CN101381516B - Room temperature vulcanized organosilicon pouring sealant for LED - Google Patents
Room temperature vulcanized organosilicon pouring sealant for LED Download PDFInfo
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- CN101381516B CN101381516B CN2008102015805A CN200810201580A CN101381516B CN 101381516 B CN101381516 B CN 101381516B CN 2008102015805 A CN2008102015805 A CN 2008102015805A CN 200810201580 A CN200810201580 A CN 200810201580A CN 101381516 B CN101381516 B CN 101381516B
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Abstract
The invention relates to a room temperature vulcanized (RTV) organosilicon potting adhesive for an LED. The potting adhesive is a bi-component potting adhesive, wherein a component A is formed by mixing vinyl terminated polymethylphenyl sioxane, vinyl dimethyl methylsiloxy terminated PDMS, polymethyl hydrogen phenyl siloxane and methyl-butynol as inhibitor in the weight ratio of 100:10-30:5-20:0.05-1; and a component B is formed by mixing vinyl terminated polymethylphenyl sioxane, vinyl dimethyl methylsiloxy terminated PDMS and methyl vinyl siloxane coordinated platinum catalyst in the weight ratio of 100:10-30:0.5-5. The RTV organosilicon potting adhesive for the LED has the advantages of good heat resistance, wet fastness, light transmittance up to 99 percent, refractive index up to 1.47 to 1.55, good packaging effect, capability of prolonging the life span of the LED, as well as simple manufacture process.
Description
Invention field
The present invention relates to a kind of used for electronic packaging Embedding Material, the room temperature vulcanized organosilicon pouring sealant that particularly a kind of LED uses.
Background technology
The LED joint sealant adopts epoxide resin material cheaply more, but the Resins, epoxy high-temperature heat-resistance is poor, and wet fastness is poor, has a lot of problems in the package application of LED.Thermotolerance missionary society damages element easily, and reduction of service life, moisture resistance properties is poor, and aqueous vapor enters device inside easily, causes problems such as short circuit easily.Flourish along with the semiconductor lighting industry along with continuing to bring out of the illumination level LED device that requires in high-power, high brightness, long lifetime, needs a kind of high performance packaged material satisfy the requirement of LED encapsulation.
Summary of the invention
The object of the present invention is to provide a kind of LED room temperature vulcanized organosilicon pouring sealant.
For achieving the above object, the present invention adopts following technical scheme:
A kind of LED room temperature vulcanized organosilicon pouring sealant, be the two-pack joint sealant, it is characterized in that component A is mixed by 100: 10～30: 5～20: 0.05～1 weight ratio by ethenyl blocking PSI, vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane, poly-methyl hydrogen phenyl siloxane and inhibitor methylbutynol; B component is mixed by 100: 10～30: 0.5～5 weight ratio by ethenyl blocking PSI, vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane, catalyzer ethylene methacrylic radical siloxane coordination platinum catalyst; Platinum content is 1000～3000ppm in the described catalyzer ethylene methacrylic radical siloxane coordination platinum catalyst.
The structure of above-mentioned ethenyl blocking PSI is: H
2C=CH (CH
3)
2Si[OSi (CH
3)
2]
a[OSi (Ph)
2]
b[OSi (CH
3)
2] CH=CH
2, wherein the span of integer a, b is respectively: a=10～200, b=5～100.
The structure of above-mentioned vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane is: H
2C=CH (CH
3)
2SiO[(CH
3)
2SiO]
nSi (CH
3)
2CH=CH
2, wherein the span of Integer n is: n=10～300.
The structure of above-mentioned poly-methyl hydrogen phenyl siloxane is:
(CH
3)
3Si[OSi (CH
3)
2]
e[OSi (Ph)
2]
f[OSi (CH
3) H]
gOSi (CH
3)
3, wherein the span of integer e, f, g is respectively: e=0～50, f=5～30, g=3～30.
In use, component A and B component were mixed by weight 1: 1, packaged after, at room temperature left standstill 6～12 hours, promptly curable.
LED of the present invention has good thermotolerance, wet fastness with room temperature vulcanized organosilicon pouring sealant, and transmittance can reach 99%, and specific refractory power can reach 1.47～1.55.Packaging effect is good, can prolong the work-ing life of LED, and manufacture craft is simple.
Embodiment
Following examples only illustrate the present invention, but the present invention and being not limited by the following examples.
Embodiment one: getting viscosity is the ethenyl blocking PSI 100g of 1000mpa.s (25 ℃), viscosity is 800mpa.s (25 ℃) vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane 10g, the poly-methyl hydrogen phenyl siloxane 10g of viscosity 100mpa.s (25 ℃), inhibitor methylbutynol 0.2g at room temperature mixes, and makes component A; Getting viscosity is the ethenyl blocking PSI 100g of 1000mpa.s (25 ℃), viscosity is 800mpa.s (25 ℃) vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane 10g, the catalyzer platinum content is that the ethylene methacrylic radical siloxane coordination platinum catalyst 2.0g of 2000ppm at room temperature mixes, and makes B component.
Component A and B component were mixed by weight 1: 1, and the exhaust bubble injects in the mould of a 2mm * 10mm * 10mm, at room temperature solidifies 8 hours, makes it to be shaped to the silica gel sheet.
Embodiment two: getting viscosity is the ethenyl blocking PSI 100g of 1400mpa.s (25 ℃), viscosity is 500mpa.s (25 ℃) vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane 15g, the poly-methyl hydrogen phenyl siloxane 15g of viscosity 200mpa.s (25 ℃), inhibitor methylbutynol 0.1g at room temperature mixes, and makes component A; Getting viscosity is the ethenyl blocking PSI 100g of 1400mpa.s (25 ℃), viscosity is 500mpa.s (25 ℃) vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane 15g, the catalyzer platinum content is that the ethylene methacrylic radical siloxane coordination platinum catalyst 3.0g of 1500ppm at room temperature mixes, and makes B component.
Component A and B component were mixed by weight 1: 1, and the exhaust bubble injects in the mould of a 2mm * 10mm * 10mm, at room temperature solidifies 6 hours, makes it to be shaped to the silica gel sheet.
Embodiment three: getting viscosity is the ethenyl blocking PSI 100g of 800mpa.s (25 ℃), viscosity is 1200mpa.s (25 ℃) vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane 20g, the poly-methyl hydrogen phenyl siloxane 8g of viscosity 300mpa.s (25 ℃), inhibitor methylbutynol 0.4g at room temperature mixes, and makes component A; Getting viscosity is the ethenyl blocking PSI 300g of 800mpa.s (25 ℃), viscosity is 1200mpa.s (25 ℃) vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane 20g, the catalyzer platinum content is that the ethylene methacrylic radical siloxane coordination platinum catalyst 1.5g of 2500ppm at room temperature mixes, and makes B component.
Component A and B component were mixed by weight 1: 1, and the exhaust bubble injects in the mould of a 2mm * 10mm * 10mm, at room temperature solidifies 10 hours, makes it to be shaped to the silica gel sheet.
Embodiment four: the LED epoxy resin embedding adhesive H-403 exhaust bubble back of purchase is injected in the mould of 2mm * 10mm * 10mm, and 150 ℃ were toasted 1 hour down, make it to be shaped to matrix.
The matrix of above-mentioned three examples is carried out the performance analysis contrast, test result such as following table:
| Product | Transmittance | Specific refractory power | Elongation | Anti-ultraviolet test | Humidity resistance |
| Embodiment 1 | 99％ | 1.49 | 120％ | Well | Well |
| Embodiment 2 | 99％ | 1.53 | 150％ | Well | Well |
| Embodiment 3 | 99％ | 1.50 | 160％ | Well | Well |
| Embodiment 4 | 99％ | 1.43 | 2％ | Relatively poor | Generally |
By above table as can be known, the LED product that adopts the present invention to make, not only transmittance is good, and have good elongation, anti-ultraviolet, wet-hot aging performance and a high advantage of specific refractory power, obviously be better than Resins, epoxy, can effectively increase the service life, promote the sound development of LED product.
Claims (3)
1. LED room temperature vulcanized organosilicon pouring sealant, be the two-pack joint sealant, it is characterized in that component A is mixed by 100: 10～30: 5～20: 0.05～1 weight ratio by ethenyl blocking PSI, vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane, poly-methyl hydrogen phenyl siloxane and inhibitor methylbutynol; B component is mixed by 100: 10～30: 0.5～5 weight ratio by ethenyl blocking PSI, vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane, catalyzer ethylene methacrylic radical siloxane coordination platinum catalyst; Platinum content is 1000～3000ppm in the described catalyzer ethylene methacrylic radical siloxane coordination platinum catalyst; The structure of described poly-methyl hydrogen phenyl siloxane is: (CH
3)
3Si[OSi (CH
3)
2]
e[OSi (Ph)
2]
f[OSi (CH
3) H]
gOSi (CH
3)
3, wherein the span of integer e, f, g is respectively: e=0～50, f=5～30, g=3～30.
