CN101388274B - Suspended type inductive element - Google Patents
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- CN101388274B CN101388274B CN2007101537377A CN200710153737A CN101388274B CN 101388274 B CN101388274 B CN 101388274B CN 2007101537377 A CN2007101537377 A CN 2007101537377A CN 200710153737 A CN200710153737 A CN 200710153737A CN 101388274 B CN101388274 B CN 101388274B
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Abstract
The invention discloses a suspended type inductance element, which comprises a dielectric base plate and a suspended type inductance coil, wherein the suspended type inductance coil comprises an input end which is arranged on the dielectric base plate. A screw coil is used to wind the electrical connection from the dielectric base plate, wherein the electrical connection passes through the dielectric base plate, and is located in the screw coil, and the screw coil is connected from the input end, an output end is arranged on the dielectric base plate, and is used to connect the screw coil nearby the input end.
Description
Technical field
The present invention relates to a kind of suspended type inductive element, particularly a kind of suspended type inductive element with high inductance value.
Background technology
In the high-frequency circuit design, direct current is played the part of identical important role with high-frequency signal.Direct current signal provides active circuits to operate in normal operation interval, makes its transmission that can handle high-frequency signal, for example amplifying signal, reducing noise index or carry out high power transmission etc.On the other hand, high-frequency signal carries desires information transmitted, sees through active circuits and handles and transmit.On the ideal, direct current and high-frequency signal should be mutual independent running, can be to not impacting each other.Direct current signal causes the accurate skew in direct current position often because of the high-frequency signal transmission fluctuation, makes active circuits can't be operated in normal interval but in fact.And the many noises of the normal introducing of direct current signal make high-frequency signal sneak into extra noise signal, cause communication system can't carry out demodulation.
Generally speaking, the inductance equiva lent impedance can and become big along with the frequency rising, shown in formula 1:
Z=jwL w=2 * π * freq L is an inductance formula 1
Therefore, see that at high-frequency signal the inductance equiva lent impedance can be very big, signal transmission meeting is intercepted by inductance equivalence high impedance.And there is not frequency in theory in direct current signal, and its impedance of seeing is very little, so signal can pass through smoothly.By on can know that inductance can be used to branch stopping direct current and high-frequency signal, make the Circuits System can normal operation.Moreover, on the circuit design of lower frequency (MHz), need to cooperate big sense value inductance just can reach the high impedance effect, this is because the not high institute of frequency of operation this moment causes.Or when high-power circuit designs, need big inductance value element separation high-frequency signal, signal leakage is arranged to current terminal with prevention.Big sense value inductance is indispensable in the circuit application design.
Yet the traditional electrical sensing unit it need large tracts of land layout transmission line just can obtain effect, and the loss of circuit layout area is the problem that lets the designer have a headache.For example, by the line characteristic impedance equivalent model, learn like formula 2:
If desire obtains the characteristic (or high inductance) of high impedance, need to improve substrate thickness or reduce the transmission line width.Perhaps, increase the degree of coupling of inductance coil, shown in formula 3:
But inductance value simple defining is produced by mutual inductance and self-induction, but self-induction on the inductance coil when frequency is very low, produce because of skin effect (Skin effect) and only some photoetching ring, partly describe to mutual inductance at this.See also Fig. 1, it shows that inductance value is formed by two tool current coil S1 and S2 induction, can be derived by Newman mutual inductance formula (Neumann formula for mutual inductance), shown in formula 3 on the sense value.If reduce the spacing R of two coils or the area of lifting coil, will have greatly improved for inductance value.
In addition, the quality factor characteristic of big sense value inductance is bad usually, because in the large tracts of land transmission line layout, has promoted the equivalent resistance of inductance own.See also formula 4:
The lifting of resistance value can cause energy loss to rise, and therefore the quality factor characteristic descends.And the layout under the large tracts of land can cause distance problem for the input of two ports inductance with output, makes on the circuit system layout and causes degree of difficulty.Add the transmission line density of needs on the inductance framework and the increase of area, will have technical difficulties on the technology.
