CN101376793A - Liquid wax for polished bonding sheet, preparation thereof and process of polished bonding sheet - Google Patents
Liquid wax for polished bonding sheet, preparation thereof and process of polished bonding sheet Download PDFInfo
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- CN101376793A CN101376793A CNA200710055082XA CN200710055082A CN101376793A CN 101376793 A CN101376793 A CN 101376793A CN A200710055082X A CNA200710055082X A CN A200710055082XA CN 200710055082 A CN200710055082 A CN 200710055082A CN 101376793 A CN101376793 A CN 101376793A
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- wax
- carrier board
- bonding sheet
- liquid
- polished
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Abstract
The invention discloses a liquid wax used for polishing bonding sheets as well as a preparation method thereof and the technique of the polishing bonding sheets. The liquid wax comprises the components (counted according to the weight portions of 10,000g) as follows: 662.3 to 665.7 portions of polyethylene glycols, 198.5 to 201.5 portions of paint flake, 548.7 to 551.2 portions of isopropanol, 307.0 to 309.7 portions of ammonia with a concentration of 25 percent, 2347.8 to 2353.4 portions of de-ionized water of 18 M as well as 5913.1 to 5940.8 portions of 8030 resin; each component is poured into a wax barrel according to the sequence and weight portions in turn and the mixture is slowly mixed through magnetic stirring, thus obtaining the liquid wax; the liquid wax can ensure the uniformity of the wax liquid, the consistency of viscidity as well as high polishing speed and is suitable for the production demand in batch; besides, the surface quality of a polishing sheet is good.
Description
Technical field
The present invention relates to a kind of liquid wax, the technology of especially a kind of liquid wax for polished bonding sheet and preparation method thereof and polished bonding sheet.
Background technology
At present, in polishing is produced, usually use the solid wax polished bonding sheet, it is prepared according to the weight ratio of 2:1 with paraffin, rosin, can use after the heat fused moulding, its shortcoming is, temperature can not surpass 45 ℃ when they polished at thick throwing machine, and polished section is cleaned difficulty, and environmental pollution is serious, production efficiency is low, incompatibility scale operation demand; And there is defective in the wax layer: adhere to a bit, dirt, particle, glittering point, bubble is arranged, and flake, the golf sphere, the wax layer covers incomplete, and is uneven or vortex arranged; Wax liquid collapses and spatters, wax slabbing line, striped or split.
Summary of the invention
In order to overcome the deficiency that existing solid wax exists in polished bonding sheet, the technology that the purpose of this invention is to provide a kind of liquid wax for polished bonding sheet and preparation method thereof and polished bonding sheet, liquid wax for polished bonding sheet is water miscible high-temp liquid wax, it can guarantee the even of wax liquid, the viscosity consistence, temperature can reach a high temperature 60 ℃ when thick throwing machine polishes, so the polishing speed height, suitable production demand, and the polished section surface quality is good.
For achieving the above object, the present invention adopts following technical scheme:
Described liquid wax for polished bonding sheet, it contains following component (by 1 myriagram weight ratio):
Polyethylene glycol 662.3～665.7
Coating agent which has to be dissolved in alcohol before use 198.5～201.5
Virahol 548.7～551.2
25% ammoniacal liquor 307.0～309.7
18,000,000 deionized waters 2347.8～2353.4
8030 resins 5913.1～5940.8
Described liquid wax for polished bonding sheet, in its component, weight is ± 0.5% at the component permissible error of 0～1000 gram, the component permissible error of weight more than 1000 grams is ± 0.2%.
The preparation method of described liquid wax for polished bonding sheet, its preparation process is as follows:
(1), be that 10 liters the wax bucket of joining is placed on the weigh scale with a capacity, weigh scale places in the stink cupboard;
(2), polyethylene glycol, coating agent which has to be dissolved in alcohol before use, Virahol, 25% ammoniacal liquor, 18,000,000 deionized waters, 8030 resins, successively in order and weight ratio, pour into and join among the wax bucket, till arrival requires reading;
(3), make the slowly mixing of preparing burden, stirred at least 3 hours by magnetic agitation; After the stirring, left standstill 3 hours;
To cover the lid of close-fitting wax bucket when (4), depositing; One barrel is joined wax material is 10 ± 0.3% kilograms;
(5), before wax liquid uses, use the filter bag of 50 μ m, give filtration.
