CN101396896B - Manufacture system of photosensitive lamination body - Google Patents

Manufacture system of photosensitive lamination body Download PDF

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Publication number
CN101396896B
CN101396896B CN2008101610790A CN200810161079A CN101396896B CN 101396896 B CN101396896 B CN 101396896B CN 2008101610790 A CN2008101610790 A CN 2008101610790A CN 200810161079 A CN200810161079 A CN 200810161079A CN 101396896 B CN101396896 B CN 101396896B
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China
Prior art keywords
substrate
laminater
manufacturing system
heater
photosensitive laminate
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Expired - Fee Related
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CN2008101610790A
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Chinese (zh)
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CN101396896A (en
Inventor
中泽直子
远藤惠介
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Fujifilm Corp
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Fujifilm Corp
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Publication of CN101396896A publication Critical patent/CN101396896A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/41Opaque

Abstract

The present invention provides a system (20) for manufacturing photosensitive laminate, which is provided with a heating device (45) and a laminating device (46). A second heating device (78) forming a heating device (45) fixes a frame body (96) on a body part (78a). Meanwhile a conveying mechanism (92) which extends to the vicinity of laminating device (46) and is used for conveying the glass substrate (24) to the attaching processing position of the laminating device (46) and a third infrared heater (90c) which is used for executing heat preserving to the glass substrate (24) on a preset temperature until the vicinity of the attaching processing position are configured in the frame body (96). The conveying mechanism (92) is provided with a plurality of conveying rollers (80a).

Description

The manufacturing system of photosensitive laminate
Technical field
The present invention relates to a kind of manufacturing system of photosensitive laminate, it possesses substrate is heated to the heater of set point of temperature and in advance at the laminater that is heated to applying photonasty plate on the said substrate of set point of temperature.
Background technology
For example, substrate for liquid crystal panel, printing wiring are fitted in through the photonasty lamellar body (photonasty plate) that will have photosensitive material (photoresist) layer with substrate with substrate and PDP panel and constitute photosensitive laminate on the substrate surface.This photonasty lamellar body is on pliability plastic supporting body, to stack gradually photosensitive material layer and diaphragm.
When making above-mentioned photosensitive laminate, usually, substrates such as glass substrate and resin substrate are heated to set point of temperature in advance.And photonasty plate that diaphragm a part or whole part is stripped from and the substrate that heated are clamped between a pair of laminating roll that constitutes laminater and heat, thereby, photosensitive material layer by thermo-compressed on said substrate.Next, from strippable substrate pliability plastic supporting body, thereby make photosensitive laminate.
For example; In the laminating method of the dried etchant resist that 8-No. 183146 communiques of Te Kaiping are disclosed; As shown in Figure 8, film cut-out portion 4 and film removal portion 5 on the throughput direction placement substrate preheating part 1 of the substrate that forms by delivery section 67, lamination portion 2, substrate cooling end 3, the substrate.
Basal plate preheating portion 1 sees this substrate 7 off after by preheating heater 1a substrate 7 being heated to set point of temperature to lamination portion 2.The a pair of laminating roll 2a of configuration, 2b in lamination portion 2, feeding substrate 7 and dried etchant resist 8 between said laminating roll 2a, 2b.Thereby, dried etchant resist 8 by thermo-compressed on substrate 7.
But, in the above-mentioned prior art, in basal plate preheating portion 1 with constitute between the substrate inserting side of laminating roll 2a, 2b of lamination portion 2 (below, be also referred to as transition portion), because substrate 7 is exposed in the indoor air, thereby the temperature of said substrate 7 reduces easily.Yet the interior Temperature Distribution of the face of substrate 7 can impact the lamination quality during lamination, and temperature homogeneity is very important for keeping the lamination quality in the face of said substrate 7.
Thereby, consider when lamination, must to guarantee that substrate 7 is preferred temperature, for example estimate the temperature of bringing by room air and reduce, set the design temperature of said substrate 7 to such an extent that be higher than target temperature.Yet because the change of the transporting velocity of the substrate 7 of transition portion, the temperature of said substrate 7 circumferences reduces greater than reasons such as central portions simultaneously, and temperature homogeneity reduces in the face of the said substrate 7 in said transition portion.
Summary of the invention
The objective of the invention is to address this is that; A kind of manufacturing system of photosensitive laminate is provided, and it can stop the temperature of substrate of the transition portion of heater and laminater to reduce, can improve simultaneously temperature homogeneity in the face of said substrate effectively.