U.S. Pat 5,461 discloses for No. 353 and a kind ofly to bury the inductance framework in adjustable.See also Fig. 2, adjustable coil 10 is arranged in the multi-layer substrate structure with interior form of burying.By control line 15 oxide-semiconductor control transistors 18, make adjacent two guide holes 14 and 16 short circuits through control signal, reach the effect of adjustment inductance value.Moreover multilager base plate levels layout metal is as the function of inductor shield.Its advantage is to have adjustment inductance value function, and electromagnetic field is distributed in the spiral inductance, has splendid quality factor characteristic.Yet this mode is being made on the big inductance.Need the labor circuit layout area.When making two ports inductance, input 12 and output 14 are separated by very far away, increase the area of circuit layout.
Moreover United States Patent (USP) US discloses a kind of a plurality of planar spiral inductance of layout that utilize for 6,384, No. 706 on the different layers substrate, utilizes through hole that each planar spiral inductance is linked again.See also Fig. 3 A, inductance element 20 comprises board structure, comprises multilayer dielectric layer 25.Two planar spiral inductance 26a and 26b are arranged in the board structure, and link through line 27, significantly to promote inductance value.The profile of inductance element 20 sees also Fig. 3 B, in board structure, also comprises power line 24, earth connection 23, holding wire 22, connect by contact wire 31, and through integrated circuit 32a and 32b and electric capacity 33a and 33b control.Yet the big inductance framework of this mode made causes the quality factor characteristic relatively poor because of electromagnetic field is prone to radiation.In addition, input is not on one deck with output, and unfavorable circuit layout needs to see through lead or through hole further.
United States Patent (USP) US discloses a kind of multilager base plate layout transmission line for 6,847, No. 282 and utilizes through hole, blind hole, buried via hole to connect each layer transmission line, forms three-dimensional inductance framework.See also Fig. 4 A, a plurality of helical coils 51,52,54,56 are arranged at respectively on the surface 53,55,57,59 of stack of dielectric substrate, and each helical coil connects through guide hole 62,64,66.And in following laminar surface 63 formation shielding pattern 65, as ground plane, to reach the inductor shield effect.This inductance element structure can be reduced layout area, and keeps big sense value of element and high-quality-factor characteristic.Yet input is not on one deck with output, need to see through through hole 67 further make input with output near 67 in order to the integrated circuit layout.
Summary of the invention
In view of this, the present invention provides a kind of suspended type inductive element, has big inductance value, high-quality-factor characteristic and reduction layout area.This suspended type inductive element is except the elevator system circuit performance and circuit layout is dwindled.
The embodiment of the invention provides a kind of suspended type inductive element, comprises dielectric substrate and suspension type inductance coil.This suspension type inductance coil comprises: input is arranged on this dielectric substrate; Helical coil, this dielectric substrate is wound to an electric connection certainly; This electric connection runs through this dielectric substrate, and is positioned at the central authorities of this helical coil, and this input connects this helical coil certainly; And output, be arranged on this dielectric substrate, connect this helical coil and adjacent to this input.
The embodiment of the invention provides a kind of suspended type inductive element in addition, comprising: dielectric substrate, and it has multi-level substrate joining structure; Input is arranged on this dielectric substrate; Helical coil, this dielectric substrate is wound to an electric connection certainly, and wherein this helical coil comprises at least one circle time coil, and wherein arbitrary coil comprises that the coiling sections is arranged on time substrate, and guide hole penetrates the coiling sections that this substrate connects primary winding; This electric connection runs through this dielectric substrate, and is positioned at the central authorities of this helical coil, and this input connects this helical coil certainly; And output, be arranged on this dielectric substrate, connect this helical coil and adjacent to this input.
