CN101354428A - Trolley for probe card and operation method of probe card using the same - Google Patents
Trolley for probe card and operation method of probe card using the same Download PDFInfo
- Publication number
- CN101354428A CN101354428A CNA2008100869825A CN200810086982A CN101354428A CN 101354428 A CN101354428 A CN 101354428A CN A2008100869825 A CNA2008100869825 A CN A2008100869825A CN 200810086982 A CN200810086982 A CN 200810086982A CN 101354428 A CN101354428 A CN 101354428A
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- China
- Prior art keywords
- probe
- temperature
- chassis
- inspection
- pedestal
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention provides a trolley for a probe card and an operating method using the probe card of the trolley. After the probe card arranged on a device is checked, preheat is not needed, and the check time can be shortened correspondingly to the preheat time. The trolley (20) for the probe card is used in carrying the probe card (6') used in a check device for high temperature check and low temperature check, and comprises a pedestal (21A) for arranging the probe card (6') detachably freely and a temperature regulating mechanism (22) for heating the probe card (6') arranged on the pedestal (21A) to a stated temperature (such as 100 DEG C) required by the check of a wafer.
Description
Technical field
The probe chassis that uses when the present invention relates on the testing fixture that carries out high temperature inspection or low temperature inspection, load and unload probe, in more detail, relating to can be after will being installed on the testing fixture with the probe of chassis conveyance, carry out the tested high temperature inspection of having a medical check-up or the low temperature inspection of wafer etc. at once, and the probe that can shorten the tested supervision time of having a medical check-up is with chassis with use the method for operating of the probe of this chassis.
Background technology
Under the situation that the high temperature inspection of carrying out tested the having a medical check-up of wafer etc. (following with " wafer " representative) or low temperature are checked, use the testing fixture that is provided with probe.For example shown in Figure 6, this testing fixture has load chamber 1 and the detecting chamber 2 that adjoins each other.
As shown in Figure 6, load chamber 1 comprises with the box being the mounting portion 3 of unit mounting wafer W, the wafer transfer mechanism (not shown) of conveyance wafer W one by one and carry out the secondary chuck (not shown) of the prealignment of wafer in the way of conveyance wafer W in the box.
As shown in Figure 6, detecting chamber 2 comprises: mounting is by the main card dish 4 that can regulate temperature of the next wafer W of the wafer transfer mechanism conveyance of load chamber 1; Be configured in the probe 6 of substantial middle of the top board 5 of main card dish 4 tops; The aligning guide of aiming at 7 with the electronic pads of wafer W on the probe 6A that carries out probe 6 and the main card dish 4, after the aiming at of the electronic pads that carries out wafer W by aligning guide 7 and probe 6A, with wafer W heating or be cooled to the temperature of regulation, under each temperature, carry out the high temperature inspection or the low temperature inspection of wafer W by main card dish 4.
As shown in Figure 6, aligning guide 7 has first image unit 7A that wafer W is made a video recording and the second image unit 7B that probe is made a video recording, and constitutes by the mode of aiming at bridge (alignment bridge) 7C and moving between the back side of detecting chamber 2 and probe core with the first image unit 7A.Probe 6 is electrically connected with measuring head 9 by abutment ring 8.
In tested inspection of having a medical check-up, the low temperature inspection that has high temperature inspection that the high-temperature area about 100 ℃ for example carries out and for example carry out at-tens of ℃ low-temperature region.Carrying out under the situation that high temperature checks, by temperature regulator (hereinafter to be referred as " temperature is transferred device ") temperature of main card dish 4 is being set at and for example checks 100 ℃ of temperature, and carry out the inspection of wafer W.Under the situation of carrying out the low temperature inspection, transfer device that the wafer W on the main card dish 4 is set in-tens of ℃ inspection temperature by the temperature that is built in the main card dish 4, and under this temperature, carry out the low temperature inspection of wafer.
Under the situation of carrying out the inspection of high temperature inspection or low temperature, must check according to each and change probe 6.Probe 6 is along with the miniaturization of the heavy caliberization of wafer W and device and weightization can not be carried out conveyance by the operator.Therefore, between site of storage and testing fixture, use chassis during conveyance probe 6.
