CN101382676B - Electro-optical device and electronic apparatus - Google Patents
Electro-optical device and electronic apparatus Download PDFInfo
- Publication number
- CN101382676B CN101382676B CN2008102137681A CN200810213768A CN101382676B CN 101382676 B CN101382676 B CN 101382676B CN 2008102137681 A CN2008102137681 A CN 2008102137681A CN 200810213768 A CN200810213768 A CN 200810213768A CN 101382676 B CN101382676 B CN 101382676B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- electronic unit
- para tape
- electro
- optical device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The present invention provides an electro-optical device capable of preventing electric short circuit on exposed electronic parts. An electro-optical device includes: a display panel module having electronic parts provided therein; and an insulating tape that is adhered to the display panel module so as to cover the electronic parts. The insulating tape includes an adhesive portion and a non-adhesive portion. The non-adhesive portion is disposed at a position that covers a region in which the electronic parts are provided, and the adhesive portion is adhered to the display panel module in regions other than the region in which the electronic parts are provided. Therefore, electric short circuit caused by the contact of dust and the electronic parts is avoided by preventing the adhesion of the dust to the adhesive portion of the insulating tape.
Description
Technical field
The present invention relates to be applicable to the electro-optical device and the electronic equipment of the demonstration of various information.
Background technology
Usually, the liquid crystal indicator as one of electro-optical device mainly possesses: the liquid crystal panel that plays a role and constitute with 2 substrate holding liquid crystals as display panel; Light emitting diode) by have LED (Light Emitting Diode: the lighting device that constitutes of the light guide plate of light source such as at end face.
In this liquid crystal indicator, the panel that lighting device is accommodated in the frame shape keeps in the body, and the two sides band of display panels with the frame shape is bonded on this panel maintenance body.At this, the driver IC that drives liquid crystal panel is set on the substrate of this liquid crystal panel, and (FPC:Flexible Printed Circuit: flexible printed circuit) electronic equipment with the outside is connected via flexible substrate.The FPC that is connected with the substrate of display panels is folded back the lighting device side, and this panel keeps body and this FPC to be incorporated in the metal framework of case shape.
And, have such situation: make the electronic unit such as resistance, capacitor on the surface that is assembled into above-mentioned FPC etc.,, expose to the outside of liquid crystal indicator being in the design of purpose with the slimming of electronic equipment, miniaturization etc.Under above-mentioned situation, need cover above-mentioned electronic unit with para tape, prevent the electric short circuit that produces because of the contact between parts.
And, in following patent documentation 1, put down in writing such technology: with the IC module clip between the card base material and when bonding, cover the protuberance of IC module with splicing tape etc.
[patent documentation 1] spy opens flat 11-259622 communique
But, to prevent that above-mentioned electric short circuit from being that purpose is used under the situation of para tape, because on the bonding portion of para tape, adhere to dust etc. easily, so by in manufacture process etc., contacting with above-mentioned electronic unit attached to the dust on the above-mentioned bonding portion, and electric short circuit might take place.In addition, the splicing tape of record in the patent documentation 1, the generation for the gauffer that prevents to take place when above-mentioned IC module and above-mentioned card base material bonding, bending etc. has added fixing otch on above-mentioned splicing tape.But, be applied in mode under the situation of above-mentioned para tape above-mentioned splicing tape, because of above-mentioned otch, can be formed in the space of directly adhering to dust on the above-mentioned electronic unit, thereby still electric short circuit might take place.
Summary of the invention
Aspect 1 of the present invention, electro-optical device possesses: the display module that disposes electronic unit; And stick on para tape on the above-mentioned display module in the mode that covers above-mentioned electronic unit; Wherein, above-mentioned para tape has adhesive portion and non-bonded part, above-mentioned non-bonded part is configured in the position that covers the zone dispose above-mentioned electronic unit, and the zone of above-mentioned adhesive portion beyond in the zone that disposes above-mentioned electronic unit sticks on the above-mentioned display module.
In above-mentioned electro-optical device, on display module, dispose electronic unit.At this, display module comprises display panels such as liquid crystal panel.In the mode of overlay electronic parts, display module is pasted para tape.Para tape has adhesive portion and the non-bonded part that is used to paste.At this, non-bonded part is configured in the position that covers the zone dispose electronic unit, and the zone of adhesive portion beyond in the zone that disposes electronic unit sticks on the display module.
