CN101373681B - Temperature fuse - Google Patents
Temperature fuse Download PDFInfo
- Publication number
- CN101373681B CN101373681B CN2008102110439A CN200810211043A CN101373681B CN 101373681 B CN101373681 B CN 101373681B CN 2008102110439 A CN2008102110439 A CN 2008102110439A CN 200810211043 A CN200810211043 A CN 200810211043A CN 101373681 B CN101373681 B CN 101373681B
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- CN
- China
- Prior art keywords
- fuse element
- electrical fuse
- fusing point
- conductor
- thermal cutoffs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000004888 barrier function Effects 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 22
- 239000012528 membrane Substances 0.000 claims description 60
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 230000004927 fusion Effects 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 230000008595 infiltration Effects 0.000 claims description 8
- 238000001764 infiltration Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 3
- 238000002955 isolation Methods 0.000 abstract 1
- 238000004904 shortening Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 229910001325 element alloy Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006334 epoxy coating Polymers 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0412—Miniature fuses specially adapted for being mounted on a printed circuit board
Abstract
This invention provides a temperature fuse, in substrate based temperature fuses, shortening distance between welding position of fuse element on film electrode and joint part of lead conductor to achieve minimization of the main body. Thus, fuse elements (3) are thoroughly welded on the film electrodes (a, b), lead conductors (A, B) are combined with the film electrodes (a, b) via soft soldering process, meltdown solder for soft soldering process or immerged extending isolation barriers (6a, 6b) for fuse element welding process are disposed between the welding position on each of the film electrodes (a, b) and soft soldering joint of the lead conductors.
Description
Technical field
The present invention relates to Thermal Cutoffs, can be used as and be assembled in the strip resistance Thermal Cutoffs that uses on the secondary battery protection circuit.
Background technology
As Thermal Cutoffs; A pair of electrical fuse element connection is set on the one side of insulated substrate uses membrane electrode; And spread all over these membrane electrodes through engaging electrical fuse element, and, each electrical fuse element comes the bonding wire conductor on connecting with membrane electrode through welding or solder, on electrical fuse element, apply flux (flux); This flux is applied the substrate type temperature fuse that electrical fuse element uses epoxy resin layer etc. to carry out sealing (for example to be known by the public; The 5th figure of patent documentation 1, the 6th figure), by protection unit exception adstante febre, produce heat through it and make electrical fuse element fusing cut off power supply to equipment.
With respect to aforesaid substrate type Thermal Cutoffs; On substrate, set up film resistance; And made the film resistance heating power during unit exception by protection, produce heat through it and electrical fuse element fusing is cut off to the strip resistance Thermal Cutoffs of the power supply of equipment also known (for example, patent documentation 2) by the public.
[patent documentation 1] Japan Patent Publication Laid-Open is put down the 3-43925 communique
[patent documentation 2] Japan Patent Publication Laid-Open 2003-217416 communique
In substrate type temperature fuse and strip resistance substrate type temperature fuse, be to carry on printed wiring board, to use mostly, require to make main part miniaturization as best one can.For example, in the strip resistance substrate type temperature fuse, sometimes be that the protecting secondary battery of packing into is housed in the cell package after with circuit board again and uses, on receiving space, require miniaturization.
In above-mentioned Thermal Cutoffs, strip resistance Thermal Cutoffs, carry out engaging of each membrane electrode and electrical fuse element through welding, through solder or weld and carry out engaging of each membrane electrode and leading-in conductor.Yet if the distance from the weld of electrical fuse element and membrane electrode to the joint of leading-in conductor and membrane electrode is shortened, when carrying out the joint of leading-in conductor through solder, scolding tin will soak on membrane electrode to be expanded and contacts with electrical fuse element.
In addition; The welding of membrane electrode and electrical fuse element is carried out through Laser Welding, Reflow Soldering etc.; If the distance from the weld of electrical fuse element and membrane electrode to the joint of leading-in conductor and membrane electrode is shortened; Then the electrical fuse element molten alloy of weld soaks into expansion on membrane electrode, and this electrical fuse element molten alloy will engage scolding tin with leading-in conductor and contact.Under the situation that the joint of leading-in conductor carries out through welding such as spot welding, contacting of leading-in conductor leading section and fusion electrical fuse element alloy will be taken place.