For example shown in Fig. 7 (a), under the situation of the probe 6 of changing testing fixture, shown in figure (d), use the front of the detecting chamber 2 of the probe 6 that next chassis 10 will use ' from the site of storage conveyance to testing fixture.Shown in Fig. 7 (b), the supporting substrates 11C that the transport mechanism 11 of this chassis 10 comprises the arm 11A that supports probe 6, moves forward and backward the first guide rail 11B of this arm of guiding 11A and supports the first guide rail 11B and moves at chassis 10 upper edge fore-and-aft directions.
Herein shown in the arrow of Fig. 7 (b), by the transport mechanism on the chassis 10 11 probe 6 in the detecting chamber 2 are taken out of, shown in the arrow of figure (c), the probe 6 of taking out of on the chassis 10 is accommodated in the containing box 60.Shown in the (a) and (b) of figure, this containing box 60 is set at the side of load chamber 1.Then, from this containing box 60 take out by the probe 6 of chassis 10 conveyances ', shown in the arrow of figure (d), on the transport mechanism 11 of transfer to the chassis 10, further as shown in the arrow of figure (e), use transport mechanism 11 with probe 6 ' move in the detecting chamber 2, and be installed in the detecting chamber 2.And when probe 6 ' quilt was moved in the detecting chamber 2, probe 6 was installed in the position of regulation automatically by main card dish 4.
Use new probe 6 ', for example wafer is being heated to 100 ℃ and carry out under the situation that the high temperature of wafer checks, before checking, make the main card dish near probe 6 ', by transferred the main card dish of device heating by temperature probe is carried out preheating, the environment temperature of checking until high temperature.By the 6 ' thermal expansion of preheating probe, so when high temperature is checked not can owing to probe 6 ' thermal expansion cause the needle point of probe (not shown) to produce offset, the electronic pads of probe and wafer is accurately contacted, can carry out the high high temperature inspection of reliability.In addition, under the situation of carrying out the low temperature inspection, by main card dish cooling probe.
But under the situation that the high temperature that carries out wafer is checked, when changing probe 6 with new probe 6 ' be installed on the testing fixture, owing to all must carry out the inspection temperature of preheating at every turn until regulation, so corresponding to this preheating time, the start time that the high temperature of wafer is checked postpones, supervision time increases as a result, has the limit in the shortening of supervision time.
Summary of the invention
The present invention proposes in order to solve above-mentioned problem, its purpose is to provide the method for operating of probe with the probe of chassis and this chassis of use, after being installed in probe on the testing fixture, can not preheating just beginning tested inspection of having a medical check-up, thereby can shorten the supervision time.
The probe chassis of a first aspect of the present invention, the probe that its conveyance is used in the testing fixture that carries out high temperature inspection or low temperature inspection is characterized in that, comprising: the pedestal of above-mentioned probe is freely installed in loading and unloading; With will be installed in the above-mentioned probe heating on this pedestal or be cooled to the thermoregulation mechanism of the temperature of the above-mentioned tested desired regulation of inspection of having a medical check-up.
In addition, the probe of a second aspect of the present invention is characterised in that with chassis in the described invention of first aspect, the said temperature governor motion has the temperature sensor of the temperature that detects above-mentioned probe.
The probe of a third aspect of the present invention is characterised in that with chassis, in the described invention of second aspect, the said temperature governor motion has according to the detected value of said temperature sensor above-mentioned probe has been reached the notification unit that the situation of the temperature of regulation is notified.
In addition, the probe of a fourth aspect of the present invention is characterised in that with chassis, in the described invention of each in first aspect～third aspect, abuts to form the mounting portion of other probe of mounting on above-mentioned pedestal.
In addition, the method of operating of the probe of a fifth aspect of the present invention, be the method for operating of the probe during the loading and unloading probe on carrying out the testing fixture that high temperature inspection or low temperature checks, it is characterized in that, comprising: above-mentioned probe is installed in the operation on the pedestal of chassis; To be installed in the above-mentioned probe heating on the above-mentioned pedestal or be cooled to above-mentioned high temperature inspection or low temperature is checked the operation of the temperature of desired regulation by the thermoregulation mechanism in the above-mentioned chassis; Be installed in operation on the above-mentioned testing fixture with the above-mentioned probe of the temperature that will adjust to afore mentioned rules.