The technology of described liquid wax for polished bonding sheet polished bonding sheet, its processing step is as follows:
(1), the preparation method prepares liquid wax as described above, and mix;
(2), flushing polishing carrier plate, remove the remaining wax of former bonding die; Bonding die carrier board diameter is 287mm, and thickness is 10.16mm;
(3), on carrier board, wax, get rid of wax; Wax: one-period is 36.5 seconds, with wax flow velocity 150 ± 5ml/ branch, supplies amount on each carrier board: 16 ± 1ml, wax bed thickness: 9 ± 2 μ m; When waxing, setting bonding die carrier board rotating speed is 200 ± 5 rev/mins, and when getting rid of wax, setting bonding die carrier board rotating speed is 300 ± 5 rev/mins;
(4), the carrier board of first-class wax is placed on the steam heater heats, carrier board is heated to 97 ± 2 ℃ in 60 seconds;
(5), with required sticking corrosion of silicon, flushing dries, and uses immediately;
(6), silicon chip is put into load platform pattern hole under the vacuum chamber, load, compressing tablet; Load: Φ 125mm can once adorn 3, and Φ 100mm can once adorn 5, and on the carrier board, worst error is 2.0 μ m between the corrosion of silicon thickness; Compressing tablet vacuum chamber cylinder pressure is 80～90PSI, i.e. 5.6～6.3 kilograms/cm
2Compressing tablet time vacuum tightness in 60 seconds reaches 0.8～1.0 holder;
(7), will be fixed on the carrier board according to the silicon chip after above-mentioned (6) the step operation;
(8), will deliver to thick throwing machine place and prepare polishing according to the carrier board of the load platform after above-mentioned (7) the step operation.
Owing to adopted aforesaid technical scheme, the present invention has following superiority:
Liquid wax for polished bonding sheet of the present invention is a kind of high-temp liquid wax, is applied to the large-scale integrated circuit polished section, because it is water miscible, so the polished section cleaning is simple, non-environmental-pollution; Temperature can reach a high temperature 60 ℃ and adopt constant voltage technology when its suitable thick throwing machine polished, polishing removal amount speed height, the parallelism TTV on polished section surface, sinuousness BOW, planeness TIR, local planeness STIR quality level height; Liquid wax for polished bonding sheet can guarantee the even of wax liquid, the viscosity consistence, and the wax layer does not exist point, dirt, particle, glittering point, bubble, flake, golf sphere; Wax liquid collapses and spatters, wax slabbing line, and striped or split, uneven or vortex is arranged, cover infull shortcoming.
Liquid wax for polished bonding sheet of the present invention, working conditions requires high, in the polished bonding sheet process, need specific superior again loading device to finish, the wax amount that adds on the polishing carrier plate, wax layer thickness, carrier board heating, load, silicon chip location, the whole load process of bonding are that repeatability is consistent, are subjected to the strictness control of equipment.Join accurately and silicon chip load on the carrier board meeting the requirements of wax, will directly have influence on the radially tapering of polished section, technical indicators such as planeness.
Description of drawings
Fig. 1 is the process flow sheet of liquid wax for polished bonding sheet polished bonding sheet.