The manufacturing system of photosensitive laminate involved in the present invention possesses substrate is heated to the heater of set point of temperature and in advance at the laminater that is heated to applying photonasty plate on the said substrate of set point of temperature.
And, be used for substrate handled to the applying of said laminater the feed mechanism carried the position and be used for disposing between heater and the laminater near the heat preservation mechanism of the said substrate insulation that is heated to set point of temperature said applying processing position.
Among the present invention, between heater and laminater, substrate is handled the position by the applying that feed mechanism is transported to said laminater, simultaneously, is handled near the position being incubated said applying under the set point of temperature by heat preservation mechanism.Thereby, can stop the temperature of substrate of the transition portion of heater and laminater to reduce, can improve simultaneously temperature homogeneity in the face of said substrate effectively.Thereby can be well and keep the lamination quality reliably.
Through the union declaration of accompanying drawing and following preferred forms example, further illustrate above-mentioned purpose and other purposes, characteristic and advantage.
Description of drawings
Fig. 1 is the summary pie graph of the manufacturing system of first embodiment of the invention.
Fig. 2 is the cutaway view of employed strip photonasty plate in the said manufacturing system.
Fig. 3 is the key diagram of the state of bonding adhesive labels on said strip photonasty plate.
Fig. 4 is the major part key diagram of said manufacturing system.
Fig. 5 is that the major part of said manufacturing system is overlooked key diagram.
Fig. 6 is the summary pie graph of the manufacturing system of second embodiment of the present invention.
Fig. 7 is the summary pie graph of the manufacturing system of the 3rd embodiment of the present invention.
Fig. 8 is the key diagram that the spy opens the laminating method of the dried etchant resist that flat 8-No. 183146 communiques are disclosed.
The specific embodiment
As shown in Figure 1; The manufacturing system 20 of the photosensitive laminate of first embodiment of the invention; In liquid crystal or the manufacturing process of organic EL with chromatic filter, the operation of carrying out is that photo-sensitive resin 28 (the afterwards stating) heat with strip photonasty plate 22 is transferred on the glass substrate 24.
As shown in Figure 2, the photonasty plate 22 that uses in the manufacturing system 20 is that pliability matrix film (supporting mass) 26, photo-sensitive resin (photosensitive material layer) 28 and diaphragm 30 is range upon range of and constitute.
As shown in Figure 1, manufacturing system 20 comprises: plate output mechanism 32, and it contains photonasty plate 22 is wound into the photonasty plate roller 22a of roller shape and exports said photonasty plate 22 from this photonasty plate roller 22a; Organisation of working 36, its on the diaphragm 30 of said photonasty plate 22 of output, form can transversely cutting hemisection position 34 (with reference to Fig. 2); Label bonding agency 40, it bonds to the adhesive labels 38 (with reference to Fig. 3) that a part has non-bonded part 38a on the diaphragm 30.
Downstream at label bonding agency 40 dispose: be used for photonasty plate 22 from index(ing) feed become continuous feed storage mechanism 42, from said photonasty plate 22 with specific length peel off the mechanism for stripping 44 of diaphragm 30 at interval, the heater 45 that glass substrate 24 is carried to the applying position with the state that is heated to set point of temperature and the photo-sensitive resin 28 that will expose owing to peeling off of said diaphragm 30 be fitted in the laminater 46 on the said glass substrate 24.Also have, the object being treated that below will utilize laminater 46 on glass substrate 24, to be fitted with photonasty plate 22 only is called adhesive substrates 24a.
Near the upper reaches of the applying position of laminater 46; Configuration detection mechanism 47; It directly detects the hemisection position 34 as the boundary position of photonasty plate 22, and the while is plate shut-off mechanism 48 between the substrate of the said photonasty plate 22 of 24 of each glass substrates of the downstream of said laminater 46 configuration cuts.The upper reaches of plate shut-off mechanism 48 are arranged on when turning round beginning and the plate shut-off mechanism 48a that turns round and use when finishing between this substrate.
Near the downstream of plate output mechanism 32, the bond pad 49 that the front end of the rear end of the photonasty plate 22 that configuration will roughly use and the new photonasty plate 22 that uses is bonded together.At the downstream of this bond pad 49 configuration film end position detector 51, the coiling that is used for controlling owing to photonasty plate roller 22a departs from horizontal the departing from that causes.