For making the feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts preferred embodiment, and conjunction with figs., elaborates as follows:
Description of drawings
Fig. 1 is the sketch map that shows that inductance value is formed by induction between two tool current coil S1 and the S2;
Fig. 2 is the sketch map that shows the inductance element of the adjustable coil of traditional tool;
Fig. 3 A shows that two planar spiral inductance of tradition are arranged at the sketch map on the different layers substrate;
Fig. 3 B is the generalized section of the planar spiral inductance element shown in Fig. 3 A;
Fig. 4 A is the sketch map that shows the three-dimensional inductance element that forms between traditional multilager base plate;
Fig. 4 B is the generalized section of the three-dimensional inductance element shown in Fig. 4 A;
Fig. 5 is the schematic perspective view that shows the suspended type inductive element framework of embodiments of the invention;
Fig. 6 is the sketch map that shows according to the dielectric substrate of the embodiment of the invention;
Fig. 7 A is the sketch map that shows according to the suspended type inductive element of one embodiment of the invention;
Fig. 7 B is the profile of the suspended type inductive element shown in Fig. 7 A;
Fig. 8 A shows the sketch map of suspended type inductive element according to another embodiment of the present invention;
Fig. 8 B is the profile of the suspended type inductive element shown in Fig. 8 A;
Fig. 9 A shows the sketch map of suspended type inductive element according to another embodiment of the present invention;
Fig. 9 B is the profile of the suspended type inductive element shown in Fig. 9 A;
Figure 10 A is the schematic perspective view that shows traditional helical inductance element;
Figure 10 B is the plane graph of the helical inductance element shown in Figure 10 A;
Figure 11 A is the schematic perspective view that shows according to the suspension type helical inductance element of one embodiment of the invention;
Figure 11 B is the plane graph of the suspension type helical inductance element shown in Figure 11 A;
Figure 12 A is inductance value and the frequency relation figure that shows according to the suspension type helical inductance element of the embodiment of the invention;
Figure 12 B is inductance value and the frequency relation figure that shows traditional helical inductance element;
Figure 13 A is quality factor and the frequency relation figure that shows according to the suspension type helical inductance element of the embodiment of the invention; And
Figure 13 B is quality factor and the frequency relation figure that shows traditional helical inductance element.
Description of reference numerals
Known portions (Fig. 1～4B)
10～adjustable coil; 12～input;
14～output; 15～control line;
16～guide hole; 18～transistor;
20～inductance element; 22～holding wire;
23～earth connection; 24～power line;
25～dielectric layer; 26a, 26b planar spiral inductance;
27～line; 31～contact wire;
32a, 32b～integrated circuit; 33a, 33b～electric capacity;
51,52,54,56～helical coil; 53,55,57, the surface of 59～stack of dielectric substrate;
62,64,66～guide hole; 63～following laminar surface;
65～shielding pattern; 67～through hole.
This case part (Fig. 5～13B)
200～suspension type inductance coil; 202～input;
203～lead sections; 205～electrically connect;
207～lead loop; 208～output;
211,212,213～coiling; 200SF～signal;
300～dielectric substrate; 310～the first dielectric layers;
320～the second dielectric layers; 330～the 3rd dielectric layers;
340～the 4th dielectric layers; 350～the 5th dielectric layers;
400a, 400b, 400c～suspended type inductive element; 410～dielectric substrate;
411-415～inferior dielectric substrate; 420～suspension type inductance coil;
430～input; 440～output;
455～cap layer; 405～bottom layer;
500～traditional helical inductance element; The dielectric substrate of 510～multilayer;
512～earth connection; 520～spiral inductance coil;
530～input; 540～output;
600～suspended type inductive element; The dielectric substrate of 610～multilayer;
612～earth connection; 620～suspension type inductance coil;
630～input; 640～output.
Embodiment
Below specify and be accompanied by the example of graphic explanation with each embodiment, as reference frame of the present invention.In graphic or specification were described, similar or identical part was all used identical figure number.And in graphic, the shape of embodiment or thickness can enlarge, and to simplify or convenient the sign.Moreover; The part of each element will be it should be noted that the element that does not illustrate among the figure or describe to describe explanation respectively in graphic; The form of knowing for affiliated person skilled; In addition, certain embodiments is merely and discloses the ad hoc fashion that the present invention uses, and it is not in order to limit the present invention.
The principal character of the embodiment of the invention and appearance attitude, with reduction inductance element layout area and keep the high inductance value of element and high-quality-factor characteristic, and proposition suspension type inductance framework.And utilize comprehensive architecture to concentrate electromagnetic field distribution, can effectively solve big inductance and bring layout area loss problem.Moreover suspension type inductance framework can make the electromagnetic field radiation rate reduce, and lowers the consumption of energy, and obtains XXX factor characteristic.On the inductor layout of two ports, this framework can elasticity change the position of importing with output, derives multiple layout type for the circuit system layout.
