CN100452379C - Display panel and encapsulation structure of its control circuit - Google Patents
Display panel and encapsulation structure of its control circuit Download PDFInfo
- Publication number
- CN100452379C CN100452379C CNB2006101019335A CN200610101933A CN100452379C CN 100452379 C CN100452379 C CN 100452379C CN B2006101019335 A CNB2006101019335 A CN B2006101019335A CN 200610101933 A CN200610101933 A CN 200610101933A CN 100452379 C CN100452379 C CN 100452379C
- Authority
- CN
- China
- Prior art keywords
- wire pattern
- encapsulating structure
- opening
- display floater
- control circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A display panel comprises an array baseplate, a control circuit connection region, a conducting wire pattern, an insulation layer covered on the conducting wire pattern, a transparent conducting layer equipped on the insulation layer, a conductive adhesive equipped on the transparent conducting layer and the insulation layer. The insulation layer has a plurality of outer lead bonding apertures and a plurality of conducting wire pattern apertures which expose the part of the conducting wire pattern. The transparent conducting layer is electrically connected with the conducting wire pattern via the outer lead bonding apertures and the conducting wire pattern apertures. The conductive adhesive completely covers the conducting wire pattern exposed by the outer lead bonding apertures and the conducting wire pattern apertures of the insulation layer. The invention blocks moisture by using the conducting glue, and prevents the corrosion of the conducting wire pattern.
Description
[technical field]
The invention relates to a display floater and its control circuit encapsulating structure, be meant a kind of conducting resinl moisture-barrier of utilizing especially, can avoid wire pattern that display floater and its control circuit encapsulating structure of corrosion take place.
[background technology]
Along with the demand for high image quality and slimming display on the market drives down, the encapsulation pattern of display panels is also towards the trend development of high pin number (high pin count) with ultra fine-pitch (fine pitch).
Display panels consists predominantly of a multiple substrate (array substrate), a colored filter substrate (CF substrate), and is arranged at layer of liquid crystal molecule wherein.Can lay many metal conductive line pattern on the multiple substrate,, be passed to thin-film transistor or common electrode, control the GTG of display panels by this as scanning signal, document signal or common electrode signal to supply with control circuit (drive IC) with controlling signal.
Generally speaking display panels can carry out a reliability test after completing, allowing display panels be in the environment of high temperature and high humility operates for a long time, by the reliability that under above-mentioned rugged environment, detects display panels, yet in the process of reliability test, but make metal conductive line pattern produce etching problem easily, particularly for the plain conductor that transmits the high pressure signal.In case and metal conductive line pattern generation corrosion phenomenon, the resistance value that will cause lead changes and influences the transmission of signal, when etching problem is serious even can cause broken string.Generally speaking, the reason that corrosion phenomenon takes place mainly is the moisture isolation capacity deficiency that the envelope of metal conductive line pattern is ended the glue material, and the excessive institute of electric field strength causes in the cooperation.
Please refer to Fig. 1, Fig. 1 is the schematic diagram of the control circuit encapsulating structure of a known display panels.Shown in the 1st figure, display panels includes a multiple substrate 10, and the periphery of multiple substrate 10 includes a control circuit bonding pad 12.From bottom to top include a first metal layer pattern 14, an insulating barrier 16, one second metal layer pattern 18, a protective layer 20 on the multiple substrate 10 in regular turn; wherein insulating barrier 16 includes an outer pin coupling opening 22; expose part the first metal layer pattern 14; protective layer 20 then includes one second metal level opening 24, exposes part second metal layer pattern 18.In addition, multiple substrate 10 includes a transparency conducting layer 26 in addition, electrically connects the first metal layer pattern 14 and second metal layer pattern 18 by the outer pin coupling opening 22 and the second metal level opening 24.
Above-mentioned is the configuration of the metal conductive line pattern on the multiple substrate 10, and known control circuit encapsulating structure comprises control chip encapsulating structure 30 in addition, and by a conducting resinl 28 and transparency conducting layer 26 electric connections, the controlling signal sent of control chip encapsulating structure 30 can be passed to multiple substrate 10 via conducting resinl 28, transparency conducting layer 26, the first metal layer pattern 14 and second metal layer pattern 18 by this, with the control display panels.