Organisation of working 36 is configured in roller to 50 downstream, and roller is used for calculating the roller diameter of accommodating the photonasty plate roller 22a that is wound in the plate output mechanism 32 to 50.This organisation of working 36 possesses single circular shear blade 52, and this circular shear blade 52 laterally moves along photonasty plate 22, at the assigned position formation hemisection position 34 of said photonasty plate 22.
As shown in Figure 2, hemisection position 34 is tripping protection film 30 at least, in fact in order to cut off this diaphragm 30 reliably, is enough to be cut into photo-sensitive resin 28 and even pliability matrix film 26 and the penetraction depth of circular shear blade 52 is set to.
Hemisection position 34 is used for setting the interval of glass substrate 24, for example is set in the position of going deep into each 10mm to the said glass substrate 24 of both sides respectively.24 of glass substrates by the part of hemisection position 34 clampings after play a role as the mask that photo-sensitive resin 28 is when the frame shape is fitted on the said glass substrate 24 in the laminater 46 stated.
Label bonding agency 40 be for and 24 of glass substrates keep the residual fraction 30b of diaphragm 30 accordingly, and supply with the adhesive labels 38 that released part 30aa that will peel off side the place ahead and the released part 30ab that peels off proceeds posterolateral link.As shown in Figure 2, diaphragm 30 clips residual fraction 30b with the released part 30aa of the part of peeling off earlier as the place ahead, on the other hand with after the part peeled off as the released part 30ab at rear.
As shown in Figure 3, adhesive labels 38 formation that is rectangle is by for example forming with diaphragm 30 identical resin materials.Adhesive labels 38 has non-bonded part (the comprising little bonding) 38a that does not have coating adhesive at central portion; Simultaneously in this non-bonded part 38a both sides, be vertical both ends of said adhesive labels 38, have and bonding first adhesive portion 38b of the released part 30aa in the place ahead and the second adhesive portion 38c bonding with the released part 30ab at rear.
As shown in Figure 1; Label bonding agency 40 possess can be whenever at a distance from the adsorbent pad 54a~54g of maximum 7 adhesive labels 38 of predetermined distance ground applying; Simultaneously; In the applying position of the said adhesive labels 38 that forms based on said adsorbent pad 54a~54g, the configuration freely of going up and down is used for keeping from the below supporting station 56 of photonasty plate 22.
Store mechanism 42 and possess floating roller 61, it can absorb the speed difference of continuous conveying of said photonasty plate 22 in intermittent delivery and downstream of the photonasty plate 22 of upstream side, but in order further to prevent tension change, by swing 2 going here and there rollers 60 and constitute freely.Also have, roller 60 can be for 1 string or more than 3 strings corresponding to storage capacity.
Be configured in the mechanism for stripping 44 of storing mechanism 42 downstream and possess the tube of suction 62, it is the tension change that is used for reducing the outlet side of photonasty plate 22, the tension force when stablizing lamination.Near configuration stripper roll 63 suction tube 62, the diaphragm of peeling off with the peel angle of acute angle from photonasty plate 22 via this stripper roll 63 simultaneously 30 except that residual fraction 30b, is wrapped in the diaphragm coiling portion 64.
Dispose tension control mechanism 66 from tension force to photonasty plate 22 that to grant in the downstream of mechanism for stripping 44.Tension control mechanism 66 possesses cylinder 68, under the driving action of this cylinder 68, makes tension regulator 70 swing displacements, thereby can adjust the tension force of the photonasty plate 22 of these tension regulator 70 sliding-contacts.Also have, tension control mechanism 66 can use as required, also can delete.
Testing agency 47 possesses photoelectric sensors 72 such as laser sensor and photoelectric sensor; The variation that said photoelectric sensor 72 directly detects the wedge-like groove shape portion at hemisection positions 34 and the ladder that produces owing to the thickness of diaphragm 30 is poor or produce owing to these combination etc., with this detection signal as boundary position signals.Photoelectric sensor 72 and backing roll 73 arranged opposite.Also have, can replace photoelectric sensor 72 and image detection means such as configuration noncontact extensometer and CCD camera etc.
Heater 45 is as shown in Figure 4, comprise the conveying mechanism 74 that is used for glass substrate 24 is carried along the arrow C direction, along the throughput direction configuration of said conveying mechanism 74 a plurality of, be first heating arrangements 76 and second heating arrangements 78 at least.
Conveying mechanism 74 possesses a plurality of resin rounding plate-like conveying rollers 80 of arranging along the arrow C direction, and said conveying roller 80 is configured in the main part 76a that constitutes first heating arrangements 76 and constitutes in the main part 78a of second heating arrangements 78.