Fig. 5 is the schematic perspective view that shows the suspended type inductive element framework of embodiments of the invention.See also Fig. 5, suspension type inductance coil 200 comprises input 202, is arranged on first of dielectric substrate.Input 202 runs through dielectric substrate via electrically connecting 205, electrically connects via lead sections 203 and helical coil again.The pattern of electric connection 205 comprises through hole (through hole), blind hole (blind hole) or buried via hole (buried hole).Electrically connect 250 and be positioned at this helical coil.For example, electric connection 205 can be positioned at the central authorities of this helical coil, and electromagnetic field is concentrated in the coil, reduces the radiation consume of electromagnetic field, improves the whole quality factor of inductance element.Helical coil upwards is wound on first from second (for example bottom surface) of dielectric substrate, and connects output 208, is arranged on first of dielectric substrate.Helical coil comprises multiple-grid coiling 211,212,213, and each coiling links through electrically connecting 207.It should be noted that the input 202 of suspension type inductance coil 200 dwindles layout area adjacent to output 208, therefore more help to integrate with other actives or passive component.
It should be noted that the shape of suspension type inductance coil 200 also is rectangular coil coil, polygon helical coil or round screw thread coil.Perhaps, suspension type inductance coil 200 can be clockwise direction winding or clockwise winding counterclockwise.
According to the embodiment of the invention, when element operated, signal 200SF connected substrate by input through guide hole earlier; Utilize on the multi-layer sheet transmission line layout mode again around through hole; Make the output signal utilize blind hole, buried via hole to connect transmission line, curl up and be fed back into by the signal, form three-dimensional inductance framework.This inductance framework can be saved the consumption of layout area and can obtain big inductance value characteristic.And can control inductance input of two ports and output end position arbitrarily, for the circuit system layout provides more design flexibility.Moreover the stereochemical structure inductance can concentrate on electromagnetic field in the coil, reduces the radiation loss of electromagnetic field, therefore also has splendid quality factor characteristic.
Fig. 6 is the sketch map that shows according to the dielectric substrate of the embodiment of the invention.The dielectric substrate of the where applicable embodiment of the invention comprises the dielectric substrate 300 of multilayer.Suspension type inductance coil 200 is buried in the dielectric substrate 300 of multilayer.For example; The dielectric substrate 300 of multilayer comprises first dielectric layer, 310 (RO4403; The dielectric material of thickness 4mil), second dielectric layer 320 (high-k material (High dielectricconstant material; HiDK 20 thickness 2mil)), the 3rd dielectric layer 330 (BT thickness 12mil), the 4th dielectric layer 340 (HiDK 20 thickness 2mil)), the 5th dielectric layer 350 (RO4403, thickness 4mil).The material of dielectric substrate comprises polymeric substrate, ceramic substrate or semiconductor substrate, and dielectric substrate can be the single layer substrate of homogenous material formation or the composite base plate that multiple material constitutes.Moreover, the circuit that dielectric substrate also comprises at least one active element or passive component and constituted.
According to another embodiment of the present invention, each layer transmits the inverse signal transmission line, encloses less than one around the signal feed-in hole number of turns of top substrate layer to lower floor.More particularly, utilize the suspension type inductance coil in the dielectric substrate of multilayer, to accomplish a complete spiral inductance (spiral inductor).Moreover in suspension type inductance framework, it can be whole patent characteristics that the guide hole structure of central point and multilager base plate are accomplished a complete spiral inductance, makes inductance coil extend toward the Z direction, forms 3D spiral inductance framework.
