CN101373752A - Fingerprint sensing chip with flexible circuit board signal transmission structure and manufacturing method thereof - Google Patents
Fingerprint sensing chip with flexible circuit board signal transmission structure and manufacturing method thereof Download PDFInfo
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- CN101373752A CN101373752A CNA2007101465330A CN200710146533A CN101373752A CN 101373752 A CN101373752 A CN 101373752A CN A2007101465330 A CNA2007101465330 A CN A2007101465330A CN 200710146533 A CN200710146533 A CN 200710146533A CN 101373752 A CN101373752 A CN 101373752A
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- circuit board
- flexible circuit
- fingerprint
- signal transmission
- fingerprint sensing
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Abstract
The invention provides a fingerprint sensing chip with a flexible circuit board signal transmission structure. The chip comprises a substrate, a plurality of first connection pads and a flexible circuit board. The substrate is provided with a plurality of fingerprint sensing units. The first connection pads are respectively arranged on the finger sensing unit and exposed out of the upper surface of the substrate. The flexible circuit board is positioned above the substrate and provided with a plurality of signal transmission structures exposed from a lower surface of the flexible circuit board. The fingerprint sensing units are respectively in electrical connection with the signal transmission structures. The upper surface of the flexible circuit board used as the surface contacting with a finger transmits a plurality of fingerprint signals measuring the finger to the fingerprint sensing unit through the signal transmission structures. The invention further provides a method for manufacturing the fingerprint sensing chip.
Description
Technical field
The present invention relates to a kind of fingerprint sensing chip, particularly a kind of fingerprint sensing chip of tool flexible circuit board signal transmission structure and manufacture method thereof.
Background technology
Present non-optical formula fingerprint sensor, exhausted major part all is design and the sensing structure that is made in silicon, no matter be condenser type, Electric field, heat seeking or other sensor chips, its basic structure all is to utilize to make the sensing cell array to allow directly contact of finger, to measure the image contrast between hand fingerprint peaks and line paddy above silicon.Relate to these fingerprint sensing chip technology, find in the following relevant patent that can be proposed referring to this case inventor: (a) the Chinese invention patent application case number 02105960.8, the applying date is on April 10th, 2002, and denomination of invention is " capacitance type fingerprint access chip ", and publication number is 1450489; (b) the Chinese invention patent application case number 02123058.7, and the applying date is on 06 13rd, 2002, and denomination of invention is " pressure type fingerprint reads chip and manufacture method thereof ", and publication number is 1464471; (c) the Chinese invention patent application case number 02124906.7, the applying date is on 06 25th, 2002, denomination of invention is " temperature sensor and use the identification of fingerprint chip of this temperature sensor ", publication number is 1463674 (d) Chinese invention patent application case number 02132054.3, the applying date is on 09 10th, 2002, denomination of invention is " the fingerprint access chip structure of little sensing cell of capacitive pressure and application thereof ", and publication number is 1482440; (e) the Chinese invention patent application case number 01119057.4, and the applying date is May 25 calendar year 2001, and denomination of invention is " capacitive pressure micro sensing assembly and manufacture method and a signal reading method ", and publication number is 1388360.
For the sensing fingerprint, chip surface all is formed with insulating barrier and points wearing and tearing with the finger contact so that prevent.Owing to the insulating barrier of fingerprint chip all is to utilize thin film fabrication technology to accumulate formation, and most insulating barrier is the dielectric material of fragility, thus the insulating barrier of chip surface not compression resistance impact.In addition, the thickness of insulating layer that forms of thin film fabrication technology is too thin usually and be not enough to produce anti-finger abrasion effect.
Moreover, when the finger that has static when the chip, produce the static discharge effect and destroy chip at chip surface easily.It is former because the thickness deficiency of insulating barrier makes the antistatic effect of chip be restricted.
Therefore, how to provide a kind of fingerprint sensing chip structure and manufacture method of being convenient to make and can effectively provide compression resistance impact, the abrasion of anti-finger and anti-electrostatic breakdown, real preceding problem of inventing institute's desire solution for the present invention's continuity.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of fingerprint sensing chip and manufacture method thereof of tool flexible circuit board signal transmission structure, and good compression resistance impact characteristics, the wear characteristic of anti-finger the and anti-electrostatic breakdown characteristic are provided.