In addition, the method for operating of the probe of a sixth aspect of the present invention is characterised in that in the described invention, to have before being installed in above-mentioned probe on the above-mentioned testing fixture aspect the 5th, unloads the operation of other probe in the above-mentioned testing fixture.
The method of operating of the probe of a seventh aspect of the present invention is characterised in that, aspect the 5th or in the described invention in the 6th aspect, has above-mentioned probe has been reached the operation that the situation of the temperature of regulation is notified.
According to the present invention, can be provided at be installed in probe on the testing fixture after, can not carry out preheating and just begin tested inspection of having a medical check-up, thereby the probe that can shorten the supervision time is with chassis with use the method for operating of the probe of this chassis.
Description of drawings
Fig. 1 (a) and (b) (a) are the sectional view of its length direction for representing the figure of probe of the present invention with an embodiment of chassis respectively, (b) are its planimetric map.
Fig. 2 (a) and (b) are the process chart of an embodiment of the method for operating of the probe of the present invention of expression use chassis shown in Figure 1.
Fig. 3 (a) and (b) are the process chart of the subsequent handling of expression operation shown in Figure 2.
Fig. 4 is the process chart of the subsequent handling of expression operation shown in Figure 3.
Fig. 5 (a) and (b) are for representing the figure that be equivalent to Fig. 1 (a) and (b) of probe of the present invention with another embodiment of chassis respectively.
Fig. 6 is the front view (FV) of the part in the front of an example of fracture expression testing fixture.
Fig. 7 (a)～(e) is the process chart of an example of the method for operating of representing existing probe respectively.
Symbol description
6,6 ' probe
20, the 20A temperature is transferred chassis (probe chassis)
The 21A pedestal
21B mounting portion
22 thermoregulation mechanisms
W wafer (tested having a medical check-up)
Embodiment
Below, the probe of the present invention of a Fig. 1～shown in Figure 4 embodiment with chassis is described, to the same as the prior art or suitable identical symbol of part mark.And, mark symbol " 6 " same as the prior art, " 6 ' " on the probe before and after changing to describe.
For example shown in Fig. 1 (a) and (b), the probe of present embodiment comprises with chassis 20: chassis main body 21; On chassis main body 21, form peristome and be used to load and unload probe 6 ' pedestal 21A; Be configured in the thermoregulation mechanism 22 of the below of pedestal 21A; With electric supply installation 23 to thermoregulation mechanism 22 power supply, make thermoregulation mechanism 22 actions by the power supply that comes self-power supply device 23, heating or cooling be installed in probe 6 on the pedestal 21A '.Below the probe of present embodiment be called temperature with chassis 20 transfer chassis 20 to describe.
In addition, thermoregulation mechanism 22 also can be made of independent well heater or independent refrigeratory.In addition, even the temperature setup unit is not set, also can learn probe 6 ' reached the fact of the temperature of regulation on chassis main body 21 by temperature sensor.
Shown in Fig. 1 (a) and (b), be provided with at the back side of chassis main body 21 hold accommodate probe 6 ' the incorporating section 24 of containing box 60.Shown in figure (a), containing box 60 constitutes in the mode that opens and closes by hinge (hinge), opens containing box 60, taking-up probe 6 '.In addition, on chassis main body 21, be formed with at the rear (with the left side of figure) of pedestal 21A temporary transient mounting take in probe 6 ' the 21B of mounting portion of containing box 60.In the bottom of the two sides of chassis main body 21, front and back separate predetermined distance two pairs of castors (caster) 25 are installed.And containing box 60 is not limited to the type by the hinge switching.
With probe 6 ' from site of storage under the situation of testing fixture conveyance, from site of storage take out take in probe 6 ' containing box 60, containing box 60 is accommodated in incorporating section 24 and carries out conveyance.With probe 6 ' when being installed on the pedestal 21A, shown in Fig. 1 (b), the operator 24 takes out containing boxs 60 and carries out mounting to the 21B of mounting portion from the incorporating section, open containing box 60 take out probe 6 ', and be installed on the pedestal 21A.When probe 6 ' be installed in pedestal 21A goes up, by thermoregulation mechanism 22 with probe 6 ' heat or the be cooled to temperature of predefined regulation.When probe 6 ' be heated or cooled during, can learn this situation by the detection of temperature sensor to the temperature of regulation.With the heating or cooled probe 6 ' probe 6 with testing fixture exchanges as described later.
