CN103759851A - Temperature compensation method used for thermal resistance collecting module - Google Patents
Temperature compensation method used for thermal resistance collecting module Download PDFInfo
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- CN103759851A CN103759851A CN201410054953.6A CN201410054953A CN103759851A CN 103759851 A CN103759851 A CN 103759851A CN 201410054953 A CN201410054953 A CN 201410054953A CN 103759851 A CN103759851 A CN 103759851A
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- 238000000034 method Methods 0.000 title abstract description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 72
- 229910052697 platinum Inorganic materials 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 6
- BASFCYQUMIYNBI-BKFZFHPZSA-N platinum-200 Chemical compound [200Pt] BASFCYQUMIYNBI-BKFZFHPZSA-N 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 4
- 238000005070 sampling Methods 0.000 description 11
- 238000009529 body temperature measurement Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
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Abstract
The invention discloses a temperature compensation method used for a thermal resistance collecting module. The method comprises the following steps that (a) sample data of measured values, changing along with the environment temperature, of the thermal resistance collecting module are collected in advance; (b) data fitting is conducted on the collected sample data to obtain a changing curve, along with the temperature, of thermal resistance sampled values, and the changing curve serves as a temperature compensating curve of the thermal resistance collecting module; (c) when actual measuring is conducted, after the thermal resistance collecting module obtains the thermal resistance sampled values, compensation is conducted on the thermal resistance sampled values through the temperature compensating curve according to the current environment temperature of the thermal resistance collecting module. According to the temperature compensation method used for the thermal resistance collecting module, the changing curve, along with the temperature, of the thermal resistance sampled values of the thermal resistance collecting module is obtained in advance, temperature compensation is conducted through the changing curve during actual measuring, and therefore the number of temperature measured deviations, caused by environment temperature changes, of the thermal resistance collecting module is reduced, measuring accuracy is greatly improved, and cost is not increased.
Description
Technical field
The present invention relates to a kind of thermal resistance method of sampling, relate in particular to a kind of temperature compensation for thermal resistance collection module.
Background technology
In industry spot application, extensively adopt thermal resistance to measure temperature, common thermal resistance has copper 50, copper 100, platinum 100, platinum 200, platinum 500, platinum 1000 etc.Compared with other sensor for measuring temperature, thermal resistance sensor has the feature of measuring accuracy height and working stability.When measured object temperature variation, the resistance value of thermal resistance changes thereupon, and the resistance value of thermal resistance and measured temperature have fixing corresponding relation, thereby can accurately obtain dut temperature value according to its resistance value.
In thermal resistance temperature surveying system, thermal resistance access signal acquisition module, converts digital signal by its analog-digital converter to tiny signal, and is calculated as temperature value, finally this temperature value is sent to controller.Although thermal resistance itself has higher measuring accuracy, but in the process of signal being changed in signal acquisition module, signal acquisition module (particularly preamplifier and analog digital conversion chip) can be subject to ambient temperature effect, thereby sampling precision is produced to considerable influence.
The impact being subject to due to variation of ambient temperature in order to reduce signal sampling module, some sampling module adopts analog digital conversion chip and the peripheral circuit of low temperature drift, this method can effectively reduce the impact of environment temperature on sampling precision, but has greatly increased sampling module cost.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of temperature compensation for thermal resistance collection module, can reduce the temperature survey deviation that thermal resistance collection module causes when variation of ambient temperature, greatly improves measuring accuracy and does not increase cost.
The present invention solves the problems of the technologies described above the technical scheme adopting to be to provide a kind of temperature compensation for thermal resistance collection module, comprises the steps: a) to gather in advance the measured value of thermal resistance collection module with the sample data of variation of ambient temperature; B) sample data collecting is carried out to data fitting and obtain thermal resistance sampled value variation with temperature curve, and the temperature compensation curve using this change curve as thermal resistance collection module; C) during actual measurement, thermal resistance collection module obtains after thermal resistance sampled value, and the environment temperature current according to thermal resistance collection module, compensates thermal resistance sampled value by temperature compensation curve.