As previously mentioned, the main cause of metal conductive line pattern generation corrosion phenomenon is the moisture isolation capacity deficiency that the envelope of metal conductive line pattern is ended the glue material, and in the control circuit encapsulating structure of known display panels, conducting resinl 28 only is covered on the outer pin coupling opening 22 with control chip encapsulating structure 30, and be not covered in other zone in the control circuit bonding pad 12, for example on the second metal level opening 24, change on the second metal level opening 24 of speech and only be coated with transparency conducting layer 26, yet the moisture isolation capacity of transparency conducting layer 26 is not good, when if adjacent lead has bigger potential difference under this situation in the metal conductive line pattern, for example working as a lead is to be used to transmit a high potential signal (as Vgh), and its adjacent lead is to be used to transmit an electronegative potential signal (as Vcom), no matter then be that the first metal layer pattern 14 or second metal layer pattern 18 that electrically connects with it all very easily produce etching problem.
[summary of the invention]
Therefore one of purpose of the present invention be to provide a display floater and its control circuit assembling structure, produce etching problem to avoid wire pattern.
For reaching above-mentioned purpose, the invention provides a kind of display floater, it is characterized in that: include:
One multiple substrate, this multiple substrate includes a control circuit bonding pad, this control circuit bonding pad includes a wire pattern, and an insulating barrier that is covered on this wire pattern, this insulating barrier has several outer pin coupling openings and several expose the wire pattern opening of this wire pattern of part;
One transparency conducting layer is arranged on this insulating barrier, and this transparency conducting layer sees through this each outer pin coupling opening and this each wire pattern opening and this wire pattern and electrically connects;
One conducting resinl is arranged on this transparency conducting layer and this insulating barrier; And
One control chip encapsulating structure is arranged at the surface of this conducting resinl, and this control chip encapsulating structure electrically is connected with this transparency conducting layer by this conducting resinl;
Wherein this conducting resinl covers this each outer pin coupling opening of this insulating barrier and this wire pattern that this each wire pattern opening is exposed fully.
For reaching above-mentioned purpose, the present invention provides the control circuit encapsulating structure of a display floater in addition, it is characterized in that: include:
One substrate: a wire pattern is laid on this substrate; One insulating barrier is covered in the surface of this wire pattern, and this insulating barrier has several outer pin coupling openings, and several expose the wire pattern opening of this wire pattern of part; One transparency conducting layer is arranged on this insulating barrier, and this transparency conducting layer sees through this each outer pin coupling opening and this each wire pattern opening and this wire pattern and electrically connects; Conducting resinl, be arranged on this transparency conducting layer and this insulating barrier, this conducting resinl is that correspondence respectively should outer pin coupling opening and this wire pattern opening respectively, and the size of this conducting resinl is greater than the size that respectively should outer pin coupling opening and the size of this wire pattern opening respectively, and this conducting resinl covers respectively this wire pattern that should outer pin coupling opening be exposed with this wire pattern opening respectively fully by this; And a control chip encapsulating structure, being arranged at the surface of this conducting resinl, this control chip encapsulating structure electrically is connected with this transparency conducting layer by this conducting resinl.
In sum, the design of display floater of the present invention and its control circuit encapsulating structure is to utilize originally to be used to adhere and to electrically connect the barrier layer of the conducting resinl of multiple substrate and control chip encapsulating structure as isolated moisture, be covered on the wire pattern by the conducting resinl after the sclerosis, can effectively block moisture and avoid wire pattern in reliability test or under high humidity environment when operation the corrosion situation takes place.
In order a nearlyer step to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing.Yet appended graphic only for reference and aid illustration usefulness is not to be used for the present invention is limited.
[description of drawings]
Fig. 1 is the schematic diagram of the control circuit encapsulating structure of a known display panels.
Fig. 2 is the schematic diagram of the display floater of the present invention's one first preferred embodiment.
Fig. 3 is the schematic diagram of the display floater of the present invention's one second preferred embodiment.
Fig. 4 to Fig. 6 is the vertical view of the control circuit bonding pad of display floater.
[embodiment]
State with other purpose, feature and advantage and can become apparent on the present invention for allowing, hereinafter the spy enumerates several preferred embodiments, and cooperate appended graphic, be described in detail below, what deserves to be explained is that display floater of the present invention and its control circuit encapsulating structure can be applicable to various display unit such as display panels, electric slurry display panel and organic luminous panel.
