CN101339692A - Electric thermo-couple temperature collection system and method - Google Patents
Electric thermo-couple temperature collection system and method Download PDFInfo
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- CN101339692A CN101339692A CNA2007102010188A CN200710201018A CN101339692A CN 101339692 A CN101339692 A CN 101339692A CN A2007102010188 A CNA2007102010188 A CN A2007102010188A CN 200710201018 A CN200710201018 A CN 200710201018A CN 101339692 A CN101339692 A CN 101339692A
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Abstract
A thermocouple temperature collection method comprises the following steps: an analog-digital conversion device in a temperature collector calculates a correction coefficient of an analog-digital conversion channel; the analog-digital conversion channel collects an analog voltage signal produced by measuring an object to be measured by a thermocouple and converts the analog voltage signal into a voltage value of a digital signal; the analog-digital conversion device makes use of error correction for the voltage value based on the correction coefficient of the analog-digital conversion channel; the temperature collector transmits the corrected voltage value to a computer by virtue of a network interface; the computer carries out cold junction compensation for the corrected voltage value; and the compensated voltage value is converted into a real temperature value of the object to be measured. The thermocouple temperature collection method can carry out a remote monitoring of the temperature of the object to be measured, and can correct and compensate the temperature, which improves the measurement accuracy of the thermocouple.
Description
Technical field
The present invention relates to a kind of thermometric system and method, especially a kind of system and method that utilizes thermopair to carry out temperature acquisition.
Background technology
Temperature is one of most important procedure parameter.According to incompletely statistics, it approximately on average accounts for about 60% of thermal parameter measurement.Temperature detecting precision has significant effects to the quality of process control.Computer technology impels research and production process monitoring and automatic technology to develop rapidly, thereby has improved the requirement to process variable detection and accuracy of detection.
At present, the most widely used detector unit is a thermopair.Thermopair is made simple and low price, and its measurable temperature range is also very big.The principle of work of thermopair is: two kinds of different metallic conductors at one end are welded to each other, form the measuring junction (also claiming the working end) of thermopair, and this measuring junction is inserted in the medium of object under test temperature; The computing machine that the other end of thermopair (reference end or free end) is then measured the Displaying Meter of temperature with one or data collector is housed links to each other.Because the thermal expansivity difference of different metal conductor, can produce certain electromotive force after being heated, be called Seebeck (seebeck) voltage, this voltage utilizes the voltage temperature table of comparisons by Displaying Meter or computing machine that data collector is housed, perhaps according to the relation formula of voltage temperature magnitude of voltage is converted into temperature value and shows.All conductive metal materials all can be called Seebeck effect because of the existing different temperatures distribution of metal inside level (being thermograde) produces different relatively thermopoweves.The size that thermopair produces Seebeck effect is to decide according to the metallochemistry composition of making thermopair.
In the past, when utilizing thermopair to carry out temperature survey, owing to reasons such as temperature, humidity and some hyperchannel cold junction compensation, cause the temperature value measured accurate inadequately, there is certain error, and Thermocouple Temperature Acquisition device of the prior art only can carry out temperature acquisition in limited area, and can not carry out the remote temperature collection.
Summary of the invention
In view of above content, be necessary to provide a kind of electric thermo-couple temperature collection system, it can carry out the remote temperature monitoring, realizes high-precision temperature data acquisition.
In view of above content, also be necessary to provide a kind of Thermocouple Temperature Acquisition method, it can carry out the remote temperature monitoring, realizes high-precision temperature data acquisition.
A kind of electric thermo-couple temperature collection system, comprise computing machine, Temperature sampler and thermopair, this thermopair links to each other with Temperature sampler, this computing machine links to each other with described Temperature sampler by a network interface, is used to monitor this Temperature sampler and gathers the temperature that described thermopair measures an object under test.This Temperature sampler comprises that at least one is from microprogram control unit and by system's control bus and this main microprogram control unit that links to each other from microprogram control unit.Wherein, describedly comprise from microprogram control unit: the analog digital ALT-CH alternate channel is used to gather the analog voltage signal that is produced when described thermopair measures above-mentioned object under test; And analog-digital commutator, be used for above-mentioned analog voltage signal is converted to digital signal, calculate the correction coefficient of analog digital ALT-CH alternate channel, and proofread and correct according to the magnitude of voltage that this correction coefficient is gathered the analog digital ALT-CH alternate channel.Described main microprogram control unit is used to gather the temperature value of cold thermocouple contact, calculates the side-play amount of this cold junction temperature value, and compensates according to the side-play amount of this cold junction temperature value temperature value to described cold junction.The magnitude of voltage of the cold junction temperature value of described computing machine after according to above-mentioned compensation after to above-mentioned correction carries out the cold junction compensation, and the compensated voltage value is converted to the actual temperature value of object under test.
