CN101393251A - Detecting device and detecting method - Google Patents
Detecting device and detecting method Download PDFInfo
- Publication number
- CN101393251A CN101393251A CNA2008100988561A CN200810098856A CN101393251A CN 101393251 A CN101393251 A CN 101393251A CN A2008100988561 A CNA2008100988561 A CN A2008100988561A CN 200810098856 A CN200810098856 A CN 200810098856A CN 101393251 A CN101393251 A CN 101393251A
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- detecting card
- sniffer
- chip
- spray nozzle
- nozzle part
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention provides a detection device and detection method, which can prevent static damage based on detection card electrified IC chip in a detection device using a detection card for detecting electrical characteristics of IC chip on a wafer. Air ionized by using an iron generator is supplied to the detection card from the upper side or the lower side of the detection card. E.g. the iron generator is arranged on the outside of a test head, simultaneously an air supply pipe is arranged around the upper side of the detection card through an opening part in the center of the test head, a nozzle part is arranged on the front end part. Or a camera is carried for shooting an electrode pad of the IC chip on the wafer, the nozzle part is arranged on a moving part capable of moving horizontally between the detection card and a wafer carrier, from which the ionized air is ejected to the detection card.
Description
Technical field
The present invention relates to make detector and tested electronic pads of having a medical check-up to electrically contact, thereby carry out the technology of this tested electrical characteristics determining of having a medical check-up.
Background technology
Go up formation as after being examined IC (integrated circuit) chip of chip at semiconductor wafer (hereinafter referred to as wafer), the detection by sniffer is tested under the state of wafer for the electrical characteristics of investigating the IC chip.In addition, this detection test is in order to judge whether the circuit part of making so far suitably carries out in manufacturing process's process of IC chip.As shown in figure 11, this sniffer constitutes in X, Y, Z direction freedom of movement and around the Z axle and rotates freely mounting wafer W on the wafer chuck 101, with the detector of the detecting card 102 of the top that is arranged on wafer chuck 101 position of the mode control wafer chuck 101 that contacts with the electronic pads of the IC chip of wafer W of probe 103 for example.And, make measuring head 105 be positioned at the top of framework 104 of the externally mounted part of constituent apparatus, this measuring head 105 is electrically connected by adapter ring 106 with detecting card 102, by reception and the transmission of carrying out signal between measuring head 105 and wafer W the electrical characteristics of the circuit on the wafer W is investigated.
But, existence by wafer chuck 101 owing to when mobile and the friction of the friction of air or drive division etc. cause its charged situation, even in addition with regard to detecting card 102 and since the card main body by insulator for example the resin material of expoxy glass etc. constitute, so there is charged situation.Figure 12 is that expression will contact the mode chart of the state of (probe 103 is contacted with the electronic pads of wafer W side) electric charge before under the charged situation of detecting card 102.If the electronic pads of the circuit on the wafer W is contacted producing under so charged situation with probe 103, then the circuit of the IC chip that described circuit is for example finished causes electrostatic breakdown, thereby the static interference that becomes mensuration becomes the main cause of the obstruction of electrometric determination in addition.
In view of the above, wafer chuck 101 is studied with the situation of external ground when measuring.If do like this then can suppress the charged of wafer chuck 101, even detecting card 102 is charged in addition, its electric charge also can pass through probe 103, wafer W and wafer chuck 101 and flow into the earth, therefore can suppress the generation of the electrostatic breakdown and the noise of the circuit on the wafer W.
But, even also can't eliminate the electric charge of detecting card 102 fully by this method.And because the filming of IC chip, miniaturization etc., the withstand voltage of circuit diminishes, and requires to reduce more the charged of parts.In addition, use across insulation course recently two coherent substrates of wafer, in such substrate, because electric charge can not flow to rear side from the face side of wafer W, so when detecting card 102 is charged, even electrostatic chuck 101 ground connection, when contact electric charge also flow to the IC chip from detecting card 102, cause that thus the possibility of electrostatic breakdown of circuit is bigger.