Like this; If contacting of electrical fuse element alloy and leading-in conductor joint scolding tin or contacting of the plating Sn of electrical fuse element alloy and leading-in conductor leading section take place; With scolding tin composition element taking place to the transfer of electrical fuse element or above-mentioned Sn transfer to electrical fuse element; The melting characteristic of electrical fuse element will change, and might move malfunctioning.
Thereby the distance that shortens between the joint of weld and leading-in conductor of the electrical fuse element on the above-mentioned membrane electrode just has problem with the downsizing of the main part of the main part of seeking substrate type temperature fuse or strip resistance substrate type temperature fuse.
Summary of the invention
The object of the invention just is to provide a kind of electrical fuse element that on the one side of substrate, is provided with to connect and to use membrane electrode; And on this membrane electrode, set up electrical fuse element through welding; The substrate type temperature fuse that the bonding wire conductor forms on each membrane electrode has perhaps further been set up the strip resistance substrate type temperature fuse of film resistance; To there be obstacle ground to shorten the weld of electrical fuse element and the distance between the leading-in conductor joint, with the downsizing of the main part of the main part of seeking substrate type temperature fuse or strip resistance substrate type temperature fuse.
The Thermal Cutoffs that technical scheme of the present invention 1 is related; It is characterized in that: on the one side of substrate, have the electrical fuse element connection and use membrane electrode; And spread all over these membrane electrodes and weld electrical fuse element; Leading-in conductor is bonded on each membrane electrode through solder, and the infiltration expansion of the molten alloy when fusion scolding tin when being provided with to above-mentioned solder between electrical fuse element weld on each membrane electrode and the leading-in conductor solder joint or electrical fuse element welding cuts off barrier.
The Thermal Cutoffs that technical scheme of the present invention 2 is related; It is characterized in that: on the one side of substrate, have the electrical fuse element connection and use membrane electrode; And spread all over these membrane electrodes and weld electrical fuse element; Leading-in conductor is bonded on each membrane electrode through welding, and the infiltration expansion of the molten alloy when setting is welded to above-mentioned electrical fuse element between electrical fuse element weld on each membrane electrode and the leading-in conductor welds joint cuts off barrier.
The Thermal Cutoffs that technical scheme of the present invention 3 is related is characterized in that the another side of substrate is provided with film resistance in the related Thermal Cutoffs of technical scheme 1.
The Thermal Cutoffs that technical scheme of the present invention 4 is related is characterized in that the another side of substrate is provided with film resistance in the related Thermal Cutoffs of technical scheme 2.
The Thermal Cutoffs that technical scheme of the present invention 5 is related is characterized in that the solder temperature of ribbon lead conductor adopts the temperature of the fusing point that is higher than electrical fuse element in the related Thermal Cutoffs of technical scheme 1.
The Thermal Cutoffs that technical scheme of the present invention 6 is related is characterized in that the solder temperature of ribbon lead conductor adopts the temperature of the fusing point that is higher than electrical fuse element in the related Thermal Cutoffs of technical scheme 3.
The Thermal Cutoffs that technical scheme of the present invention 7 is related is characterized in that in the related Thermal Cutoffs of technical scheme 1, and the fusing point of barrier is the temperature of fusing point that is higher than fusing point and the electrical fuse element of scolding tin.
The Thermal Cutoffs that technical scheme of the present invention 8 is related is characterized in that the fusing point of barrier is the temperature that is higher than the fusing point of electrical fuse element in the related Thermal Cutoffs of technical scheme 2.
The Thermal Cutoffs that technical scheme of the present invention 9 is related is characterized in that in the related Thermal Cutoffs of technical scheme 3, and the fusing point of barrier is the temperature of fusing point that is higher than fusing point and the electrical fuse element of scolding tin.
The Thermal Cutoffs that technical scheme of the present invention 10 is related is characterized in that the fusing point of barrier is the temperature that is higher than the fusing point of electrical fuse element in the related Thermal Cutoffs of technical scheme 4.
The Thermal Cutoffs that technical scheme of the present invention 11 is related is characterized in that in the related Thermal Cutoffs of technical scheme 5, and the fusing point of barrier is the temperature of fusing point that is higher than fusing point and the electrical fuse element of scolding tin.
