CN202111230U - Anti-metal ultrahigh frequency electronic tag antenna, tag and anti-counterfeiting ring-pull can - Google Patents
Anti-metal ultrahigh frequency electronic tag antenna, tag and anti-counterfeiting ring-pull can Download PDFInfo
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- CN202111230U CN202111230U CN2011201843020U CN201120184302U CN202111230U CN 202111230 U CN202111230 U CN 202111230U CN 2011201843020 U CN2011201843020 U CN 2011201843020U CN 201120184302 U CN201120184302 U CN 201120184302U CN 202111230 U CN202111230 U CN 202111230U
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- antenna
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- metal
- ultrahigh frequency
- insulating substrate
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Abstract
The utility model relates to an anti- metal ultrahigh frequency electronic tag antenna, a tag and an anti-counterfeiting ring-pull can. The anti-metal ultrahigh frequency electronic tag antenna comprises a first antenna unit and a second antenna unit, wherein the first antenna unit is a microstrip antenna, the second antenna unit comprises a carrier and an antenna portion, the carrier of the second antenna unit across the edge of the radiation cell of the microstrip antenna is bonded on the upper surface of the radiation cell and on the surface of an insulating substrate, the antenna portion of the second antenna unit is provided with two feed ends used for connecting a chip. The anti-metal ultrahigh frequency electric tag comprises an electric tag chip and above electric tag antenna. The anti-counterfeiting ring-pull can comprises the electric tag chip and the anti-metal ultrahigh frequency electric tag antenna formed by first and second antenna units, and the electric tag chip is bonded on the second antenna unit. The antenna is simple in structure and low in manufacture cost, and when applied to a metal surface, the antenna can perform excellent communication with read write lines.
Description
Technical field
The utility model relates to a kind of anti-metal ultrahigh frequency electronic tag and antenna thereof that can use in the metal surface.
Background technology
As everyone knows; Radio wave is to be absorbed by metallic shield; Therefore, be pasted on the RFID of metal surface because metal itself to absorption of electromagnetic wave, causes RFID itself to obtain enough energy from read write line; Perhaps produce great frequency deviation, cause the RFID of metal surface can't work usually.
Traditional method in the past typically uses the microstrip antenna that pcb board (printed wire) is made anti-metal, again RFID chip nation is implanted in the antenna interconnecting piece position surely.But this method cost is high, complex structure, therefore the RFID anti-metal tag is held at high price, and has had a strong impact on the application of RFID label in the metal Related product.
Summary of the invention
The purpose of the utility model provides a kind of simple in structure, simple anti-metal ultrahigh frequency electronic tag antenna of manufacturing process.
For reaching above-mentioned purpose; The anti-metal ultrahigh frequency electronic tag of the utility model antenna is made up of first antenna element and second antenna element; First antenna element is the microstrip antenna of processing with the whole lower surface and the part upper surface of bonding mode coated insulation substrate with metallic foil; Second antenna element contains carrier and antenna part; The carrier of second antenna element is across the edge of the radiation element of said microstrip antenna and be bonded in the upper surface of radiation element and the upper surface of said insulating substrate, and the antenna part of second antenna element is provided with two feed ends that are used to connect chip.
Wherein, the insulating substrate of microstrip antenna can adopt single insulating substrate.And can be further with the part of product package boxboard insulating substrate as said microstrip antenna.For requiring the smaller occasion of label area; In order to reach the communication performance that needs; Can use the antenna structure of multilayer; That is: microstrip antenna is made up of a plurality of insulating substrates and a strip metal paper tinsel band of range upon range of setting, and said metallic foil warp repeatedly bending coats the whole lower surface of each insulating substrate and the part upper surface of top layer insulating substrate.
The antenna part of second antenna element preferably by folded dipole be arranged on folded dipole and form near two broken lines at two ends places.
The utility model also provides a kind of anti-metal ultrahigh frequency electronic tag; Comprise electronic label chip and above-mentioned electronic label antenna; Electronic label chip is bonded on second antenna element, the pin of electronic label chip directly with second antenna element on two feed ends be connected.
The utility model also provides a kind of false proof metal pop can; Comprise electronic label chip and the anti-metal ultrahigh frequency electronic tag antenna of forming by first, second two antenna elements; First antenna element is shaken hands by tank body, the unlatching of this metal pop can and is arranged at tank body and opens the microstrip antenna that the insulating substrate between the handle is formed; Second antenna element contains carrier that fragile paper processes and is printed in the antenna part on this carrier; Edge and the upper surface that is bonded in the unlatching handle and the upper surface of said insulating substrate that this carrier is shaken hands across said unlatching; The antenna part of second antenna element is provided with two feed ends, and said electronic label chip is bonded on second antenna element, and pin directly is connected with said two feed ends.