First heating arrangements, 76 to the second heating arrangements 78 lean on arrow C direction upstream side, are provided with to carry and put the fixed station 84 on base station 82.On fixed station 84 like Fig. 4 and shown in Figure 5, be provided be parallel to each other, along the pair of guide rails 86 that the arrow C direction is extended, main part 76a is configured to can be at this guide rail 86 upper edge arrow C directions advance and retreat predetermined distance L1.
Main part 76a is provided with interlock (not diagram) respectively at arrow C direction leading section and arrow C direction rearward end, and said main part 76a is maintained at the advance and retreat position.At the going-back position of main part 76a, be that the entrance side of glass substrate 24 is provided with robot guardrail 88.In main part 76a, be provided be positioned at above the conveying roller 80, the first infrared heater 90a of for example panel type.
Second heating arrangements 78 possesses main part 78a, and said main part 78a is provided with feed mechanism 92, and the position is handled near the applying that it extends to the laminater 46, be used for glass substrate 24 is transported to said laminater 46; The 3rd infrared heater (heat preservation mechanism) 90c, it is used to be incubated the said glass substrate 24 that is heated to set point of temperature near the position is handled in said applying; Keep out of the way mechanism 94, it can make said main part 78a move with respect to said laminater 46.
On main part 78a, form with after state the opening 98 that is communicated with framework 96 in, the while in this main part 78a, be provided with along the extension of arrow C direction be positioned at above a plurality of conveying rollers 80, the second infrared heater 90b of for example panel type.In addition, first and second infrared heater 90a, 90b also can use storage heater.
In the side of the arrow C direction front of main part 78a, be fixed with the framework 96 of extending along glass substrate 24 horizontal (among Fig. 5, arrow D direction).In framework 96, constitute a plurality of resin rounding plate-like conveying roller 80a of feed mechanism 92, be provided with simultaneously and be positioned at said conveying roller 80a top, panel type the 3rd infrared heater 90c (or storage heater) along arrow C direction configuration.On framework 96, be formed for the opening 96a of glass substrate 24 to laminater 46 outputs.
Keep out of the way mechanism 94 and possess a pair of second guide rail 100 that on base station 82, is parallel to each other and extends along arrow D direction, can be on this second guide rail 100 along arrow D direction advance and retreat ground configuration movable table 102.Do not have illustrated interlock in the setting of the advance and retreat position of the arrow D of movable table 102 direction, can keep said movable table 102 at two positions.
The pair of guide rails 104 be parallel to each other and extend along the arrow C direction is set on movable table 102, can be on said guide rail 104 along the arrow C direction advance and retreat ground disposal subject 78a of portion.Main part 78a fixes near laminater 46 in arrow C direction front position, on the other hand, can fix at arrow C direction back-end location.
Main part 78a can move to arrow D direction along guide rail 100 after arrow C 1 direction moves predetermined distance L1.Be set at the size that feed mechanism 92 is not interfered with laminater 46 along the displacement L1 of arrow C 1 direction when arrow D direction moves; Simultaneously, be set at the operator along the displacement L2 of arrow D direction said laminater 46 is carried out the size that main part 78a can not interfere when the various maintenance activities.
Also has the formation that can adopt configuration not have illustrated air suspension board, glass substrate 24 being suspended and carrying in the transport 74 along the arrow C direction.
As shown in Figure 1, be provided with the substrate accumulator 110 of accommodating a plurality of glass substrates 24 at the upper reaches of heater 45.Substrate accumulator 110 is set up the fan component (or conduit assembly) 112 that is used for dedusting on 3 sides beyond input and the conveying end.Remove blowing out of electric clean air in 112 pairs of substrate accumulators 110 of fan component.Be housed in each glass substrate 24 in the substrate accumulator 110 and be set at adsorbent pad 116 absorption on the hand 114a of robot 114 and take out, be transported into heater 45.
The lamination that laminater 46 possesses up and down configuration, be heated to set point of temperature simultaneously is with rubber rollers 120a, 120b.Backing roll 122a, 122b in rubber rollers 120a, the last sliding-contact of 120b, simultaneously, said backing roll 122b by roller clamping section 124 by pressing to rubber rollers 120b side.
Near rubber rollers 120a, can dispose movably and prevent touch roll 126, be used to prevent that photonasty plate 22 from touching said rubber rollers 120a.Configuration is used for photonasty plate 22 is prepared the preparation heating part 127 that is heated to set point of temperature in advance near the upper reaches of laminater 46.This preparation heating part 127 for example possesses heaters such as infrared ray rod heater.