In addition, in patent documentation 1, put down in writing conductive sheet has been set in the side of wafer chuck, this thin plate ground connection, thereby the method that makes wafer chuck rise probe is contacted with this conductive sheet, but the quantity of probe is increased, so can't guarantee the wide space of the side of wafer chuck.So in order to obtain the position of the electronic pads on the wafer, when wafer surface was made a video recording, the mobile radius of wafer chuck increased, and becomes the obstruction of miniaturization.Further, also existence has to frequently change the bad of conductive sheet.
[patent documentation 1] TOHKEMY 2003-100821: paragraph 0040,0041
Summary of the invention
The present invention proposes in view of such situation, its purpose is to provide a kind of electrostatic breakdown that is examined chip (also comprise as the manufacturing of the integrated circuit of purpose the circuit in stage) midway that can suppress on the substrate, can suppress sniffer, detection method and stored program storage medium of bad influence of the inspection of the electrical characteristics that caused by static in addition.
Sniffer of the present invention, it will be arranged with a plurality of substrate-placings that are examined chip on the mounting table that can move, and the described electronic pads that is examined chip is contacted with the detector of detecting card, be examined the inspection of chip, it is characterized in that, comprise:
Be used to make the ion generator of gas ionization; With
Supply with by the Ionized gas of this ion generator to be used for removing the spray nozzle part of electricity to detecting card.
Described spray nozzle part is provided with in the mode of for example supplying with ionizable gas from the top of detecting card.Enumerated following formation as such concrete example.
Described detecting card is set on the top plate of the framework of surrounding mounting table,
Above described top plate, be provided with and electrically contact with described detecting card and have the measuring head of the peristome of up/down perforation in central authorities,
Gas supply pipe to described spray nozzle part supply gas is to be drawn out to outside formation by described peristome.In this case, for example ion generator is set at the outside of described measuring head.
Further, can enumerate following formation,
Described detecting card is set on the top plate of the framework of surrounding mounting table,
Above described top plate, be provided with the measuring head that electrically contacts with described detecting card,
Gas supply pipe to described spray nozzle part supply gas is drawn out to the outside between by described detecting card and described top plate.In this case, for example ion generator is set at the position of departing from from the lower zone of described measuring head.
In addition, described spray nozzle part also can be provided with in the mode of supplying with ionizable gas from the below of detecting card.Enumerated following formation as such concrete example.
On the probe and the height and position between the substrate on the mounting table of described detecting card, be provided with and possess the moving body freely that moves in the horizontal direction that is used for image unit that the electronic pads of the tested chip of having a medical check-up of described substrate is made a video recording,
Described spray nozzle part is arranged on the described moving body.In this case, described ion generator setting is carried on the moving body.
Another invention makes to be arranged with a plurality of substrate-placings that are examined chip on the mounting table that can move for detection method, checks by detecting card, it is characterized in that, comprising:
Thereby supply with the operation of this detecting card being removed electricity by the ionizable gas of ion generator to described detecting card; Then,
Thereby the electronic pads that is examined chip that makes the substrate that is positioned on the described mounting table contacts the operation of the inspection that is examined chip with the detector of detecting card.In addition, even the present invention also sets up on to the storage medium of storing for the program of action on computers of implementing this detection method.
The present invention, make and be arranged with a plurality of substrate-placings of chip that are examined on the mounting table that can move, check by detecting card, because supply with by the ionizable gas of ion generator to detecting card from spray nozzle part, even also can be removed so detecting card is charged, can reduce possibility, in addition because also can reduce the noise that causes by charged, so can carry out stable inspection by the electrostatic breakdown of the circuit that is examined chip of the charged substrate that causes of detecting card.
Description of drawings
Fig. 1 is the longitdinal cross-section diagram of the integral body of the sniffer in expression first embodiment of the present invention.
Fig. 2 is the approximate vertical view of this device of expression.
Fig. 3 is the side view in partial cross-section that the summary of expression ion generator constitutes.
Charged, the key diagram that removes the appearance of electricity of the detecting card in the above-mentioned sniffer of Fig. 4 pattern ground expression.
Fig. 5 is the longitdinal cross-section diagram of the integral body of the sniffer in expression second embodiment of the present invention.
Fig. 6 is the longitdinal cross-section diagram of the integral body of the sniffer in expression the 3rd embodiment of the present invention.