The Thermal Cutoffs that technical scheme of the present invention 12 is related is characterized in that in the related Thermal Cutoffs of technical scheme 6, and the fusing point of barrier is the temperature of fusing point that is higher than fusing point and the electrical fuse element of scolding tin.
The Thermal Cutoffs that technical scheme of the present invention 13 is related; It is characterized in that the length direction thermal resistance of the leading-in conductor C relative with film resistance is higher than the length direction thermal resistance of the leading-in conductor relative with electrical fuse element in the related Thermal Cutoffs of technical scheme 3～12.
The Thermal Cutoffs that technical scheme of the present invention 14 is related is characterized in that the material of the leading-in conductor C relative with film resistance is an iron system in the related Thermal Cutoffs of technical scheme 13, and the material of the leading-in conductor relative with electrical fuse element is a copper system.
Because at the weld of electrical fuse element and membrane electrode with for barrier between the leading-in conductor joint of same membrane electrode, the infiltration expansion of molten alloy when the membrane electrode place is provided with the welding of the infiltration expansion that cuts off scolding tin or electrical fuse element, thus can prevent leading-in conductor engage scolding tin when the contact of electrical fuse element or electrical fuse element weld molten alloy to the contact of leading-in conductor joint.In the case, can make the weld of electrical fuse element and membrane electrode and be to set up the required minimal distance of barrier for the distance between the leading-in conductor joint of same membrane electrode.Under this short distance, also can get rid of contacting of electrical fuse element alloy and leading-in conductor joint scolding tin or contacting of the plating Sn of electrical fuse element alloy and leading-in conductor leading section; And can avoid scolding tin composition element to the transfer of electrical fuse element or above-mentioned Sn to the variation of the melting characteristic of the electrical fuse element that transfer caused of electrical fuse element, can guarantee stable operating characteristics.
Description of drawings
Fig. 1 is the figure of expression according to Thermal Cutoffs one embodiment of the present invention.
Fig. 2 is the figure of expression according to strip resistance Thermal Cutoffs one embodiment of the present invention.
Fig. 3 is that the figure according to the secondary battery protection circuit plate of strip resistance Thermal Cutoffs of the present invention is carried in expression.
Fig. 4 is pack into the figure of secondary battery protection circuit of strip resistance Thermal Cutoffs of expression.
Embodiment
Below, with reference to accompanying drawing on one side with regard to embodiments of the invention describe on one side.
Fig. 1 plane graph that to be expression excised according to the part of an embodiment of Thermal Cutoffs of the present invention.
In Fig. 1, the 1st, thermal endurance, the insulated substrate that heat conductivity is good for example can use ceramic wafer.A, b are formed in a pair of electrical fuse element on the one side of substrate and connect and use membrane electrode, can for example printing, the sintering of silver paste are provided with through conductor paste.A, B are the ribbon lead conductors, and the thickness of ceramic wafer 1 is 250 μ m～400 μ m as thin as a wafer, are bonded on electrical fuse element through solder and connect with on the membrane electrode.On the ceramic wafer as thin as a wafer of 250 μ m～400 μ m, if weld for example spot welding leading-in conductor, just worry that the crackle of ceramic wafer is damaged, if but to utilize solder just can get rid of this unfavorable.The 3rd, spread all over electrical fuse element and connect with the electrical fuse element that welds between membrane electrode, selected scolding tin is so that the fusing point of this electrical fuse element is lower than the fusing point of above-mentioned scolding tin.F is a flux.
6a, 6b are arranged on the barrier between the weld of solder place and electrical fuse element 3 of the last leading-in conductor A of membrane electrode a, b, B, the infiltration expansion of the fusion electrical fuse element of weld when the infiltration expansion of the fusion scolding tin when cutting off the leading-in conductor solder and electrical fuse element welding.The shape of this barrier can adopt the film of weir dike or wettability difference, in the plane except that illustrated linearity, can also adopt circular-arc, semicircle shape.The insulated enclosure thing epoxy coating layer for example of the one side of covered substrate 1 is set, but diagram not.
In above-mentioned, carried out leading-in conductor A, B and after the solder of membrane electrode a, b engages, carried out the welding of electrical fuse element 3 again to membrane electrode a, b.
When solder engaged, fusion scolding tin will soak into expansion because of its surface tension, was cut off but soak into expansion at the barrier place.