See also Fig. 2, Fig. 2 is the schematic diagram of the display floater of the present invention's one first preferred embodiment.As shown in Figure 2, the display floater of present embodiment includes a multiple substrate 50, and multiple substrate 50 includes a control circuit bonding pad 52, one wire patterns and is laid in the control circuit bonding pad 52, and an insulating barrier 56 is covered in the surface of wire pattern.In present embodiment; wire pattern is to be the pair of lamina metal conductive line pattern; it includes a first metal layer pattern 54, one second metal layer pattern 58; insulating barrier 56 then includes the surface that one first insulating barrier 56a is covered in the first metal layer pattern 54, and one second insulating barrier (protective layer) 56b is covered in the surface of second metal layer pattern 58.The first insulating barrier 56a includes several outer pin coupling openings 62, exposes part the first metal layer pattern 54, the second insulating barrier 56b and then includes several second metal level openings (wire pattern opening) 64, exposes part second metal layer pattern 58.
In addition, be provided with a transparency conducting layer 66 on the insulating barrier 56, transparency conducting layer 66 sees through outer pin coupling opening 62 and is connected with the first metal layer pattern 54, and see through the second metal level opening 64 and be connected with second metal layer pattern 58, the first metal layer pattern 54 and second metal layer pattern 58 electrically connect mutually by this, and can reduce the resistance value of wire pattern.The effect of wire pattern is the signal of control circuit is passed to display floater, therefore wire pattern be with multiple substrate 50 on thin-film transistor or electric connection such as common electrode, wherein the first metal layer pattern 54 is that the first metal layer (metal 1) with thin-film transistor defines simultaneously, second metal layer pattern 58 then defines simultaneously with second metal level (metal 2) of thin-film transistor, and look the defeated signal difference of institute's tendency to develop, be connected with scan line or data line respectively.
What deserves to be explained is, the conducting resinl 68 of present embodiment display floater is to be covered in fully on the outer pin coupling opening 62 and the second metal level opening 64, and because conducting resinl 68 can be heated sclerosis after attaching control chip encapsulating structure 70, therefore having good moisture blocks ability, the first metal layer pattern 54 and second metal layer pattern 58 are by the covering of conducting resinl 68 and can be isolated with extraneous moisture effectively, so can effectively reduce the probability of wire pattern generation corrosion phenomenon under this situation.
See also Fig. 3, Fig. 3 is the schematic diagram of the display floater of the present invention's one second preferred embodiment, and wherein for ease of comparing the similarities and differences of present embodiment and previous embodiment, assembly identical in Fig. 3 uses the label identical with Fig. 2.As shown in Figure 3; the display floater of present embodiment includes a multiple substrate 50; multiple substrate 50 includes a control circuit bonding pad 52; one the first metal layer pattern 54 is located on the multiple substrate 50 in the control circuit bonding pad 52; one first insulating barrier 56a is covered in surface, one second metal layer pattern 58 of the first metal layer pattern 54, and one second insulating barrier (protective layer) 56b is covered in the surface of second metal layer pattern 58.The first insulating barrier 56a includes several outer pin coupling openings 62, and several the first metal layer openings 63 expose part the first metal layer pattern 54, its China and foreign countries' pin coupling opening 62 is the outer pin layers 74 corresponding to control chip encapsulating structure 70, the usefulness of with electric connection by this, the first metal layer opening 63 is then not corresponding with outer pin layer 74, but since on the structural design or wire pattern electrical etc. consider set.In addition, the second insulating barrier 56b then includes several second metal level openings 64, exposes part second metal layer pattern 58.
Be provided with a transparency conducting layer 66 on the insulating barrier 56, transparency conducting layer 66 sees through outer pin coupling opening 62 and is connected with the first metal layer pattern 54 with the first metal layer opening 63, and see through the second metal level opening 64 and be connected with second metal layer pattern 58, the first metal layer pattern 54 and second metal layer pattern 58 electrically connect mutually by this, and can reduce the resistance value of wire pattern.
Be in the previous embodiment difference, because the present embodiment display floater includes outer pin coupling opening 62, the first metal layer opening 63 and the second metal level opening 64, therefore the setting of conducting resinl 68 is to be covered in fully on outer pin coupling opening 62, the first metal layer opening 63 and the second metal level opening 64, and the first metal layer pattern 54 and the good moisture isolation capacity of second metal layer pattern 58 more can effectively be provided by this.