Disposing film conveying roller 128a and substrate conveying roller 128b between laminater 46 and substrate between the plate shut-off mechanism 48.The downstream of plate shut-off mechanism 48 configuration cooling body 130 between substrate is simultaneously at the downstream of this cooling body 130 configuration matrix mechanism for stripping 132.Cooling body 130 is supplied with cold wind to this adhesive substrates 24a and is implemented cooling processing after plate shut-off mechanism 48 cuts off the photonasty plate between adhesive substrates 24a 22 between via substrate.Specifically, setting the cold wind temperature is 10 ℃, and air quantity is 1.0~2.0m 3/ min.Also have, also can not use cooling body 130, and after cool off naturally in the photosensitive laminate accumulator 146 stated.In addition, also can replace cold wind, and utilize indoor wind to blow.
The matrix mechanism for stripping 132 that is configured in cooling body 130 downstream possesses a plurality of adsorbent pad 134 of the absorption adhesive substrates 24a from the below; Keep via mechanical hand 136 matrix film 26 and residual fraction 30b being peeled off under the state of said adhesive substrates 24a in absorption on this adsorbent pad 134.In the upper reaches, downstream and two sides of adsorbent pad 134, configuration to the laminated portion integral body of adhesive substrates 24a spray from the side of 4 directions remove electric air remove hair drier (not diagram).Also have, can be with workbench vertical or when peeling off with its inclination, or upset for dedusting.
Downstream at matrix mechanism for stripping 132 are provided with the photosensitive laminate accumulator 146 that contains a plurality of photosensitive laminates 140.Peeled off the photosensitive laminate 140 of matrix film 26 and residual fraction 30b from adhesive substrates 24a through matrix mechanism for stripping 132; Be set at adsorbent pad 144 absorption on the hand 142a of robot 142 and take out, be housed in the photosensitive laminate accumulator 146.Also have, hand 142a also can not utilize absorption and use the hold mode of for example utilizing friction to carry out.
Photosensitive laminate accumulator 146 is set up the fan component (or conduit assembly) 112 that is used for dedusting on 3 sides beyond input and the conveying end.Remove blowing out of electric clean air in 112 pairs of photosensitive laminate accumulators 146 of fan component.
In the manufacturing system 20; Plate output mechanism 32, organisation of working 36, label bonding agency 40, storage mechanism 42, mechanism for stripping 44, tension control mechanism 66 also have testing agency 47 to be configured in the top of laminater 46; But; Also can form following formation in contrast, be about to said plate output mechanism 32 and be configured in the below of said laminater 46 to said testing agency 47, photonasty plate 22 turns upside down; Photo-sensitive resin 28 is fitted in glass substrate 24 downsides, also can said manufacturing system 20 integral body be constituted in a straight line in addition.
Manufacturing system 20 is carried out integral body control via lamination control part 150; For example all be provided with lamination control part 152, substrate heating control section 154 and matrix in each function portion of this manufacturing system 20 and peel off control part 156 etc., they interrelate through the in-process network.
Lamination control part 150 interrelates with plant network, carries out the information processing that is used to produce from the production management of the indication information that does not have the illustrated CPU of factory (condition enactment and production information etc.) and operational management etc.
Lamination control part 152 is carried out the control of each function portion as the whole center of operation, and formation is controlled the for example controlling organization of heater 45 according to the positional information at the hemisection position 34 of the photonasty plate 22 that utilizes testing agency 47 to detect.
Matrix is peeled off control part 156 and is carried out matrix film 26 is controlled from the action that the adhesive substrates 24a that is supplied with by laminater 46 peeled off, lower procedure, discharged photosensitive laminate 140, controls the information of said adhesive substrates 24a and said photosensitive laminate 140 simultaneously.
Be separated into the first clean room 162a and the second clean room 162b via next door 160 in the manufacturing system 20.Accommodate plate output mechanism 32 among the first clean room 162a and accommodate later mechanism of testing agency 47 in tension control mechanism 66, the second clean room 162b.The first clean room 162a and the second clean room 162b are communicated with via breakthrough part 164.
Below describe about the action of this manufacturing system 20.