Fig. 7 is the approximate three-dimensional map of the integral body of the sniffer in the 3rd above-mentioned embodiment of expression.
Fig. 8 is the performance plot that is illustrated in the measurement result of the wafer chuck voltage under the situation of not using ion generator.
Fig. 9 is the performance plot of expression for the measurement result of the wafer chuck voltage of confirming effect of the present invention.
Figure 10 is the performance plot of expression for the measurement result of the wafer chuck voltage of confirming effect of the present invention.
Figure 11 is the summary side elevation of the existing sniffer of expression.
Figure 12 is the detecting card of expression in the existing sniffer and the key diagram of the charged appearance of wafer.
Symbol description
1 framework
12 top boards
2 wafer chucks
The W wafer
3 detecting cards
31 probes
4 measuring heads
The 4a peristome
5 ion generators
61 spray nozzle parts
62 air supply pipes
7,82 micrographic cameras
Embodiment
[first embodiment]
As depicted in figs. 1 and 2, the sniffer that relates to of embodiments of the present invention possesses the framework 1 as the shell body that constitutes the sniffer main body.On the base station 11 of the bottom of this framework 1, from beginning to be provided with in the following order down: along guide rail in Y direction (direction in the table of paper) elongation, by for example ball-screw etc. along the driven Y worktable 21 of Y direction; With along guide rail in directions X elongation, by ball-screw for example along the driven X worktable 22 of directions X.Collocation is set respectively on this X worktable 22 and Y worktable 21 motor of scrambler, but is omitted here.
Above the moving area of wafer chuck 2, detecting card 3 loading and unloading are mounted freely on the top board 12 as the top plate of framework 1.Upper face side at detecting card 3 is formed with electrode group, be disposed at top board 12 above measuring head 4 and above-mentioned electrode group between conduct in order to obtain, and be inserted with adapter ring 41.At the central portion of measuring head 4, up/down perforation ground is formed with the peristome 4a as peephole, and this peristome 4a overlaps with the peristome 41a of adapter ring 41.This adapter ring 41 constitutes the spray point unit that is formed with a plurality of so-called spray points as electrode part (Port go ピ Application Pu Keer pin) 41b in the mode corresponding with the allocation position of the electrode group of detecting card 3 on lower surface, for example is fixed on measuring head 4 sides.Measuring head 4 constitutes, the linkage that the figure of the side by for example being arranged on framework 1 does not show, level shown in Figure 1 locate and adapter ring 41 side direction on retreating position between can be around the turning axle rotation of level.
In addition, be provided with in the assortment of the electronic pads of the corresponding wafer W of the lower face side of detecting card 3, with the electrode group of upper surface side be electrically connected respectively by the relative detector probe 31 that is called as so-called eedles etc. that constitutes along the metal wire of tiltedly below elongation of the surface of wafer W for example.As detector, also can be the vertical needle of Surface Vertical elongation of relative wafer W or the golden projected electrode that on flexible film, forms etc.
Further, this sniffer possesses first image unit of the needle point of probe 31 being made a video recording for the contraposition of carrying out wafer W and probe 31 and second image unit that the electronic pads on the wafer W is made a video recording.These image unit has diagram in the 3rd embodiment, omit record in the present embodiment for fear of the numerous and diverse of drawing, if but narration simply, first image unit is fixed on the following Z moving part 23 of wafer chuck 2, and second image unit is provided with in the mode that can move horizontally between detecting card 3 and wafer chuck 2.
And this sniffer for example possesses: ion generator 5; Be used for will by these ion generator 5 ionizable gases for example dry air be ejected into the spray nozzle part 61 of detecting card 3; The air supply pipe 62 that is connected the supply pipe of ion generator 5 and spray nozzle part 61 with conduct.In this embodiment, ion generator 5 is set at the edge part of the upper surface of framework 1, and air supply pipe 62 is provided with from the outstanding mode in its below with insertion above the peristome 4a of above-mentioned measuring head 4.In addition, be illustrated in the place of leaving framework 1 at Fig. 1, Fig. 2 intermediate ion generator 5 for convenience.