By two embodiment of the invention described above as can be known the present invention utilize the comprehensive Coverage Control circuit of conducting resinl bonding pad, block the infiltration of aqueous vapor by this and reach the function of corrosion protection.In practical application, the setting of conducting resinl does not need comprehensive Coverage Control circuit bonding pad, and visual control circuit bonding pad layout type difference is changed.Please refer to Fig. 4 to Fig. 6, Fig. 4 to Fig. 6 is the vertical view of the control circuit bonding pad of display floater, wherein Fig. 4 has shown the display floater design that only has outer pin coupling opening, Fig. 5 has shown the display floater design with outer pin coupling opening and the first metal layer opening, and Fig. 6 shown have outer pin coupling opening, the display floater of the first metal layer opening and the second metal level opening designs.
As shown in Figure 4, in control circuit bonding pad 52, the length of conducting resinl 68 and width are respectively La and W2, and the length of outer pin coupling opening 62 and width are respectively Lb and W1.Owing in control circuit bonding pad 52, only be provided with outer pin coupling opening 62, therefore conducting resinl 68 and outside the length and the width of pin coupling opening 62 satisfy under the condition of La＞Lb and W2＞W1, can effectively avoid etching problem.In other words, conducting resinl 68 covers the wire pattern that outer pin coupling opening 62 is exposed, and can effectively completely cut off moisture, and Coverage Control circuit bonding pad 52 comprehensively.
As shown in Figure 5, in control circuit bonding pad 52, the length of conducting resinl 68 and width are respectively La and W2, the length of outer pin coupling opening 62 and the first metal layer opening 63 and for Lc, width be W1.Because pin coupling opening 62 and the first metal layer opening 63 outside in control circuit bonding pad 52, only being provided with, therefore satisfy under the condition of La＞Lc and W2＞W1 with the length and the width of the first metal layer opening 63 at conducting resinl 68, outer pin coupling opening 62, can effectively avoid etching problem.Change speech, conducting resinl 68 only need cover outer pin coupling opening 62 and the wire pattern that the first metal layer opening 63 is exposed, and can effectively completely cut off moisture, and Coverage Control circuit bonding pad 52 comprehensively.
As shown in Figure 6, in control circuit bonding pad 52, the length of conducting resinl 68 and width are respectively La and W2, the length of outer pin coupling opening 62, the first metal layer opening 63 and the second metal level opening 64 and for Ld, width be W1.Because pin coupling opening 62, the first metal layer opening 63 and the second metal level opening 64 outside in control circuit bonding pad 52, being provided with, therefore length and the width at conducting resinl 68, outer pin coupling opening 62, the first metal layer opening 63 and the second metal level opening 64 satisfies under the condition of La＞Ld and W2＞W1, can effectively avoid etching problem.
From the above, at various different display floaters design, design principle of the present invention is that the size of conducting resinl should be greater than the size of each outer pin coupling opening and the size of each wire pattern opening (including the first metal layer opening and the second metal level opening), conducting resinl can cover the wire pattern that each outer pin coupling opening and each wire pattern opening are exposed fully by this, and reaches the effect of isolated moisture.
The above only is preferred embodiment of the present invention, and is all according to equalization variation and modification that the present invention did, all should belong to covering scope of the present invention.
[primary clustering symbol description]
10 multiple substrates, 12 control circuit bonding pads
14 the first metal layer patterns, 16 insulating barriers
18 second metal layer patterns, 20 protective layers
22 outer pin coupling opening 24 second metal level openings
26 transparency conducting layers, 28 conducting resinls
50 multiple substrates, 52 control circuit bonding pads
54 the first metal layer patterns, 56 insulating barriers
The 56a first insulating barrier 56b second insulating barrier
58 second metal layer patterns, 62 outer pin coupling openings
63 the first metal layer openings, 64 second metal level openings
66 transparency conducting layers, 68 conducting resinls
70 control chip encapsulating structures, 72 bearing beds
74 outer pin layers
Claims (15)
1. display floater is characterized in that: include:
One multiple substrate, this multiple substrate includes a control circuit bonding pad, this control circuit bonding pad includes a wire pattern, and an insulating barrier that is covered on this wire pattern, this insulating barrier has several outer pin coupling openings and several expose the wire pattern opening of this wire pattern of part;
One transparency conducting layer is arranged on this insulating barrier, and this transparency conducting layer sees through this each outer pin coupling opening and this each wire pattern opening and this wire pattern and electrically connects;
One conducting resinl is arranged on this transparency conducting layer and this insulating barrier; And
One control chip encapsulating structure is arranged at the surface of this conducting resinl, and this control chip encapsulating structure electrically is connected with this transparency conducting layer by this conducting resinl;
Wherein this conducting resinl covers this each outer pin coupling opening of this insulating barrier and this wire pattern that this each wire pattern opening is exposed fully.
2. display floater as claimed in claim 1 is characterized in that: this wire pattern includes a first metal layer pattern and one second metal layer pattern.
3. display floater as claimed in claim 2 is characterized in that: this wire pattern opening includes several the first metal layer openings that exposes this first metal layer pattern.
4. display floater as claimed in claim 2 is characterized in that: this wire pattern opening includes several second metal level openings that exposes this second metal layer pattern.
5. display floater as claimed in claim 1 is characterized in that: this conducting resinl is an anisotropy conductiving glue.
6. display floater as claimed in claim 1 is characterized in that: this control chip encapsulating structure is one crystal grain/mantle encapsulating structure.
7. display floater as claimed in claim 1 is characterized in that: this control chip encapsulating structure is a coil type soft carrier plate encapsulating structure.
8. the control circuit encapsulating structure of a display floater is characterized in that: include:
One substrate:
One wire pattern is laid on this substrate;
One insulating barrier is covered in the surface of this wire pattern, and this insulating barrier has several outer pin coupling openings, and several expose the wire pattern opening of this wire pattern of part;
One transparency conducting layer is arranged on this insulating barrier, and this transparency conducting layer sees through this each outer pin coupling opening and this each wire pattern opening and this wire pattern and electrically connects;
Conducting resinl, be arranged on this transparency conducting layer and this insulating barrier, this conducting resinl is that correspondence respectively should outer pin coupling opening and this wire pattern opening respectively, and the size of this conducting resinl is greater than the size that respectively should outer pin coupling opening and the size of this wire pattern opening respectively, and this conducting resinl covers respectively this wire pattern that should outer pin coupling opening be exposed with this wire pattern opening respectively fully by this; And
One control chip encapsulating structure is arranged at the surface of this conducting resinl, and this control chip encapsulating structure electrically is connected with this transparency conducting layer by this conducting resinl.
9. the control circuit encapsulating structure of display floater as claimed in claim 8 is characterized in that: this substrate is a multiple substrate of this display floater.
10. the control circuit encapsulating structure of display floater as claimed in claim 8, it is characterized in that: this wire pattern includes a first metal layer pattern and one second metal layer pattern.
11. the control circuit encapsulating structure of display floater as claimed in claim 10 is characterized in that: this wire pattern opening includes several the first metal layer openings that exposes this first metal layer pattern.
12. the control circuit encapsulating structure of display floater as claimed in claim 10 is characterized in that: this wire pattern opening includes several second metal level openings that exposes this second metal layer pattern.
13. the control circuit encapsulating structure of display floater as claimed in claim 8 is characterized in that: this conducting resinl is an anisotropy conductiving glue.
14. the control circuit encapsulating structure of display floater as claimed in claim 8 is characterized in that: this control chip encapsulating structure is one crystal grain/mantle encapsulating structure.