At first, as shown in Figure 1, in organisation of working 36, circular shear blade 52 laterally moves along photonasty plate 22, and this photonasty plate 22 is cut into photo-sensitive resin 28 and even matrix film 26 from diaphragm 30, forms hemisection position 34 (with reference to Fig. 2).Have, photonasty plate 22 is as shown in Figure 1 again, after carrying along the arrow A direction corresponding to the size of the residual fraction 30b of diaphragm 30, stops formation hemisection position 34 under the migration of circular shear blade 52.Thereby, on photonasty plate 22, clip residual fraction 30b the released part 30aa in the place ahead and the released part 30ab at rear (with reference to Fig. 2) be set.
Next, photonasty plate 22 is transported to label bonding agency 40, and the regulation applying position of diaphragm 30 is configured on the supporting station 56.In label bonding agency 40; Utilize adsorbent pad 54a~54g absorption to keep the adhesive labels 38 of regulation number; Each adhesive labels 38 is across the residual fraction 30b of diaphragm 30, with the released part 30aa in the place ahead and bonding being integral of released part 30ab (with reference to Fig. 3) at rear.
The photonasty plate 22 of bonding for example 7 adhesive labels 38 is as shown in Figure 1, carries continuously to mechanism for stripping 44 after preventing the tension change of outlet side via storing mechanism 42.In mechanism for stripping 44, the matrix film 26 of photonasty plate 22 is inhaled into tube 62 absorption and keeps, and diaphragm 30 reservation residual fraction 30b are stripped from from said photonasty plate 22 simultaneously.This diaphragm 30 is stripped from the peel angle of acute angle via stripper roll 63, and is wrapped in diaphragm coiling portion 64.
Under the effect of mechanism for stripping 44; After diaphragm 30 reservation residual fraction 30b peel off from matrix film 26; Photonasty plate 22 carries out tension adjustment via tension control mechanism 66, utilizes photoelectric sensor 72 to carry out the detection at hemisection position 34 through testing agency 47 again.
According to the detection information at hemisection position 34, under the turning effort of film conveying roller 128a, photonasty plate 22 is carried to laminater 46 quantitatively.At that time, prevent touch roll 126 standby up, rubber rollers 120b is configured in the below simultaneously.
On the other hand, heater 45 is set the heating-up temperature in first and second heating arrangements 76,78 corresponding to the laminating temperature in the laminater 46.For example, if laminating temperature is 110 ℃, then the heating-up temperature in first and second heating arrangements 76,78 is set in about 120 ℃ via first and second infrared heater 90a, 90b.
So the glass substrate 24 that is housed in the substrate accumulator 110 is controlled by robot 114, this glass substrate 24 is transported in first heating arrangements 76.In first heating arrangements 76, as shown in Figure 4, under the heat effect of the first infrared heater 90a, after glass substrate 24 is heated up, via conveying mechanism 74 with said glass substrate 24 to 78 feedings of second heating arrangements.
In second heating arrangements 78, via the second infrared heater 90b glass substrate 24, this glass substrate 24 with the state that utilizes the 3rd infrared heater 90c and maintain set point of temperature via feed mechanism 92 to laminater 46 feedings.In the laminater 46, glass substrate 24 temporarily is configured between rubber rollers 120a, the 120b corresponding to the fitting part of the photo-sensitive resin 28 of photonasty plate 22.
Under this state, via roller clamping section 124 backing roll 122b and rubber rollers 120b are risen, thereby glass substrate 24 is sandwiched between rubber rollers 120a, the 120b with the stamping pressure of stipulating.Have again, under the turning effort of rubber rollers 120a, on this glass substrate 24, utilize heating and melting transfer printing (lamination) photo-sensitive resin 28.
At this; As lamination; Speed is that the temperature of 1.0m/min~10.0m/min, rubber rollers 120a, 120b is that 80 ℃~150 ℃, the rubber hardness of said rubber rollers 120a, 120b are 40 degree~90 degree, and the punching press (line pressure) of this rubber rollers 120a, 120b is 50N/cm~400N/cm.
If be through with via rubber rollers 120a, 120b at photonasty plate 22 of glass substrate 24 laminated; Then the rotation of said rubber rollers 120a stops; On the other hand, lamination the said glass substrate 24 of said photonasty plate 22, be that adhesive substrates 24a is clamped by substrate conveying roller 128b.
And; Rubber rollers 120b removes clamping to keeping out of the way from the isolated direction of rubber rollers 120a, begins the rotation of substrate conveying roller 128b simultaneously; Adhesive substrates 24a quantitatively carries along the arrow C direction, and the position moves near the assigned position in rubber rollers 120a below between the substrate of photonasty plate 22.On the other hand, via heater 45 next glass substrate 24 is carried to the applying position.