As the installation site of ion generator 5, for example can be on measuring head 4, perhaps also can be in peristome 4a.Spray nozzle part 61 is at the leading section of this air supply pipe 62, and the mode that sprays with the upper surface from detecting card 3 constitutes horn-like.Air supply pipe 62, with the set positions of spray nozzle part 61 from detecting card 3 a little upward lateral deviation for example be mounted freely on the upper surface of measuring head 4 from the mode of part by installing component 62a loading and unloading.
Mounting structure as this installing component 62a, can constitute: air supply pipe 62 is fixed with breakthrough status, and the portion that is stuck is set at these dull and stereotyped both ends, on the other hand, on the mouth edge part of peristome 4a, the holding section that engages with the above-mentioned portion of being stuck is set.In this case, when making measuring head 4 rotate to retreating position, for example above-mentioned installing component 62a is unloaded from measuring head 4, air supply pipe 62 and spray nozzle part 61 are pulled out from peristome 4a.
The air supply pipe 62 of the upstream side of ion generator 5 is provided with becomes the valve 63 that air is supplied with the part of control gear, and side is provided with for example air high-pressure gas cylinder 64 as the supply source of dry air at its upstream.Valve 63 for example is arranged on the framework 1, and air high-pressure gas cylinder 64 is arranged on the place of for example leaving framework 1.
As shown in Figure 3, ion generator 5 constitutes, and electrode 52 is arranged in the main body 51 that is formed with electric field formation space, and this electrode 52 is connected with direct supply 53.As the shape of electrode 52, can use for example the stream of a plurality of stick electrode and air is intersected the shape of assortment with the mode that contacts effectively by the atmosphere in the main body 51.When this electrode 52 is applied high voltage, around electrode 52, form non-uniform electric field, if supply with dry air under this state, then this dry air is transported to spray nozzle part 61 by electric field and ionicization.Device for positive ion and negative ion equivalent are taken place on ion generator 5 substrates has with ion and this electrified body of electrified body same polarity and repels mutually, and on the other hand, the ion with reversed polarity is attracted on this electrified body, thereby this charging neutrality is removed.
In addition, this sniffer possesses the control part 10 that comprises computing machine etc., this control part 10 has the function that output is used for carrying out according to the program in the storer control signal of following operation, promptly, moving of wafer chuck 2, the camera operation of the not shown image unit of having narrated is based on the calculating of the contact position of this image pickup result, the action of ion generator 5 and valve 63 etc.Said procedure is installed on the control part 10 after can being stored in the storage medium of hard disk, CD, MO (magneto-optic disk) etc.
Then the effect of above-mentioned embodiment is set forth.At first, utilize not shown carrying arm that wafer W is positioned on the wafer chuck 2.Then, use first image unit narrated and second image unit that contact position is calculated (using accompanying drawing to describing aspect this in the 3rd embodiment).On the other hand, make ion generator 5 and valve 63 actions, supply with for example about 20 seconds from spray nozzle part 61 to detecting card 3 ionizable air.Fig. 4 (a) is the charged state of detecting card 3, does not contact in this stage.At this as mentioned above, when ionizable gas was supplied to detecting card 3, shown in Fig. 4 (b), electric charge charged on detecting card 3 was neutralized, thereby is removed.
, wafer chuck 2 risen, probe 31 is contacted with the electronic pads that forms on the chip being examined on the wafer W successively,, carry out the electrical characteristics inspection by supplying with electric signal from measuring head 4 to electronic pads by adapter ring 41, detecting card 3 and probe 31 thereafter.Then, probe 31 is contacted successively with electronic pads on the wafer W, each chip is checked.And, also can be the mode that probe is contacted with the whole electronic pads that respectively is examined chip of wafer simultaneously.In addition, with regard to wafer chuck 2, preference is as removing by ground connection etc. before contacting.
So, if whole on the wafer W are examined having checked of chip, then wafer chuck 2 moves to primary position, utilizes not shown carrying arm to take out of this wafer W, simultaneously next wafer W is positioned on the wafer chuck 2.
The detecting card 3 that is undertaken by ion generator 5 remove electrician's preface, when checking wafer W, can before checking, it carry out, but also can to move into check with the wafer of 1 part in zone (1 batch of part) of for example wafer rack of framework 1 adjacency before, do not remove the inspection that electrician's preface is just carried out the wafer of 1 batch of part thereafter.