Because the adhesive portion of para tape has cementability, so adhere to dust etc. easily on its surface.Thereby, if the adhesive portion of pasting para tape in the zone that disposes electronic unit then because of attached to the dust on the adhesive portion etc., will produce problems such as electronic unit short circuit.In this, in above-mentioned electro-optical device, because adhesive portion is not set, so need not the problems such as short circuit that electronic unit can take place worry in the zone of configuration electronic unit.
In a kind of mode of above-mentioned electro-optical device, above-mentioned display module has framework; Above-mentioned para tape is pasted for said frame.In this mode, utilize the para tape stick on the framework, can prevent from the dust of framework for the adhering to of electronic unit, thereby can reduce the generation of the problems such as short circuit of electronic unit.
In the another way of above-mentioned electro-optical device, said frame has and is arranged on the locational window that above-mentioned electronic unit is exposed; Above-mentioned para tape sticks on the said frame in the circumferential position of above-mentioned window.In this mode, electronic unit exposes to the outside from the window that is arranged on the framework, and pastes para tape in the mode that covers this window.In this mode, because utilize the window be arranged on the framework to prevent contacting of electronic unit and framework, and adhesive portion is not set, so need not the problems such as short circuit that electronic unit can take place worry in the zone that disposes electronic unit.
In the another way of above-mentioned electro-optical device, said frame and above-mentioned electronic unit dispose in mode overlapping on the thickness direction of said frame.In this mode, because electronic unit disposes in mode overlapping on the thickness direction of framework, so the amount of can be further that electronic unit of electro-optical device attenuate and framework is overlapping thickness.
In the another way of above-mentioned electro-optical device, the thickness of the aspect ratio said frame of above-mentioned electronic unit is little.In this mode, electronic unit is insulated band and covers, and does not dispose para tape with pushing.Utilize this structure, can prevent that para tape is squeezed on the electronic unit, prevent the adhering to etc. of breakage, foreign matter of the para tape that the extruding of electronic unit caused because of para tape, can prevent dust from the band of breakage enter, dust adheres to electronic unit, thereby can reduce the generation of the problems such as short circuit of electronic unit.
In the another way of above-mentioned electro-optical device, above-mentioned display module has flexible substrate, and above-mentioned electronic unit is configured on the above-mentioned flexible substrate.In this mode, because electronic unit is configured on the flexible substrate, so need not to prepare in addition substrate, the thick circuit board of use of configuration electronic unit.And then, because flexible substrate and display panel further are adjacent to, so can further form electro-optical device slim.
In addition, in the another way of above-mentioned electro-optical device, above-mentioned para tape sticks on the above-mentioned flexible substrate.In this mode, para tape is directly pasted for flexible substrate, the adhesive portion in the zone that disposes electronic unit with the external pasting para tape.Thereby, need not to worry because of the problems such as short circuit of electronic unit taking place, and can directly protect electronic unit attached to the dust on the adhesive portion.And then, because the adaptation height of para tape and flexible substrate, so can reduce dust entering from the outside.
Above-mentioned display module has framework, and disposing said frame with the overlapping mode of above-mentioned flexible substrate, and said frame has and is arranged on the locational window that the above-mentioned electronic unit that covered by above-mentioned para tape is exposed.In this mode, because on flexible substrate, dispose electronic unit, and flexible substrate is directly pasted para tape, so can directly protect electronic unit.And, be insulated the locational window that electronic unit that band covers exposes by having to be arranged on to make, can make electronic unit and framework overlapping.Its result can make the overlay electronic parts and be pasted with the display module and the framework of para tape approaching.
In preferred example, above-mentioned display module has display panel, and above-mentioned flexible substrate is connected with above-mentioned display panel.In this mode, the wiring of disposing the flexible substrate of electronic unit is connected with the wiring of display panel.And, by along the display panel configurations flexible substrate, can further form electro-optical device slim, miniaturization.In addition, can use above-mentioned electro-optical device to constitute electronic equipment.At this moment, because electronic equipment has the display panel that the electronic unit that is configured on the display panel is difficult to short circuit, so can form quality good electron equipment.
Description of drawings
Fig. 1 is the planimetric map of the liquid crystal indicator of embodiments of the present invention;
Fig. 2 is the sectional view of the liquid crystal indicator of present embodiment;
Fig. 3 is the planimetric map of the para tape of present embodiment;
Fig. 4 is the sectional view of the para tape of present embodiment;
Fig. 5 is the planimetric map of the liquid crystal indicator of distortion example;
Fig. 6 is the sectional view of the liquid crystal indicator of distortion example;
Fig. 7 is the sectional view of the liquid crystal indicator of distortion example;
Fig. 8 is the planimetric map of the para tape of distortion example; And
Fig. 9 is a skeleton view of having used the electronic equipment of liquid crystal indicator of the present invention.
Symbol description
9: lighting device, 11: light guide plate, 15: light source portion, 16:LED, 20: as the liquid crystal panel of display panel, 40: driver IC, 41: electronic unit, 51:FPC, 61: panel keeps body, 62: framework, 63: window, 70,73,74,75,76,77,78: para tape, 71: non-bonded part, 72,73a, 74a, 75a, 76a, 77a, 78a: adhesive portion, 100,100a, 100b: as the liquid crystal indicator of display module, 710: as the personal computer of electronic equipment, 720: as the mobile phone of electronic equipment.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Following embodiment is that the present invention is applied to situation as the liquid crystal indicator of an example of electro-optical device.Organic Light Emitting Diode), the device of plasma panel etc. and, can use electro-optical device of the present invention and be not limited to liquid crystal indicator, and (the OLED:Organic Light Emitting Diode: that also can be to use organic EL.
[structure of liquid crystal indicator]
Fig. 1 is the planimetric map of the liquid crystal indicator 100 of present embodiment, and Fig. 2 is the sectional view that the sectional view A-A ' of liquid crystal indicator 100 shown in Figure 1 locates.
As Fig. 1 and shown in Figure 2, liquid crystal indicator 100 mainly possesses lighting device 9, the liquid crystal panel 20 as display panel, panel maintenance body 61, framework 62.And liquid crystal indicator 100 is examples of the display module among the present invention.Liquid crystal panel 20 relatively disposes with the top of light guide plate 11.
Between lighting device 9 and liquid crystal panel 20,, diffusion sheet 12, prismatic sheet 13 for example are set as optical sheet.Diffusion sheet 12 has to the effect of comprehensive diffusion from the light L of light guide plate 11 ejaculations.Prismatic sheet 13 has the effect of light L optically focused on liquid crystal panel 20, and it has the prismatic shape that makes the section general triangular and goes up the shape that extension forms in direction (direction on the limit vertical with this section) on one side.The light L that penetrates from light guide plate 11 throws light on by seeing through liquid crystal panel 20 after having passed through these optical sheets.
On liquid crystal panel 20, (Chip On Glass: technology glass top chip) directly is equipped with as the driver IC 40 of liquid crystal drive with IC (driver) to utilize COG.In the end of liquid crystal panel 20, be connected with FPC (Flexible Printed Circuit: flexible printed circuit) 51, a part of terminal of driver IC 40 is connected with the wiring 52 that is formed on the liquid crystal panel 20, thereby is connected with FPC51.At the other end of FPC51, be provided with connector 51a.Outside electronic equipment and connector 51a are electrically connected.In addition, in the regional 51b of FPC51, electronic units 41 such as resistance, capacitor are installed.And, be set in also to comprise on the electronic unit 41 and carried out the scolding tin after the soldering etc.Driver IC 40 according to provide via FPC51, from the control signal of the electronic equipment of outside, drive the driving circuit of liquid crystal panel 20.Thus, the state of orientation of liquid crystal 4 is carried out control.
Embedded lighting device 9, panel behind the liquid crystal panel 20 has been installed has been kept body 61 to be incorporated in the framework 62 of the case shape that forms with sheet metal etc.On framework 62, have and be arranged on the locational window 63 that regional 51b is exposed in the mode that does not contact with electronic unit 41, window 63 parts of framework 62 become the cavity.By window 63 is set, can realize slimming.That is, when having made liquid crystal indicator 100,,, can realize the slimming of liquid crystal indicator 100 so pass through the setting of window 63 because electronic unit 41 does not overlap with framework 62.Window 63 is not limited to 1 on framework 62, and also can exist a plurality of according to configuration of electronic unit 41 etc.And, in Fig. 2,, also can be the thickness 62a big such structure of the height 41a of electronic unit 41 than framework 62 though the thickness 62a of framework 62 is described greatlyyer than the height 41a of electronic unit 41.
And then, by configuration window 63 on framework 62, can make framework 62 lightweights.Its result can make liquid crystal indicator 100 lightweights that are mounted with this framework 62.When hope makes framework 62 lightweights, can in the scope of the rigidity that keeps framework 62, enlarge the area of window 63.
Para tape 70 covers and is arranged on the locational window 63 that the regional 51b that disposes electronic unit 41 is exposed, and sticks on the outside of framework 62.Utilize above-mentioned para tape 70, can prevent electric short circuit that causes because of other modules of the Outboard Sections that is positioned at liquid crystal indicator 100 and contacting of electronic unit 41 etc.
(structure of para tape)
Below, the structure of detailed description para tape 70.As mentioned above, by para tape 70 being sticked on the framework 62, can prevent the short circuit between parts in the mode that covers window 63.But, under situation about existing not with the bonding adhesive linkage 70b of framework 62, because adhesive linkage 70b has cementability, thus in the manufacture process of liquid crystal indicator 100 or after making, exist not with the bonding adhesive linkage 70b of framework 62 on adhere to dust situation.And, under above-mentioned dust and situation that electronic unit 41 contacts, electric short circuit might take place.
Thereby, in the liquid crystal indicator 100 of present embodiment, shown in the planimetric map of the para tape of Fig. 3, para tape 70 is divided into non-bonded part 71 and adhesive portion 72.Fig. 4 is the section B-B of para tape 70 ' sectional view located.Non-bonded part 71 only is made of insulation course 70a, and adhesive portion 72 is made of insulation course 70a and adhesive linkage 70b.And, though on the adhesive portion 72 of Fig. 4, only at the one-sided adhesive linkage 70b that is bonded with of insulation course 70a, also can be according to the design of applied product, at the two side bonds adhesive linkage 70b of insulation course 70a.
And, on para tape 70, covering the part configuration non-bonded part 71 of window 63, the area configurations adhesive portion 72 beyond the part that covers window 63 makes the outside of adhesive linkage 70b and framework 62 bonding.Thus, it is all and framework 62 is bonding for the adhesive linkage 70b of adhesive portion 72, thereby can eliminate the zone that adhesive linkage 70b exposes, and promptly might adhere to the zone of dust.Thus, can prevent that dust is attached to para tape 70, thereby can prevent contacting of the electronic unit 41 that causes because of adhering to of above-mentioned dust and above-mentioned dust.
And, in the structure of the para tape 70 of Fig. 3, though all disposed adhesive portion 72 on 4 limits of the housing of para tape 70, also can be for example in above-mentioned 4 limits, configuration adhesive portion 72 on 2 relative limits only.In addition, when covering under the situation of these a plurality of windows 63,, also can dispose adhesive portion 72 even beyond the housing of para tape 70 at a plurality of windows 63 of design on the framework 62 and with 1 para tape 70.For example, covering under the situation of 2 windows 63 with 1 para tape 70, can be in the mode of bonding adhesive linkage 70b on the framework 62 of the boundary member that is positioned at above-mentioned 2 windows 63, configuration adhesive portion 72.Under above-mentioned situation, also the zone of on adhesive linkage 70b, adhering to dust can be eliminated, thereby dust can be prevented the adhering to of para tape 70, can prevent contacting of electronic unit 41 and above-mentioned dust.
Preferably, the insulation course 70a of para tape 70 forms with having flexible insulating material, further preferably is to have retractility.When the height 41a of electronic unit 41 is thicker than the thickness 62a of framework 62, exist electronic unit 41 from the outstanding situation of framework 62.In this case, be out of shape accordingly by the para tape 70 and the shape of electronic unit 41, can not make also that para tape 70 is damaged just can overlay electronic parts 41.On the material of insulation course 70a, can use with the sheet of resins such as polyester, polybutylene terephthalate, polycarbonate, polyetherimide, vestolit, polypropylene as primary raw material.In addition, can be 1 layer also can be the stack membrane structure of multilayer to insulation course.By adopting this rhythmo structure, can form the high insulation course of function.In addition, because, can increase the different film of function arbitrarily, so pass through the combination of layer by being arranged to multilayer, it is also conceivable that adjustment, the raising of obdurability, light-proofness, the selection of permeability, the thermal diffusivity of retractility, and form the good heat exchange sheet of heat conductivity etc.In the present embodiment, for example adopt polyacrylic.
And present embodiment is not limited to above-mentioned embodiment, and various changes in addition, improvement etc.Variation below is described.
(embodiment 1)
Below, modified embodiment of the present embodiment 1 is described.The liquid crystal indicator 100 of above-mentioned embodiment is by sticking on para tape 70 on the framework 62, cover the regional 51b that disposes electronic unit 41.But,, be not limited to this as using liquid crystal indicator of the present invention.Fig. 5 is the planimetric map of the liquid crystal indicator 100a of variation 1, and Fig. 6 represents the section C-C of liquid crystal indicator 100a shown in Figure 5 ' sectional view located.Below, the liquid crystal indicator 100a of variation 1 is described with reference to Fig. 5 and Fig. 6.
In the liquid crystal indicator 100a of variation 1, different with the liquid crystal indicator 100 of above-mentioned embodiment, para tape 70 is secured on the FPC51, via above-mentioned para tape 70 framework 62 is installed on the FPC51.That is, para tape 70 is sandwiched between FPC51 and the framework 62.On framework 62, for the thickness of the integral body that reduces liquid crystal indicator 100a, same with the foregoing description, the position of exposing at the electronic unit 41 that makes on the FPC51 is provided with window 63.As shown in Figure 6, liquid crystal indicator 100a has given prominence to para tape 70 and has been insulated the electronic unit 41 that covers with 70 from window 63.
In the liquid crystal indicator 100a of variation 1, also be for para tape 70 overlay electronic position component configuration non-bonded part 71.And, the position in the zone of the FPC51 beyond the regional 51b of electronic unit 41 is disposed in covering, configuration adhesive portion 72.By above-mentioned configuration, under the situation that is pasted with para tape 70 on the FPC51, also can eliminate the zone of on adhesive linkage 70b, adhering to dust, thereby can prevent the generation of the electric short circuit that causes because of electronic unit 41 and contacting of dust.
And, in the liquid crystal indicator 100a of variation 1, also be to be not limited to as shown in Figure 5,4 limits of the housing of para tape 70 are formed adhesive portion 72, but also can for example in above-mentioned 4 limits, only on 2 relative limits, form adhesive portion 72.In addition, as shown in Figure 5, the regional 51b that disposes electronic unit 41 has 2, under the situation that covers para tape 70 thereon, also the part between above-mentioned 2 regional 51b can be formed adhesive portion 72, make the adhesive linkage 70b of zone beyond the regional 51b and para tape 70 bonding.
(variation 2)
The liquid crystal indicator 100 of above-mentioned embodiment is by sticking on para tape 70 on the framework 62, cover the regional 51b that disposes electronic unit 41.At this moment, para tape 70 sticks on the outside of framework 62.Para tape 70 also can stick on the inner face of framework 62.Fig. 7 is the sectional view of the liquid crystal indicator of variation 2.As shown in Figure 7, liquid crystal indicator 100b possesses framework 62, and framework 62 is provided with fenestrate 63 in the position relative with electronic unit 41.And para tape 70 covers and is arranged on the locational window 63 that the regional 51b that disposes electronic unit 41 is exposed, and sticks on the inner face 62b of framework 62.And para tape 70 sticks on the circumferential position of window 63.
Add together thickness when thick at the thickness of electronic unit 41 than the thickness with the thickness of insulation course 70a and adhesive linkage 70b, electronic unit 41 and framework 62 be configuration overlappingly on the thickness direction of framework 62.At this moment, also can be that para tape 70 deflections ground covers window 63.And then, adding together thickness when thick at the thickness of electronic unit 41 than thickness with the thickness of the thickness of insulation course 70a, adhesive linkage 70b and framework 62, electronic unit 41 is provided with highlightedly from the outside 62c of framework 62.In the case, also can be that para tape 70 deflections ground covers window 63.
Thereby para tape 70 can prevent electric short circuit that causes because of other modules in the outside that is positioned at liquid crystal indicator 100b and contacting of electronic unit 41 etc.And then, because with the circumferential arrangement of para tape 70 in the inboard of framework 62, so when assembling liquid crystal indicator 100b and other modules, the assembly operation person is difficult to touch the periphery of para tape 70.Thereby, the structure of liquid crystal indicator 100b can be formed the structure that para tape 70 is difficult to be stripped from.
(variation 3)
In the above-described embodiment, in electronic unit 41, comprise resistance, capacitor, through the scolding tin after the soldering etc.If in detail, then in electronic unit 41, comprise vernier capacitor, variable resistor, inductor, the terminal class, semiconductor element, the connector that in electrical specification inspection etc., use and the scolding tin that connects these elements and wiring etc.
(variation 4)
In the above-described embodiment, though used adhesive linkage 70B to be configured in para tape 70 on the insulation course 70a, also adhesive linkage 70b can be configured on the framework 62.Also can work as in the circumferential arrangement of the window 63 of framework 62 after the adhesive linkage 70b, dispose para tape 70 in the mode that covers window 63.In the case, also can prevent contacting of electronic unit 41 and dust.This content also can be applied to variation 2, can access same effect.
And then this content also can be applied to variation 1.After the adhesive linkage 70b that can work as the position configuration that on FPC51, do not dispose electronic unit 41, dispose para tape 70 in the mode of overlay electronic parts 40.In the case, can prevent contacting of electronic unit 41 and dust.
(variation 5)
In the above-described embodiment, though the whole periphery of para tape 70 is set to adhesive portion 72 as shown in Figure 3, can adhesive portion 72 be configured on the whole periphery of para tape 70 yet.Fig. 8 is the planimetric map of para tape, and it is the figure of the position of the adhesive portion in the explanation para tape.For example, shown in Fig. 8 (a), para tape 73 also can be along the limit configuration adhesive portion 73a at the two ends of length direction.When pasting para tape 73,,, can operability paste well so compare with the situation that is fixed on whole periphery because adhesive portion 73a is fixed on 2 places.In addition,, compare, also can operability peel off well with the situation that is fixed on whole periphery even when peeling off para tape 73.
In addition, for example shown in Fig. 8 (b), para tape 74 also can be at the end configuration adhesive portion 74a of length direction.When pasting para tape 74, because,, can operability paste well so compare with the situation that is fixed on 2 places with adhesive portion 74a stuck-at-place.In addition,, compare, also can operability peel off well with the situation that is fixed on 2 places even when peeling off para tape 74.At this moment, because binding part 74 is unfixing with the end 74b of opposition side, so preferably, fix from framework 62 grades as variation 1.
In addition, for example shown in Fig. 8 (c), para tape 75 also can be on the part on the limit of an end of length direction configuration adhesive portion 75a.Compare when on 1 limit is whole, disposing, can operability peel off well with adhesive portion 75a.At this moment, also, so preferably, fix from framework 62 grades as variation 1 because the end 74b of adhesive portion 74a and opposition side is unfixing.
In addition, also can be for example shown in Fig. 8 (d), para tape 76 disposes adhesive portion 76a in the mode of arranging intermittently on whole periphery.Compare when disposing continuously, can operability peel off well with adhesive portion 76a.And then for example shown in Fig. 8 (e), para tape 77 also can dispose adhesive portion 77a on four angles.The time compare with adhesive portion 76a being configured in whole periphery, can operability paste well and peel off.
In addition, for example shown in Fig. 8 (f), para tape 78 also can be at periphery position configuration adhesive portion 78a in addition.At this moment, because the periphery of para tape 78 is unfixing, so preferably, fix from pushing as framework 62 grades of variation 1.And the mode so that adhesive portion 78a is positioned at the position relative with the position that does not dispose electronic unit 41 on FPC51 disposes para tape 78.At this moment, compare when being configured in adhesive portion 76a on the whole periphery, also can operability paste well and peel off.
(variation 6)
In the above-described embodiment, though used the bonding agent that comprises acrylic-based adhesives etc., also can use other bonding agent for adhesive linkage 70b.As long as bonding agent can be adhesively fixed on para tape 70 on FPC51 or the framework 62, preferably do not produce the bonding agent of the gas of corrosion damage electronic unit 41, wiring, substrate etc.For alite paste, can from various bonding agents such as natural rubber class bonding agent, starch based bonding agent, glue class bonding agent, polyurethane type resin bonding agent, ethers cellulose, ethane-acetic acid ethyenyl ester resene bonding agent, epoxy resin bonding agent, silicone bonding agent, select to use.Because the material adhesive property difference of alite paste, so preferably select by experiment because of being adhesively fixed.In addition, when being adhesively fixed FPC51 and para tape 70, can not using bonding agent and carry out thermo-compressed.Can subdue the operation of on para tape 70, smearing bonding agent.This content can also be applied to above-mentioned variation.