Embodiment
Embodiment one
This liquid wax for polished bonding sheet, it contains following component (by 1 myriagram weight ratio):
Polyethylene glycol 662.3
Coating agent which has to be dissolved in alcohol before use 198.5
Virahol 548.7
25% ammoniacal liquor 307.0
18,000,000 deionized waters 2347.8
8030 resins 5913.1
The preparation liquid wax for polished bonding sheet, its preparation process is as follows:
(1), be that 10 liters the wax bucket of joining is placed on the weigh scale with a capacity, weigh scale places in the stink cupboard;
(2), polyethylene glycol, coating agent which has to be dissolved in alcohol before use, Virahol, 25% ammoniacal liquor, 18,000,000 deionized waters, 8030 resins, successively in order and massfraction, pour into and join among the wax bucket, till arrival requires reading;
(3), make the slowly mixing of preparing burden, stirred at least 3 hours by magnetic agitation; After the stirring, left standstill 3 hours;
To cover the lid of close-fitting wax bucket when (4), depositing; Always join wax material for one barrel and be about 10 kilograms;
(5), before wax liquid uses, use the filter bag of 50 μ m, give filtration.
The technology of liquid wax polished bonding sheet, its processing step is as follows:
(1), the preparation method prepares liquid wax as described above, and mix;
(2), flushing polishing carrier plate, remove the remaining wax of former bonding die, bonding die carrier board diameter is 287mm, thickness is 10.16mm;
(3), on carrier board, wax, get rid of wax; Wax: one-period is 36.5 seconds, with wax flow velocity 148ml/ branch, supplies amount on each carrier board: 15.8ml, wax bed thickness: 8.5 μ m; When waxing, setting bonding die carrier board rotating speed is 200 rev/mins: when getting rid of wax, setting bonding die carrier board rotating speed is 300 rev/mins;
(4), the carrier board of first-class wax is placed on the steam heater heats, carrier board is heated to 96 ℃ in 60 seconds;
(5), with required sticking corrosion of silicon, flushing dries, and uses immediately;
(6), silicon chip is put into load platform pattern hole under the vacuum chamber, adorn the silicon chip of 3 Φ 125mm, compressing tablet vacuum chamber cylinder pressure is 82PSI;
(7), will be fixed on the carrier board according to the silicon chip after above-mentioned (6) the step operation;
(8), will deliver to thick throwing machine place and prepare polishing according to the carrier board of the load platform after above-mentioned (7) the step operation.
Embodiment two
This liquid wax for polished bonding sheet, it contains following component (by 1 myriagram weight ratio):
Polyethylene glycol 664.0
Coating agent which has to be dissolved in alcohol before use 200.0
Virahol 550.0
25% ammoniacal liquor 308.4
18,000,000 deionized waters 2350.6
8030 resins 5927.0
The preparation liquid wax for polished bonding sheet, its preparation process is as follows:
(1), be that 10 liters the wax bucket of joining is placed on the weigh scale with a capacity, weigh scale places in the stink cupboard;
(2), polyethylene glycol PEGE-200, coating agent which has to be dissolved in alcohol before use, Virahol, 25% ammoniacal liquor, 18,000,000 deionized waters, 8030 resins, successively in order and massfraction, pour into and join among the wax bucket, till arrival requires reading;
(3), make the slowly mixing of preparing burden, stirred at least 3 hours by magnetic agitation; After the stirring, left standstill 3 hours;
To cover the lid of close-fitting wax bucket when (4), depositing; One barrel is always joined wax material is 10 kilograms;
(5), before wax liquid uses, use the filter bag of 50 μ m, give filtration.
The technology of liquid wax polished bonding sheet, its processing step is as follows:
(1), the preparation method prepares liquid wax as described above, and mix;
(2), flushing polishing carrier plate, remove the remaining wax of former bonding die, bonding die carrier board diameter is 287mm, thickness is 10.16mm;
(3), on carrier board, wax, get rid of wax; Wax: one-period is 36.5 seconds, with wax flow velocity 152ml/ branch, supplies amount on each carrier board: 16.2ml, wax bed thickness: 9.0 μ m; When waxing, setting bonding die carrier board rotating speed is 200 rev/mins: when getting rid of wax, setting bonding die carrier board rotating speed is 300 rev/mins;
(4), the carrier board of first-class wax is placed on the steam heater heats, carrier board is heated to 97 ℃ in 60 seconds;
(5), with required sticking corrosion of silicon, flushing dries, and uses immediately;
(6), silicon chip is put into load platform pattern hole under the vacuum chamber, adorn the silicon chip of 3 Φ 125mm, compressing tablet vacuum chamber cylinder pressure is 85PSI;
(7), will be fixed on the carrier board according to the silicon chip after above-mentioned (6) the step operation;
(8), will deliver to thick throwing machine place and prepare polishing according to the carrier board of the load platform after above-mentioned (7) the step operation.
