CN101362224A - Cutting method of circuit board - Google Patents
Cutting method of circuit board Download PDFInfo
- Publication number
- CN101362224A CN101362224A CNA2008101958417A CN200810195841A CN101362224A CN 101362224 A CN101362224 A CN 101362224A CN A2008101958417 A CNA2008101958417 A CN A2008101958417A CN 200810195841 A CN200810195841 A CN 200810195841A CN 101362224 A CN101362224 A CN 101362224A
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- cutting
- small pieces
- wiring board
- cutting method
- pin
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Abstract
The invention relates to a method for cutting a circuit board, which comprises the following procedures: (1) typesetting-forming one piece of hunk by arranging at least two pieces of scraps and setting aside a cutting position outside each brink of each scrap; (2) one-time cutting-choosing a pair of opposite brinks on each scrap and cutting out a positioning slot along the cutting position outside of a pair of the opposite brinks; (3) pin positioning-choosing a plurality of pins with the sizes matched with the width of the positioning slot and respectively inserting the pins into the positioning slot; and (4) secondary cutting-cutting along the cutting position where cutting is not carried out. The method is applicable to the cutting of the circuit board with small size; drilling on a finished product of the circuit board is avoided; and the quality of the finished product is improved. The precision of the size of the cutting method can reach plus or minus 0.1mm, which is enough to meet the requirements for cutting the circuit boards of various norms.
Description
Technical field
The present invention relates to a kind of cutting method of wiring board.
Background technology
When making wiring board, often when setting type, two or multi-disc wiring board are arranged into a sheet of, to control cost, to improve output.After production finishes, utilize the data cutting machine this sheet to be cut into the wiring board finished product of small pieces then.
During cutting, must on the position of every small pieces finished product, get out earlier 3,4 apertures, in each hole, add pin, sheet is fixed on the work top by pin greater than 1 millimeter locating hole.Go out complete finished product profile with milling cutter along the edge cuts of small pieces then.
But when finished product small-sized, then perforate onboard.If directly cutting then can be because of unbalance stress damaged line plate.Present most of producer fixes wiring board by the method for sticking adhesive tape at the plate face and cuts then when running into this problem, but because adhesive tape is fixing not firm, discontinuity, therefore often cutting accuracy is not high, and causes unfilled corner easily, the scrappage height.
Summary of the invention
The object of the present invention is to provide a kind of energy cutting can't adopt the cutting method of the wiring board that pin fixes in the plate.
For achieving the above object, the present invention has taked following technical scheme:
A kind of cutting method of wiring board comprises following steps:
(1), sets type: be arranged into 1 sheet by at least 2 small pieces, outside every edge of every small pieces, reserve cleavage;
(2), once cutting: select a pair of opposed edges on each small pieces, the cleavage outer along these a pair of opposite edges cuts out locating slot;
(3), pin location: a plurality of pins of selecting size to match with the width of described locating slot, insert respectively in each described locating slot;
(4), secondary cut: cut along the cleavage that did not also carry out cutting.
Selected a pair of opposite edges include one the longest edge in all edges of described small pieces in step (2).
Selected a pair of opposite edges include the edge of being with turning point in step (2).In step (3), the place is provided with pin at described turning point, and this pin is close to the small pieces that are shaped as indent.
In step (3), described pin is close to the bight of each small pieces.
In step (3), between described pin and the described locating slot for excessively to cooperate.
Also comprise following steps between step (3) and step (4): the upper surface at described sheet pastes a complete adhesive tape, and this adhesive tape covers at least a portion of each small pieces.
Cutting method according to wiring board of the invention process has following advantage:
1, be applicable to undersized wiring board cutting, this wiring board can't insert pin and fix because size is too little in plate.
2, avoid on the circuit board finished product, holing, improved the quality of finished product.
3, the dimensional accuracy of this cutting method can reach ± 0.1 millimeter, be enough to satisfy the wiring board cutting demand of all size.
Description of drawings
Accompanying drawing 1 is a schematic flow sheet of the present invention.
Wherein: 1, sheet; 2, small pieces; 3, cleavage; 4, locating slot; 5, pin.
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described:
Cutting method according to wiring board of the invention process comprises the steps:
1, set type: the wiring board small pieces 2 of 2 L fonts are arranged into 1 sheet 1 symmetrically, between 2 small pieces 2 and outward flange all reserve cleavage 3.Small pieces are of a size of 5 * 5 millimeters, and shop bolt can't be set in plate.
2, once cutting: this time the purpose of cutting is to cut out the locating slot 4 that is used to plug pin 5.In the present embodiment, because the wiring board of L font possesses the S shape edge of band turning point, so select this S type edge and offside edge thereof as the edge that once cuts.Three road cleavages 3 cut along upper, middle and lower, cut out three road locating slots 4,1 millimeter of groove width.
3, pin location: pin 5 is inserted in the locating slots 4, be used in ensuing secondary cut stressed, thereby play indirect addressing effect to small pieces.At the both ends of per pass locating slot 4, the bight of just being close to each small pieces 2 is provided with pin 5.The diameter of pin 5 is 0.95 millimeter, just realizes excessively cooperating with locating slot 4.In addition, also be provided with pin 5, and the position that is provided with is a side of being close to the small pieces 2 of indent, otherwise pin 5 can't be stressed at two turning point places at S shape edge.
4, the upper surface at sheet 1 pastes a complete adhesive tape, and 2 small pieces 2 are all covered.
5, secondary cut: cut along the remaining left and right sides twice cleavage 3 that did not also carry out cutting, obtain finished product.
The creation point of this cutting method just is to abandon this thinking of in the past " small pieces 2 must be fixed on the base plate with the pin 5 in the insertion plate earlier and just can finish cutting ", but the locating slot 4 that creatively will be used to plug pin 5 is opened in the outside of small pieces 2.Pin 5 roles are not direct fixing small pieces 2, and only are the stressed effects of playing when cutting.Because frictional force, small pieces 2 can have towards the trend of blade direction of advance operation when cutting, and the pin 5 at the edge of being close to small pieces 2 is set on this direction so, just can be inconsistent with small pieces 2, play stressed effect.
For this cutting method of better implement, key is to select a suitable cut edge.Based on previously described pin 5 stressed principles, preferably select the long edge of length once to cut as far as possible, and pin 5 is fixed on the bight of small pieces 2 as far as possible, suffered moment is longer when cutting like this.Can not select adjacent edge, otherwise must be stressed on a certain direction.
Above-mentioned for convenience of description stressed principle, present embodiment have selected to possess the small pieces 2 of S shape turning point on a lateral edges.Common wiring board only possesses rectangular turning mostly, just can obtain good implementation result according to " selection longer edges " mentioned above and " edge of select tape turning point ".If run into shaped piece,, just can realize cutting effect preferably as long as when selecting a cut edge, grasp the principle of " moment is increased " as far as possible.
Adhesive tape is preferably selected anti-ization gold size band, can avoid colloid in the circuit board residual, pollutes wiring board.The position of taping must be noted that when secondary cut and can not be cut off, in order to avoid finished product is sucked away.
As mentioned above, we are illustrated according to aim of the present invention fully, but the present invention is not limited to the foregoing description and implementation method.The practitioner of correlative technology field can carry out different variations and enforcement in the scope of technological thought permission of the present invention.
Claims (7)
1, a kind of cutting method of wiring board is characterized in that comprising following steps:
(1), sets type: be arranged into 1 sheet (1) by at least 2 small pieces (2), outside every edge of every small pieces (2), reserve cleavage (3);
(2), once cutting: select a pair of opposed edges on each small pieces (2), the cleavage (3) outer along these a pair of opposite edges cuts out locating slot (4);
(3), pin location: select size and a plurality of pins (5) that the width of described locating slot (4) matches, insert respectively in each described locating slot (4);
(4), secondary cut: cut along the cleavage (3) that did not also carry out cutting.
2, the cutting method of wiring board according to claim 1 is characterized in that: selected a pair of opposite edges include one the longest edge in all edges of described small pieces (2) in step (2).
3, the cutting method of wiring board according to claim 1 is characterized in that: selected a pair of opposite edges include the edge of being with turning point in step (2).
4, the cutting method of wiring board according to claim 3 is characterized in that: in step (3), be provided with pin (5) at described turning point place, this pin (5) is close to the small pieces (2) that are shaped as indent.
5, the cutting method of wiring board according to claim 1 is characterized in that: in step (3), described pin (5) is close to the bight of each small pieces (2).
6, the cutting method of wiring board according to claim 1 is characterized in that: in step (3), between described pin (5) and the described locating slot (4) for excessively to cooperate.
7, the cutting method of wiring board according to claim 1, it is characterized in that: also comprise following steps between step (3) and step (4): the upper surface at described sheet (1) pastes a complete adhesive tape, and this adhesive tape covers at least a portion of each small pieces (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101958417A CN101362224B (en) | 2008-09-03 | 2008-09-03 | Cutting method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101958417A CN101362224B (en) | 2008-09-03 | 2008-09-03 | Cutting method of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101362224A true CN101362224A (en) | 2009-02-11 |
| CN101362224B CN101362224B (en) | 2010-06-16 |
Family
ID=40388928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101958417A Expired - Fee Related CN101362224B (en) | 2008-09-03 | 2008-09-03 | Cutting method of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101362224B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195335A (en) * | 2018-10-17 | 2019-01-11 | 深圳崇达多层线路板有限公司 | A kind of L-type auxiliary positioning module and molding gong plate method for forming gong plate |
| CN109397370A (en) * | 2017-08-15 | 2019-03-01 | 惠州中京电子科技有限公司 | Splice screen board cutting method |
-
2008
- 2008-09-03 CN CN2008101958417A patent/CN101362224B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109397370A (en) * | 2017-08-15 | 2019-03-01 | 惠州中京电子科技有限公司 | Splice screen board cutting method |
| CN109195335A (en) * | 2018-10-17 | 2019-01-11 | 深圳崇达多层线路板有限公司 | A kind of L-type auxiliary positioning module and molding gong plate method for forming gong plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101362224B (en) | 2010-06-16 |
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| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20190903 |
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| CF01 | Termination of patent right due to non-payment of annual fee |