed circuit board (PCB) and second printed circuit board (PCB); Metallic dielectric layer is that conductance is greater than 10
-7(Ω cm)
-1, and do not have radioactive single metal or alloy; Described first printed circuit board (PCB) and second printed circuit board (PCB) produce in metallic dielectric layer in conjunction with the back compound between layer of metal.
4, as any described printed circuit-board assembly in the claim 1 to 3, it is characterized in that, also be filled with sealing in the space between described first printed circuit board (PCB), second printed circuit board (PCB) or solidify adhesive sheet.
5, as any described printed circuit-board assembly in the claim 1 to 3, it is characterized in that, described first printed circuit board (PCB), second printed circuit board (PCB) are ordinary circuit board, support plate, adopt initiatively or passive type is imbedded in the circuit board that technology forms any one.
6, the manufacture method of printed circuit-board assembly comprises the following steps:
S1, provide one second printed circuit board (PCB), and the one side of described second printed circuit board (PCB) has the metal connecting portion;
S2, provide one first printed circuit board (PCB), and the one side of described first printed circuit board (PCB) has the metal connecting portion;
S3, described second printed circuit board (PCB) and first printed circuit board (PCB) is superimposed, and both metal connecting portions are close to, under vacuum environment, use the welding method that need not solder flux that both metal connecting portions are combined into one then.
7, the manufacture method of printed circuit-board assembly as claimed in claim 6 is characterized in that, all comprises the step that forms dielectric layer in described step S1 and the S2; The step of described formation dielectric layer is being covered the layer of metal dielectric layer for the method that adopts chemistry or physics on described metal connecting portion; Described metallic dielectric layer is that conductance needs greater than 10
-7(Ω cm)
-1, and do not have radioactive single metal or alloy; Described first printed circuit board (PCB) and second printed circuit board (PCB) produce in metallic dielectric layer in conjunction with the back compound between layer of metal.
8, the manufacture method of printed circuit-board assembly as claimed in claim 6 is characterized in that, described hot pressing, and its hot pressing temperature is 150 degrees centigrade to 700 degrees centigrade, hot pressing pressure is greater than 69 kPas.
As the manufacture method of any described printed circuit-board assembly in the claim 6 to 8, it is characterized in that 9, the described welding method that need not solder flux is thermal pressure weldering or supersonic welding or magnetic discharge welding.
10, as the manufacture method of any described printed circuit-board assembly in the claim 6 to 8, it is characterized in that, described first printed circuit board (PCB), second printed circuit board (PCB) are ordinary circuit board, support plate, and adopt initiatively or passive type is imbedded in the circuit board that technology forms any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102170872A CN101400222B (en) | 2008-10-20 | 2008-10-20 | Printed circuit board assembly and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102170872A CN101400222B (en) | 2008-10-20 | 2008-10-20 | Printed circuit board assembly and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101400222A true CN101400222A (en) | 2009-04-01 |
| CN101400222B CN101400222B (en) | 2012-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102170872A Active CN101400222B (en) | 2008-10-20 | 2008-10-20 | Printed circuit board assembly and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1384701A (en) * | 2001-05-07 | 2002-12-11 | 索尼公司 | Multi-layered printed circuit board and its making process |
| US6831235B1 (en) * | 2000-02-14 | 2004-12-14 | Ibiden Co., Ltd. | Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
| CN1787727A (en) * | 2004-12-09 | 2006-06-14 | 比亚迪股份有限公司 | Flexible printed circuit board and method for connecting printed circuit board thereof |
| US7223687B1 (en) * | 2005-12-29 | 2007-05-29 | Subtron Technology Co., Ltd. | Printed wiring board and method of fabricating the same |
-
2008
- 2008-10-20 CN CN2008102170872A patent/CN101400222B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6831235B1 (en) * | 2000-02-14 | 2004-12-14 | Ibiden Co., Ltd. | Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
| CN1384701A (en) * | 2001-05-07 | 2002-12-11 | 索尼公司 | Multi-layered printed circuit board and its making process |
| CN1787727A (en) * | 2004-12-09 | 2006-06-14 | 比亚迪股份有限公司 | Flexible printed circuit board and method for connecting printed circuit board thereof |
| US7223687B1 (en) * | 2005-12-29 | 2007-05-29 | Subtron Technology Co., Ltd. | Printed wiring board and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101400222B (en) | 2012-08-22 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee before: SHENNAN CIRCUITS Co.,Ltd. Address after: 518053 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee before: SHENZHEN SHENNAN CIRCUITS Co.,Ltd. |