According to above-mentioned embodiment, because will supply to detecting card 3 from spray nozzle part 61 by ion generator 5 ionizable gases, even also can remove so detecting card 3 is charged, therefore can reduce possibility by the electrostatic breakdown of the circuit that is examined wafer W of the charged substrate that causes of detecting card 3, in addition because also can reduce the noise that causes by charged, so can carry out stable inspection.
[second embodiment]
In this embodiment, as shown in Figure 5, on the mouth edge part of the peristome of the top board 12 that is used to install detecting card 3, spray nozzle part 61 is set, and carry out in the gap that is arranged between measuring head 4 and the top board 12 of 5 air supply pipe 62 from spray nozzle part 61 to ion generator in mode towards the ionizable air of detecting card 3 ejections.Such formation also has same action effect.
[the 3rd embodiment]
As mentioned above, in the embodiment formerly, do not illustrate about the image unit that is used for so-called wafer aligned, but in Fig. 6 and Fig. 7, put down in writing whole formation in this embodiment, put down in writing image unit simultaneously.As shown in Figure 7, be fixed on the Z moving part 23 of below of wafer chuck 2 as the micrographic camera 7 of first image unit.And on the height and position between the needle point of wafer chuck 2 and probe 31, be provided with wafer chuck 2 relative in the moving body 8 of the angle tubular of growing crosswise that can flatly move.This moving body 8 constitutes, and is installed in following guide rail 81 guiding of top board 12, and the mode that can move horizontally by not shown drive unit.
Above-mentioned moving body 8 is provided with the micrographic camera 82 of conduct second image unit that wafer W is made a video recording, make this moving body 8 move to the aligned position of regulation in advance, by side thereunder wafer chuck 2 is moved, can make a video recording by the electronic pads that is examined chip on 82 pairs of wafer W of micrographic camera.When these micrographic camera 7 and 82 optical axis when lumping together, when the needle point that utilizes 7 pairs of probes 31 of micrographic camera is made a video recording, when the electronic pads that utilizes 82 pairs of wafer W sides of micrographic camera is made a video recording, by obtaining the coordinate position of wafer chuck 2 at that time respectively in advance, the coordinate position of the wafer chuck 2 in the time of can calculating contact.
At this, in this embodiment, above-mentioned moving body 8 is provided with ion generator 5, spray nozzle part 61 and valve 63.Spray nozzle part 61, one ends in this example are blocked, on the conduit of the length of the approximate diameter of detecting card 3, in the mode that sprays air up at length direction across wearing a plurality of squit hole 61a at interval.The air supply pipe 62 of the upstream side of ion generator 5 in framework 1, draw around and be drawn out to the outside.
In such formation,,, so carry out removing of detecting card 3 so that the mode of these detecting card 3 scannings moves moving body 8, and sprays ionizable air shown in the dotted line of Fig. 6 from spray nozzle part 61 towards detecting card 3 in the lower side of detecting card 3.Even also can have same action effect according to this embodiment.
[validation test]
In device shown in Figure 1, measure the current potential do not make ion generator 5 actions promptly detecting card 3 not removed electric wafer chuck 2 when just contacting, obtain result as shown in Figure 8.In Fig. 8, so-called probe shooting, the stage of utilizing the camera of the Z moving part 23 of the below be arranged on wafer chuck 2 that probe 31 is made a video recording exactly, so-called wafer shooting, the stage of utilizing camera mobile framework 1 in that the electronic pads that is examined chip on the wafer W is made a video recording exactly.
And in this device, measure the current potential of the wafer chuck 2 when after contacting, making removing of ion generator 5 actions carrying out detecting card 3 electric, obtain result as shown in Figure 9.According to these result, can know when detecting card 3 is charged, if utilize ion generator 5 to remove electricity then its carried charge is reduced.
In this external this device, measure the current potential of the wafer chuck 2 when before contacting, making removing of ion generator 5 actions carrying out detecting card 3 electric, obtain result as shown in figure 10., can know according to the present invention from this result,, reduce the possibility of electrostatic breakdown even wafer W near detecting card 3, also can suppress the charged of wafer W.