Then, with reference to Fig. 2～Fig. 4 the method for operating of the probe of the chassis of use present embodiment is described.
At first, the operator is probe 6 ' take out from site of storage with the state that is accommodated in the containing box 60, and is positioned in temperature and transfers on the 21B of mounting portion of chassis 20.Shown in Fig. 2 (a), open the containing box 60 that is positioned on the 21B of mounting portion.Afterwards, the operator from containing box 60, take out probe 6 ', with probe 6 ' be installed on the pedestal 21A.Be accommodated in the incorporating section 24 becoming empty containing box 60.Then, for example carrying out under the situation that high temperature checks, the operator in the temperature that is set to regulation by the temperature setup unit of thermoregulation mechanism 22 (for example 100 ℃) afterwards, Closing Switch makes the well heater operation of temperature adjusting mechanism 22.Shown in figure (b), the operator makes temperature transfer chassis 20 to advance to the testing fixture of regulation in the process of utilizing temperature adjusting mechanism 22 with the temperature of probe 6 ' be heated to regulation.
Then, shown in Fig. 3 (a), transport mechanism 11 on the chassis 10 in the front by being pre-configured in detecting chamber 2, with probe 6 after detecting chamber 2 is taken out of on the chassis 10, shown in figure (a) middle arrow, the operator transfers 6 transfers of the probe on the chassis 10 21B of mounting portion of chassis 20 to temperature.At this moment, because the probe 6 of pedestal 21A ' be heated to the temperature of regulation, so as in figure (b) shown in arrow, with this probe 6 ' transfer chassis 20 transfers to the transport mechanism 11 of chassis 10 from temperature.
Then, when the transport mechanism 11 of operator by chassis 10 with probe 6 ' when moving in the detecting chamber 2, probe 6 ' in detecting chamber 2, be installed in the automatically place of regulation.At this moment, because probe 6 ' be heated to high temperature to check desired temperature, so can get started the high temperature inspection of wafer.During this period, take out probe 6 ' and become the side that empty containing box 60 stands on load chamber 1.Making from the probe 6 of testing fixture taking-up transfers chassis 20 to return site of storage by temperature.And, because chassis 10 has transport mechanism 11, so only when probe 6 ' move into is taken out of detecting chamber 2, use.
Present embodiment according to above explanation, carry out 6 ' time of probe of using in the testing fixture of high temperature inspection in conveyance, use comprise loading and unloading freely install probe 6 ' pedestal 21A, transfer chassis 20 with the temperature of the thermoregulation mechanism 22 of the temperature of the desired regulation of inspection that will be installed in probe 6 on this pedestal 21A ' be heated to wafer, with probe 6 ' conveyance to testing fixture, so the high temperature of probe 6 ' be heated to before being installed on testing fixture wafer is checked desired temperature, therefore, as long as with probe 6 ' be installed in the testing fixture, not needing as prior art probe to be carried out preheating just can check at once, omitted the required time of preheating, the supervision time of wafer can be shortened, thereby the throughput of inspection can be improved.
In addition, according to present embodiment because thermoregulation mechanism 22 have detect heated probe 6 ' the temperature sensor of temperature, so can detect probe 6 ' reliably for checking desired temperature.Further, because thermoregulation mechanism 22 has the notification unit of the situation of probe 6 ' reached the temperature of regulation being notified according to the detected value of temperature sensor, so can learn the situation of probe 6 ' be preheated reliably, can promptly install probe 6 ', help further to shorten the supervision time.In addition, because on the chassis main body 21 of temperature accent chassis 20, be formed with the 21B of mounting portion with pedestal 21A adjacency, so change probe 6 ' situation under, can be with the transfer and temporarily being placed on the 21B of mounting portion from testing fixture of the probe 6 after using.
In addition, for example shown in Fig. 5 (a) and (b), temperature of the present invention transfer chassis also can omit temporary transient mounting probe 6 ' mounting portion.Shown in the (a) and (b) of figure, the temperature of present embodiment is transferred chassis 20A, only is provided with pedestal 21A on chassis main body 21, is provided with thermoregulation mechanism 22 and electric supply installation 23 in the inside of chassis main body 21.Because should temperature transfer chassis 20A on chassis main body 21, not have mounting portion,, outside this, have temperature accent chassis 20 identical functions shown in the (a) and (b) with Fig. 1 so can not temporarily be placed on the chassis main body 21 from the probe 6 that testing fixture takes out.
And the present invention is not subjected to any restriction of above-mentioned embodiment, can suitably change each inscape as required.For example in the above-described embodiment tested high temperature inspection of having a medical check-up is illustrated, but equally also can be applicable to tested low temperature inspection of having a medical check-up.
Utilizability on the industry
The present invention can be applied to carry out the inspection dress that the tested electrical characteristics of having a medical check-up of wafer etc. check In putting.
Claims (7)
1. probe chassis, the probe that its conveyance is used in the testing fixture that carries out high temperature inspection or low temperature inspection is characterized in that, comprising:
The pedestal of described probe is freely installed in loading and unloading; With will be installed in the described probe heating on this pedestal or be cooled to the thermoregulation mechanism of the temperature of the described tested desired regulation of inspection of having a medical check-up.
2. probe chassis as claimed in claim 1 is characterized in that:
Described thermoregulation mechanism has the temperature sensor of the temperature that detects described probe.
3. probe chassis as claimed in claim 2 is characterized in that:
Described thermoregulation mechanism has according to the detected value of described temperature sensor described probe has been reached the notification unit that the situation of the temperature of regulation is notified.
4. as each described probe chassis in claim 1～claim 3, it is characterized in that:
On described pedestal, abut to form the mounting portion of other probe of mounting.
5. the method for operating of a probe is the method for operating of the probe when loading and unloading probe on the testing fixture that carries out the inspection of high temperature inspection or low temperature, it is characterized in that, comprising:
Described probe is installed in the operation on the pedestal of chassis; To be installed in described probe on the described pedestal by the thermoregulation mechanism in described chassis heating or be cooled to described high temperature inspection or low temperature is checked the operation of the temperature of desired regulation; Be installed in operation on the described testing fixture with the described probe of the temperature that will adjust to described regulation.
6. the method for operating of probe as claimed in claim 5 is characterized in that, comprising:
Before being installed in described probe on the described testing fixture, unload the operation of other probe in the described testing fixture.
7. as the method for operating of claim 5 or the described probe of claim 6, it is characterized in that, comprising:
Described probe has been reached the operation that the situation of the temperature of regulation is notified.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-193495 | 2007-07-25 | ||
| JP2007193495 | 2007-07-25 | ||
| JP2007193495A JP5049419B2 (en) | 2007-07-25 | 2007-07-25 | Probe card carriage and probe card handling method using the carriage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101354428A true CN101354428A (en) | 2009-01-28 |
| CN101354428B CN101354428B (en) | 2011-07-27 |
Family
ID=40307330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100869825A Active CN101354428B (en) | 2007-07-25 | 2008-04-03 | Trolley for probe card and operation method of probe card using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5049419B2 (en) |
| KR (1) | KR101071024B1 (en) |
| CN (1) | CN101354428B (en) |
| TW (1) | TWI459492B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101425A (en) * | 2013-04-15 | 2014-10-15 | 镇江逸致仪器有限公司 | Laser diode bar test system possessing normal temperature detection and high temperature detection double clamps |
| CN104569775A (en) * | 2013-10-29 | 2015-04-29 | 东京毅力科创株式会社 | Maintenance carriage for wafer inspection apparatus and maintenance method for wafer inspection apparatus |
| CN109782031A (en) * | 2018-12-27 | 2019-05-21 | 上海华岭集成电路技术股份有限公司 | A kind of method that the high and low temperature test environment replaces probe card automatically |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101046769B1 (en) * | 2009-01-20 | 2011-07-06 | 주식회사 쎄믹스 | Probe card case |
| JP5517344B2 (en) * | 2010-02-12 | 2014-06-11 | 東京エレクトロン株式会社 | Probe card transport mechanism, probe card transport method, and probe apparatus |
| JP5874427B2 (en) * | 2012-02-14 | 2016-03-02 | セイコーエプソン株式会社 | Parts inspection device and handler |
| JP5967509B1 (en) * | 2015-02-27 | 2016-08-10 | 株式会社東京精密 | Transport unit and prober |
| KR101854015B1 (en) * | 2015-11-06 | 2018-05-02 | 세메스 주식회사 | Apparatus of storing probe cards |
| CN107664557B (en) * | 2017-11-15 | 2020-02-07 | 无锡阿尔法精密机械制造有限公司 | Ceramic pressure sensor grade sorting device |
| JP6575663B2 (en) * | 2018-10-24 | 2019-09-18 | 株式会社東京精密 | Probe card type temperature sensor and wafer chuck temperature measuring method |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05343486A (en) * | 1992-06-04 | 1993-12-24 | Tokyo Electron Yamanashi Kk | Inspection apparatus |
| JPH06349909A (en) * | 1993-06-14 | 1994-12-22 | Hitachi Ltd | Probe inspection device |
| JPH11145215A (en) * | 1997-11-11 | 1999-05-28 | Mitsubishi Electric Corp | Tester for semiconductor and controlling method therefor |
| JPH11330171A (en) * | 1998-05-11 | 1999-11-30 | Sony Corp | Wafer prober and wafer transportating-processing method therein |
| JP2000241454A (en) * | 1999-02-23 | 2000-09-08 | Mitsubishi Electric Corp | Probe card for high temperature test and test equipment |
| JP2003215162A (en) * | 2002-01-17 | 2003-07-30 | Seiko Epson Corp | Probe card, and semi-conductor measuring instrument provided with the same |
| JP2004170267A (en) * | 2002-11-20 | 2004-06-17 | Tokyo Seimitsu Co Ltd | Dolly for carrying probe card |
| JP4391744B2 (en) * | 2002-12-27 | 2009-12-24 | 東京エレクトロン株式会社 | Mobile probe card transport device, probe device, and probe card transport method to probe device |
| CN2695211Y (en) * | 2004-04-23 | 2005-04-27 | 陈国华 | Trolley device |
| KR100674417B1 (en) | 2005-07-28 | 2007-01-29 | 미래산업 주식회사 | Test chamber unit for testing semiconductor device |
| JP2007165715A (en) * | 2005-12-15 | 2007-06-28 | Tokyo Electron Ltd | Mounting method for probe card, and probe card transferring and loading assisting device used therefor |
| US20070166134A1 (en) * | 2005-12-20 | 2007-07-19 | Motoko Suzuki | Substrate transfer method, substrate transfer apparatus and exposure apparatus |
| KR100698965B1 (en) | 2006-06-20 | 2007-03-23 | 주식회사 해동 | Thermal Control Device of Mold |
-
2007
- 2007-07-25 JP JP2007193495A patent/JP5049419B2/en not_active Expired - Fee Related
-
2008
- 2008-04-03 CN CN2008100869825A patent/CN101354428B/en active Active
- 2008-07-24 TW TW097128187A patent/TWI459492B/en active
- 2008-07-24 KR KR1020080072211A patent/KR101071024B1/en active IP Right Grant
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101425A (en) * | 2013-04-15 | 2014-10-15 | 镇江逸致仪器有限公司 | Laser diode bar test system possessing normal temperature detection and high temperature detection double clamps |
| CN104569775A (en) * | 2013-10-29 | 2015-04-29 | 东京毅力科创株式会社 | Maintenance carriage for wafer inspection apparatus and maintenance method for wafer inspection apparatus |
| CN109782031A (en) * | 2018-12-27 | 2019-05-21 | 上海华岭集成电路技术股份有限公司 | A kind of method that the high and low temperature test environment replaces probe card automatically |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5049419B2 (en) | 2012-10-17 |
| KR20090012123A (en) | 2009-02-02 |
| KR101071024B1 (en) | 2011-10-06 |
| TWI459492B (en) | 2014-11-01 |
| JP2009032801A (en) | 2009-02-12 |
| CN101354428B (en) | 2011-07-27 |
| TW200921832A (en) | 2009-05-16 |
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