A kind of Thermocouple Temperature Acquisition method comprises the steps: that the analog-digital commutator in the Temperature sampler calculates the correction coefficient of analog digital ALT-CH alternate channel; Analog voltage signal that this analog digital ALT-CH alternate channel collection is produced by a thermocouple measurement one object under test and the magnitude of voltage that is converted into digital signal; Described analog-digital commutator utilizes the correction coefficient of described analog digital ALT-CH alternate channel that this magnitude of voltage is carried out error correction; Described Temperature sampler sends a computing machine to by the magnitude of voltage of network interface after with above-mentioned correction; Magnitude of voltage after this computing machine will be proofreaied and correct carries out the cold junction compensation; Reach the actual temperature value that the compensated voltage value is converted into object under test.
Compared to prior art, described electric thermo-couple temperature collection system and method can be carried out the remote temperature monitoring to object under test, and the temperature data that the analog digital ALT-CH alternate channel is gathered is proofreaied and correct, and, improved the precision of thermocouple measurement to the temperature compensation of cold thermocouple contact.
Description of drawings
Fig. 1 is the synoptic diagram of thermocouple measurement candle flame temperature.
Fig. 2 is the system architecture diagram of electric thermo-couple temperature collection system preferred embodiment of the present invention.
Fig. 3 is the main process flow diagram of Thermocouple Temperature Acquisition method of the present invention preferred embodiment.
Fig. 4 is the process flow diagram that calculates the correction coefficient of AD passage.
Fig. 5 is the process flow diagram that calculates the side-play amount of cold thermocouple contact temperature.
Fig. 6 is a synoptic diagram of measuring the temperature of cold thermocouple contact in the Thermocouple Temperature Acquisition method of the present invention preferred embodiment.
Fig. 7 is the process flow diagram of in the Thermocouple Temperature Acquisition method of the present invention preferred embodiment magnitude of voltage of AD passage collection being proofreaied and correct.
Fig. 8 is the process flow diagram of compensation cold junction temperature in the Thermocouple Temperature Acquisition method of the present invention preferred embodiment.
Fig. 9 is the process flow diagram that calculates the object under test actual temperature value in the Thermocouple Temperature Acquisition method of the present invention preferred embodiment.
Embodiment
For a better understanding of the present invention, now relational term is made description below:
Cold junction and cold junction compensation: utilizing thermopair to carry out thermometric the time, only thermopair is connected with voltage table or other measuring system cannot because when the tinsel of thermopair is connected to voltage table or measuring system, can produce some extra voltages.
As shown in Figure 1, be the synoptic diagram that utilizes a candle flame temperature of a thermocouple measurement.Thermopair among this figure at one end is welded by tinsel copper (Cu) and cobalt (Co), and the other end of two one metal wires connects two copper wires of a voltage table respectively.Thermopair among the figure forms two contact J1 and J2 altogether, and two contact J1 are to be formed by connecting by two different tinsel copper and cobalts with J2.Wherein, J1 is a thermal cross, produces a Seebeck voltage that is produced by the candle flame temperature, and J2 is the thermal cross of a parasitism, and it also can produce a voltage that is produced by the environment temperature of voltage table.The magnitude of voltage Vmeas that voltage table is measured is V in fact
J1With V
J2Algebraic sum, therefore in order to calculate the magnitude of voltage that the J1 contact produces, just must know the magnitude of voltage of J2 contact.In the past, the method that addresses this problem was that the J2 contact is in 0 ℃ the mixture of ice and water, therefore claimed that J2 is cold junction, then V
J2=0, so Vmeas=V
J1Yet in actual applications, the reference temperature that obtains 0 ℃ is unrealistic, if the cold junction temperature is not 0 ℃, so, in order to determine the temperature of actual thermal cross (abbreviation hot junction) J1, the temperature of just necessary known cold junction J2.Consider the voltage of non-zero cold junction temperature, must compensate, promptly so-called cold junction compensation the thermopair output voltage.