See also Fig. 7 A, one embodiment of the invention provide suspended type inductive element 400a, and it comprises that suspension type inductance coil 420 buries in the dielectric substrate 410 of multilayer.Input 430 is arranged on first of dielectric substrate 410, and connects suspension type inductance coil 420 central guide holes.Suspension type inductance coil 420 output 440 that upwards is intertwined and connected.Fig. 7 B is that the suspension type inductance coil 420 shown in Fig. 7 A is along line of cut 7B-7B profile.See also Fig. 7 B, the dielectric substrate 410 of multilayer for example is five layers inferior dielectric substrate 411-415, and input 430 can be selected to be positioned on the inferior dielectric substrate of different layers with output 440.Layer is exposed to respectively outside the dielectric substrate 410 of multilayer outside the suspension type inductance coil 420.The input 430 of helical coil is adjacent to input 440, thereby can control inductance input of two ports and output end position arbitrarily, for the circuit system layout provides more design flexibility.
See also Fig. 8 A, another embodiment of the present invention provides suspended type inductive element 400b, and it comprises that suspension type inductance coil 420 buries in the dielectric substrate 410 of multilayer.Input 430 is arranged on first of dielectric substrate 410, and connects suspension type inductance coil 420 central guide holes.Suspension type inductance coil 420 output 440 that upwards is intertwined and connected.Cap layer 455 is arranged at the top of the dielectric substrate 410 of multilayer, and bottom layer 405 is arranged at the bottom (being shown in Fig. 8 B) of the dielectric substrate 410 of multilayer.Fig. 8 B is that the suspension type inductance coil 420 shown in Fig. 8 A is along line of cut 8B-8B profile.See also Fig. 8 B, the dielectric substrate 410 of multilayer for example is five layers inferior dielectric substrate 411-415, and input 430 can be selected to be positioned on the inferior dielectric substrate of different layers with output 440.Layer is embedded in respectively in cap layer 455 and the bottom layer 405 outside the suspension type inductance coil 420.According to above explanation; Mainly illustrate the embodiment of the invention the suspension type inductance coil can in bury to substrate; Right non-in order to limiting the present invention, the other technologies characteristic, for example input and output are not one to fix on the top layer; Perhaps inductance can partly be arranged in top layer or internal layer, all falls within the spirit and scope of the present invention.
See also Fig. 9 A, another embodiment of the present invention provides suspended type inductive element 400c, and it comprises that suspension type inductance coil 420 buries in the dielectric substrate 410 of multilayer.Input 430 is arranged on first of dielectric substrate 410, and connects suspension type inductance coil 420 central guide holes.Suspension type inductance coil 420 output 440 that upwards is intertwined and connected.Bottom layer 405 is arranged at the bottom (being shown in Fig. 9 B) of the dielectric substrate 410 of multilayer.Fig. 9 B is that the suspension type inductance coil 420 shown in Fig. 9 A is along line of cut 9B-9B profile.See also Fig. 9 B, the dielectric substrate 410 of multilayer for example is five layers inferior dielectric substrate 411-415, and input 430 can be selected to be positioned on the inferior dielectric substrate of different layers with output 440.The upper strata of suspension type inductance coil 420 is exposed on the dielectric substrate 410 of multilayer, and its lower floor is embedded in the bottom layer 405.
Figure 10 A is the schematic perspective view that shows traditional helical inductance element.Figure 10 B is the plane graph of the helical inductance element shown in Figure 10 A.See also Figure 10 A, traditional helical inductance element 500 comprises that spiral inductance coil 520 buries in the dielectric substrate 510 of multilayer.Input 530 and output 540 are arranged on first of dielectric substrate 510, and connect the two ends of spiral inductance coil 520 respectively.In the neighboring area of helical inductance element 500 earth connection 512 is set.
Figure 11 A is the schematic perspective view that shows according to the suspension type helical inductance element of one embodiment of the invention.Figure 11 B is the plane graph of the suspension type helical inductance element shown in Figure 11 A.See also Figure 11 A, suspended type inductive element 600, it comprises that suspension type inductance coil 620 buries in the dielectric substrate 610 of multilayer.Input 630 is arranged on first of dielectric substrate 610, and connects suspension type inductance coil 620 central guide holes.Suspension type inductance coil 620 output 640 that upwards is intertwined and connected.In the neighboring area of suspension type helical inductance element 600 earth connection 612 is set.
The inductance characteristic of traditional helical inductance element 500 with suspended type inductive element 600 compared, list in table one.