For reaching above-mentioned purpose, the invention provides a kind of fingerprint sensing chip of tool flexible circuit board signal transmission structure, it comprises a substrate, a plurality of first connection gasket and a flexible circuit board.Substrate has a plurality of fingerprint sensings unit.First connection gasket is arranged at respectively on the described fingerprint sensing unit, and is exposed to a upper surface of substrate.Flexible circuit board is positioned at the top of substrate, and have a plurality of signal transmission structures and expose from a lower surface of flexible circuit board, described fingerprint sensing unit is electrically connected to described signal transmission structure respectively, and a upper surface of flexible circuit board as with the surface of proficiency abutment, and will measure a plurality of finger lines signals of pointing by described signal transmission structure and be sent to described fingerprint sensing unit.
The present invention also provides a kind of manufacture method of fingerprint sensing chip of tool flexible circuit board signal transmission structure, comprises following steps: a substrate is provided, and it has a plurality of fingerprint sensings unit; Form a plurality of first connection gaskets on described fingerprint sensing unit respectively, described first connection gasket is exposed to a upper surface of substrate; One flexible circuit board is provided, and it is positioned at the top of substrate, and has a plurality of signal transmission structures and expose from a lower surface of flexible circuit board; And the pressing flexible circuit board is to substrate, so that described fingerprint sensing unit is electrically connected to described signal transmission structure respectively.And a upper surface of flexible circuit board as with the surface of proficiency abutment, and will measure a plurality of finger lines signals of pointing by described signal transmission structure and be sent to described fingerprint sensing unit.
Description of drawings
Fig. 1 shows the partial top view according to fingerprint sensing chip of the present invention.
Fig. 2 and Fig. 3 show the end view according to the manufacturing step of the fingerprint sensing chip of first embodiment of the invention.
Fig. 4 shows the end view according to the application of the fingerprint sensing chip of first embodiment of the invention.
Fig. 5 shows the part sectioned view according to the fingerprint sensing chip of second embodiment of the invention.
Fig. 6 shows the part sectioned view according to the fingerprint sensing chip of third embodiment of the invention.
Fig. 7 shows the end view according to the application of the fingerprint sensing chip of fourth embodiment of the invention.
Drawing reference numeral:
F: finger
10: substrate
10A: upper surface
12: the fingerprint sensing unit
13: the first connection gaskets
20: flexible circuit board
20A: upper surface
20B: lower surface
21: the anti-fouling material layer
22: signal transmission structure
22A: metal electrode
22B: second connection gasket
22C: metal plug
30: packed layer
Embodiment
For foregoing of the present invention can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Cover brilliant film (Chip-on-film, COF) be a kind of with crystal grain chip bonding (Flip Chip Bonding) in flexible circuit board (Flexible Printed Circuit board, the FPC) technology on the base material.This technology is applied in the IC encapsulation very widely, for example display panels (Liquid Crystal Panel) is exactly to utilize COF to finish with the encapsulation of associated drives IC, save traditional printed circuit board (PCB), reach more compact purpose and have can deflection characteristic.
Seeking to improve in the process of the compression resistance impact of fingerprint sensing chip, the abrasion of anti-finger and anti-electrostatic breakdown, this case inventor finds and the technology of COF can be applied in the fingerprint sensing chip, not only can solve the stability problem (reliability) of above-mentioned sensor chip, can also solve the encapsulation problem of chip simultaneously, can be and serve multiple.Below in detail its execution mode will be described in detail.
Fig. 1 shows the partial top view according to fingerprint sensing chip of the present invention.Though Fig. 1 is shown as the array that a plurality of sensing cells 12 are formed, the present invention does not limit sensing cell number and the distribution mode in the array, is matrix distribution in the present embodiment.Fig. 2 and 3 shows the end view according to the manufacturing step of the fingerprint sensing chip of first embodiment of the invention.Fig. 4 shows the end view according to the application of the fingerprint sensing chip of first embodiment of the invention.Shown in Fig. 1 to 4, the structure and the manufacture method of the fingerprint sensing chip of present embodiment comprise following steps.
At first, provide a substrate 10, substrate 10 is generally silicon materials, also can be other semi-conducting material or insulating properties substrate such as glass, and it has a plurality of fingerprint sensings unit 12, as shown in Figure 2.Each fingerprint sensing unit 12 can be to be a capacitance type fingerprint sensing cell, a pressure type fingerprint sensing cell, a thermal-induction type fingerprint sensing unit or an electric field fingerprint sensing cell or other sensing cells as infrared ray or optical profile type or any different sensing modes.
Then, form a plurality of first connection gaskets 13 respectively on described fingerprint sensing unit 12, described first connection gasket 13 is exposed to a upper surface 10A of substrate 10, as shown in Figure 2.The generation type of described connection gasket 13, generally be to utilize plating mode to form at the crystal column surface electrogilding, certainly, any metal that can form electrical joint or conducting polymer or ACF (anisotropy conducting film) or to appoint the plyability structure of the two composition can be the composition material of connection gasket 13 of the present invention.