2. LED room temperature vulcanized organosilicon pouring sealant according to claim 1 is characterized in that the structure of described ethenyl blocking PSI is: H
2C=CH (CH
3)
2Si[OSi (CH
3)
2]
a[OSi (Ph)
2]
b[OSi (CH
3)
2] CH=CH
2, wherein the span of integer a, b is respectively: a=10～200, b=5～100.
3. LED room temperature vulcanized organosilicon pouring sealant according to claim 1 is characterized in that: the structure of described vinyl-dimethyl base silyloxy end-blocking polydimethylsiloxane is: H
2C=CH (CH
3)
2SiO[(CH
3)
2SiO]
nSi (CH
3)
2CH=CH
2, wherein the span of Integer n is: n=10～300.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102015805A CN101381516B (en) | 2008-10-23 | 2008-10-23 | Room temperature vulcanized organosilicon pouring sealant for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102015805A CN101381516B (en) | 2008-10-23 | 2008-10-23 | Room temperature vulcanized organosilicon pouring sealant for LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101381516A CN101381516A (en) | 2009-03-11 |
| CN101381516B true CN101381516B (en) | 2011-11-23 |
Family
ID=40461581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102015805A Active CN101381516B (en) | 2008-10-23 | 2008-10-23 | Room temperature vulcanized organosilicon pouring sealant for LED |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101775264B (en) * | 2009-12-24 | 2012-05-02 | 安徽泽润光电有限公司 | Chip fixing glue for LED (Light Emitting Diode) |
| CN101935455B (en) * | 2010-07-28 | 2012-10-24 | 杭州师范大学 | Organosilicon material for packaging LED and preparation method thereof |
| CN102382618B (en) * | 2011-08-25 | 2013-01-23 | 江苏创景科技有限公司 | Two-component high strength transparent room temperature solidified organosilicon pouring glue |
| CN102676113B (en) * | 2012-04-28 | 2013-11-06 | 烟台德邦先进硅材料有限公司 | Light-emitting diode (LED) packaging silica gel and preparation method thereof |
| JP2014031394A (en) * | 2012-08-01 | 2014-02-20 | Shin Etsu Chem Co Ltd | Addition curable silicone composition, and semiconductor apparatus comprising semiconductor element coated with cured material of said composition |
| CN103146202A (en) * | 2013-03-18 | 2013-06-12 | 盐城菁华新材料科技有限公司 | Preparation method of liquid silicone rubber for packaging light-emitting diode |
| CN104672917B (en) * | 2014-03-13 | 2017-12-15 | 冯德平 | A kind of organosilicon artificial water |
| CN107151545A (en) * | 2017-05-19 | 2017-09-12 | 合肥市惠科精密模具有限公司 | A kind of Thin Film Transistor-LCD good packaging silicon rubber of high heat conduction cementability |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101016446A (en) * | 2007-02-15 | 2007-08-15 | 东莞市贝特利新材料有限公司 | Organosilicon electronic encapsulation material |
| CN101045819A (en) * | 2007-04-30 | 2007-10-03 | 东莞市贝特利新材料有限公司 | Organic silicon resin composite |
| CN101054507A (en) * | 2007-05-30 | 2007-10-17 | 南京工业大学 | High heat conduction organosilicon filling and sealing gum |
-
2008
- 2008-10-23 CN CN2008102015805A patent/CN101381516B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101016446A (en) * | 2007-02-15 | 2007-08-15 | 东莞市贝特利新材料有限公司 | Organosilicon electronic encapsulation material |
| CN101045819A (en) * | 2007-04-30 | 2007-10-03 | 东莞市贝特利新材料有限公司 | Organic silicon resin composite |
| CN101054507A (en) * | 2007-05-30 | 2007-10-17 | 南京工业大学 | High heat conduction organosilicon filling and sealing gum |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101381516A (en) | 2009-03-11 |
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