The above-mentioned temperature compensation for thermal resistance collection module, wherein, described step a) in to multiple thermal resistance collection modules of same model carry out data acquisition calculating mean value as the measured value of the thermal resistance collection module of this model the sample data with variation of ambient temperature.
The above-mentioned temperature compensation for thermal resistance collection module, wherein, the described step a) measured value of middle thermal resistance collection module is the resistance maximal value of every kind of thermal resistance with variation of ambient temperature, the scope of described variation of ambient temperature is-20 ℃～70 ℃.
The above-mentioned temperature compensation for thermal resistance collection module, wherein, described step is carried out data fitting to every kind of thermal resistance sampled value in b), obtains thermal resistance sampled value variation with temperature curve separately.
The above-mentioned temperature compensation for thermal resistance collection module, wherein, the principle of utilizing the resistance value read under Current Temperatures and resistance value under 25 ℃ of environment temperatures to equate with the ratio of corresponding 2 on compensated curve in described step c), try to achieve 25 ℃ of resistance values under environment temperature, thereby realize temperature compensation.
The above-mentioned temperature compensation for thermal resistance collection module, wherein, described step b) in temperature compensation curve after matching be S=a+b*exp (c*x), wherein, S is the sampled value of thermal resistance collection module to certain type of thermal resistance, and x is the current environment temperature of thermal resistance collection module, a, b, c is temperature compensation fitting parameter.
The above-mentioned temperature compensation for thermal resistance collection module, wherein, described thermal resistance is copper 50, copper 100, platinum 1000, platinum 500, platinum 200 or platinum 100.
The present invention contrasts prior art following beneficial effect: the temperature compensation for thermal resistance collection module provided by the invention, by obtaining in advance the thermal resistance sampled value variation with temperature curve that gathers thermal resistance collection module, and when actual measurement, utilize this change curve to carry out temperature compensation, thereby can reduce the temperature survey deviation that thermal resistance collection module causes when variation of ambient temperature, greatly improve measuring accuracy and do not increase cost.
Accompanying drawing explanation
Fig. 1 is the temperature compensation schematic flow sheet of the present invention for thermal resistance collection module;
Fig. 2 is the matched curve figure of thermal resistance collection module of the present invention;
Fig. 3 is the linear relationship schematic diagram of platinum 1000 thermal resistance ohmic values and sampled value under 25 ℃ of conditions.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
Fig. 1 is the temperature compensation schematic flow sheet of the present invention for thermal resistance collection module.
Refer to Fig. 1, the temperature compensation for thermal resistance collection module provided by the invention comprises the steps:
Step S1: gather in advance the measured value of thermal resistance collection module with the sample data of variation of ambient temperature.Owing to considering the gain of dissimilar thermal resistance input circuit and the difference of sampled signal scope, the temperature response curve of thermal resistance collection module can be different, in order to reduce to greatest extent the measuring error of every type of thermal resistance, all kinds thermal resistance is carried out respectively to data acquisition and curve.Meanwhile, for fit error curve more accurately, need to carry out data acquisition to multiple thermal resistance collection module samples of same model, to obtain the assembly average of data.
The present invention, in sample data gatherer process, mainly gathers two groups of data below:
1) module real time environment temperature value
The temperature sensor carrying with digital measurement of temperature device or analog-digital converter chip inside, can obtain from-20 ℃ to 70 ℃, or from the real time temperature reading of 70 ℃ to-20 ℃.
2) thermal resistance real-time sampling value
In temperature rising and reduction process, read the sampled data of a certain stationary heat resistance.
Step S2: the sample data collecting is carried out to data fitting and obtain thermal resistance sampled value variation with temperature curve, and the temperature compensation curve using this change curve as thermal resistance collection module.Curve can be selected dissimilar formula as required, and as multistage polynomial expression or index equation, this depends on which kind of model matched curve selects.By obtaining mass data, select appropriate data processing tools, and select suitable mathematical model, utilize the method for mathematical statistics, obtain the mean value of all data, finally obtain a compensated curve.