For preventing metal forming damage, extrusion coating paper in advance at the back side of metallic foil.The back side that is preferably in metallic foil is provided with Double-face gummed paper, so not only can reduce the possibility that metallic foil damages, and can also realize the bonding of metallic foil and insulating substrate through Double-face gummed paper.
The utility model adopts common insulating material; Simply be coated on this insulating material surface with aluminium foil or other metal formings and process first antenna element; As the little band path of electromagnetic wave, promptly process anti-metal ultrahigh frequency electronic tag antenna at the privileged site of first antenna element second antenna element that bonds then.Its antenna structure is simple, and is cheap for manufacturing cost.In addition, the utility model anti-metal ultrahigh frequency electronic tag antenna and tag application when the metal surface, can with the read write line good communication, and the size of antenna can do less, greatly expanded the application of RFID.
Description of drawings
Fig. 1 is the structural representation of embodiment 1 anti-metal ultrahigh frequency electronic tag antenna.
Fig. 2 is its cutaway view.
Fig. 3 is the structural representation of the anti-metal ultrahigh frequency electronic tag of employing embodiment 1 antenna.
Fig. 4 is the structural representation of embodiment 2 anti-metal ultrahigh frequency electronic tag antennas.
Fig. 5 is the structural representation of its metallic foil.
Fig. 6 is the structural representation of embodiment 3 anti-metal ultrahigh frequency electronic tag antennas.
Fig. 7 is the structural representation of the anti-metal ultrahigh frequency electronic tag of employing embodiment 3 antennas.
Fig. 8 is the structural representation of the false proof metal pop can of embodiment.
Embodiment
The utility model adopts bonding mode that metal forming is coated on the insulating substrate surface and forms microstrip antenna (being called first antenna element), pastes second antenna element in the privileged site of first antenna element then, constitutes complete anti-metal RFID antenna.Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Embodiment 1: see figures.1.and.2; This anti-metal ultrahigh frequency electronic tag antenna is made up of first antenna element 1 and second antenna element 2; First antenna element 1 is the microstrip antenna of processing with the whole lower surface and the part upper surface of bonding mode coated insulation substrate 12 with metallic foil 11; Second antenna element 2 contains carrier 21 and antenna part 22; The carrier 21 of second antenna element 2 is across the edge 131 of the radiation element 13 of said microstrip antenna and be bonded in the upper surface of radiation element and the upper surface of said insulating substrate 12, and the antenna part 22 of second antenna element 2 is provided with two feed ends 23 that are used to connect chip.First antenna element 1 carries out the transmission of energy and signal with the be coupled wireless feeding classification and second antenna element 2.
The insulating substrate 12 of microstrip antenna (i.e. first antenna element 1) is single insulating substrate.Insulating substrate 12 can adopt common insulating material, and the thickness of insulating substrate 12 can be 1-5mm, and the length L of the radiation element 13 of microstrip antenna (being the metallic foil of insulating substrate 12 upper surfaces) can adjust according to performance requirement.
The antenna part 22 of second antenna element 2 is made up of folded dipole 221 and two broken lines 222,223; Article two, broken line 222,223 is separately positioned on the folded dipole 221 and locates near two ends, and the position of said second antenna element 2 makes its antenna part 22 to be crossed over by the edge 131 of the radiation element 13 of said microstrip antenna.
Above-mentioned anti-metal ultrahigh frequency electronic tag antenna can make through following preparation method: metal forming is cut into the metallic foil 11 wide with insulating substrate 12; Cover the whole lower surface of insulating substrate 12 with a strip metal paper tinsel band 11; Cover the part upper surface of insulating substrate 12 then after the bending; Process microstrip antenna, i.e. first antenna element 1; In upper surface printing, the spraying of carrier 21 or the antenna part 22 of pasting second antenna element 2, process second antenna element 2; Make the edge 131 of the carrier 21 of second antenna element 2 then, and be bonded in the upper surface of radiation element 13 and the upper surface of said insulating substrate 12 across the radiation element 13 of said microstrip antenna.
In order to prevent that metal forming from damaging, the extrusion coating paper at the back side of metallic foil 11 in advance is as the cigarette masking foil.The back side that is preferably in metallic foil 11 is provided with Double-face gummed paper, so not only can reduce the possibility that metallic foil 11 damages, and can also realize combining of metallic foil 11 and insulating substrate 12 easily through Double-face gummed paper.
Shown in Figure 3 is the structural representation that adopts the anti-metal ultrahigh frequency electronic tag of embodiment 1 antenna.With reference to Fig. 3; This anti-metal ultrahigh frequency electronic tag; Comprise the electronic label antenna of electronic label chip 3 and embodiment 1, electronic label chip 3 is bonded on second antenna element 2, the pin of electronic label chip 3 directly with second antenna element 2 on two feed ends 23 be connected.
Embodiment 2: with reference to Fig. 4 and Fig. 5; Embodiment 2 anti-metal ultrahigh frequency electronic tag antennas and embodiment 1 are basic identical; Difference is: among the embodiment 2, the part of the boxboard 100 of the corrugated case of employing article packing is as the insulating substrate 12 of first antenna element 1.When making packing case, metallic foil 11 bags of the specific dimensions that cross cutting is good are affixed on the edge of boxboard 100, thereby first antenna element 1 is directly molded on the casing.During use, stick second antenna element 2 and promptly constitute anti-metal ultrahigh frequency electronic tag antenna.
In order to make metal forming be not easy to damage, the available mode that is similar to the cigarette masking foil is combined with each other metal forming and paper in advance, more convenient like this use.Dotted line is represented crease line among Fig. 5, and the distance between two crease lines equates with the thickness of boxboard 100.
Embodiment 3: with reference to Fig. 6; Embodiment 3 anti-metal ultrahigh frequency electronic tag antennas are made up of first antenna element 1 and second antenna element 2; First antenna element 1 is the microstrip antenna of processing with the whole lower surface and the part upper surface of bonding mode coated insulation substrate 12 with metallic foil 11; Second antenna element 2 is identical with embodiment 1; Contain carrier and antenna part, the carrier of second antenna element 2 is across the edge 131 of the radiation element 13 of said microstrip antenna and be bonded in the upper surface of radiation element and the upper surface of said insulating substrate 12, and the antenna part of second antenna element 2 is provided with two feed ends that are used to connect chip.First antenna element 1 carries out the transmission of energy and signal with the be coupled wireless feeding classification and second antenna element 2.
Microstrip antenna (i.e. first antenna element 1) is made up of the insulating substrate 12 and a strip metal paper tinsel band 11 of a plurality of range upon range of settings, and said metallic foil 11 warps repeatedly bending coat the whole lower surface of each insulating substrate 12 and the part upper surface of top layer insulating substrate.Insulating substrate 12 can adopt common insulating material, and the thickness of each insulating substrate 12 can be adjusted according to circumstances, and the length of the radiation element 13 of microstrip antenna (being the metallic foil of top layer insulating substrate 12 upper surfaces) can be adjusted according to circumstances.
The structure of second antenna element 2, shape and identical with embodiment 1 with the position relation of the radiation element 13 of microstrip antenna.
The anti-metal ultrahigh frequency electronic tag antenna of embodiment 3 adopts sandwich construction, is applied in the occasion that requires the label area smaller, can reach preferable communication performance.
Fig. 7 is the structural representation of the anti-metal ultrahigh frequency electronic tag of employing embodiment 3 antennas.With reference to Fig. 7; This anti-metal ultrahigh frequency electronic tag; Comprise the electronic label antenna of electronic label chip 3 and embodiment 3, electronic label chip 3 is bonded on second antenna element 2, the pin of electronic label chip 3 directly with second antenna element 2 on two feed ends be connected.
Embodiment 4: with reference to Fig. 8; A kind of false proof metal pop can; Comprise electronic label chip 3 and the anti-metal ultrahigh frequency electronic tag antenna of forming by first antenna element 1 and second antenna element 2; First antenna element 1 by the tank body 111 of this metal pop can, open handle 112 and be arranged at tank body 111 and open the microstrip antenna that the insulating substrate 12 between the handle 112 is formed; Second antenna element 2 contains carrier that fragile paper processes and is printed in the antenna part on this carrier, and this carrier is across the edge of said unlatching handle 112 and be bonded in the upper surface of opening handle 112 and the upper surface of insulating substrate 12, and the antenna part of second antenna element 2 is provided with two feed ends; Said electronic label chip 3 is bonded on second antenna element 2, and pin directly is connected with said two feed ends.First antenna element 1 carries out the transmission of energy and signal with the be coupled wireless feeding classification and second antenna element 2.The structure of second antenna element 2, shape can be identical with second antenna element 2 among the embodiment 1.Insulating substrate 12 can be bonded in above the tank body 111, in the handle groove that unlatching handle 112 can be embedded on the insulating substrate 12.
No matter take off the RFID label on the pop can, still open pop can, all can damage the RFID label, thereby can reach false proof purpose.And, can send the energy and the signal of read write line emission to label chip because the RFID label adopts above-mentioned anti-metal ultrahigh frequency electronic tag antenna abundantly, and activate label chip, label chip is communicated by letter with read write line normally.
Claims (6)
1. anti-metal ultrahigh frequency electronic tag antenna; It is characterized in that: form by first antenna element and second antenna element; First antenna element is the microstrip antenna of processing with the whole lower surface and the part upper surface of bonding mode coated insulation substrate with metallic foil; Second antenna element contains carrier and antenna part; The carrier of second antenna element is across the edge of the radiation element of said microstrip antenna and be bonded in the upper surface of radiation element and the upper surface of said insulating substrate, and the antenna part of second antenna element is provided with two feed ends that are used to connect chip.
2. anti-metal ultrahigh frequency electronic tag antenna according to claim 1, it is characterized in that: the insulating substrate of said microstrip antenna is single insulating substrate.
3. anti-metal ultrahigh frequency electronic tag antenna according to claim 2, it is characterized in that: the insulating substrate of said microstrip antenna is the part of product package boxboard.
4. anti-metal ultrahigh frequency electronic tag antenna according to claim 1; It is characterized in that: said microstrip antenna is made up of a plurality of insulating substrates and a strip metal paper tinsel band of range upon range of setting, and said metallic foil warp repeatedly bending coats the whole lower surface of each insulating substrate and the part upper surface of top layer insulating substrate.
5. anti-metal ultrahigh frequency electronic tag; It is characterized in that: comprise each described electronic label antenna of electronic label chip and claim 1-4; Electronic label chip is bonded on second antenna element, the pin of electronic label chip directly with second antenna element on two feed ends be connected.
6. false proof metal pop can; It is characterized in that: comprise electronic label chip and the anti-metal ultrahigh frequency electronic tag antenna of forming by first, second two antenna elements; First antenna element is shaken hands by tank body, the unlatching of this metal pop can and is arranged at tank body and opens the microstrip antenna that the insulating substrate between the handle is formed; Second antenna element contains carrier that fragile paper processes and is printed in the antenna part on this carrier; Edge and the upper surface that is bonded in the unlatching handle and the upper surface of said insulating substrate that this carrier is shaken hands across said unlatching; The antenna part of second antenna element is provided with two feed ends, and said electronic label chip is bonded on second antenna element, and pin directly is connected with said two feed ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201843020U CN202111230U (en) | 2011-06-02 | 2011-06-02 | Anti-metal ultrahigh frequency electronic tag antenna, tag and anti-counterfeiting ring-pull can |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201843020U CN202111230U (en) | 2011-06-02 | 2011-06-02 | Anti-metal ultrahigh frequency electronic tag antenna, tag and anti-counterfeiting ring-pull can |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202111230U true CN202111230U (en) | 2012-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201843020U Expired - Fee Related CN202111230U (en) | 2011-06-02 | 2011-06-02 | Anti-metal ultrahigh frequency electronic tag antenna, tag and anti-counterfeiting ring-pull can |
Country Status (1)
| Country | Link |
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| CN (1) | CN202111230U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810744A (en) * | 2011-06-02 | 2012-12-05 | 深圳市华阳微电子有限公司 | Anti-metal ultrahigh-frequency electronic tag antenna, anti-metal ultrahigh-frequency electronic tag and manufacturing method of anti-metal ultrahigh-frequency electronic tag antenna |
| CN103324974A (en) * | 2012-03-20 | 2013-09-25 | 深圳市华阳微电子有限公司 | Vertical type anti-metal RFID and antenna |
| CN103662278A (en) * | 2012-09-24 | 2014-03-26 | 苏州数伦科技有限公司 | Packaging tin with anti-dismantling electronic tag |
-
2011
- 2011-06-02 CN CN2011201843020U patent/CN202111230U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810744A (en) * | 2011-06-02 | 2012-12-05 | 深圳市华阳微电子有限公司 | Anti-metal ultrahigh-frequency electronic tag antenna, anti-metal ultrahigh-frequency electronic tag and manufacturing method of anti-metal ultrahigh-frequency electronic tag antenna |
| CN103324974A (en) * | 2012-03-20 | 2013-09-25 | 深圳市华阳微电子有限公司 | Vertical type anti-metal RFID and antenna |
| CN103324974B (en) * | 2012-03-20 | 2016-01-20 | 深圳市华阳微电子股份有限公司 | Vertical type anti-metal RFID and antenna |
| CN103662278A (en) * | 2012-09-24 | 2014-03-26 | 苏州数伦科技有限公司 | Packaging tin with anti-dismantling electronic tag |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN HYAN MICROELECTRONICS CO., LTD. Free format text: FORMER NAME: HUAYANG MICROELECTRONICS CO., LTD., SHENZHEN |
|
| CP03 | Change of name, title or address |
Address after: 518108 Guangdong city of Shenzhen province Baoan District Shiyan street community on AI Qun Lu with rich Industrial Zone No. 1-2 building three or four floor Patentee after: Shenzhen Hyan Microelectronics Co., Ltd. Address before: 518110, four floor, Guanlan Industrial Park, grain group, Song Yuan ha community, Guanlan street, Shenzhen, Guangdong, Baoan District Province, 10 Patentee before: Shenzhen Huayang Microelectronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20200602 |