(embodiment 7)
In the above-described embodiment, when on framework 62, pasting para tape 70, para tape 70 is loosely pasted.Even when the height 41a of electronic unit 41 is higher than the thickness 62a of framework 62,, and can be difficult to damage electronic unit 41 also because para tape 70 is difficult to push electronic unit 41.
[electronic unit]
Below, can use the object lesson of the electronic equipment of the liquid crystal indicator 100 of above-mentioned embodiment and 100a with reference to Fig. 9 explanation.
At first, the example that is applied to the display part of portable personal computer (so-called notebook computer) for the liquid crystal indicator 100 with above-mentioned embodiment describes.Fig. 9 (a) is the skeleton view of the structure of this personal computer of expression.As shown in the drawing, personal computer 710 possesses the main part 712 that comprises keyboard 711, the display part 713 of having used liquid crystal indicator 100 of the present invention.
Then, the example of the display part that is applied to mobile phone for liquid crystal indicator 100 or 100a with above-mentioned embodiment describes.Fig. 9 (b) is the skeleton view of the structure of this mobile phone of expression.As shown in the drawing, mobile phone 720 together also possesses display part 724 with receiving mouth 722, mouth piece 723 except a plurality of action buttons 721.
And, as the electronic equipment that can use liquid crystal indicator 100 of the present invention or 100a, except personal computer shown in Figure 9, mobile phone, can also enumerate LCD TV, the video recorder of the type monitor direct viewing type of finding a view, automobile navigation apparatus, pager, electronic notebook, electronic calculator, word processor, workstation, videophone, POS terminal, digital camera.
If employing the present invention, then para tape has adhesive portion and non-bonded part, and non-bonded part is configured on the position that covers the zone dispose electronic unit, and the zone of adhesive portion beyond in the zone that disposes above-mentioned electronic unit sticks on the display module.Thus, can prevent by dust the adhering to of the bonding portion of para tape, and the electric short circuit that causes because of dust and contacting of electronic unit.Thereby, can be widely used in liquid-crystal apparatus, electroluminescence device, electro-optical devices such as plasma panel, in the electronic equipment etc., these equipment are for example with mobile phone, headed by the personal computer etc., LCD TV is arranged, type/monitor direct viewing type the video recorder of finding a view, automobile navigation apparatus, pager, electrophoretic apparatus, electronic notebook, electronic calculator, word processor, workstation, videophone, the POS terminal, electronic equipment with touch panel, device (the FED:Field EmissionDisplay (field-emitter display) that possesses electronic emission element, SCEED:Surface-Conduction Electron-EmitterDisplay (surface-conduction-electron emission display)) etc.
Claims (10)
1. electro-optical device is characterized in that possessing:
Dispose the display module of electronic unit; And
Stick on para tape on the above-mentioned display module in the mode that covers above-mentioned electronic unit;
Wherein, above-mentioned display module has framework;
Said frame has and is arranged on the locational window that above-mentioned electronic unit is exposed;
Above-mentioned para tape has adhesive portion and non-bonded part, and above-mentioned non-bonded part is configured in the position that covers the zone dispose above-mentioned electronic unit, and the zone of above-mentioned adhesive portion beyond in the zone that disposes above-mentioned electronic unit sticks on the above-mentioned display module.
2. electro-optical device according to claim 1 is characterized in that:
Above-mentioned para tape is pasted for said frame.
3. electro-optical device according to claim 2 is characterized in that:
Above-mentioned para tape sticks on the said frame in the circumferential position of above-mentioned window.
4. electro-optical device according to claim 3 is characterized in that: said frame and above-mentioned electronic unit dispose in mode overlapping on the thickness direction of said frame.
5. electro-optical device according to claim 3 is characterized in that: the thickness of the aspect ratio said frame of above-mentioned electronic unit is little.
6. according to any described electro-optical device of claim 1～5, it is characterized in that: above-mentioned display module has flexible substrate, and above-mentioned electronic unit is configured on the above-mentioned flexible substrate.
7. electro-optical device according to claim 6 is characterized in that: above-mentioned display module has display panel, and above-mentioned flexible substrate is connected with above-mentioned display panel.
8. electro-optical device according to claim 1 is characterized in that: above-mentioned display module has flexible substrate, and above-mentioned para tape sticks on the above-mentioned flexible substrate.
9. electro-optical device according to claim 8 is characterized in that:
To dispose said frame with the overlapping mode of above-mentioned flexible substrate.