Step S3: during actual measurement, thermal resistance collection module obtains after thermal resistance sampled value, and the environment temperature current according to thermal resistance collection module, compensates thermal resistance sampled value by temperature compensation curve.
Below for dissimilar thermal resistance, provide concrete fitting formula a: S=a+b*exp (c*x), wherein S is the sampled value of temperature sampling module to certain type of thermal resistance, a, b, three parameters of c temperature compensation formula, e power in exp mathematics, x be temperature measurement module when variation of ambient temperature, the reading of temperature collect module environment temperature.By the data acquisition to dozens of module and processing, obtained above compensation formula, the matching that this formula comparison is good exemplary module temperature variant trend of measured value in variation of ambient temperature process.As shown in Figure 2, transverse axis is that temperature measurement module is when variation of ambient temperature, the environment temperature original value recording in real time, the longitudinal axis is that temperature measurement module is that temperature measurement module is sampled certain type of thermal resistance and the line that obtains to the sampled value broken line of certain type of thermal resistance in temperature changing process, intermediate curve is the matched curve S=a+b*exp (c*x) of certain type of thermal resistance, has the instance parameter value of every type of matched curve below.Finally, in software, use this formula to compensate measured value, reached the expection of Thermistor Temperature Measurement compensation.
The present invention, under-20 ℃ to 70 ℃ conditions, has obtained three parameter a of temperature compensation formula by experiment, b, and c, for different thermal resistance types, its compensated curve has different parameters.The present invention obtains the different thermal resistance types that meet above formula a by many experiments below, b, the preferred value of c parameter.
Type copper 50, its compensated curve parameter a, b, the fitting parameter of c is as follows:
a=4820.3729
b=4.26494E-07
c=0.00837248
Above parameter has determined the matched curve of copper 50: y=a+b*exp (c*x).
Type copper 100, its compensated curve parameter a, b, the fitting parameter of c is as follows:
a=5577.09009
b=1.42485E-06
c=0.0078929
Above parameter has determined the matched curve of copper 100: y=a+b*exp (c*x).
Type platinum 1000, its compensated curve parameter a, b, the fitting parameter of c is as follows:
a=14884.9502
b=7.27018E-06
c=0.0079965
Above parameter has determined the matched curve of platinum 1000: y=a+b*exp (c*x)
Type platinum 500, its compensated curve parameter a, b, the fitting parameter of c is as follows:
a=7451.12060
b=5.4896E-07
c=0.0088453
Above parameter has determined the matched curve of platinum 500: y=a+b*exp (c*x).
Type platinum 200, its compensated curve parameter a, b, the fitting parameter of c is as follows:
a=3067.46998
b=2.0817E-07
c=0.008888
Above parameter has determined the matched curve of platinum 200: y=a+b*exp (c*x).
Type platinum 100, its compensated curve parameter a, b, the fitting parameter of c is as follows:
a=14894.56234
b=5.27493E-06
c=0.0078295
Above parameter has determined the matched curve of platinum 100: y=a+b*exp (c*x).
Below in conjunction with embodiment, the resistance derivation method while measuring is described once.Enumerate one type of platinum 1000, other type platinum 100, platinum 200, platinum 500, copper 100, copper 50 is all same principle, this is no longer going to repeat them.
Experimental formula 1: resistance is A1 in T temperature and in the difference of 25 ℃ of down-sampled values with the ratio of its sampled value at 25 ℃, and this ratio A 1, measuring in temperature range, is changeless to same type platinum 1000.Following formula:
A1=（b*e(c*X(T))-b*e(c*X(25℃))）/(a+b*e(c*X(25℃)))；
Wherein, A1 is ratio; Parameter a, b, c, from platinum 1000 given parameters values, please refer to all kinds given parameters value above; X (T) when analog-digital converter is operated in environment temperature T ℃, its real-time reading of internal temperature module; X (25 ℃) is when analog-digital converter is operated in 25 ℃ of environment temperatures, and its internal temperature module reading, needs read value referring to calibrating the first step below.