Table one inductance characteristic comparison sheet
| ? | Layout area | Inductance value | Maximum quality factor |
| The suspension type inductance | 70mil×80mil | ?16.95nH | ?76.92 |
| The conventional helical inductance | 140mil×60mil | ?7.76nH | ?71.03 |
The layout area of conventional helical inductance element 500 is 140mil * 60mil, and input and output be arranged at the two ends of coil respectively, therefore is difficult for the layout circuit design, and integrates with other elements are difficult.Moreover, see also Figure 12 B and 13B, the inductance value of helical inductance element 500 is 7.76nH only, and maximum quality factor 71.03, more than both electrical characteristics all relatively low.With respect to the suspended type inductive element 600 that the embodiment of the invention provides, layout area is 70mil * 80mil, and input and output end position near, make the circuit design layout easy.Moreover, see also Figure 12 A and 13A, the inductance value of suspended type inductive element 600 promotes and is 16.95nH, and maximum quality factor also to promote be 76.92, more than the traditional relatively helical inductance element 500 of both electrical characteristics, improve significantly.
Though the present invention discloses as above with preferred embodiment; So it is not in order to limit scope of the present invention; Person skilled is not breaking away from the spirit and scope of the present invention under any; When can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that accompanying Claim defines.
Claims (33)
1. suspended type inductive element comprises:
Dielectric substrate; Wherein bottom is arranged at the bottom of this dielectric substrate, and
The suspension type inductance coil comprises:
Input is arranged on this dielectric substrate;
Helical coil, this dielectric substrate twines and electrically connects certainly;
This electric connection runs through this dielectric substrate, and is positioned at the central authorities of this helical coil, and this input connects this helical coil certainly; And
Output; Be arranged on this dielectric substrate; Connect this helical coil and adjacent to this input; Wherein this input runs through this dielectric substrate via this electric connection, electrically connects this helical coil output that upwards is intertwined and connected from this bottom surface of this dielectric substrate again via lead sections and this helical coil.
2. suspended type inductive element as claimed in claim 1, this dielectric substrate are the single layer substrate of homogenous material formation or the composite base plate that multiple material constitutes.
3. suspended type inductive element as claimed in claim 1, wherein the material of this dielectric substrate comprises polymeric substrate, ceramic substrate or semiconductor substrate.
4. suspended type inductive element as claimed in claim 1, wherein this dielectric substrate comprises multilayer dielectric layer.
5. suspended type inductive element as claimed in claim 1,, wherein this electric connection utilizes folded hole technology to comprise via process, blind hole technology or buried via hole technology, and is formed at the different dielectric interlayer.
6. suspended type inductive element as claimed in claim 1 comprises that also cap layer is arranged at the top of this dielectric substrate, and wherein this electric connection utilizes folded hole technology to comprise via process, blind hole technology or buried via hole technology, and is formed at the different dielectric interlayer.
7. suspended type inductive element as claimed in claim 1, wherein this dielectric substrate comprises the circuit that at least one active element or passive component constitutes.
8. suspended type inductive element as claimed in claim 1, wherein this dielectric substrate comprises the laminated construction of multi-level substrate.
9. suspended type inductive element as claimed in claim 8; Wherein this helical coil comprises a plurality of coilings; Wherein these a plurality of coilings are arranged on this multi-level substrate; And guide hole penetrates this each level substrate and connects these a plurality of coilings, and is combined into a complete helical coil by the coiling and the blind buried via hole of different layers.
10. suspended type inductive element as claimed in claim 8, wherein this helical coil comprises many turn coil, wherein this input and output are positioned on the inferior substrate of different layers.
11. suspended type inductive element as claimed in claim 1, wherein this electric connection is positioned at this helical coil.
12. suspended type inductive element as claimed in claim 1, wherein the material of this electric connection comprises electric conducting material or permeability magnetic material.
13. suspended type inductive element as claimed in claim 1, wherein this helical coil is polygon helical coil or round screw thread coil.
14. suspended type inductive element as claimed in claim 1, wherein this helical coil is a rectangular coil coil.
15. suspended type inductive element as claimed in claim 1, wherein this helical coil is that clockwise direction twines or clockwise winding counterclockwise.
