CN101377970B - Interactive screw type inductive element - Google Patents
Interactive screw type inductive element Download PDFInfo
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- CN101377970B CN101377970B CN2007101424542A CN200710142454A CN101377970B CN 101377970 B CN101377970 B CN 101377970B CN 2007101424542 A CN2007101424542 A CN 2007101424542A CN 200710142454 A CN200710142454 A CN 200710142454A CN 101377970 B CN101377970 B CN 101377970B
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Abstract
The invention provides an interactive spiral inductor, comprising a dielectric substrate. A first terminal is arranged on the dielectric substrate. A winding conductive coil along the clockwise direction is connected with the first terminal and comprises at least one turn of coil for surrounding the dielectric substrate. The winding conductive coil along the anticlockwise direction comprises at least one turn of the coil for surrounding the dielectric substrate, wherein, the winding conductive coil along the clockwise direction and the winding conductive coil along the anticlockwise direction are electrically connected. A second terminal is connected with the conductive coil along the anticlockwise direction and is adjacent to the first terminal.
Description
Technical field
The present invention relates to a kind of concealed electric sensing unit, particularly a kind of three-dimension interaction screw type inductive element with high quality factor.
Background technology
The concealed electric sensing unit has been widely used in the circuit such as resonator, filter and matching network.In fields such as wireless telecommunications, digital computer, portable electronic product and information household appliances, high frequency, wideband, and three characteristics of miniaturization almost become the main demand important document in high-tech industry and market.
In system module, inductance is radio frequency and digital watershed.When being applied to radio-frequency module, traditional electrical sensing unit and radio circuit coupling and energy loss are closely bound up, and the good and bad most important parameter of decision inductance is mainly the inductance natural frequency of vibration (SRF) and quality factor (Quality factor).The high natural frequency of vibration can make that the inductance opereating specification is broader, and high-quality-factor reduces by the signal energy slippages.Because inductance greater than the natural frequency of vibration opereating specification time, has been become the electric capacity response by inductance characteristic, this transformation can have a strong impact on the characteristic and the usefulness of system or circuit.Therefore, must reduce the ghost effect of inductance itself or improve in design from induction structure.
In the definition of the quality factor of typical inductive element as shown in Equation 1.More particularly, promptly institute's stored energy and catabiotic ratio in the one-period perhaps, utilize formula 2, try to achieve from measuring the frequency range data.
Q=F
0/ Δ F F
0: operating frequency Δ F:3dB bandwidth formula (2)
Moreover the quality factor of inductance element is relevant with itself equivalent resistance (ESR), if equivalent resistance is little, under the identical inductances framework, quality factor can promote.In addition, electromagnetic field field shape distributes and also can influence the quality factor characteristic of inductance element.The otherness of thick behaviour's degree (Roughly) in surface and technology all can influence the quality factor of inductance element.
Therefore, when the cloth intra-office buried inductance, the factor that must consider comprised inductive strong and weak degree, ground plane to the influence of inductance or the distribution of an inductance shape itself etc.Bury inductance in the tradition and need take bigger layout area, with the inductance characteristic that obtains.In addition, during layout dual-port inductance element, often be separated by too far because of input and output, and cause the puzzlement of layout designs, the shared area of layout also promotes relatively.Moreover, because the complexity of communication system increases now, thereby need more inductance holding circuit characteristics.Therefore industry is needed badly and is buried the inductance element structure in the improvement, in the hope of significantly reducing the manufacturing cost of circuit layout area and commodity.
U.S. Pat 5,461 discloses for No. 353 and a kind ofly to bury the inductance framework in adjustable.See also Fig. 1, adjustable coil 10 is arranged in the multi-layer substrate structure with interior form of burying.By control line 15 oxide-semiconductor control transistors 18, make adjacent two conductive holes 14 and 16 short circuits by control signal, reach the effect of adjusting inductance value.Moreover multilager base plate levels layout metal is as the function of inductor shield.Its advantage is to have adjusts the inductance value function, and electromagnetic field is distributed in the spiral inductance, has splendid quality factor characteristic.Yet this mode is being made on the big inductance.Need expend a large amount of circuit layout area.When making the dual-port inductance, input 12 and output 14 are separated by very far away, increase the area of circuit layout.
Moreover United States Patent (USP) US discloses a kind of integrated coil inductance for 5,978, No. 231, and between substrate, and the cloth intra-office buries spiral induction structure on this magnetic material with the pressing magnetic material.Thus, the inductance value of spiral inductance can be influenced by magnetic material and promote.Fig. 2 A is the floor map that shows traditional integrated coil inductance, and Fig. 2 B is the profile of the integrated coil inductance shown in Fig. 2 A.See also 2A and 2B figure, the integrated coil inductance comprises that magnetic material layer s is in pressing from both sides between the substrate.In bury spiral inductance and be arranged on the magnetic material, spiral inductance comprises the loop construction that is made of conductive layer 29,30 and conductive hole 28.Loop construction comprises corresponding lead sections 29a, 29b and 30a, 30b, is arranged at the top and bottom of magnetic material layer s respectively. Lead sections 29a, 29b and 30a, 30b are connected to form spiral inductance by conductive hole 28a-28e.Because magnetic material twines in being subjected to helical winding, thereby has big inductance value, and, owing to be distributed in the spiral inductance than strong-electromagnetic field, thereby have preferable quality factor characteristic.Yet the input of the integrated coil inductance of traditional double port and output are separated by very far away, increase the area of circuit layout, unfavorable and other active elements and passive component integration.
United States Patent (USP) US discloses a kind of double layer planar induction structure for 6,696, No. 910.See also Fig. 3, double layer planar inductance element 50 comprises that circuit board 54, one ground planes 64 are arranged on the circuit board 54.Threaded hole 75,76 is arranged at the neighboring area of circuit board 54.In bury spiral inductance 52 and comprise that coiling 58 and conductive hole 62 are arranged at the middle section of circuit board 54, and use the magnetic core of high magnetic conductive material 56, and this inductance element can be used as transformer (Transformer) as spiral inductance 52.Comprise other circuit structures 68,70,72,74 on the circuit board 54 in addition, for example lead and conductive hole 66.
The inductance value of traditional double layer plane inductance element is because of being subjected to the influence of magnetic material, and inductance value can significantly promote.And electromagnetic field distributes and concentrates in the spiral inductance, therefore has splendid quality factor characteristic.Yet, utilize the inductance of this mode made, will import further with output after, area that still can't the reduction circuit layout.
Summary of the invention
In view of this, the invention provides a kind of three-dimension interaction spiral inductance framework.Effectively solve first terminal of dual-port inductance element and the distance of second terminal, in order to inductance element and other active elements and passive component integration.And utilize three-dimensional winding structure that electromagnetic field is distributed and concentrate, and then the electromagnetic field radiation rate is reduced, lower the consumption of energy, and obtain XXX factor characteristic.
The embodiment of the invention provides a kind of interactive screw type inductive element, comprising: dielectric substrate; First terminal is arranged on this dielectric substrate; Clockwise direction twines conductive coil and connects this first terminal, and it has at least one coil, around this dielectric substrate; Counterclockwise twine conductive coil and have at least one circle coil, around this dielectric substrate, wherein this clockwise direction twines conductive coil and counterclockwise twines conductive coil with this and connect by electricity; And second terminal connect this counter clockwise direction conductive coil, contiguous this first terminal, and being arranged on this dielectric substrate.
The embodiment of the invention provides a kind of interactive screw type inductive element in addition, comprising: dielectric substrate; First terminal is arranged on this dielectric substrate; The first interactive screw type coil comprises: first clockwise direction twines conductive coil and connects this first terminal, and it has at least one circle coil, around this dielectric substrate; And first counterclockwise twine conductive coil and have at least one circle coil, and around this dielectric substrate, wherein this first clockwise direction twines conductive coil and twines conductive coil with this first counter clockwise direction and connect by first electricity; The second interactive screw type coil comprises: second clockwise direction twines conductive coil and has at least one circle coil, around this dielectric substrate; And second counterclockwise twine conductive coil and have at least one circle coil, and around this dielectric substrate, wherein this second clockwise direction twines conductive coil and twines conductive coil with this second counter clockwise direction and connect by second electricity; The 3rd electricity connects, and connects this first interactive screw type coil and this second interactive screw type coil; And second terminal connect this counter clockwise direction conductive coil, contiguous this first terminal, and being arranged on this dielectric substrate.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Fig. 1 is the schematic diagram that shows the inductance element of the adjustable coil of traditional tool;
Fig. 2 A is the floor map that shows traditional integrated coil inductance;
Fig. 2 B is the profile of the integrated coil inductance shown in Fig. 2 A;
Fig. 3 is the floor map that shows traditional double layer planar induction structure;
Fig. 4 is the floor map that shows typical spiral inductance structure;
Fig. 5 is the floor map that shows according to the interactive screw type inductive element of the embodiment of the invention;
Fig. 6 is the schematic diagram that shows according to the dielectric substrate of the embodiment of the invention;
Fig. 7 A is the schematic perspective view that shows according to the interactive screw type inductive element of the embodiment of the invention;
Fig. 7 B is the plane graph of the interactive screw type inductive element shown in Fig. 7 A;
Fig. 8 A shows the schematic perspective view of the mutual screw type inductive element of double cross according to another embodiment of the present invention;
Fig. 8 B is the plane graph of the mutual helical inductance element of double cross shown in Fig. 8 A;
Fig. 9 A is inductance value and the frequency relation figure that shows according to the mutual helical inductance element of the embodiment of the invention;
Fig. 9 B is inductance value and the frequency relation figure that shows according to the mutual helical inductance element of double cross of the embodiment of the invention;
Figure 10 A is quality factor and the frequency relation figure that shows according to the mutual helical inductance element of the embodiment of the invention; And
Figure 10 B is quality factor and the frequency relation figure that shows according to the mutual helical inductance element of double cross of the embodiment of the invention.
Description of reference numerals
Known portions (Fig. 1-3)
10 adjustable coils; 12 first terminals (input);
14 second terminals (output); 15 control lines;
16 conductive holes; 18 transistors;
29,30 conductive layers; 28 conductive holes;
The s magnetic material layer; 29a, 29b, 30a, 30b lead sections;
The 28a-28e conductive hole; 50 double layer planar inductance elements;
Bury spiral inductance in 52; 54 circuit boards;
56 high magnetic conductive materials; 58 coilings;
62 conductive holes; 64 ground planes;
66 conductive holes; 68,70,72,74 circuit structures;
75,76 threaded hole.
This case part (Fig. 4-10B)
100 helical inductance elements; 102 first terminals (input);
105a-105e, 107a-107d lead sections; 104a-104e, 106a-106e conductive hole;
108 second terminals (output); 100S
FSignal;
200 interactive screw type inductive elements; 202 first terminals (input);
205a, 205b, 207a, 207c lead sections; 204a, 204b, 206a, 206b conductive hole;
208 second terminals (output); 210 electricity connect;
215a, 215b, 217a, 217b lead sections; 214a, 214b, 216a, 216b conductive hole;
200S
FSignal; 300 dielectric substrates;
310 first dielectric layers; 320 second dielectric layers;
330 the 3rd dielectric layers; 340 the 4th dielectric layers;
350 the 5th dielectric layers; 400 interactive screw type inductive elements;
410 dielectric substrates; 412 earth connections (face);
420 mutual spiral inductance coils; 430 first terminals (input);
440 second terminals (output); The mutual helical inductance element of 500 double crosses;
510 dielectric substrates; The 520A first mutual spiral inductance coil;
The 520B second mutual spiral inductance coil; 512 earth connections (face);
525 electricity connect; 530 first terminals (input);
540 second terminals (output).
Embodiment
Below describe and be accompanied by the example of graphic explanation in detail with each embodiment, as reference frame of the present invention.In graphic or specification were described, similar or identical part was all used identical figure number.And in graphic, the shape of embodiment or thickness can enlarge, and to simplify or convenient the sign.Moreover, the part of each element will be to describe explanation respectively in graphic, it should be noted that, the element that does not illustrate among the figure or describe, for having the form of knowing usually known to the knowledgeable in the affiliated technical field, in addition, only for disclosing the ad hoc fashion that the present invention uses, it is not in order to limit the present invention to certain embodiments.
Fig. 4 is the floor map that shows typical spiral inductance structure.Helical inductance element 100 comprises that first terminal 102 (for example input) connects helical coil and twines, and then connects second terminal 108 (for example output).Helical coil twines and to comprise and lead sections 105a-105e and 107a-107d are arranged on the dielectric substrate upper and lower surface respectively, and utilizes conductive hole 104a-104e and 106a-106e to link, the formation clockwise direction or the helical coil of putting property winding counterclockwise.First terminal 102 (for example input) of helical inductance element 100 and second terminal 108 (for example output) are arranged at the both sides of helical coil respectively.If during the dual-port inductor layout, input and output a good distance off occupy many areas on circuit layout, the integration of unfavorable and other circuit elements.The inductance framework can effectively reduce the layout area loss, and has the high-quality-factor element characteristic.When element is worked, signal 100S
FBy first terminal 102 (for example input) input, behind helical coil, and export earlier by second terminal 108 (for example output).
According to the embodiment of the invention, utilize the different layers substrate layout transmission line that interlocks.And use conductive hole to link transmission path, bury three-dimensional mutual inductive circuit framework in the formation.This framework can make the input of dual-port inductance and output adjacent to homonymy, can effectively reduce the layout area loss, and the design and the circuit layout mode of circuit designers novelty can be provided.In addition, in bury comprehensive architecture electromagnetic field is concentrated among the mutual spiral inductance, therefore have splendid quality factor characteristic.
Fig. 5 is the floor map that shows according to the interactive screw type inductive element of the embodiment of the invention.See also Fig. 5, interactive screw type inductive element 200 comprises dielectric substrate 300 (being shown in Fig. 6).First terminal 202 (for example input) is arranged on the dielectric substrate.The conductive coil that clockwise direction twines connects first terminal 202 (for example input), and it has at least one circle coil, around dielectric substrate.Clockwise direction twines conductive coil and comprises lead sections 205a, 205b and 207a, 207c, is arranged at respectively on the dielectric substrate upper and lower surface, and utilizes conductive hole 204a, 204b and 206a, 206b to link.
Counterclockwise twine at least one circle coil of conductive coil tool, around this dielectric substrate.Clockwise direction twines conductive coil and comprises lead sections 215a, 215b and 217a, 217b, is arranged at respectively on the dielectric substrate upper and lower surface, and utilizes conductive hole 214a, 214b and 216a, 216b to link.Clockwise direction winding conductive coil twines conductive coil with counter clockwise direction and is connected 210 connections by electricity.Second terminal 208 (for example output) connects this counter clockwise direction conductive coil, contiguous first terminal 202 (for example input), and be arranged on this dielectric substrate.When element is worked, signal 200S
FBy first terminal 202 (for example input) feed-in, after clockwise direction twines conductive coil, electricity connection 210 and counterclockwise twines conductive coil, and export earlier by second terminal 208 (for example output).Because the staggered levels substrate (can use the different layers substrate) that is in the layout of of transmission line can navigate on the same path input signal and output signal.In addition, it should be noted that first terminal 202 (for example input) of mutual spiral inductance coil dwindles layout area adjacent to second terminal 208 (for example output), help active or passive component integration, on layout, have very big design flexibility for circuit designers with other.
Fig. 6 is the schematic diagram that shows according to the dielectric substrate of the embodiment of the invention.The dielectric substrate of the where applicable embodiment of the invention comprises the dielectric substrate 300 of multilayer.Mutual spiral inductance coil is buried in the dielectric substrate 300 of multilayer.For example, the dielectric substrate 300 of multilayer comprises first dielectric layer, 310 (RO4403, the dielectric material of thickness 4mil), second dielectric layer 320 (high dielectric constant material (High dielectricconstant material, HiDK 20 thickness 2mil)), the 3rd dielectric layer 330 (BT thickness 12mil), the 4th dielectric layer 340 (HiDK 20 thickness 2mil)), the 5th dielectric layer 350 (RO4403, thickness 4mil).The material of dielectric substrate comprises polymeric substrate, ceramic substrate or semiconductor substrate, and dielectric substrate can be the single layer substrate of homogenous material formation or the composite base plate that multiple material constitutes.Moreover dielectric substrate also comprises the circuit that active element or passive component constituted at least.
Fig. 7 A is the schematic perspective view that shows according to the interactive screw type inductive element of the embodiment of the invention.Fig. 7 B is the plane graph of the interactive screw type inductive element shown in Fig. 7 A.See also Fig. 7 A, interactive screw type inductive element 400 comprises that mutual spiral inductance coil 420 buries in the dielectric substrate 410 of multilayer.First terminal 430 (for example input) is arranged on the dielectric substrate 410 with second terminal 440 (for example output).Neighboring area at mutual helical inductance element 400 is provided with earth connection 412.
It should be noted,, can select to cover a cap layer, perhaps, increase by a bottom at dielectric substrate 410 back sides in dielectric substrate 410 upper stratas according to other embodiments of the invention.More particularly, can utilize different folded hole technology (comprising through hole (through hole), blind hole (blind hole) or buried via hole (buried hole)), and be formed at the different dielectric layer, to finish the inductance framework.
Fig. 8 A shows the schematic perspective view of the mutual screw type inductive element of double cross according to another embodiment of the present invention.Fig. 8 B is the plane graph of the mutual helical inductance element of double cross shown in Fig. 8 A.See also Fig. 8 A, the mutual helical inductance element 500 of double cross comprises the first mutual spiral inductance coil 520A and the second mutual spiral inductance coil 520B, buries in the dielectric substrate 510 of multilayer.Being connected 525 with an electricity between the first mutual spiral inductance coil 520A and the second mutual spiral inductance coil 520B links to each other.First terminal 530 (for example input) is connected with the first mutual spiral inductance coil 520B, and second terminal 540 (for example output) and the second mutual spiral inductance coil 520A, and is arranged on the dielectric substrate 510.Earth connection (face) 512 is set in the neighboring area of helical inductance element 500.
Fig. 9 A is inductance value and the frequency relation figure that shows according to the mutual helical inductance element of the embodiment of the invention, and Fig. 9 B is inductance value and the frequency relation figure that shows according to the mutual helical inductance element of double cross of the embodiment of the invention.See also Fig. 9 A and 9B, mutual helical inductance element 400 is under frequency 45MHz condition, and inductance value is 5.16nH.And double helix inductance element 500 is under frequency 45MHz condition, and inductance value is 10.28nH.Moreover, seeing also Figure 10 A and 10B, the maximum quality factor of mutual helical inductance element 400 is 57.54 relative approaching with the maximum quality factor 51.03 of double helix inductance element 500.Therefore, double helix inductance element 500 can make the unlikely quality factor that has the greatest impact of inductance value multiplication.
Though the present invention discloses as above with preferred embodiment; so it is not in order to limit scope of the present invention; the person of ordinary skill in the field without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that accompanying Claim defines.
Claims (14)
1. interactive screw type inductive element comprises:
Dielectric substrate has opposite first and second surface;
First terminal is arranged on this dielectric substrate;
Clockwise direction twines conductive coil and connects this first terminal, and it has at least one circle coil, around this first surface and this second surface of this dielectric substrate;
Counterclockwise twine conductive coil and have at least one circle coil, around this first surface and this second surface of this dielectric substrate, wherein this clockwise direction winding conductive coil counterclockwise twines conductive coil with this and connects by electricity; And
Second terminal connects this counter clockwise direction conductive coil, contiguous this first terminal, and be arranged on this dielectric substrate,
Wherein, this clockwise direction twines conduction line segment that conductive coil is positioned at this first surface and the projection of this second surface is intersected at this counterclockwise twines the conduction line segment that conductive coil is positioned at this second surface.
2. interactive screw type inductive element as claimed in claim 1, wherein, this dielectric substrate is the single layer substrate of homogenous material formation or the composite base plate that multiple material constitutes.
3. interactive screw type inductive element as claimed in claim 1, wherein the material of this dielectric substrate comprises polymeric substrate, ceramic substrate or semiconductor substrate.
4. interactive screw type inductive element as claimed in claim 1, wherein this dielectric substrate comprises multilayer dielectric layer.