If the front-end configuration of this next one glass substrate 24 is between rubber rollers 120a, 120b, then said rubber rollers 120b rises, and utilizes said rubber rollers 120a, 120b to clamp said next glass substrate 24 and photonasty plate 22.And, under the turning effort of rubber rollers 120a, 120b and substrate conveying roller 128b, the beginning lamination, simultaneously, adhesive substrates 24a carries to the arrow C direction.
Adhesive substrates 24a quantitatively carries along the arrow C direction, after the photonasty plate 22 via 24 of the 48 cut-out glass substrates of plate shut-off mechanism between substrate, cools off through cooling body 130, is transplanted on matrix mechanism for stripping 132 again.In this matrix mechanism for stripping 132, be adsorbed under the state that remains on the adsorbent pad 134,, obtain photosensitive laminate 140 via mechanical hand 136 stripping group body thin films 26 and residual fraction 30b at adhesive substrates 24a.
At that time, remove electric air from the side of 4 directions to the laminated portion integral spray of adhesive substrates 24a in the upper reaches, downstream and two sides of adsorbent pad 134.Also have, photosensitive laminate 140 is kept by the hand 142a of robot 142, in photosensitive laminate accumulator 146, accommodates specified quantity.
In this case; In first embodiment; As shown in Figure 4; Between heater 45 and laminater 46, glass substrate 24 is handled the position via the applying that the conveying roller 80a that constitutes feed mechanism 92 is transported to said laminater 46, handles near the position being incubated said applying under the predetermined heating temperature via the 3rd infrared heater 90c simultaneously.
Thereby, can prevent effectively that the temperature of glass substrate 24 on the transition portion of heater 45 and laminater 46 from reducing, can improve the interior temperature homogeneity of face of said glass substrate 24 simultaneously.Thereby, can stop as much as possible between photonasty plate 22 and glass substrate 24, to be involved in bubble and said photonasty plate 22 folds etc. take place, can be well and keep the lamination quality of adhesive substrates 24a reliably.
In addition, at the arrow C direction front end face of the main part 78a that constitutes second heating arrangements 78 feed mechanism 92 is set, said feed mechanism 92 is near laminater 46 configurations.
Thereby; Even adopt when special thin-walled and the large-scale glass substrate 24; The throughput direction front that also can keep this glass substrate 24 reliably, can constitute between the rubber rollers 120a of laminater 46, the 120b smooth and easy and carry said glass substrate 24 reliably.
Have, when maintenance activity that carries out laminater 46 etc., as following, first heating arrangements 76 and second heating arrangements 78 carry out backward movement again.Promptly, in first heating arrangements 76, main part 76a moves predetermined distance L1 along first guide rail 86 to arrow C 1 direction, the main part 78a that constitutes second heating arrangements 78 simultaneously moves predetermined distance L1 along the 3rd guide rail 104 to arrow C 1 direction equally.At this, first heating arrangements 76 and second heating arrangements 78 are implemented interlocking and are moved to the arrow C direction to stop.
Next, in second heating arrangements 78, main part 78a and movable table 102 one move predetermined distance L2 along second guide rail 100 to arrow D direction (with reference to Fig. 5), implement interlocking.
Thereby, in the laminater 46, being formed for the space of maintenance activity in heater 45 sides, the operator can use this space to constitute the maintenance activity such as cleaning and replacing of rubber rollers 120a, the 120b of laminater 46.
Also have, in first embodiment, glass substrate 24 carries out carrying based on the what is called of index(ing) feed in batches, but is not limited thereto, and also can be applicable to the formation of the said glass substrate 24 of continuous conveying.
Fig. 6 is the major part key diagram of manufacturing system 170 of the photosensitive laminate of second embodiment of the present invention.Also have, for attaching with identical reference marks with the manufacturing system 20 identical inscapes of first embodiment, its detailed explanation is omitted.In addition, below the 3rd embodiment of explanation omits its detailed description too.
Manufacturing system 170 possesses heater 172 and laminater 46.Heater 172 possesses along at least the first heating arrangements 174 and second heating arrangements 176 of the throughput direction configuration of conveying mechanism 74.The main part 174a that constitutes first heating arrangements 174 is fixed on the base station 82, and the main part 176a that constitutes second heating arrangements 176 simultaneously is fixed on the said base station 82.
This second embodiment except particularly can being suitable for well when laminater 46 maintenance activities that need not carry out from heater 172 sides, can obtain and the same effect of above-mentioned first embodiment.
Fig. 7 is the major part key diagram of manufacturing system 190 of the photosensitive laminate of the 3rd embodiment of the present invention.
Manufacturing system 190 possesses heater 45 and laminater 192.Laminater 192 is provided with substructure member 194, configuration supporting station 196 on this substructure member 194.Framework 198 at these supporting station 196 upper supports, simultaneously, a plurality of conveying roller 80a and the 3rd infrared heater 90c are set in said framework 198.
In the 3rd embodiment that so constitutes, the framework 198 of accommodating conveying roller 80a and the 3rd infrared heater 90c is installed in laminater 192 sides via supporting station 196.Thereby, except the formation of simplifying heater 45 sides effectively, can obtain and the same effect of above-mentioned first embodiment.
Also have, in the 3rd embodiment, adopted heater 45, but also can replace it and adopt heater 172.In addition, used second heating arrangements 178, also can replace first heating arrangements 76 on the other hand and adopt first heating arrangements 174.

Claims (6)

1. the manufacturing system of a photosensitive laminate possesses substrate (24) is heated to the heater (45) of set point of temperature in advance and goes up the laminater (46) of applying photonasty plate (22) at the said substrate (24) that is heated to set point of temperature,
The manufacturing system of said photosensitive laminate is characterised in that,
Between said heater (45) and said laminater (46), dispose feed mechanism (92) and heat preservation mechanism (90c),
Said feed mechanism (92) is used for that said substrate (24) is handled the position to the applying of said laminater (46) and carries;
Said heat preservation mechanism (90c) is used for said substrate (24) insulation that is heated to set point of temperature, near the position is handled in said applying.
2. the manufacturing system of photosensitive laminate according to claim 1 is characterized in that,
Said heater (45) possesses the conveying mechanism (74) that is used to carry said substrate (24) and along a plurality of heating arrangements (78) of the throughput direction configuration of said conveying mechanism (74), and,
Installing said feed mechanism (92) and said heat preservation mechanism (90c) with the said heating arrangements (78) that is configured in the downstream of throughput direction of said laminater (46) adjacency.
3. the manufacturing system of photosensitive laminate according to claim 2 is characterized in that,
Said heating arrangements (78) is accommodated said conveying mechanism (74) and heating source (90b), and possess the main part (78a) that said feed mechanism (92) and said heat preservation mechanism (90c) are installed and can make said main part (78a) with respect to said laminater (46) mobile keep out of the way mechanism (94).
4. the manufacturing system of photosensitive laminate according to claim 3 is characterized in that,
Said keep out of the way mechanism (94) can make said main part (78a) along near and move away from the first direction of said laminater (46) with second direction that said first direction intersects.
5. the manufacturing system of photosensitive laminate according to claim 1 is characterized in that,
Said feed mechanism (92) and said heat preservation mechanism (90c) are contained on the said laminater (192).
6. according to the manufacturing system of any described photosensitive laminate in the claim 1~5, it is characterized in that,
Said heat preservation mechanism possesses heater.
CN2008101610790A 2007-09-27 2008-09-26 Manufacture system of photosensitive lamination body Expired - Fee Related CN101396896B (en)

Applications Claiming Priority (3)

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JP2007251249A JP2009078509A (en) 2007-09-27 2007-09-27 Photosensitive laminate manufacturing system
JP2007-251249 2007-09-27
JP2007251249 2007-09-27

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CN105479908A (en) * 2016-01-11 2016-04-13 常州天合光能有限公司 Double-layer dot-matrix type heating laminating machine
CN116252519B (en) * 2022-12-07 2024-03-26 深圳源明杰科技股份有限公司 Label preparation method and system
CN116277990B (en) * 2023-03-24 2023-11-28 扬州纳力新材料科技有限公司 Integrated equipment for high-efficiency welding of composite current collector

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EP1460656A1 (en) * 2003-03-17 2004-09-22 TDK Corporation Production method of laminated soft magnetic member, production method of soft magnetic sheet, and method for heat treating laminated soft magnetic member
JP4101845B2 (en) * 2006-05-01 2008-06-18 高木産業株式会社 Heat source device and control method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1460656A1 (en) * 2003-03-17 2004-09-22 TDK Corporation Production method of laminated soft magnetic member, production method of soft magnetic sheet, and method for heat treating laminated soft magnetic member
JP4101845B2 (en) * 2006-05-01 2008-06-18 高木産業株式会社 Heat source device and control method thereof

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