Then, provide a flexible circuit board 20, it is positioned at the top of substrate 10, and has a plurality of signal transmission structures 22 and expose from a lower surface 20B of flexible circuit board 20, as shown in Figure 2.In present embodiment, the thickness of flexible circuit board 20 is between 20 to 50 microns, in the present embodiment, the material of flexible circuit board for but be not limited to polyimides (Polyimide), it has quite good manufacturing and environmental stability, simultaneously flexible circuit board 20 can also comprise the anti-fouling material layer 21 of a more wear-resisting or hydrophobic and oleophobic, as shown in Figure 7, to prevent that water from dividing and greasy dirt is thereon residual, rice resin etc. how for example, the quality when using to increase.The anti-fouling material layer can be by being but is not limited to a wear-resisting macromolecular material, a hydrophobic macromolecular material or the macromolecular material of an oleophobic and is formed.
Therefore this thickness can provide the fingerprint sensing chip structure of good compression resistance impact, the abrasion of anti-finger and anti-electrostatic breakdown much larger than the thickness of the formed dielectric film of thin film fabrication technology of prior art.
At last, hot pressing flexible circuit board 20 is to substrate 10, as shown in Figure 3.So, can make described fingerprint sensing unit 12 electrically connect (electrical connection) respectively to described signal transmission structure 22, and a upper surface 20A of flexible circuit board 20 is as the surface that contacts with a finger F, and be sent to described fingerprint sensing unit 12 by a plurality of finger lines signals that described signal transmission structure 22 will measure finger F, as shown in Figure 4.
Therefore, the fingerprint sensing chip of a kind of tool flexible circuit board signal transmission structure of present embodiment comprises a substrate 10, a plurality of first connection gaskets 13 and a flexible circuit board 20.Substrate 10 has a plurality of fingerprint sensings unit 12.First connection gasket 13 is arranged at respectively on the described fingerprint sensing unit 12, and is exposed to a upper surface 10A of substrate 10.Flexible circuit board 20 is positioned at the top of substrate 10, and has a plurality of signal transmission structures 22 and expose from a lower surface 20B of flexible circuit board 20.Described fingerprint sensing unit 12 is electrically connected to described signal transmission structure 22 respectively, and a upper surface 20A of flexible circuit board 20 as with the surface that contacts of finger F, and be sent to described fingerprint sensing unit 12 by a plurality of finger lines signals that described signal transmission structure 22 will measure finger F.
As shown in Figure 4, the fingerprint sensing chip of present embodiment can also comprise a packed layer 30, and it is filled between the lower surface 20B of the upper surface 10A of substrate 10 and flexible circuit board 20, and coats described fingerprint sensing unit 12.Therefore, the manufacture method of present embodiment can also comprise following steps: fill packed layer 30 between the lower surface 20B of the upper surface 10A of substrate 10 and flexible circuit board 20, and make packed layer 30 coat described fingerprint sensing unit 12.It should be noted that packed layer 30 can be a manufacturing step optionally.
Again, each signal transmission structure 22 can only comprise but be not limited to second a connection gasket 22B (this structure can be called the single-layer metal flexible circuit board) who exposes, and the described second connection gasket 22B is electrically connected to described fingerprint sensing unit 12 respectively.Therefore, provide the step of flexible circuit board 20 to comprise: to form a plurality of second connection gasket 22B that expose, use for being electrically connected to described fingerprint sensing unit 12 respectively.
Fig. 5 shows the part sectioned view according to the fingerprint sensing chip of second embodiment of the invention.As shown in Figure 5, the second connection gasket 22B and the metal plug 22C that expose including but not limited to a metal electrode 22A, of each signal transmission structure 22 of the flexible circuit board 20 of present embodiment.Be embedded in the metal electrode 22A in the flexible circuit board 20.The second connection gasket 22B that exposes is formed on the lower surface 20B of flexible circuit board 20.Metal plug 22C is formed in the flexible circuit board 20, in order to metal electrode 22A is electrically connected to the second connection gasket 22B.
In present embodiment, the first segment of described metal electrode 22A equals one second pitch of described sensing cell 12 apart from (pitch).First segment is apart from the distance between the central point of the adjacent two metal electrode 22A of representative, and second pitch is represented the distance between the central point of adjacent two sensing cells 12.Yet the present invention is not subject to this, and the first segment distance of described metal electrode 22A can be less than second pitch of described sensing cell 12, as shown in Figure 6.In like manner, the first segment of described metal electrode 22A distance can be greater than second pitch of described sensing cell 12.
Again, in order further to promote the tolerance of sensor chip to Electrostatic Discharge, can optionally make a conductive layer, it forms the part of the upper surface of flexible circuit board.So conductive layer is outside being exposed to.Conductive layer comprises but is not limited to metal level, and is to be disposed at around the signal transmission structure, to conduct the electrostatic charge near object or finger.Conductive layer can be by suitable electrical arrangement, for example but be not limited to the mode of conductive layer being done electrical ground connection, keeps the normal operation of sensor chip.
Pass through the above embodiment of the present invention, a kind of fingerprint sensing chip structure and manufacture method of being convenient to make and can effectively provide compression resistance impact, the abrasion of anti-finger and anti-electrostatic breakdown can be provided, effectively solve the problem of the relatively poor compression resistance impact characteristics of existing fingerprint sensing chip structure, the wear characteristic of anti-finger the and anti-electrostatic breakdown characteristic.
The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to convenient explanation technology contents of the present invention, but not with narrow sense of the present invention be limited to the foregoing description, in the situation that does not exceed spirit of the present invention and following claim, the many variations of being done is implemented, and all belongs to scope of the present invention.
Claims (9)
1. the fingerprint sensing chip of a tool flexible circuit board signal transmission structure is characterized in that, this fingerprint sensing chip comprises:
One substrate, it has a plurality of fingerprint sensings unit;
A plurality of first connection gaskets, it is arranged at respectively on described a plurality of fingerprint sensings unit, and is exposed to a upper surface of described substrate; And
One flexible circuit board, it is positioned at the top of described substrate, and have a plurality of signal transmission structures and expose from a lower surface of described flexible circuit board, described a plurality of fingerprint sensings unit is electrically connected to described a plurality of signal transmission structure respectively, and a upper surface of described flexible circuit board as with the surface of proficiency abutment, and be sent to described a plurality of fingerprint sensings unit by a plurality of finger lines signals that described a plurality of signal transmission structures will measure described finger.
2. fingerprint sensing chip as claimed in claim 1 is characterized in that, this fingerprint sensing chip also comprises:
One packed layer, it is filled between the described lower surface of the described upper surface of described substrate and described flexible circuit board, and coats described a plurality of fingerprint sensings unit.
3. fingerprint sensing chip as claimed in claim 1 is characterized in that, each described signal transmission structure comprises second connection gasket that exposes, and described a plurality of second connection gaskets are electrically connected to described a plurality of fingerprint sensings unit respectively.
4. fingerprint sensing chip as claimed in claim 1 is characterized in that, the described signal transmission structure of each of described flexible circuit board comprises:
One metal electrode, in be embedded in the described flexible circuit board;
One second connection gasket that exposes is formed on the described lower surface of described flexible circuit board; And
One metal plug is formed in the described flexible circuit board, and described metal electrode is electrically connected to described second connection gasket.
5. fingerprint sensing chip as claimed in claim 1 is characterized in that, described flexible circuit board also has an anti-fouling material layer, and it forms the described upper surface of described flexible circuit board, to prevent that water from dividing and greasy dirt is thereon residual.
6. fingerprint sensing chip as claimed in claim 1 is characterized in that described flexible circuit board also has a conductive layer, and it forms the part of the described upper surface of described flexible circuit board, to guide the static of described finger.
7. the manufacture method of the fingerprint sensing chip of a tool flexible circuit board signal transmission structure is characterized in that, this manufacture method comprises following steps:
One substrate is provided, and it has a plurality of fingerprint sensings unit;
Form a plurality of first connection gaskets respectively on described a plurality of fingerprint sensings unit, described a plurality of first connection gaskets are exposed to a upper surface of described substrate; And
One flexible circuit board is provided, and it is positioned at the top of described substrate, and has a plurality of signal transmission structures and expose from a lower surface of described flexible circuit board; And
The described flexible circuit board of pressing is to described substrate, so that described a plurality of fingerprint sensings unit is electrically connected to described a plurality of signal transmission structure respectively, and the described upper surface of described flexible circuit board as and the surface of proficiency abutment, and be sent to described a plurality of fingerprint sensings unit by a plurality of finger lines signals that described a plurality of signal transmission structures will measure described finger.
8. manufacture method as claimed in claim 7 is characterized in that, this manufacture method also comprises following steps:
Fill a packed layer between the described lower surface of the described upper surface of described substrate and described flexible circuit board, and make described packed layer coat described a plurality of fingerprint sensings unit.