15. the control circuit encapsulating structure of display floater as claimed in claim 8 is characterized in that: this control chip encapsulating structure is a coil type soft carrier plate encapsulating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101019335A CN100452379C (en) | 2006-07-11 | 2006-07-11 | Display panel and encapsulation structure of its control circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101019335A CN100452379C (en) | 2006-07-11 | 2006-07-11 | Display panel and encapsulation structure of its control circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101106117A CN101106117A (en) | 2008-01-16 |
| CN100452379C true CN100452379C (en) | 2009-01-14 |
Family
ID=38999931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101019335A Active CN100452379C (en) | 2006-07-11 | 2006-07-11 | Display panel and encapsulation structure of its control circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100452379C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253507B (en) * | 2011-04-08 | 2014-03-26 | 深圳市华星光电技术有限公司 | Chip fanout forming method |
| TWI453513B (en) * | 2011-11-18 | 2014-09-21 | Au Optronics Corp | Display panel |
| CN104049398B (en) * | 2014-06-19 | 2017-01-25 | 深圳市华星光电技术有限公司 | Display panel and manufacturing method thereof |
| CN109979907B (en) * | 2017-12-28 | 2021-01-08 | 瀚宇彩晶股份有限公司 | Electronic product |
| CN108717834B (en) * | 2018-05-24 | 2021-01-22 | 上海九山电子科技有限公司 | Transparent LED display panel and transparent LED display device |
| CN109003566B (en) * | 2018-06-19 | 2021-07-13 | 南京中电熊猫液晶显示科技有限公司 | Detection device and detection method for display panel |
| CN110571224B (en) * | 2019-08-05 | 2021-12-28 | 深圳市华星光电半导体显示技术有限公司 | Display device and method for manufacturing the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10199930A (en) * | 1996-12-28 | 1998-07-31 | Casio Comput Co Ltd | Connection structure of electronic components and connecting method therefor |
| JP2003290178A (en) * | 2002-03-29 | 2003-10-14 | Glory Ltd | Finger print detector and production method therefor |
| CN1731579A (en) * | 2005-07-25 | 2006-02-08 | 友达光电股份有限公司 | Chip with buffer layer and electric engagement device applying the chip and display board |
| US20060035036A1 (en) * | 2004-08-16 | 2006-02-16 | Telephus Inc. | Anisotropic conductive adhesive for fine pitch and COG packaged LCD module |
| CN1794448A (en) * | 2005-11-02 | 2006-06-28 | 友达光电股份有限公司 | Chip pressing structure and its shaping method and electronic installation |
-
2006
- 2006-07-11 CN CNB2006101019335A patent/CN100452379C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10199930A (en) * | 1996-12-28 | 1998-07-31 | Casio Comput Co Ltd | Connection structure of electronic components and connecting method therefor |
| JP2003290178A (en) * | 2002-03-29 | 2003-10-14 | Glory Ltd | Finger print detector and production method therefor |
| US20060035036A1 (en) * | 2004-08-16 | 2006-02-16 | Telephus Inc. | Anisotropic conductive adhesive for fine pitch and COG packaged LCD module |
| CN1731579A (en) * | 2005-07-25 | 2006-02-08 | 友达光电股份有限公司 | Chip with buffer layer and electric engagement device applying the chip and display board |
| CN1794448A (en) * | 2005-11-02 | 2006-06-28 | 友达光电股份有限公司 | Chip pressing structure and its shaping method and electronic installation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101106117A (en) | 2008-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100452379C (en) | Display panel and encapsulation structure of its control circuit | |
| TW397924B (en) | A liquid crystal display apparatus having terminal protected from breaking down | |
| US8049856B2 (en) | Display substrate and display device having the same | |
| CN111919164B (en) | Display panel with narrow lower frame and electronic equipment | |
| CN101452126B (en) | Liquid crystal display device and fabricating method thereof | |
| US7507592B2 (en) | Bonding pad structure for a display device and fabrication method thereof | |
| US7403256B2 (en) | Flat panel display and drive chip thereof | |
| CN201590281U (en) | Fan-shaped conducting wire structure and display panel adopted by same | |
| CN101135798A (en) | Liquid crystal display device | |
| US7109575B2 (en) | Low-cost flexible film package module and method of manufacturing the same | |
| CN109459895A (en) | Display panel and display device | |
| CN101216619B (en) | Planar display and method of manufacture and photoelectric device and process for production thereof | |
| CN106950763A (en) | Display module and terminal | |
| CN105867710A (en) | Flat panel display with integrated touch screen panel | |
| CN101574022A (en) | Electronic circuit device, process for manufacturing the same and display apparatus | |
| CN111430421B (en) | Display device and method for manufacturing the same | |
| US6624868B1 (en) | Chip-on-glass (COG) structure liquid crystal display (LCD) | |
| WO2020156595A9 (en) | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof | |
| US7639338B2 (en) | LCD device having external terminals | |
| WO2021103352A1 (en) | Display apparatus | |
| KR100243914B1 (en) | The structure of tap-pad part and its manufacturing method of lcd panel | |
| CN101840080B (en) | Liquid crystal display | |
| CN101779525A (en) | Wiring board and liquid crystal display device | |
| KR100557260B1 (en) | Liquid crystal display device | |
| CN101221971A (en) | Plane display device and its testing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |