CN101374403B - Shielding structure of electronic device and manufacturing method thereof - Google Patents
Shielding structure of electronic device and manufacturing method thereof Download PDFInfo
- Publication number
- CN101374403B CN101374403B CN2007101417426A CN200710141742A CN101374403B CN 101374403 B CN101374403 B CN 101374403B CN 2007101417426 A CN2007101417426 A CN 2007101417426A CN 200710141742 A CN200710141742 A CN 200710141742A CN 101374403 B CN101374403 B CN 101374403B
- Authority
- CN
- China
- Prior art keywords
- functional module
- screen
- layer
- circuit substrate
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The invention relates to a shield structure of an electronic device, which includes: a circuit substrate; at least one function module, which is equipped on one side of the circuit substrate and is electrically connected on the circuit substrate; at least one first coating module layer, which is combined outside the function module; at least one shield layer, which is combined outside the first coating module layer; and one second coating module layer, which is combined outside the shield layer. Wherein, the shield layer is formed outside the first coating module layer by the spray finishing, printing and other modes for realizing the effect of electromagnetic shielding, thereby the shield layer can effectively reduce the production time and cost.
Description
Technical field
The present invention relates to a kind of shielding construction of electronic installation, refer to a kind of structure that promotes electromagnetic shielding especially, and the manufacture method of this shielding construction.
Background technology
Along with the development of radio-frequency communication technology, mean that the wireless telecommunications element must more rigorous and optimizing effect on circuit design.Characteristics such as that radio communication product mostly requires is in light weight, volume is little, high-quality, low price, low consumpting power and high-reliability, these characteristics have promoted the technological development and the Market Growth of RF integrated circuit.And the electro-magnetic screen function of wireless module and quality requirements seem important relatively in the radio communication product, can be not interfering with each other and have influence on communication quality to guarantee signal.
Existing wireless module or other need be made the circuit module of electromagnetic shielding, need to add the structure such as the design of electromagnetic shielding crown cap of electromagnetic shielding according to institute's application need, and the size of this electromagnetic armouring structure must cooperate different modules, so that the signal source in the circuit is done to isolate and is isolated, but the existing electromagnetic shielding crown cap of this kind must design and produce at different modules or device, makes this existing electromagnetic shielding crown cap need expend more man-hour, manpower and cost.
In addition, another shortcoming of above-mentioned existing electromagnetic shielding crown cap need make the electronic circuit of electromagnetic shielding for this or size, shape, the block of device differs, made manual mould, carry out punch process and reach progressively component package at the module of each different size, shape, block as need, allow the electromagnetic shielding crown cap making difficulty and can't be applicable on the production line of quick production that and economic benefit and industry applications that existing electromagnetic shielding crown cap is produced reduce.
Summary of the invention
Main purpose of the present invention is to overcome the deficiencies in the prior art and defective, proposes a kind of shielding construction and manufacture method thereof of electronic installation, and this structure can utilize modes such as spraying, printing to form, so can effectively lower the cost of making.
Another object of the present invention is to, propose a kind of shielding construction and manufacture method thereof of electronic installation, can promote the industrial utilization of electromagnetic shielding metal level production and can expand the range of application of this shielding construction.
In order to reach above-mentioned purpose, the invention provides a kind of shielding construction of electronic installation, it comprises: a circuit substrate; At least one functional module, its be arranged at this circuit substrate a side and be electrically connected at this circuit substrate; At least one first overmold layer, it is incorporated into this functional module outside; At least one screen, it is incorporated into this first overmold layer outside; And one second overmold layer, it is incorporated into this screen outside.
In order to reach above-mentioned purpose, the invention provides a kind of manufacture method of shielding construction of electronic installation, its step comprises: a circuit substrate (a) is provided; (b) electrically connect at least one functional module in a side of this circuit substrate; (c) form one first overmold layer in the outside of each functional module; (d) form a screen in the outside of each first overmold layer; (e) form one second overmold layer in the outside of this screen.
In order to reach above-mentioned purpose, the present invention also provides a kind of shielding construction of electronic installation, and it comprises: a circuit substrate; One first functional module, it is arranged at a side of this circuit substrate and is electrically connected at this circuit substrate, and wherein one first overmold layer is arranged at this first functional module outside; One second functional module, it is arranged at a side of this circuit substrate and is electrically connected at this circuit substrate; One first screen, it is arranged at this first overmold layer outside; One secondary shielding layer, it is arranged at the outside of this first screen and this second functional module; And one second overmold layer, it is arranged at this secondary shielding layer outside.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the schematic diagram of shielding construction first embodiment of electronic installation of the present invention;
Fig. 2 is the flow chart of the shielding construction manufacture method of electronic installation of the present invention;
Fig. 3 is the schematic diagram of shielding construction second embodiment of electronic installation of the present invention.