10. an electronic equipment is characterized in that: any described electro-optical device that possesses claim 1～9.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP229810/2007 | 2007-09-05 | ||
| JP2007229810 | 2007-09-05 | ||
| JP2008156291A JP4582207B2 (en) | 2007-09-05 | 2008-06-16 | Electro-optical device and electronic apparatus |
| JP156291/2008 | 2008-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101382676A CN101382676A (en) | 2009-03-11 |
| CN101382676B true CN101382676B (en) | 2010-11-10 |
Family
ID=40462598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102137681A Active CN101382676B (en) | 2007-09-05 | 2008-09-04 | Electro-optical device and electronic apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4582207B2 (en) |
| CN (1) | CN101382676B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103503053A (en) * | 2011-05-13 | 2014-01-08 | 夏普株式会社 | Display module and display device equipped with display module |
| WO2013069584A1 (en) * | 2011-11-11 | 2013-05-16 | シャープ株式会社 | Display device |
| KR101904465B1 (en) * | 2012-03-29 | 2018-12-03 | 삼성디스플레이 주식회사 | Flat panel apparatus |
| JP2017122858A (en) * | 2016-01-08 | 2017-07-13 | 三菱電機株式会社 | Protective sheet, insulating film, and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4572323B2 (en) * | 2004-07-22 | 2010-11-04 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
| JP2007025626A (en) * | 2005-06-17 | 2007-02-01 | Sanyo Epson Imaging Devices Corp | Electro-optical device and electronic equipment |
-
2008
- 2008-06-16 JP JP2008156291A patent/JP4582207B2/en active Active
- 2008-09-04 CN CN2008102137681A patent/CN101382676B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101382676A (en) | 2009-03-11 |
| JP2009080461A (en) | 2009-04-16 |
| JP4582207B2 (en) | 2010-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10359658B2 (en) | Electro-optical device and electronic equipment | |
| CN101526694B (en) | Liquid crystal display device | |
| KR100467183B1 (en) | Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same | |
| CN100399127C (en) | Electro-optical device and electronic apparatus | |
| US20150085210A1 (en) | In-Cell Touch Liquid Crystal Display Module and Manufacturing Method For The Same | |
| KR101788489B1 (en) | Touch display module and electronic display product | |
| CN114755855A (en) | Display device | |
| US7993730B2 (en) | Electro-optical device and electronic apparatus | |
| CN106647069B (en) | Double-sided display device | |
| CN113555412A (en) | Display module and display device | |
| KR20190035986A (en) | Display device and method for manufacturing the same | |
| CN102736316A (en) | Liquid crystal display device | |
| CN101382676B (en) | Electro-optical device and electronic apparatus | |
| KR101797001B1 (en) | Acf, fabricating method of display panel using the same, fpd module inculding the display panel | |
| JP2006078622A (en) | Electro-optical apparatus and electronic device | |
| WO2004044645A1 (en) | Liquid crystal display | |
| CN102096214A (en) | Liquid crystal display device | |
| US20090079926A1 (en) | Circuit structure of liquid crystal display module and assembly method thereof | |
| CN114927071A (en) | Display module and display device | |
| JP2862900B2 (en) | LCD display | |
| JP2001264751A (en) | Liquid crystal display device | |
| KR100544817B1 (en) | LCD Module | |
| KR20060084015A (en) | A flat display device for attaching a cover for protecting a printed circuit board and manufacturing method thereof | |
| CN107123386B (en) | Panel portion and display device including the same | |
| JP2009075498A (en) | Electro-optical device and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: NANKAI UNIVERSITY Free format text: FORMER OWNER: SANYO EPSON IMAGING DEVICES CO. Effective date: 20110520 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NAGANO PREFECTURE, JAPAN TO: TOKYO, JAPAN |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110520 Address after: Tokyo, Japan Patentee after: Sony Corp. Address before: Nagano Patentee before: Sanyo Epson Imaging Devices Co. |
|
| ASS | Succession or assignment of patent right |
Owner name: NIPPON DISPLAY CO., LTD. Free format text: FORMER OWNER: SONY CORPORATION Effective date: 20121115 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20121115 Address after: Aichi Patentee after: Japan display West Co.,Ltd. Address before: Tokyo, Japan Patentee before: Sony Corp. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20211021 Address after: Tokyo, Japan Patentee after: JAPAN DISPLAY Inc. Address before: Aichi Patentee before: Japan display West Co.,Ltd. |
|
| TR01 | Transfer of patent right |