In addition, during to the welding of membrane electrode (using Laser Welding, Reflow Soldering etc.), the fusion electrical fuse element of weld will soak into expansion because of its surface tension, is cut off but soak into expansion at the barrier place at electrical fuse element.
Thereby; Can prevent that leading-in conductor from engaging scolding tin molten alloy when the contact of electrical fuse element or electrical fuse element welding and can make the weld of electrical fuse element and membrane electrode and become for the distance between the leading-in conductor joint of same membrane electrode and set up the required minimal distance of barrier to the contact of leading-in conductor joint.Under this short distance, also can get rid of the electrical fuse element alloy and engage contacting of scolding tin with leading-in conductor; And can avoid the variation of the melting characteristic of the electrical fuse element that scolding tin composition element causes to the transfer of electrical fuse element, can guarantee stable operating characteristics.
When ceramic wafer is also thicker than above-mentioned thickness (250 μ m～400 μ m), can also carry out engaging of leading-in conductor and membrane electrode through welding such as spot welding.
At this moment; Molten alloy is to the contact at leading-in conductor front end place in the time of can preventing the electrical fuse element welding; And the variation of the melting characteristic of the electrical fuse element that causes to the transfer of electrical fuse element of the plating Sn that can avoid leading-in conductor surface, can guarantee stable operating characteristics.
As the material of above-mentioned barrier, use material with respect to fusion scolding tin and fusion electrical fuse element stable (thermal endurance), can use the metal of wettability differences such as pottery, heat-resistant resin, Ni such as glass (quartz), aluminium oxide or zirconia.
Fig. 2 representes the embodiment of strip resistance Thermal Cutoffs, and Fig. 2 (I) omits the insulated enclosure thing and illustrated vertical view, and Fig. 2 (II) is a rearview, and Fig. 2 (III) is the III-III sectional view among Fig. 2 (I).
In Fig. 2 (I), the 1st, thermal endurance, heat conductivity good insulation performance substrate be ceramic wafer for example.A, b are formed in the membrane electrode of one side 101 both sides of insulated substrate 1, and the 2nd, target, for example printing, the sintering of silver paste form through conductor paste.The 3rd, electrical fuse element sets across both sides membrane electrode a, b and intermediate coat electrode 2, is welded on and membrane electrode a, b, 2 infall.Electrical fuse element 3 is distinguished into part n and the m that clips intermediate coat electrode 2.On electrical fuse element 3, be coated with the apposition flux, but its diagram is omitted.A, B are bonded on both sides membrane electrode a, the last ribbon lead conductor of b respectively through solder; Two jiaos of the hand front side of substrate by otch; Last such shown in Fig. 2 (III) at each ribbon lead conductor A, B; At the step e that forms the another side side that rises to substrate near the position of cutting shoulder acies, the upper side of step is positioned at substrate another side upside, exceeds the thickness of ribbon lead conductor than it.6a, 6b are arranged on the barrier between the solder joint of membrane electrode a, b weld last and electrical fuse element 3 and ribbon lead conductor A, B.
In Fig. 2 (II), the 41, the 42nd, be set at the membrane electrode of the front and back on the substrate another side 10, likewise be provided with membrane electrode a, the b of aforesaid substrate one side through printing, the sintering of conductor paste.The film resistance that membrane electrode before and after r is arranged on is 41,42, for example printing, the sintering of ruthenium-oxide powder slurries are provided with through resistance slurry.For example glass sintering film g of diaphragm is set on film resistance.A membrane electrode 42 in the membrane electrode 41,42 of front and back is connected on the intermediate coat electrode 2 of substrate one side through through hole 24.C is the avris portion on another membrane electrode 41 in the membrane electrode 41,42 before and after being attached to, and C is the ribbon lead conductor, and leading section is engaged with on the above-mentioned avris c of portion with the mode that face engages.The 5th, the insulated enclosure thing of covered substrate one side 101; For example such shown in the figure, the screening glass 51 that dispose by on substrate one side 101, contact with flux for example potsherd, glass overlapping sheet and this screening glass 51 and substrate simultaneously between 101 encirclement flux and the hardening resin that solidifies for example epoxy resin 52 constitute.
In strip resistance Thermal Cutoffs according to the present invention, that works that the length of membrane electrode a, b is shortened as above-mentioned, thereby the planar dimension of substrate is diminished fully, so can dwindle the exterior contour of insulated enclosure thing.