9. manufacture method as claimed in claim 7 is characterized in that, provides the step of described flexible circuit board to comprise:
Form a plurality of second connection gaskets that expose, it is for being electrically connected to described a plurality of fingerprint sensings unit respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101465330A CN101373752B (en) | 2007-08-20 | 2007-08-20 | Fingerprint sensing chip with flexible circuit board signal transmission structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2007101465330A CN101373752B (en) | 2007-08-20 | 2007-08-20 | Fingerprint sensing chip with flexible circuit board signal transmission structure and manufacturing method thereof |
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| CN101373752A true CN101373752A (en) | 2009-02-25 |
| CN101373752B CN101373752B (en) | 2011-01-26 |
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| CN102236460A (en) * | 2010-04-28 | 2011-11-09 | 周正三 | Sensing device, mini-touch control device and producing method of sensing device |
| CN103364123A (en) * | 2012-04-02 | 2013-10-23 | 宏达国际电子股份有限公司 | Force sensor and detector for user identification module card contact pin |
| CN104156712A (en) * | 2014-08-26 | 2014-11-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition and detection assembly and electronic device |
| CN104182743A (en) * | 2013-05-23 | 2014-12-03 | 李美燕 | Divergent sensing apparatus and manufacturing method thereof |
| CN103729615B (en) * | 2012-10-12 | 2017-04-12 | 茂丞科技股份有限公司 | Biosensor module, biosensor assembly, method of manufacturing the same, and electronic device using the same |
| CN107346412A (en) * | 2014-03-24 | 2017-11-14 | 指纹卡有限公司 | Fingerprint acquisition apparatus, method and the electronic installation of the fingerprint pattern of sensing finger |
| CN108112176A (en) * | 2016-11-24 | 2018-06-01 | 原通科技股份有限公司 | Method for manufacturing signal measurement medium flexible board |
| CN104933396B (en) * | 2014-03-18 | 2018-07-10 | 茂丞科技股份有限公司 | All-plane sensor with exposed pigment layer and electronic device using same |
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| JP3887252B2 (en) * | 2002-03-15 | 2007-02-28 | 日本電信電話株式会社 | Manufacturing method of surface shape recognition sensor |
| CN101379510B (en) * | 2005-10-18 | 2012-09-26 | 奥森泰克公司 | Finger sensing with enhanced mounting and associated methods |
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- 2007-08-20 CN CN2007101465330A patent/CN101373752B/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102236460A (en) * | 2010-04-28 | 2011-11-09 | 周正三 | Sensing device, mini-touch control device and producing method of sensing device |
| CN102236460B (en) * | 2010-04-28 | 2013-11-27 | 周正三 | Sensing device, mini-touch control device and producing method of sensing device |
| CN103364123A (en) * | 2012-04-02 | 2013-10-23 | 宏达国际电子股份有限公司 | Force sensor and detector for user identification module card contact pin |
| CN103364123B (en) * | 2012-04-02 | 2016-04-27 | 宏达国际电子股份有限公司 | Force sensor and detector for user identification module card contact pin |
| CN103729615B (en) * | 2012-10-12 | 2017-04-12 | 茂丞科技股份有限公司 | Biosensor module, biosensor assembly, method of manufacturing the same, and electronic device using the same |
| CN104182743A (en) * | 2013-05-23 | 2014-12-03 | 李美燕 | Divergent sensing apparatus and manufacturing method thereof |
| CN104182743B (en) * | 2013-05-23 | 2018-04-10 | 茂丞科技股份有限公司 | Divergence expression sensing device further and its manufacture method |
| CN104933396B (en) * | 2014-03-18 | 2018-07-10 | 茂丞科技股份有限公司 | All-plane sensor with exposed pigment layer and electronic device using same |
| CN107346412A (en) * | 2014-03-24 | 2017-11-14 | 指纹卡有限公司 | Fingerprint acquisition apparatus, method and the electronic installation of the fingerprint pattern of sensing finger |
| CN107346412B (en) * | 2014-03-24 | 2022-01-11 | 指纹卡安娜卡敦知识产权有限公司 | Fingerprint sensing device, method and electronic device for sensing fingerprint pattern of finger |
| CN104156712A (en) * | 2014-08-26 | 2014-11-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition and detection assembly and electronic device |
| CN108112176A (en) * | 2016-11-24 | 2018-06-01 | 原通科技股份有限公司 | Method for manufacturing signal measurement medium flexible board |
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