Claims (14)
1. sniffer, it will be arranged with a plurality of substrate-placings that are examined chip on the mounting table that can move, and the described electronic pads that is examined chip is contacted with the probe of detecting card, be examined the inspection of chip, it is characterized in that, comprise:
Be used to make the ion generator of gas ionization; With
Supply with by the Ionized gas of this ion generator to be used for removing the spray nozzle part of electricity to detecting card.
2. sniffer as claimed in claim 1 is characterized in that:
Described spray nozzle part is provided with in the mode of supplying with ionizable gas from the top of detecting card.
3. sniffer as claimed in claim 2 is characterized in that:
Described detecting card is set on the top plate of the framework of surrounding mounting table,
Above described top plate, be provided with and electrically contact with described detecting card and have the measuring head of the peristome of up/down perforation in central authorities,
Gas supply pipe to described spray nozzle part supply gas is drawn out to the outside by described peristome.
4. sniffer as claimed in claim 3 is characterized in that:
Described ion generator is set at the outside of described measuring head.
5. sniffer as claimed in claim 2 is characterized in that:
Described detecting card is set on the top plate of the framework of surrounding mounting table,
Above described top plate, be provided with the measuring head that electrically contacts with described detecting card,
Between the gas supply pipe of described spray nozzle part supply gas is by described measuring head and described top plate, be drawn out to the outside.
6. sniffer as claimed in claim 5 is characterized in that:
Described ion generator is set at the position of departing from from the lower zone of described measuring head.
7. sniffer as claimed in claim 1 is characterized in that:
Described spray nozzle part is provided with in the mode of supplying with ionizable gas from the below of detecting card.
8. sniffer as claimed in claim 7 is characterized in that:
On the probe and the height and position between the substrate on the mounting table of described detecting card, be provided with to possess and be used for the image unit that the electronic pads of the tested chip of having a medical check-up of described substrate is made a video recording and move in the horizontal direction moving body freely,
Described spray nozzle part is arranged on the described moving body.
9. sniffer as claimed in claim 8 is characterized in that:
Described ion generator is arranged on the described moving body.
10. a detection method makes to be arranged with a plurality of substrate-placings that are examined chip on the mounting table that can move, and checks by detecting card, it is characterized in that, comprising:
Thereby supply with the operation of this detecting card being removed electricity by the ionizable gas of ion generator to described detecting card; With
Then, thus make the electronic pads that is examined chip of the substrate that is positioned on the described mounting table contact the operation of the inspection that is examined chip with the probe of detecting card.
11. detection method as claimed in claim 10 is characterized in that:
Described detecting card is set on the top plate of the framework of surrounding mounting table,
Above described top plate, be provided with and electrically contact with described detecting card and have the measuring head of the peristome of up/down perforation in central authorities,
The operation of described detecting card being removed electricity for from be arranged on by described peristome draw from the outside around the spray nozzle part of leading section of gas supply pipe, supply with the operation of described ionizable gas to described detecting card.
12. detection method as claimed in claim 10 is characterized in that:
Described detecting card is arranged on the top plate of the framework of surrounding mounting table,
Above described top board, be provided with the measuring head that electrically contacts with described detecting card,
The operation of described detecting card being removed electricity for from be arranged on from the outside to the lower side of described measuring head draw around the spray nozzle part of leading section of gas supply pipe, supply with the operation of described ionizable gas to described detecting card.
13. detection method as claimed in claim 10 is characterized in that:
On the probe and the height and position between the substrate on the mounting table of described detecting card, be provided with to possess and be used for the image unit that the electronic pads of the tested chip of having a medical check-up of described substrate is made a video recording and move in the horizontal direction moving body freely,
The operation of described detecting card being removed electricity is for from being arranged on spray nozzle part on the described moving body sprays described ionizable gas upward towards described detecting card operation.