As shown in Figure 2, be the system architecture diagram of electric thermo-couple temperature collection system preferred embodiment of the present invention.This electric thermo-couple temperature collection system comprises that at least one thermopair 1 is integrated on the plank, Temperature sampler 2, computing machine 3 and dc power source adapter 4.This dc power source adapter 4 is used for providing operating voltage to described Temperature sampler 2.
Thermopair 1 is at one end to be welded to each other by two kinds of different metallic conductors to form, and in this preferred embodiment, these two kinds of metals are respectively copper and cobalt.Thermopair 1 is connected with Temperature sampler 2 by thermocouple wire.
Be equipped with holding circuit 20, filter processor 21 in this Temperature sampler 2, at least one is parallel from microprogram control unit (microprogram controller unit; MCU) 22 (present embodiment is that example describes with five from MCU), system's control bus (system management bus; SMBus) 23, main MCU 24, cold junction temperature compensation sensor (CodeJunction Compensation Sensor, CJC Sensor) 25 and network interface 26.Wherein, describedly link to each other with main MCU 24 by SMBus 23 from MCU 22, described main MCU 24 passes through network interface 26 and is connected with described computing machine 3.This network interface 26 is welded on the Temperature sampler 2, and it defers to ICP/IP protocol, and transfer rate is 10/,100,000,000.Present embodiment is not limited thereto kind of network interface 26, and it can also be the network interface 26 of other type, and this network interface 26 is not limited to be welded on the Temperature sampler 2.
When holding circuit 20 was used for overcurrent, overvoltage, the chip in the protection Temperature sampler 2 was not by over-voltage breakdown, and this chip comprises from MCU 22 and main MCU 24.Described filter processor 20 connects two copper cash, is connected with the cobalt line with the copper cash of thermopair 1 respectively.This filter processor 20 is used to filter the analog voltage signal that thermopair 1 produces, and it can effectively remove interference, and the antijamming capability of enhanced system makes this analog voltage signal become steady through filter processor 20.When a copper cash of described filter processor 20 is connected with the cobalt line of thermopair 1, because its metal material difference can produce a voltage (poor) value; And when another copper cash of described filter processor 20 is connected with the copper cash of thermopair 1, do not form thermopair during owing to identical material metal connection and processing uniform temp, can produce a thermopower at the cold junction place of this thermopair 1.
Wherein, each comprises a multi-way switch and four temperature acquisition passages (the analog/digital conversion passage is called for short the AD passage) from MCU 22.Described multi-way switch is used to control described four AD passages from MCU 22 and gathers the magnitude of voltage that the thermopair 1 that connects separately measures object under test, this object under test such as baking box, humiture cabinet etc. successively.Described AD passage is meant the circuit of data transmission.In the present embodiment all can be controlled its corresponding AD passage at one time simultaneously from the multi-way switch of MCU 22 and carry out temperature acquisition.Described AD passage respectively has one and has analog/digital (analog/digital, A/D) the AD device of translation function, the magnitude of voltage that is used for described AD passage is gathered is a digital signal by analog signal conversion, and this digital signal is usually with binary representation (below be referred to as " binary voltage value ").This AD device also is used to calculate the correction coefficient of AD voltage that passage is gathered, and sends the described binary voltage value of order this AD device correction of control by computing machine 3.Described from MCU 22 by system's control bus (system management bus, SM Bus) sends the binary voltage value after the described correction to main MCU 24, this main MCU 24 passes to computing machine 3 by the binary voltage value of network interface 26 after with described correction, is calculated the actual temperature value of the object under test that each AD passage gathered by this computing machine 3.When computing machine 3 needed Long-distance Control Temperature sampler 2, the user can carry out the remote temperature monitoring to this Temperature sampler 2 by need the IP address of the Temperature sampler 2 of control to the native system input.
AD device in the present embodiment can also be used to read the magnitude of voltage that is connected on this AD channel circuit, and this magnitude of voltage directly calculates the temperature value that this AD passage is gathered after the temperature correction instrument is proofreaied and correct.Because calculating described temperature value from MCU 22 by the AD device need take bigger memory headroom, therefore, the temperature value that present embodiment AD passage is gathered is calculated by computing machine 3.
The thermopower that produces at cold junction J2 place when CJC Sensor 25 is used to measure filter processor 20 and is connected with thermopair 1.One section calculation procedure of main MCU 24 stored, be used for described thermopower is carried out analog/digital conversion, be about to this thermopower and convert a binary digital signal (below be referred to as " scale-of-two thermopower ") to, calculate the cold junction temperature value of this scale-of-two thermopower correspondence and calculate the side-play amount of this cold junction temperature value, according to the described cold junction temperature value of this offset compensation, and the cold junction temperature value after will compensating sends computing machine 3 to by network interface 26.In addition, described main MCU 24 also comprises a flash memory, is used to store the side-play amount of the correction coefficient of described AD voltage that passage is gathered, described cold junction temperature and the type of thermopair 1.The type of this thermopair 1 comprises T type, J type, K type, E type, N28 type, N14 type, S type, R type and Type B.Electric thermo-couple temperature collection system described in the present embodiment is supported the thermopair 1 of three types of T, J, K, Figure 1 shows that T type thermopair 1.
Described computing machine 3 comprises a control module 30, data receiving element 32, a computing unit 34 and a display unit 36.This control module 30 is used to control the described described binary voltage value of AD device correction in MCU 22 to sending order from MCU 22 and main MCU 24, and the calculation procedure of controlling described main MCU 24 stored compensates described cold junction temperature value.Data Receiving unit 32 is used to receive the binary voltage value after the described correction that is sent from MCU 22, and receives the cold junction temperature value after the compensation that described main MCU24 sends.Computing unit 34 is used for the binary voltage value after the described correction is carried out the cold junction compensation according to following steps: the binary voltage value after the described correction is converted to decimal system magnitude of voltage V, and the cold junction temperature value after the described compensation is converted to magnitude of voltage V according to the relational expression between temperature-voltage
1, calculate the object under test that thermopair 1 gathers and the Seebeck magnitude of voltage that produces: V
0=V-V
1, utilize relational expression between temperature-voltage with V
0Be converted to the actual temperature value T of object under test
0, and show by display unit 36.Wherein, described computing unit 34 can also directly find out the temperature value of described Seebeck magnitude of voltage correspondence by search " the voltage temperature table of comparisons ", should " voltage-temperature table of comparisons " be the public table of comparisons of industry.The display that described display unit 36 can be connected for computing machine 3.
As shown in Figure 3, be the main process flow diagram of Thermocouple Temperature Acquisition method of the present invention preferred embodiment.At first, described AD device calculates the correction coefficient of AD passage, and the calculation procedure in the described main MCU 24 calculates the side-play amount (step S300) of thermopair 1 cold junction temperature value.This AD passage is gathered the magnitude of voltage that the thermopair 1 that connects separately measures object under test successively, and wherein, this magnitude of voltage is an analog voltage signal, and the AD device is converted to this analog voltage signal the binary voltage value (step S301) that shows with digital signal.The described AD device of control module 30 controls is proofreaied and correct this binary voltage value according to described correction coefficient, and sending this binary voltage value to described main MCU 24, this main MCU 24 sends this binary voltage value to computing machine 3 (step S302) by network interface 26.The described calculation procedure of control module 30 controls is according to the temperature value of the described cold junction of offset compensation of described cold junction temperature value, and the cold junction temperature value after will compensating sends computing machine 3 (step S303) to by network interface 26.Data Receiving unit 32 receives the cold junction temperature value after described binary voltage values and the compensation, and the cold junction temperature value of computing unit 34 after according to this compensation carries out cold junction with described binary voltage value and compensate (step S304).Described computing unit 34 calculates the actual temperature value (step S305) of object under test according to this compensated voltage value.
As shown in Figure 4, be the process flow diagram of correction coefficient described in the AD device calculating chart 3 step S300.Because the magnitude of voltage that the AD passage is gathered may be because some factor, for example, enlargement factor, have or not influences such as impact damper setting, front-end circuit, temperature, humidity, cause the existence of error, more accurate for the actual temperature value that makes the object under test that finally records, need carry out error correction to the AD passage.
This correction factor calculation step is as follows: at first, step S400, described AD device receive the user from being connected to the standard voltage value a1 of a temperature correction instrument (not shown) input on the AD passage, wherein, and the a1=0.000 millivolt.In step S401, receive the magnitude of voltage that the AD passage is gathered, and this magnitude of voltage is converted to binary voltage value b1.In step S402, receive the user from being connected to the standard voltage value a2 of the temperature correction instrument input on the AD passage, this a2 is the full scale value of AD device.In step S403, receive another magnitude of voltage that the AD passage is gathered, and this magnitude of voltage is converted to binary voltage value b2.Step S404, the described AD device magnitude of voltage after according to above-mentioned reception and conversion calculates the correction coefficient of this AD passage.The linear equation in two unknowns group that the formula of this calculating is made up of b1x+y=a1 and b2x+y=a2.Wherein, the correction coefficient x that is calculated represents side-play amount (offset), and y represents slope (span).Step S405, described AD device sends to main MCU 24 with correction coefficient x, the y that calculates, and is stored in the flash memory of this main MCU 24, so that the follow-up magnitude of voltage that this AD passage is gathered is proofreaied and correct
As shown in Figure 5, be the process flow diagram of the side-play amount of cold junction temperature value described in the calculating chart 3 step S300.When measuring the temperature of cold junction J2,, obtain the side-play amount of this thermopair 1 cold junction temperature value because therefore the temperature that the error that CJC Sensor 25 may exist itself can cause the cold junction measured deviation to some extent will compensate it.Computing method are as follows: in step S500, the calculation procedures in the main MCU 24 receive the ambient temperature value T that users utilize the cold junction of the higher thermometer measure of precision
EnvIn step S501, this calculation procedure reads a temperature value T of the measured cold junction of CJC Sensor 25
J2
Wherein, CJC Sensor 25 measures the temperature value T of cold junction
J2Synoptic diagram as shown in Figure 6, wherein, J1 is a hot junction, J2 is a cold junction, L is an isotherm, the temperature of each point on this isotherm all is identical.J2 and a point are on same the isotherm, so the J2 point is identical with a point temperature.When measuring a point temperature, at first, give operating voltage of this CJC Sensor25, in this preferred embodiment, this operating voltage is positive 5 volts; CJC Sensor 25 measures the magnitude of voltage V at resistance r two ends
rBecause the resistance of resistance r is known, be made as R; Then can be according to formula I=V by the electric current of resistance r
r/ R obtains electric current I; Utilize the relational expression between electric current and the temperature to obtain a point that CJC Sensor 25 measures, i.e. cold junction J2 temperature value T at last
J2
In step S502, calculation procedure utilizes T
EnvWith T
J2Carry out algebraic operation and obtain the offset delta of the temperature of cold junction J2, i.e. offset delta=T
Env-T
J2In step S503, calculation procedure is stored in this offset delta in the flash memory of main MCU 24, so that follow-up temperature value to the cold junction J2 that measures compensates.
As shown in Figure 7, be the particular flow sheet of Fig. 3 step S302.At first, described AD device reads the magnitude of voltage that the AD passage gathered and this magnitude of voltage is converted to binary voltage value Vmeas (step S700).The AD device reads the correction coefficient x and the y (step S701) of the AD passage that is stored in the described flash memory.This AD device is proofreaied and correct described binary voltage value Vmeas, and the method for correction is: V=xVmeas+y (step S702).Magnitude of voltage V after will proofreading and correct from MCU 22 sends main MCU 24 to by SMBus 23, and the magnitude of voltage V after this main MCU 24 will proofread and correct by network interface 26 sends computing machine 3 (step S703) to.
As shown in Figure 8, be the particular flow sheet of Fig. 3 step S303.At first, step S800, calculation procedure read the temperature value t of the cold junction of CJC Sensor25 measurement.Step S801, this calculation procedure reads the offset delta that is stored in the described flash memory, and temperature value t is compensated, and compensation formula is: T=t+ δ.Step S802, the temperature value T of the cold junction after main MCU 24 will compensate sends computing machine 3 to by network interface 26.
As shown in Figure 9, be the particular flow sheet of Fig. 3 step S305.These computing method comprise the steps: at first, step S900, and the binary voltage value V after computing unit 34 will be proofreaied and correct is converted to a magnitude of voltage V with decimal representation
10Cold junction temperature value T after step S901, computing unit 34 will compensate according to the relational expression between temperature-voltage is converted to magnitude of voltage V
1Step S902, computing unit 34 calculate that thermopairs 1 measure object under test and the Seebeck magnitude of voltage that produces: V
0=V
10-V
1, i.e. compensated voltage value.Step S903, computing unit 34 utilize relational expression between temperature-voltage with V
0Be converted to the actual temperature value T of object under test
0, and show by display unit 36.
Claims (9)
1. an electric thermo-couple temperature collection system comprises computing machine, Temperature sampler and thermopair, and this thermopair links to each other with Temperature sampler, it is characterized in that:
This computing machine links to each other with described Temperature sampler by a network interface, is used to monitor the temperature of the object under test that described thermopair that this Temperature sampler gathers measures;
This Temperature sampler comprises at least one from microprogram control unit and by system's control bus and this main microprogram control unit that links to each other from microprogram control unit, wherein,
Describedly comprise from microprogram control unit:
The analog digital ALT-CH alternate channel is used to gather the analog voltage signal that is produced when described thermopair measures above-mentioned object under test; And
Analog-digital commutator is used for above-mentioned analog voltage signal is converted to digital signal, calculates the correction coefficient of analog digital ALT-CH alternate channel, and proofreaies and correct according to the magnitude of voltage that this correction coefficient is gathered the analog digital ALT-CH alternate channel;
Described main microprogram control unit is used to gather the temperature value of cold thermocouple contact, calculates the side-play amount of this cold junction temperature value, and compensates according to the side-play amount of this cold junction temperature value temperature value to described cold junction; And
The magnitude of voltage of the cold junction temperature value of described computing machine after according to above-mentioned compensation after to above-mentioned correction carries out the cold junction compensation, and the compensated voltage value is converted to the actual temperature value of object under test.
2. electric thermo-couple temperature collection system as claimed in claim 1 is characterized in that, described Temperature sampler also comprises:
Filter processor is used to filter the analog voltage signal that the thermocouple measurement object under test produces.
3. electric thermo-couple temperature collection system as claimed in claim 1 is characterized in that, described main microprogram control unit comprises flash memory, is used to store the correction coefficient of described analog digital ALT-CH alternate channel and the side-play amount of described cold thermocouple contact temperature.
4. electric thermo-couple temperature collection system as claimed in claim 1 is characterized in that, the temperature value of described cold thermocouple contact is to be measured the cold junction of described thermopair and obtained by a cold junction temperature compensation sensor.
5. electric thermo-couple temperature collection system as claimed in claim 1 is characterized in that, described computing machine comprises:
Control module, send order to described from microprogram control unit and main microprogram control unit, be used to control described analog-digital commutator in microprogram control unit and proofread and correct described digital signal, and control described main microprogram control unit and compensate described cold junction temperature value, wherein, described digital signal is the binary voltage value;
The Data Receiving unit is used to receive described binary voltage value after the correction that microprogram control unit sent, and receives the cold junction temperature value after the compensation that described main microprogram control unit sends;
Computing unit, be used for the binary voltage value after the described correction is converted to decimal system magnitude of voltage, and the cold junction temperature value after the described compensation is converted to magnitude of voltage according to the relational expression between temperature and the voltage, calculate the Seebeck magnitude of voltage of the object under test that thermopair gathers by the magnitude of voltage after this temperature transition and described decimal system magnitude of voltage, and utilize relational expression between temperature and the voltage this Seebeck magnitude of voltage to be converted to the actual temperature value of object under test; And
Display unit is used to show the actual temperature value of described object under test.
6. a Thermocouple Temperature Acquisition method is characterized in that, this method comprises:
Analog-digital commutator in the Temperature sampler calculates the correction coefficient of analog digital ALT-CH alternate channel;
Analog voltage signal that this analog digital ALT-CH alternate channel collection is produced by a thermocouple measurement one object under test and the magnitude of voltage that is converted into digital signal;
Described analog-digital commutator utilizes the correction coefficient of described analog digital ALT-CH alternate channel that this magnitude of voltage is carried out error correction;
Described Temperature sampler sends a computing machine to by the magnitude of voltage of network interface after with above-mentioned correction;
Magnitude of voltage after this computing machine will be proofreaied and correct carries out the cold junction compensation; And
This computing machine is converted into the compensated voltage value actual temperature value of object under test.
7. Thermocouple Temperature Acquisition method as claimed in claim 6 is characterized in that, the step that described analog-digital commutator calculates the correction coefficient of analog digital ALT-CH alternate channel comprises:
Receive the standard voltage value a1 of user's input;
Read the magnitude of voltage b1 that analog-digital commutator collects;
Receive another standard voltage value a2 of user's input;
Read another magnitude of voltage b2 that analog-digital commutator collects; And
According to above-mentioned four magnitudes of voltage, calculate the correction coefficient of analog digital ALT-CH alternate channel.
8. Thermocouple Temperature Acquisition method as claimed in claim 6 is characterized in that, described computing machine comprises the step that magnitude of voltage carries out the cold junction compensation:
Main microprogram control unit in the Temperature sampler calculates the side-play amount of cold thermocouple contact temperature value;
The cold junction temperature compensation sensor is measured the temperature value of the cold junction of described thermopair;
Temperature sampler compensates the said temperature value according to the side-play amount of described cold junction temperature value;
Cold junction temperature value after computing machine will compensate is converted into magnitude of voltage; And
The magnitude of voltage of above-mentioned magnitude of voltage and thermopair generation is carried out algebraic operation, draw cold junction compensated voltage value.
9. Thermocouple Temperature Acquisition method as claimed in claim 8 is characterized in that, the step of the side-play amount of described calculating cold thermocouple contact temperature value comprises:
Receive the ambient temperature value T of the cold thermocouple contact of a thermometer measure;
Read the temperature value t of the cold junction that the cold junction temperature compensation sensor measures; And
T and t are carried out algebraic operation, calculate the side-play amount of cold junction temperature value.
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| CN2446059Y (en) * | 2000-09-21 | 2001-09-05 | 中国船舶重工集团公司第七研究院第七一一研究所 | Marine temp reducing processing appts. |
| CN2514952Y (en) * | 2001-12-19 | 2002-10-09 | 中国科学院金属研究所 | Temperature field automatic collection device of single crystal high temperature directional solidification process |
| CN100383491C (en) * | 2004-12-29 | 2008-04-23 | 中国科学院空间科学与应用研究中心 | Temperature acquisition system in multiple channels suitable to examination of microgravity liquid |
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2007
- 2007-07-06 CN CN2007102010188A patent/CN101339692B/en not_active Expired - Fee Related
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| CN103376058A (en) * | 2012-04-28 | 2013-10-30 | 鸿富锦精密工业（深圳）有限公司 | Temperature compensation system and method |
| CN103994827A (en) * | 2014-04-18 | 2014-08-20 | 天长市博控光电科技有限公司 | Digital photoelectric temperature sensor |
| CN105067151A (en) * | 2015-08-04 | 2015-11-18 | 西安昆仑工业（集团）有限责任公司 | Signal conditioning based artillery temperature parameter test device and method |
| CN105955135A (en) * | 2016-06-14 | 2016-09-21 | 珠海格力电器股份有限公司 | Outdoor temperature correction method and device |
| CN105955135B (en) * | 2016-06-14 | 2019-01-08 | 珠海格力电器股份有限公司 | Outdoor temperature correction method and device |
| CN111971537A (en) * | 2018-04-19 | 2020-11-20 | 吉奥马科技有限公司 | Temperature correction device and temperature measurement device |
| CN115472136A (en) * | 2022-08-16 | 2022-12-13 | 昆山国显光电有限公司 | Display panel and electronic equipment |
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