16. suspended type inductive element as claimed in claim 9, wherein each level substrate transmits inverse signal transmission line, encloses less than one around the signal feed-in hole number of turns of last level substrate to following level substrate.
17. suspended type inductive element as claimed in claim 1, wherein this suspension type inductance coil is accomplished a complete spiral inductance in the dielectric substrate of multilayer.
18. suspended type inductive element as claimed in claim 1, wherein in this suspended type inductive element, the guide hole structure of central point and multilager base plate are accomplished a complete spiral inductance, make inductance coil extend toward the Z direction, form 3D spiral inductance framework.
19. a suspended type inductive element comprises:
Dielectric substrate, it has multi-level substrate joining structure, and wherein bottom is arranged at the bottom of this dielectric substrate;
Input is arranged on this dielectric substrate;
Helical coil, this dielectric substrate is wound to an electric connection certainly, and wherein this helical coil comprises a plurality of coilings, and wherein these a plurality of coilings are arranged on this each level substrate, and guide hole penetrates this each these a plurality of coilings of level substrate connection;
This electric connection runs through this dielectric substrate, and is positioned at the central authorities of this helical coil, and this input connects this helical coil certainly; And
Output; Be arranged on first of this dielectric substrate; Connect this helical coil and adjacent to this input; Wherein this input runs through this dielectric substrate via this electric connection, electrically connects this helical coil output that upwards is intertwined and connected from this bottom surface of this dielectric substrate again via lead sections and this helical coil.
20. suspended type inductive element as claimed in claim 19, wherein the material of this dielectric substrate comprises polymeric substrate, ceramic substrate or semiconductor substrate, and this dielectric substrate is the single layer substrate of homogenous material formation or the composite base plate that multiple material constitutes.
21. suspended type inductive element as claimed in claim 19, wherein this dielectric substrate comprises multilayer dielectric layer.
22. suspended type inductive element as claimed in claim 19, wherein this electric connection utilizes folded hole technology to comprise via process, blind hole technology or buried via hole technology, and is formed at the different dielectric interlayer.
23. suspended type inductive element as claimed in claim 19 comprises that also cap layer is arranged at the top of this dielectric substrate, wherein this electric connection utilizes folded hole technology to comprise via process, blind hole technology or buried via hole technology, and is formed at the different dielectric interlayer.
24. suspended type inductive element as claimed in claim 19, wherein this dielectric substrate comprises the circuit that at least one active element or passive component constitutes.
25. suspended type inductive element as claimed in claim 19, wherein this helical coil comprises many turn coil, and wherein this input and output are positioned on the inferior substrate of different layers.
26. suspended type inductive element as claimed in claim 19, wherein this electric connection is positioned at this helical coil.
27. suspended type inductive element as claimed in claim 19, wherein the material of this electric connection comprises electric conducting material or permeability magnetic material.
28. suspended type inductive element as claimed in claim 19, wherein this helical coil is polygon helical coil or round screw thread coil.
29. suspended type inductive element as claimed in claim 19, wherein this helical coil is a rectangular coil coil.
30. suspended type inductive element as claimed in claim 19, wherein this helical coil is that clockwise direction twines or clockwise winding counterclockwise.
31. suspended type inductive element as claimed in claim 19, wherein each level substrate transmits inverse signal transmission line, encloses less than one around the signal feed-in hole number of turns of last level substrate to following level substrate.
32. suspended type inductive element as claimed in claim 19, wherein this suspension type inductance coil is accomplished a complete spiral inductance in the dielectric substrate of multilayer.
33. suspended type inductive element as claimed in claim 19, wherein in this suspended type inductive element, the guide hole structure of central point and multilager base plate are accomplished a complete spiral inductance, make inductance coil extend toward the Z direction, form 3D spiral inductance framework.
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| US7026904B2 (en) * | 2001-10-19 | 2006-04-11 | Broadcom Corporation | Multiple layer inductor and method of making the same |
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| US7026904B2 (en) * | 2001-10-19 | 2006-04-11 | Broadcom Corporation | Multiple layer inductor and method of making the same |
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