Fig. 3 representes that the protecting secondary battery that carries according to strip resistance Thermal Cutoffs of the present invention uses circuit board; Overdischarge is installed on printed wiring board P prevents that switch is with FET (N) and overcharge and prevent that switch is with FET (M); To be housed in the space between FET towards downside according to the insulated enclosure thing 5 of strip resistance Thermal Cutoffs of the present invention; Make ribbon lead conductor A, B be placed on a FET above; Make ribbon lead conductor C be placed on another FET above, each ribbon lead conductor A, B, C are connected on the assigned position of distribution conductor of printed wiring board P.
In strip resistance Thermal Cutoffs according to the present invention, as above-mentioned, can make the exterior contour size decreases of insulated enclosure thing, so the interval of two FET is narrowed down, improve packing density.
Fig. 4 representes to be assembled with according to the secondary battery protection circuit of strip resistance Thermal Cutoffs of the present invention equivalent circuit when the charging, and M is that overdischarge prevents that switch from using FET, and N overcharges to prevent that switch from using FET.N, m are the electrical fuse element parts according to strip resistance Thermal Cutoffs of the present invention, and r is the film resistance of strip resistance Thermal Cutoffs, and S is the IC control part, and Tr is a transistor, and E is a secondary cell, and D is the charging source.Overdischarge prevent switch with FET, overcharge prevent switch with FET, according to strip resistance Thermal Cutoffs of the present invention, IC control part, transistor Tr etc. carried above-mentioned protecting secondary battery with circuit board on.
In Fig. 4, A, B are corresponding to the leading-in conductor of electrical fuse element side, and C is corresponding to the leading-in conductor of film resistance side.Last owing to flow through loop current always at ribbon lead conductor A, B, so use the conductor that plating Sn obtains on common conductive material such as copper, copper alloy.Only when unusual (when overcharging), according to the signal transistor switch Tr from control part connect and at leading-in conductor C upper reaches overcurrent, film resistance r heating and make electrical fuse element part n, m fusing.In the case; Leading-in conductor C uses at the higher metal of the thermal resistance conductor that for example plating Sn obtains on iron system or the nickel etc. of iron, ferroalloy etc.; Passed this leading-in conductor C and leaked with the generation heat that prevents film resistance r, and preferably made the length direction thermal resistance of leading-in conductor C be higher than the length direction thermal resistance of leading-in conductor A or B.And then, can also make the width of ribbon lead conductor C littler than the width of ribbon lead conductor A or B.In the case, can also make the resistance of resistance ratio film resistance r of leading-in conductor C enough low, and can guarantee to utilize the high efficiency heating of the film resistance r of secondary cell E.
Claims (14)
1. Thermal Cutoffs is characterized in that:
On the one side of substrate, have the electrical fuse element connection and use membrane electrode; And spread all over these membrane electrodes and weld electrical fuse element; On each membrane electrode through solder the bonding wire conductor, the infiltration expansion of the molten alloy when fusion scolding tin when being provided with to above-mentioned solder between electrical fuse element weld on each membrane electrode and the leading-in conductor solder joint or electrical fuse element welding cuts off barrier.
2. Thermal Cutoffs is characterized in that:
On the one side of substrate, have the electrical fuse element connection and use membrane electrode; And spread all over these membrane electrodes and weld electrical fuse element; On each membrane electrode, pass through welding and the bonding wire conductor, the infiltration of the molten alloy when setting is welded to above-mentioned electrical fuse element between electrical fuse element weld on each membrane electrode and the leading-in conductor welds joint is expanded and is cut off barrier.
3. according to the described Thermal Cutoffs of claim 1, it is characterized in that:
The another side of substrate is provided with film resistance.
4. according to the described Thermal Cutoffs of claim 2, it is characterized in that:
The another side of substrate is provided with film resistance.
5. according to the described Thermal Cutoffs of claim 1, it is characterized in that:
The solder temperature of leading-in conductor is higher than the fusing point of electrical fuse element.
6. according to the described Thermal Cutoffs of claim 3, it is characterized in that:
The solder temperature of leading-in conductor is higher than the fusing point of electrical fuse element.