Symbol description among the figure
1 circuit substrate
The 11a first functional module 11b second functional module
11,11 ' functional module
The 12a first overmold layer 12b the 3rd overmold layer
12,12 ' the first overmold layer
13,13 ' screen
14 second overmold layers
23 first screens
24 secondary shielding layers
Embodiment
See also Fig. 1, the invention provides a kind of shielding construction of electronic installation, this shielding construction can effectively prevent the phenomenon that high-frequency signal is interfering with each other.
The shielding construction of this electronic installation comprises a circuit substrate 1, and this circuit substrate 1 is the made circuit board of a BT resin (Bismaleimide Triazine Resin) among this embodiment, and it is one positive and one and this front opposed bottom surface that this circuit substrate 1 has.This circuit substrate 1 is provided with many connecting lines, comprises ground termination points and other electrical circuit, and described connecting line is made with general existing mode, does not add to set forth at this.
In addition, at least one functional module 11 is set, and this functional module 11 is electrically connected at above-mentioned connecting line, to reach the transmission of signal in the one side of this circuit substrate 1.In the present embodiment, there are two functional modules 11 and 11 ' to be located on this circuit substrate 1; And this functional module is RF (Radio Frequency) radio-frequency module, for example be a wireless signal (Wireless) module, a bluetooth (Bluetooth) module or global location (GPS) module, that is this functional module 11 can be a bluetooth (Bluetooth) module, and this functional module 11 ' can be a wireless signal (Wireless) module, but does not exceed with above-mentioned module.
Moreover at least one first overmold layer 12 is incorporated into the outside of this functional module 11, and this first overmold layer 12 can be a hot melt packaging plastic and forms, but does not exceed with above-mentioned, and this first overmold layer 12 is mainly reaches the purpose that coats this functional module 11.So in the present embodiment, the first overmold layer 12 and 12 ' is separately positioned on the outside of this functional module 11 and 11 ', and coats this two functional module 11 and 11 '.
Then the arranged outside of this first overmold layer 12 has a screen 13, and this screen 13 forms in the outside of this first overmold layer 12; This screen 13 is a metal level, and this metal level is formed with spraying, mode of printing; That is this metal level also utilizes the outside that spraying, mode of printing be incorporated into this first overmold layer 12 to reach the effect of electromagnetic shielding, makes the signal of functional module 12 can be not interfering with each other.In the present embodiment simultaneously, two screens 13 and 13 ' are coated on this first overmold layer 12 and 12 ' respectively.And the major function of this two screen 13 and 13 ' is to provide respectively the electrical plane of reference of this two functional module 11 and 11 ', that is this two screen 13 and 13 ' can isolate its respectively corresponding functional module 11 and 11 ' signal that is sent, and makes it can not produce the phenomenon that interferes with each other.
Last second overmold layer 14 forms in the outside of this screen 13, forms the overmold layer of an integral coating.In the present embodiment, this second overmold layer 14 is coated on the outside of this two screen 13 and 13 '; In addition, this second overmold layer 14 can be formed by same encapsulating material with this first overmold layer 12: on the contrary, both also can be different encapsulating materials.
Please refer to Fig. 2, reach the manufacture method of the shielding construction of above-mentioned electronic installation with detailed description, its step comprises:
Step 1 a: circuit substrate 1 is provided;
Step 2: electrically connect at least one functional module 11 in a side of this circuit substrate 1;
Step 3: form one first overmold layer 12 in the outside of this each functional module 11;
Step 4: form a screen 13 in the outside of each first overmold layer 12;
Step 5: form one second overmold layer 14 in the outside of this screen 13.
In step 1, the invention provides the circuit substrate 1 of a BT resin, but material is not as limit; In step 3, this first overmold layer 12 is coated on the outside of this functional module 11, so the shape of this first overmold layer 12 must be corresponding to this functional module 11, that is the shape of above-mentioned two first overmold layers 12 and 12 ' corresponds respectively to this two functional module 11 and 11 ', to reach the purpose that coats this functional module 11; In step 4, this screen 13 utilizes spraying, the formed metal level of mode of printing, make this screen 13 in this way and can effectively reduce Production Time and cost, the shape of this screen 13 and size all can be corresponding to this first overmold layers 12, to improve the application of this screen 13 simultaneously; In addition the thickness of this screen 13 also can be when being shaped the in addition management and control of Control Parameter condition, with the overall accuracy of this screen 13 of effective raising.
Please refer to Fig. 3, this is the second embodiment of the present invention, one circuit substrate 1 similarly is provided in this embodiment, which is provided with one first functional module 11a and one second functional module 11b, and this first functional module 11a and this second functional module 11b all are electrically connected at this circuit substrate 1.Similarly, this first functional module 11a and this second functional module 11b are respectively a RF (Radio Frequency) radio-frequency module.Moreover this first functional module 11a outside is coated with one first overmold layer 12a.Then the outside of this first overmold layer 12a is provided with one first screen 23; Further, one the 3rd overmold layer 12b is set, coats this first screen 23 and this second functional module 11b; One secondary shielding layer 24 is set again, and it is coated on the outside of this secondary shielding layer 24 and the 3rd overmold layer 12b; This structure can utilize this first screen 23 to coat this first functional module 11a to completely cut off this first functional module 11a and this second functional module 11b and can utilize this secondary shielding layer 24 isolated this second functional module 11b; The structure of present embodiment only proposes two functional modules 11, and in fact this programme can be used for the structure of a plurality of functional modules 11, utilizes shielding construction proposed by the invention, can make to be isolated mutually between a plurality of functional modules 11 and can be not interfering with each other.
Moreover, also be coated with one second overmold layer 14 in the outside of this secondary shielding layer 24, to reach the purpose of protection.
And the overmold layer and the screen of formed thereby among second embodiment, its method for making is all identical with first embodiment, does not repeat them here.
In sum, the present invention has following all advantages:
1, the screen of the present invention's proposition is made in modes such as spraying, printings, and needn't be through offering the installation procedure of complicated high one-tenth man-hour, manpower and cost such as mould, metal stamping and encapsulation, can significantly reduce manufacturing manpower, man-hour, the cost of making the electromagnetic shielding crown cap, and and then promote the industrial utilization of electromagnetic shielding metal level production and can expand the range of application of this structure.
2, on the other hand, the present invention can reach the effect that anti-stop signal disturbs mutually, and in other words, the present invention proposes a shielding construction with preferable shield effectiveness.
The above only is preferred embodiment of the present invention, non-ly is intended to limit to scope of patent protection of the present invention, thus use such as specification of the present invention and accompanying drawing content institute for it equivalence change, all in like manner all be contained in the scope of the present invention.
Claims (16)
1. the shielding construction of an electronic installation is characterized in that, comprises:
One circuit substrate;
At least one functional module, it is arranged at a side of this circuit substrate and is electrically connected at this circuit substrate;
At least one first overmold layer, it is incorporated into this functional module outside;
At least one screen, it is incorporated into this first overmold layer outside; And
One second overmold layer, it is incorporated into this screen outside.
2. the shielding construction of electronic installation as claimed in claim 1 is characterized in that, this functional module is a radio-frequency module.
3. the shielding construction of electronic installation as claimed in claim 1 is characterized in that, this first overmold layer and this second overmold layer are formed by a hot melt packaging plastic.
4. the shielding construction of electronic installation as claimed in claim 1 is characterized in that, this screen is a metal level.
5. the shielding construction of electronic installation as claimed in claim 4 is characterized in that, this metal level is formed with spraying, mode of printing.
6. the shielding construction of electronic installation as claimed in claim 1 is characterized in that, this screen is an electrical plane of reference.
7. the manufacture method of the shielding construction of an electronic installation as claimed in claim 1 is characterized in that, comprises step:
(a) provide a circuit substrate;
(b) electrically connect at least one functional module in a side of this circuit substrate;
(c) form one first overmold layer in the outside of each functional module;
(d) form a screen in the outside of each first overmold layer;
(e) form one second overmold layer in the outside of this screen.
8. manufacture method as claimed in claim 7 is characterized in that, this screen of this step (d) forms a metal level with spraying, mode of printing.
9. manufacture method as claimed in claim 7 is characterized in that, this first overmold layer and this second overmold layer are formed by a hot melt packaging plastic.
10. manufacture method as claimed in claim 7 is characterized in that, this functional module is a radio-frequency module.
11. the shielding construction of an electronic installation is characterized in that, comprises:
One circuit substrate;
One first functional module, it is arranged at a side of this circuit substrate and is electrically connected at this circuit substrate, and wherein one first overmold layer is arranged at this first functional module outside;
One second functional module, it is arranged at a side of this circuit substrate and is electrically connected at this circuit substrate;
One first screen, it is arranged at the outside of this first overmold layer;
One secondary shielding layer, it is arranged at the outside of this first screen and this second functional module; And
One second overmold layer, it is arranged at this secondary shielding layer outside.
12. the shielding construction of electronic installation as claimed in claim 11 is characterized in that, this first functional module and this second functional module are respectively a radio-frequency module.
13. the shielding construction as electronic installation as described in the claim 11 is characterized in that this first overmold layer and this second overmold layer are respectively a hot melt packaging plastic and form.
14. the shielding construction as electronic installation as described in the claim 11 is characterized in that this first screen and this secondary shielding layer are respectively a metal level.
15. the shielding construction as electronic installation as described in the claim 11 is characterized in that, this metal level is formed with spraying, mode of printing.
16. the shielding construction as electronic installation as described in the claim 11 is characterized in that, is provided with one the 3rd overmold layer between this secondary shielding layer and this first screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101417426A CN101374403B (en) | 2007-08-21 | 2007-08-21 | Shielding structure of electronic device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101417426A CN101374403B (en) | 2007-08-21 | 2007-08-21 | Shielding structure of electronic device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101374403A CN101374403A (en) | 2009-02-25 |
| CN101374403B true CN101374403B (en) | 2010-09-22 |
Family
ID=40448237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101417426A Expired - Fee Related CN101374403B (en) | 2007-08-21 | 2007-08-21 | Shielding structure of electronic device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101374403B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378565A (en) * | 2010-08-19 | 2012-03-14 | 环旭电子股份有限公司 | Cover body and electronic device using same |
| EP3132664A4 (en) | 2014-04-18 | 2017-11-29 | Henkel AG & Co. KGaA | Emi shielding composition and process for applying it |
| CN105336629B (en) * | 2014-08-08 | 2018-11-27 | 日月光半导体制造股份有限公司 | The manufacturing method and Electronic Packaging module of Electronic Packaging module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1061317A (en) * | 1991-07-05 | 1992-05-20 | 孙喜权 | Firming electronic functional block |
| CN2616010Y (en) * | 2003-03-14 | 2004-05-12 | 黎文玉 | Anti-electromagnetic wave coating structure improvement for flexible cables |
| CN1829431A (en) * | 2005-03-02 | 2006-09-06 | 中华映管股份有限公司 | Cloth for preventing interference of electromagnetic wave and electronic device |
| CN1963958A (en) * | 2005-11-08 | 2007-05-16 | 华硕电脑股份有限公司 | Arranging wire and electronic device using the same |
-
2007
- 2007-08-21 CN CN2007101417426A patent/CN101374403B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1061317A (en) * | 1991-07-05 | 1992-05-20 | 孙喜权 | Firming electronic functional block |
| CN2616010Y (en) * | 2003-03-14 | 2004-05-12 | 黎文玉 | Anti-electromagnetic wave coating structure improvement for flexible cables |
| CN1829431A (en) * | 2005-03-02 | 2006-09-06 | 中华映管股份有限公司 | Cloth for preventing interference of electromagnetic wave and electronic device |
| CN1963958A (en) * | 2005-11-08 | 2007-05-16 | 华硕电脑股份有限公司 | Arranging wire and electronic device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101374403A (en) | 2009-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104396359B (en) | For providing the system and method for the electromagnetic interference shield for integrated circuit modules | |
| CN103165039B (en) | High-contrast light-emitting diode (LED) display module and production method thereof | |
| CN201194229Y (en) | Semiconductor package for integrated antenna | |
| US20140198459A1 (en) | Stacked package device and manufacturing method thereof | |
| CN104347595B (en) | Electronic packaging module and manufacturing method thereof | |
| CN101374403B (en) | Shielding structure of electronic device and manufacturing method thereof | |
| CN104425884A (en) | Mobile terminal and antenna manufacturing method thereof | |
| CN102610910A (en) | Built-in antenna component | |
| CN104576616A (en) | Module integrated circuit packaging structure and fabricating method thereof | |
| CN208589533U (en) | Antenna module and electronic equipment | |
| US20190352769A1 (en) | Housing of electronic device and method for manufacturing housing | |
| TW201417982A (en) | Assembling method for housing of electronic device and assembly of housing of electronic device | |
| CN206164609U (en) | Center and cell -phone | |
| CN109561644B (en) | Preparation method of circuit board assembly, circuit board assembly and mobile terminal | |
| CN102543904A (en) | Modular integrated circuit packaging structure and manufacturing method thereof | |
| CN205789980U (en) | The motherboard of OLED array, OLED display panel, display device | |
| CN110335862A (en) | A kind of shielding process of SIP encapsulation | |
| CN202210572U (en) | Composite antenna structure | |
| CN104797079A (en) | Method for reducing impedance mismatching on package and PCB (printed circuit board) | |
| CN202799387U (en) | Structure maintaining uniformity of planeness of surface of PCB | |
| CN101801156B (en) | Method for manufacturing flexible printed circuit board and structure thereof | |
| CN209267937U (en) | A kind of shielding construction and its electronic equipment | |
| CN207780422U (en) | Backboard and electronic equipment | |
| CN106104919A (en) | Three-dimensional antenna arrangement | |
| CN101373741B (en) | Semiconductor shielding structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100922 Termination date: 20160821 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |