CN101367454B - Tinsel packagings - Google Patents

Tinsel packagings Download PDF

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Publication number
CN101367454B
CN101367454B CN2008101460416A CN200810146041A CN101367454B CN 101367454 B CN101367454 B CN 101367454B CN 2008101460416 A CN2008101460416 A CN 2008101460416A CN 200810146041 A CN200810146041 A CN 200810146041A CN 101367454 B CN101367454 B CN 101367454B
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CN
China
Prior art keywords
area
antenna
electronic tag
tinsel
packagings
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101460416A
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Chinese (zh)
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CN101367454A (en
Inventor
丁勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHULUN COMPUTER TECHNOLOGY (SHANGHAI) Co Ltd
Original Assignee
SHULUN COMPUTER TECHNOLOGY (SHANGHAI) Co Ltd
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Priority to CN2008101460416A priority Critical patent/CN101367454B/en
Publication of CN101367454A publication Critical patent/CN101367454A/en
Application granted granted Critical
Publication of CN101367454B publication Critical patent/CN101367454B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention relates to a metal foil package, which is made of the metal foil packing paper; the package is provided with an electronic tag; the electronic tag comprises an integrated circuit and an antenna; the integrated circuit is connected with the antenna in direct way, in capacity coupling way, or in sensibility coupling way; the integrated circuit is memorized with information; the integrated circuit exchanges the information with an external reader-writer through the antenna; a metal foil on the packing paper comprises a first zone, and the first zone is hollow, and the first zone forms a window that is used for the antenna of the electronic tag to receive/transmit the radio wave. The first zone can also form one part of the antenna; the metal foil of the packing paper also comprises a second zone; the second zone is provided with a pieced pattern that form part or all of entire antenna of the electronic tag, or the second zone is pieced, and the electronic tag is arranged inside the second zone. The electronic tag is free from the interference of the metal foil.

Description

Tinsel packagings
Technical field
The present invention relates to packing material, relate in particular to the packing material of containing metal paper tinsel, the particularly design of the electronic tag on the tinsel packagings.
Background technology
On the one hand; Being of wide application of tinsel packagings, such as: to the packing box of the damp article of cigarette, food or other fearness, here; Tinsel packagings can be directly to process with the paper of containing metal paper tinsel; Also can be to be formed by stacking by paper and the metallic paper of separating, again such as: much be used for the label of treasure such as instrument, common also is to be processed by paper that is attached with metallic paper or carboard.
On the other hand; The electronic tag design is varied on the current packaging thing; As: the disclosed a kind of Electronic Tag Carton of Chinese patent CN2851122, mainly be provided with a casing, be provided with a fender in this casing; This fender one side is provided with one and inhales the ripple material, and the corresponding casing outside of this fender is provided with the electronic tag of a less radio-frequency automatic identification system; And for example: the disclosed a kind of electronic tag that is attached to the metal surface of CN2904128; The magnetic piece, adhered layer, the surface insulation protective cover that comprise ordinary electronic label, high magnetic flux; The ordinary electronic label is close to the one side of the magnetic piece of high magnetic flux; Adhered layer is close to the another side of the magnetic piece of high magnetic flux, and the size of the magnetic piece of high magnetic flux is greater than the size of ordinary electronic label, and the surface insulation protective cover is coated on around the ordinary electronic label.
It is thus clear that; To in the metallic paper packing box or electronic tag will be set under the metallic paper label carry out the Application Design such as false proof of article the time; Existing electronic tag Application Design will run into a basic problem: the existence of metallic paper can influence the performance of electronic label antenna and block the radio wave propagation that electronic tag work is used, thereby has influence on reading the information of preserving in the IC in the electronic tag.
Summary of the invention
The technical matters that the present invention will solve is to avoid the weak point of above-mentioned prior art, and the electronic tag on the tinsel packagings is improved design, makes electronic tag not influenced and normal operation by the obstruction of metallic paper.
The technical scheme that the present invention solves the problems of the technologies described above also comprises; Manufacture a kind of tinsel packagings, processed by the metallic paper wrapper, this packing material is provided with electronic tag; This electronic tag comprises IC and antenna; This IC and this antenna direct connection or capacitive or inductive coupled the connection store information on this IC, and this IC carries out the exchange of this information through this antenna and extraneous read write line; Metallic paper on this wrapper comprises the first area, and the first area of this metallic paper is a hollow out, and this first area constitutes the antenna of this electronic tag and receives/send out the window of radiowave.
This metallic paper wrapper can have the substrate of insulation material, and this insulation material can be paper, plastics etc., and this metallic paper wrapper also can be not have the substrate of insulation material;
Has the situation of insulation material substrate for the metallic paper wrapper, when the first area of this metallic paper is hollow out, with then hollow out, the also not hollow out processing in the lump of the first area of this metallic paper corresponding insulation material base part.
This antenna refers to single antenna or aerial array.
This first area can also directly constitute the part of this antenna.
In an embodiment of tinsel packagings of the present invention, the metallic paper on this wrapper also comprises second area, and the second area of this metallic paper has pierced pattern, and this pierced pattern constitutes the local or whole of this antenna.
Be similar to the first area of metallic paper; The situation that has the substrate of insulation material for the metallic paper wrapper; The second area of this metallic paper is when having pierced pattern; Then can have pierced pattern in the lump with the corresponding insulation material of the second area of this metallic paper base part, also can not carry out hollow out and handle.
In another embodiment of tinsel packagings of the present invention; Metallic paper on this wrapper also comprises second area; The second area of this metallic paper is a hollow out, and this electronic tag is attached to placing this second area in the insulation material substrate, and; The size of electronic tag exists at interval between the border of electronic tag and the border of second area less than the size of second area.
Be similar to the first area of metallic paper; The situation that has the substrate of insulation material for the metallic paper wrapper; The second area of this metallic paper is when having pierced pattern; Then can have pierced pattern in the lump with the corresponding insulation material of the second area of this metallic paper base part, also can not carry out hollow out and handle.
In the above-described embodiments, the first area of this metallic paper and/or the second area of metallic paper can be provided with the film of insulation material to fill the space that hollow out causes, and reach moisture effect.
IC and antenna can direct connections, at this moment, also comprise in the tinsel packagings of the present invention: a metallic conductor circuit, the IC of electronic tag and this metallic conductor circuit direct connection and constitute an electronic module tag; The metallic conductor circuit is attached in the insulation material substrate, and the one of which end is connected with the IC of electronic tag, the contact point of its other end formation electronic module tag; The contact point of electronic module tag and antenna are through welding or conducting resinl direct connection;
IC and antenna also can capacitive or inductive coupled the connections; At this moment; Also comprise in the tinsel packagings of the present invention: one near closed endless metal conductor circuit, and the IC of electronic tag is arranged in the gap of this endless metal conductor circuit and constitutes an electronic module tag with the closed metallic conductor circuit direct connection of this annular; The annular closed metallic conductor circuit of approaching closure and the IC of electronic tag are all attached in the insulation material substrate; Electronic module tag is attached to antenna through non-conductive adhesive and forms capacitive or inductive coupled connection.
A typical shape of tinsel packagings of the present invention is to be box-like, and wherein, the first area of the metallic paper on electronic tag and the wrapper is positioned on opposed two faces.
Compare with prior art, tinsel packagings of the present invention, electronic tag is not influenced and normal operation by the obstruction of metallic paper can on it.
Description of drawings
Fig. 1 a is a scheme drawing before tinsel packagings embodiment one moulding of the present invention;
Fig. 1 b is a scheme drawing after tinsel packagings embodiment one moulding of the present invention;
Fig. 2 a is preceding first scheme drawings of tinsel packagings embodiment two moulding of the present invention;
Fig. 2 b is first scheme drawing after tinsel packagings embodiment two moulding of the present invention;
Fig. 2 c is preceding second scheme drawings of tinsel packagings embodiment two moulding of the present invention;
Fig. 2 d is second scheme drawing after tinsel packagings embodiment two moulding of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is made further detailed description.
Tinsel packagings embodiment one of the present invention shown in Fig. 1 a and Fig. 1 b, is processed by the wrapper 1 of band metallic paper; Packing material is provided with an electronic tag 2; Comprise the IC that links into an integrated entity 21 and antenna 22, IC 21 and antenna 22 can be direct connections or through a metallic circuit direct connection attached to a non-conductive film, also can right and wrong directly conduct electricity the capacitive or the inductive coupled connection of formula; Certainly, this antenna 22 also can be an aerial array.
The first area 11 of the metallic paper on the wrapper is a hollow out, and the wrapper 1 of band metallic paper is that the method through vacuum metallization prepares, and multiple realization means can be arranged; First method is: adopt direct vapour deposition method; Before vacuum plating, after on the coating of basic paper the place of antenna pattern being blocked, directly install on the vacuum metallization machine directly metallizing; This metal can be a good conducting metal such as aluminium, copper, silver or gold, and coating just can not be plated to this zone like this; Second method is: adopt and shift vapour deposition method; Earlier metallizing on the polyester of drum or polyacrylic film is here, the same with above-mentioned first method; After will the place of antenna pattern being blocked on the coating on the plastic sheeting; Directly install to direct metallizing on the vacuum metallization machine, and then metallic membrane is transferred on the paper substrate through adhesion agent, peel off plastic sheeting at last; The third method is: adopt and shift vapour deposition method; First metallizing on the polyester of drum or polyacrylic film directly installs on the vacuum metallization machine directly metallizing, and then metallic membrane is transferred on the paper substrate through adhesion agent; What be different from above-mentioned second method is: when shifting; Pattern through the control gluing forms antenna pattern, makes no glue part can not be transferred to paper substrate and gets on, and peels off plastic sheeting at last.No matter adopt which kind of concrete grammar, can be in due course, to above-mentioned openwork part; Metallizing part not just; Paste film, its objective is the space that filling is caused by the hollow-out parts branch, to guarantee moisture effect with the wrapper 1 of metallic paper.
This first area 11 constitutes the antenna 22 of electronic tag 2 receives/send out the window of radiowave, also possibly constitute the part of antenna 22, and the pattern of this window can be a rectangle, also can be shape square or that other is any.
The second area 12 of the metallic paper on the wrapper has the metallic paper pierced pattern of setting, the cross flute profile shown in 1a and Fig. 1 b, the part of the antenna 22 of this pierced pattern structure electronic tag or whole.The method for making of this second area 12; Similar with the method for making of above-mentioned first area 11; Repeat no more at this; Need to prove: when adopting the wrapper 1 of method for preparing band metallic paper, at first be the wrapper of preparing band metallic paper with above-mentioned first area and second area array, and then suitable cutting just obtain concrete, can be directly in order to the wrapper 1 of the metallic paper of connection with wrapping of piece.
Visible from Fig. 1 b, after wrapper 1 folded, it is box-like that tinsel packagings is, and electronic tag 2 is positioned on opposed two faces with first area 11.
The manufacturing process of above-mentioned tinsel packagings embodiment comprises:
1, adopt the vacuum metallization method, preparation has the wrapper of the band metallic paper of above-mentioned first area and second area pattern array;
2, cut out the wrapper 1 of the band metallic paper of appropriate size;
3, be directly connected to electronic tag on the metallic paper wrapper that is manufactured with antenna with IC; Perhaps, be connected on the antenna through welding or conducting resinl making good direct connection electronic tag film piece in advance; Perhaps, will connect electronic module tag indirectly is indirectly coupled on the metallic paper wrapper through capacitive or perception;
4, the metallic paper wrapper with electronic label folds or is not applied to foldedly article packing.
Tinsel packagings embodiment two of the present invention shown in Fig. 2 a to Fig. 2 d, is processed by the wrapper 1 of band metallic paper, and packing material is provided with an electronic tag 2; The metal of the first area 11 of the metallic paper on the wrapper is a hollow out; Its preparation method is with the description among the embodiment one; This first area 11 constitutes the window of an antenna receipts/radiowave of electronic tag 2, and the pattern of this window can be a rectangle, also can be shape square or that other is any.The metal of the second area 12 of the metallic paper on the wrapper also is a hollow out; Its preparation method is with the description among the embodiment one; Electronic tag 2 places this second area 12; The size of electronic tag 2 exists at interval between the border of electronic tag 2 and the border of second area less than the size of second area 12.Preferably, second area is a rectangle, can certainly be shape square or that other is any.Visible from Fig. 2 b, after wrapper 1 folded, it is box-like that tinsel packagings is, and electronic tag 2 is positioned on two relative faces with first area 11.
Wherein, IC 21 can be the direct connection shown in Fig. 2 a and Fig. 2 b with antenna 22, and antenna at this moment can be the metallic strip structures of specific pattern, and is certain, and both also can be the non-conductive film direct connections that metallic circuit is arranged through;
IC 21 and antenna 22 also can be that the capacitive of the non-direct conduction formula shown in Fig. 2 c and Fig. 2 d is of coupled connections; At this moment antenna 22 directly is made up of metallic paper; One near module of closed becket structure 23 and IC 21 formations; 21 of IC are arranged in the closed gap of this becket structure 23, and antenna 22 is through capacitive or inductive coupled and IC 21 couplings.
The manufacturing process of above-mentioned tinsel packagings embodiment comprises:
1, use the vacuum metallization method, preparation has the wrapper of the band metallic paper of above-mentioned first area and second area pattern array;
2, cut out the wrapper 1 of the band metallic paper of appropriate size;
3, lay electronic module tag in second area;
4, the metallic paper wrapper with the electronic label module folds or is not applied to foldedly article packing.
The above is merely preferred embodiment of the present invention, is not in order to restriction protection scope of the present invention, so the equivalence that all utilizations specification sheets of the present invention and accompanying drawing content are done changes, all in like manner all is contained in the rights protection scope of the present invention.

Claims (10)

1. a tinsel packagings is processed by the metallic paper wrapper, it is characterized in that:
This packing material is provided with electronic tag; This electronic tag comprises IC and antenna; This IC and this antenna direct connection or capacitive or inductive coupled the connection store information on this IC, and this IC carries out the exchange of this information through this antenna and extraneous read write line;
Metallic paper on this wrapper comprises the first area, and the metallic paper of the first area of this metallic paper is a hollow out, and this first area constitutes the antenna of this electronic tag and receives/send out the window of radiowave.
2. tinsel packagings as claimed in claim 1 is characterized in that:
This first area constitutes the part of this antenna.
3. tinsel packagings as claimed in claim 1 is characterized in that:
Metallic paper on this wrapper also comprises second area, and the second area of this metallic paper has pierced pattern, and this pierced pattern constitutes the local or whole of this antenna.
4. tinsel packagings as claimed in claim 1 is characterized in that:
Metallic paper on this wrapper also comprises second area, and the second area of this metallic paper is a hollow out, and this electronic tag is attached to the second area that places this metallic paper in the substrate of insulation material.
5. tinsel packagings as claimed in claim 4 is characterized in that:
The size of this electronic tag exists at interval between the border of the border of this electronic tag and the second area of this metallic paper less than the size of the second area of this metallic paper.
6. like claim 3,4 or 5 described tinsel packagings, it is characterized in that:
The first area of this metallic paper and/or the second area of metallic paper are provided with the film of insulation material to fill the space that hollow out causes.
7. tinsel packagings as claimed in claim 1 is characterized in that:
This tinsel packagings is box-like, and the first area of this electronic tag and this metallic paper is positioned on opposed two faces.
8. tinsel packagings as claimed in claim 1 is characterized in that:
Also comprise: a metallic conductor circuit, the IC of this electronic tag and this metallic conductor circuit direct connection and constitute an electronic module tag;
This metallic conductor is attached in the insulation material substrate, and the one of which end is connected with the IC of this electronic tag, the contact point of its other end formation electronic module tag;
The contact point of this electronic module tag and this antenna are through welding or conducting resinl direct connection.
9. tinsel packagings as claimed in claim 1 is characterized in that:
Also comprise: one near closed endless metal conductor circuit, and the IC of this electronic tag is arranged in the gap of this endless metal conductor circuit and constitutes an electronic module tag with the closed metallic conductor circuit direct connection of this annular;
Should be near the IC of closed annular closed metallic conductor circuit and this electronic tag all attached in the insulation material substrate;
This electronic module tag is attached to this antenna through non-conductive adhesive and forms capacitive or inductive coupled connection.
10. tinsel packagings as claimed in claim 1 is characterized in that:
This antenna refers to single antenna or aerial array.
CN2008101460416A 2007-08-17 2008-08-05 Tinsel packagings Expired - Fee Related CN101367454B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008101460416A CN101367454B (en) 2007-08-17 2008-08-05 Tinsel packagings

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN200710075768.5 2007-08-17
CN200710075768 2007-08-17
CN2008101460416A CN101367454B (en) 2007-08-17 2008-08-05 Tinsel packagings

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CN101367454A CN101367454A (en) 2009-02-18
CN101367454B true CN101367454B (en) 2012-01-25

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103662330B (en) * 2012-09-14 2016-12-21 苏州数伦科技有限公司 A kind of packaging bag with anti-dismounting formula RFID label tag
CN103662331B (en) * 2012-09-17 2016-12-07 苏州数伦科技有限公司 A kind of packaging bag with dismantling-proof radio frequency identification tag

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201066511Y (en) * 2007-08-17 2008-05-28 丁勇 Metal foil packing material

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201066511Y (en) * 2007-08-17 2008-05-28 丁勇 Metal foil packing material

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