7. according to the described Thermal Cutoffs of claim 1, it is characterized in that:
The fusing point of barrier is higher than the fusing point of scolding tin and the fusing point of electrical fuse element.
8. according to the described Thermal Cutoffs of claim 2, it is characterized in that:
The fusing point of barrier is higher than the fusing point of electrical fuse element.
9. according to the described Thermal Cutoffs of claim 3, it is characterized in that:
The fusing point of barrier is higher than the fusing point of scolding tin and the fusing point of electrical fuse element.
10. according to the described Thermal Cutoffs of claim 4, it is characterized in that:
The fusing point of barrier is higher than the fusing point of electrical fuse element.
11., it is characterized in that according to the described Thermal Cutoffs of claim 5:
The fusing point of barrier is higher than the fusing point of scolding tin and the fusing point of electrical fuse element.
12., it is characterized in that according to the described Thermal Cutoffs of claim 6:
The fusing point of barrier is higher than the fusing point of scolding tin and the fusing point of electrical fuse element.
13., it is characterized in that according to each described Thermal Cutoffs in the claim 3,4,6,9,10,12:
The length direction thermal resistance of the leading-in conductor C relative with film resistance is higher than the length direction thermal resistance of the leading-in conductor relative with electrical fuse element.
14., it is characterized in that according to the described Thermal Cutoffs of claim 13:
The material of the leading-in conductor C relative with film resistance is an iron system, and the material of the leading-in conductor relative with electrical fuse element is a copper system.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007213317 | 2007-08-20 | ||
| JP2007-213317 | 2007-08-20 | ||
| JP2007213317 | 2007-08-20 | ||
| JP2008-158792 | 2008-06-18 | ||
| JP2008158792 | 2008-06-18 | ||
| JP2008158792A JP4663759B2 (en) | 2007-08-20 | 2008-06-18 | Thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101373681A CN101373681A (en) | 2009-02-25 |
| CN101373681B true CN101373681B (en) | 2012-10-10 |
Family
ID=40447777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102110439A Active CN101373681B (en) | 2007-08-20 | 2008-08-20 | Temperature fuse |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4663759B2 (en) |
| KR (1) | KR101465265B1 (en) |
| CN (1) | CN101373681B (en) |
| TW (1) | TW200917305A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5939311B2 (en) * | 2013-01-11 | 2016-06-22 | 株式会社村田製作所 | fuse |
| CN103594300B (en) * | 2013-12-06 | 2016-08-31 | 上海长园维安电子线路保护有限公司 | A kind of temperature fuse and manufacture method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2433729Y (en) * | 2000-08-10 | 2001-06-06 | 吕俊杰 | Thin temp. fuse |
| CN1477663A (en) * | 2002-07-16 | 2004-02-25 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type temp, fuse and wire for temp, fuse component |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017776Y2 (en) * | 1981-12-14 | 1985-05-30 | 内橋金属工業株式会社 | temperature fuse |
| JPS62177249A (en) * | 1986-01-28 | 1987-08-04 | 株式会社クラレ | Interlacing nozzle |
| JPH0514438Y2 (en) * | 1987-11-19 | 1993-04-16 | ||
| JP2003217416A (en) * | 2002-01-25 | 2003-07-31 | Nec Schott Components Corp | Temperature fuse and protective device mounted with the same |
-
2008
- 2008-06-18 JP JP2008158792A patent/JP4663759B2/en active Active
- 2008-08-14 KR KR1020080080092A patent/KR101465265B1/en not_active IP Right Cessation
- 2008-08-19 TW TW097131570A patent/TW200917305A/en unknown
- 2008-08-20 CN CN2008102110439A patent/CN101373681B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2433729Y (en) * | 2000-08-10 | 2001-06-06 | 吕俊杰 | Thin temp. fuse |
| CN1477663A (en) * | 2002-07-16 | 2004-02-25 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type temp, fuse and wire for temp, fuse component |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2003-217416A 2003.07.31 |
| JP特开平10-116549A 1998.05.06 |
| JP特开平11-96870A 1999.04.09 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090019698A (en) | 2009-02-25 |
| KR101465265B1 (en) | 2014-11-26 |
| TW200917305A (en) | 2009-04-16 |
| JP4663759B2 (en) | 2011-04-06 |
| JP2009070804A (en) | 2009-04-02 |
| CN101373681A (en) | 2009-02-25 |
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