14. storage medium, it stores the program of operation on computers that is used for sniffer, this sniffer will be arranged with a plurality of substrate-placings that are examined chip on the mounting table that can be in the horizontal direction moves with vertical direction, utilize detecting card inspection
Described program is formed the step group to implement each described detection method of claim 10～14.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007245915A JP2009076776A (en) | 2007-09-21 | 2007-09-21 | Probe device and probe method |
| JP2007-245915 | 2007-09-21 | ||
| JP2007245915 | 2007-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101393251A true CN101393251A (en) | 2009-03-25 |
| CN101393251B CN101393251B (en) | 2011-10-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100988561A Active CN101393251B (en) | 2007-09-21 | 2008-05-19 | Detecting device and detecting method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2009076776A (en) |
| KR (1) | KR101019878B1 (en) |
| CN (1) | CN101393251B (en) |
| TW (1) | TWI427295B (en) |
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| CN108885238A (en) * | 2017-01-19 | 2018-11-23 | 深圳市汇顶科技股份有限公司 | A kind of test device for matrix arrangement chip |
| CN110023773A (en) * | 2017-02-22 | 2019-07-16 | 新东工业株式会社 | Test macro |
| CN113725131A (en) * | 2021-11-02 | 2021-11-30 | 西安奕斯伟材料科技有限公司 | Wafer pretreatment device and wafer defect detection method |
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| CN101968518B (en) * | 2009-07-27 | 2012-08-08 | 京元电子股份有限公司 | Semiconductor testing apparatus with concentric probe seats |
| JP6289962B2 (en) * | 2013-07-11 | 2018-03-07 | 東京エレクトロン株式会社 | Probe device |
| KR101897638B1 (en) * | 2017-08-21 | 2018-09-13 | (주)씨온테크 | High-precision automatic test equipment |
| TWI655444B (en) * | 2017-12-20 | 2019-04-01 | 亞亞科技股份有限公司 | IC inspection machine with temporary fixing effect |
| US10698025B2 (en) * | 2018-07-20 | 2020-06-30 | Formfactor Beaverton, Inc. | Probe systems and methods that utilize a flow-regulating structure for improved collection of an optical image of a device under test |
| CN117501137A (en) * | 2021-06-23 | 2024-02-02 | 三菱电机株式会社 | Inspection apparatus |
| CN114966147B (en) * | 2022-05-27 | 2023-12-22 | 江苏艾科半导体有限公司 | Chip test probe station protection cover |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6251280U (en) * | 1985-09-19 | 1987-03-30 | ||
| WO1996029607A1 (en) * | 1995-03-18 | 1996-09-26 | Tokyo Electron Limited | Method and apparatus for inspecting substrate |
| JPH0982766A (en) * | 1995-09-18 | 1997-03-28 | Sony Corp | Probing measuring apparatus |
| JP3842468B2 (en) * | 1998-12-08 | 2006-11-08 | 株式会社日本マイクロニクス | Probe cleaning method and apparatus |
| JP2002340974A (en) * | 2001-05-17 | 2002-11-27 | Matsushita Electric Ind Co Ltd | Instrument and method for measuring electric characteristic of semiconductor element |
| JP4791023B2 (en) * | 2004-11-08 | 2011-10-12 | インターナショナル・ビジネス・マシーンズ・コーポレーション | TFT inspection apparatus and inspection method |
-
2007
- 2007-09-21 JP JP2007245915A patent/JP2009076776A/en active Pending
-
2008
- 2008-05-19 CN CN2008100988561A patent/CN101393251B/en active Active
- 2008-05-21 KR KR1020080047168A patent/KR101019878B1/en active IP Right Grant
- 2008-09-19 TW TW097136136A patent/TWI427295B/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976576A (en) * | 2016-10-24 | 2018-05-01 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN108885238A (en) * | 2017-01-19 | 2018-11-23 | 深圳市汇顶科技股份有限公司 | A kind of test device for matrix arrangement chip |
| CN110023773A (en) * | 2017-02-22 | 2019-07-16 | 新东工业株式会社 | Test macro |
| CN113725131A (en) * | 2021-11-02 | 2021-11-30 | 西安奕斯伟材料科技有限公司 | Wafer pretreatment device and wafer defect detection method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101393251B (en) | 2011-10-26 |
| JP2009076776A (en) | 2009-04-09 |
| KR101019878B1 (en) | 2011-03-04 |
| KR20090031196A (en) | 2009-03-25 |
| TWI427295B (en) | 2014-02-21 |
| TW200914835A (en) | 2009-04-01 |
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