Embodiment three
This liquid wax for polished bonding sheet, it contains following component (by 1 myriagram weight ratio):
Polyethylene glycol 665.7
Coating agent which has to be dissolved in alcohol before use 201.5
Virahol 551.2
25% ammoniacal liquor 309.7
18,000,000 deionized waters 2353.4
8030 resins 5940.8
The preparation liquid wax for polished bonding sheet, its preparation process is as follows:
(1), be that 10 liters the wax bucket of joining is placed on the weigh scale with a capacity, weigh scale places in the stink cupboard;
(2), polyethylene glycol PEGE-200, coating agent which has to be dissolved in alcohol before use, Virahol, 25% ammoniacal liquor, 18,000,000 deionized waters, 8030 resins, successively in order and massfraction, pour into and join among the wax bucket, till arrival requires reading;
(3), make the slowly mixing of preparing burden, stirred at least 3 hours by magnetic agitation; After the stirring, left standstill 3 hours;
To cover the lid of close-fitting wax bucket when (4), depositing; Always join wax material for one barrel and be about 10 kilograms;
(5), before wax liquid uses, use the filter bag of 50 μ m, give filtration.
The technology of liquid wax polished bonding sheet, its processing step is as follows:
(1), the preparation method prepares liquid wax as described above, and mix;
(2), flushing polishing carrier plate, remove the remaining wax of former bonding die, bonding die carrier board diameter is 287mm, thickness is 10.16mm;
(3), on carrier board, wax, get rid of wax; Wax: one-period is 36.5 seconds, with wax flow velocity 152ml/ branch, supplies amount on each carrier board: 16.8ml, wax bed thickness: 10.5 μ m; When waxing, setting bonding die carrier board rotating speed is 204 rev/mins: when getting rid of wax, setting bonding die carrier board rotating speed is 305 rev/mins;
(4), the carrier board of first-class wax is placed on the steam heater heats, carrier board is heated to 98.5 ℃ in 60 seconds;
(5), with required sticking corrosion of silicon, flushing dries, and uses immediately;
(6), silicon chip is put into load platform pattern hole under the vacuum chamber, adorn the silicon chip of 5 Φ 100mm, compressing tablet vacuum chamber cylinder pressure is 85PSI;
(7), will be fixed on the carrier board according to the silicon chip after above-mentioned (6) the step operation;
(8), will deliver to thick throwing machine place and prepare polishing according to the carrier board of the load platform after above-mentioned (7) the step operation.
Claims (4)
1, a kind of liquid wax for polished bonding sheet is characterized in that: it contains following component (by 1 myriagram weight ratio):
Polyethylene glycol 662.3～665.7
Coating agent which has to be dissolved in alcohol before use 198.5～201.5
Virahol 548.7～551.2
25% ammoniacal liquor 307.0～309.7
18,000,000 deionized waters 2347.8～2353.4
8030 resins 5913.1～5940.8.
2, liquid wax for polished bonding sheet as claimed in claim 1 is characterized in that: in its component, weight is ± 0.5% at the component permissible error of 0～1000 gram, and the component permissible error of weight more than 1000 grams is ± 0.2%.