5. interactive screw type inductive element as claimed in claim 4, comprise that also bottom or cap layer are arranged at the bottom and the top of this dielectric substrate respectively, wherein this electricity connects the folded hole of utilization technology and comprises via process, blind hole technology or buried via hole technology, and is formed between the different dielectric layer.
6. interactive screw type inductive element as claimed in claim 1, wherein this dielectric substrate comprises the circuit that active element or passive component constituted at least.
7. interactive screw type inductive element as claimed in claim 1, wherein this first terminal is an input, and this second terminal is an output.
8. interactive screw type inductive element comprises:
Dielectric substrate has opposite first and second surface;
First terminal is arranged on this dielectric substrate;
The first interactive screw type coil comprises:
First clockwise direction twines conductive coil and connects this first terminal, and it has at least one circle coil, around this first surface and this second surface of this dielectric substrate; And
First counterclockwise twines conductive coil has at least one circle coil, around this first surface and this second surface of this dielectric substrate, wherein this first clockwise direction twines conductive coil and twines conductive coil with this first counter clockwise direction and connect by first electricity;
The second interactive screw type coil comprises:
Second clockwise direction twines conductive coil and has at least one circle coil, around this first surface and this second surface of this dielectric substrate; And
Second counterclockwise twines conductive coil has at least one circle coil, around this first surface and this second surface of this dielectric substrate, wherein this second clockwise direction twines conductive coil and twines conductive coil with this second counter clockwise direction and connect by second electricity;
The 3rd electricity connects, and connects this first interactive screw type coil and this second interactive screw type coil; And
Second terminal connects this second counter clockwise direction conductive coil, contiguous this first terminal, and be arranged on this dielectric substrate,
Wherein, this first clockwise direction twines conductive coil and is positioned at the projection of the conduction line segment of this first surface to this second surface, intersects at this first counter clockwise direction and twines the conduction line segment that conductive coil is positioned at this second surface; Wherein, this second clockwise direction twines conductive coil and is positioned at the projection of the conduction line segment of this first surface to this second surface, intersects at this second counter clockwise direction and twines the conduction line segment that conductive coil is positioned at this second surface.
9. interactive screw type inductive element as claimed in claim 8, wherein, this dielectric substrate is the single layer substrate of homogenous material formation or the composite base plate that multiple material constitutes.
10. interactive screw type inductive element as claimed in claim 8, wherein the material of this dielectric substrate comprises polymeric substrate, ceramic substrate or semiconductor substrate.
11. interactive screw type inductive element as claimed in claim 8, wherein this dielectric substrate comprises multilayer dielectric layer.
12. interactive screw type inductive element as claimed in claim 11, comprise that also bottom or cap layer are arranged at the bottom and the top of this dielectric substrate respectively, wherein this electricity connects the folded hole of utilization technology and comprises via process, blind hole technology or buried via hole technology, and is formed between the different dielectric layer.
13. interactive screw type inductive element as claimed in claim 8, wherein this dielectric substrate comprises the circuit that active element or passive component constituted at least.
14. interactive screw type inductive element as claimed in claim 8, wherein this first terminal is an input, and this second terminal is an output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101424542A CN101377970B (en) | 2007-08-27 | 2007-08-27 | Interactive screw type inductive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101424542A CN101377970B (en) | 2007-08-27 | 2007-08-27 | Interactive screw type inductive element |
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| Publication Number | Publication Date |
|---|---|
| CN101377970A CN101377970A (en) | 2009-03-04 |
| CN101377970B true CN101377970B (en) | 2011-11-09 |
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| CN2007101424542A Expired - Fee Related CN101377970B (en) | 2007-08-27 | 2007-08-27 | Interactive screw type inductive element |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114141472B (en) * | 2021-01-19 | 2024-01-16 | 西安电子科技大学 | High-integration high-shielding transformer structure based on penetrating through holes |
| CN114420421A (en) * | 2022-02-07 | 2022-04-29 | 湖南好易佳电路板股份有限公司 | Composite circuit board integrated modularized electromagnetic winding |
| CN116052981B (en) * | 2023-03-31 | 2023-06-13 | 北京航天微电科技有限公司 | Magnetic film inductor and preparation method thereof |
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Granted publication date: 20111109 Termination date: 20180827 |