3, a kind of preparation method of liquid wax for polished bonding sheet as claimed in claim 1 is characterized in that: its preparation process is as follows:
(1), be that 10 liters the wax bucket of joining is placed on the weigh scale with a capacity, weigh scale places in the stink cupboard;
(2), polyethylene glycol, coating agent which has to be dissolved in alcohol before use, Virahol, 25% ammoniacal liquor, 18,000,000 deionized waters, 8030 resins, successively in order and weight ratio, pour into and join among the wax bucket, till arrival requires reading;
(3), make the slowly mixing of preparing burden, stirred at least 3 hours by magnetic agitation; After the stirring, left standstill 3 hours;
To cover the lid of close-fitting wax bucket when (4), depositing; One barrel is joined wax material is 10 ± 0.3% kilograms;
(5), before wax liquid uses, use the filter bag of 50 μ m, give filtration.
4, a kind of technology of liquid wax for polished bonding sheet polished bonding sheet as claimed in claim 1 is characterized in that: its processing step is as follows:
(1), the preparation method prepares liquid wax as described above, and mix;
(2), flushing polishing carrier plate, remove the remaining wax of former bonding die; Bonding die carrier board diameter is 287mm, and thickness is 10.16mm;
(3), on carrier board, wax, get rid of wax; Wax: one-period is 36.5 seconds, with wax flow velocity 150 ± 5ml/ branch, supplies amount on each carrier board: 16 ± 1ml, wax bed thickness: 9 ± 2 μ m; When waxing, setting bonding die carrier board rotating speed is 200 ± 5 rev/mins, and when getting rid of wax, setting bonding die carrier board rotating speed is 300 ± 5 rev/mins;
(4), the carrier board of first-class wax is placed on the steam heater heats, carrier board is heated to 97 ± 2 ℃ in 60 seconds;
(5), with required sticking corrosion of silicon, flushing dries, and uses immediately;
(6), silicon chip is put into load platform pattern hole under the vacuum chamber, load, compressing tablet; Load: Φ 125mm can once adorn 3, and Φ 100mm can once adorn 5, and on the carrier board, worst error is 2.0 μ m between the corrosion of silicon thickness; Compressing tablet vacuum chamber cylinder pressure is 80～90PSI, i.e. 5.6～6.3 kilograms/cm
2Compressing tablet time vacuum tightness in 60 seconds reaches 0.8～1.0 holder;
(7), will be fixed on the carrier board according to the silicon chip after above-mentioned (6) the step operation;
(8), will deliver to thick throwing machine place and prepare polishing according to the carrier board of the load platform after above-mentioned (7) the step operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710055082XA CN101376793A (en) | 2007-08-29 | 2007-08-29 | Liquid wax for polished bonding sheet, preparation thereof and process of polished bonding sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710055082XA CN101376793A (en) | 2007-08-29 | 2007-08-29 | Liquid wax for polished bonding sheet, preparation thereof and process of polished bonding sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101376793A true CN101376793A (en) | 2009-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200710055082XA Pending CN101376793A (en) | 2007-08-29 | 2007-08-29 | Liquid wax for polished bonding sheet, preparation thereof and process of polished bonding sheet |
Country Status (1)
| Country | Link |
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| CN (1) | CN101376793A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103567857A (en) * | 2013-11-04 | 2014-02-12 | 上海申和热磁电子有限公司 | Double-sided polishing process for silicon wafer |
| CN104369085A (en) * | 2014-09-15 | 2015-02-25 | 华东光电集成器件研究所 | Silicon wafer polishing and bonding method |
| CN107011839A (en) * | 2016-01-28 | 2017-08-04 | 北京保利世达科技有限公司 | A kind of liquid wax and preparation method thereof |
-
2007
- 2007-08-29 CN CNA200710055082XA patent/CN101376793A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103567857A (en) * | 2013-11-04 | 2014-02-12 | 上海申和热磁电子有限公司 | Double-sided polishing process for silicon wafer |
| CN104369085A (en) * | 2014-09-15 | 2015-02-25 | 华东光电集成器件研究所 | Silicon wafer polishing and bonding method |
| CN107011839A (en) * | 2016-01-28 | 2017-08-04 | 北京保利世达科技有限公司 | A kind of liquid wax and preparation method thereof |
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Application publication date: 20090304 |