Experimental formula 2: to same type platinum 1000, as follows at difference and 25 ℃ of sampled value ratios of T ℃ and 25 ℃ sampled value:
A2=（S(T)-S(25℃)）/S(25℃)
Wherein, A2 is ratio; ST is when platinum 1000 detector resistors are during at T ℃, the sampled value of analog-digital converter to this thermal resistance; S (25 ℃) is when platinum 1000 detector resistors are during at 25 ℃, the sampled value of analog-digital converter to this thermal resistance.
Above two ratio A 1 and A2 equate.Therefore obtain equation:
(b*e(c*X(T))-b*e(c*X(25℃))）/(a+b*e(c*X(25℃)))=(S(T)-S(25℃))/S(25℃)；
In superincumbent equation, the value on the equation left side can obtain from matched curve, the temperature value that the S (T) on formula the right arrives for actual measurement, S (25 ℃), for the temperature value that needs to measure is from the equation of face above, just can calculate the sampled value of S at 25 ℃ (25 ℃).
Once calibrating principle of the present invention and temperature computation are finally described, enumerate one type of platinum 1000, other is identical, repeats no longer one by one.
Measuring resistance type platinum 1000 calibrating principles: under 25 ℃ of conditions, the process of calibration is as follows:
The first step is obtained the internal temperature module reading X (25 ℃) of analog-digital converter;
3 definite resistance values of second step sampling: CalibPoint1=800 Ω, CalibPoint2=1800 Ω, CalibPoint3=3000 Ω, the sampled value that its correspondence reads is: CalibPara1, CalibPara2, CalibPara3.
Fig. 3 is the linear relationship schematic diagram of platinum 1000 thermal resistance ohmic values and sampled value under 25 ℃ of conditions, and transverse axis is the sampled value of analog-digital converter to platinum 1000 thermal resistances; The longitudinal axis is the ohmic value scope of platinum 1000 thermal resistances.
The present invention adopts two sections of straight lines to be similar to calibration method, and the sampled value respectively situation on two sections of straight lines is as follows:
1) when the resistance sampling value obtaining is between CalibPara1 and CalibPara2, computing formula is calibration equation 1:
OHM (Ω)=(S (x) – CalibPara1)/(CalibPara2 – CalibPara1) * (CalibPoint2 – CalibPoint1)+CalibPoint1; Wherein, OHM (Ω) is the ohmic value of platinum 1000 thermal resistances, and S (x) is when analog-digital converter is operated in environment temperature X ℃, and its internal temperature module reading, is now 25 ℃ of sampled values under condition; CalibPara1, CalibPara2, CalibPara3 is three ohmic values of platinum 1000 thermal resistances; CalibPoint1, CalibPoint2, CalibPoint3 is the sampled value of analog-digital converter to platinum 1000 thermal resistances, respectively corresponding three above resistance values.
This S (x)=S (25 ℃), the equation by S (x) more than substitution, can obtain platinum 1000 resistance OHM (Ω).
2) when the resistance sampling value obtaining is between CalibPara2 and CalibPara3, computing formula is calibration equation 2:
OHM(Ω)=(S(x)–CalibPara2)/(CalibPara3–CalibPara2)*(CalibPoint3–CalibPoint2)+CalibPoint2。
This S (x)=S (25 ℃), the equation by S (x) more than substitution, can obtain the resistance OHM (Ω) of platinum 1000.
From formula above, just obtained the resistance value of platinum 1000 corresponding measured objects under 25 ℃ of conditions, then by " thermopair international practical temperature scale table " or " thermal resistance international practical temperature scale table ", table look-up, obtain the measured temperature value of platinum 1000 resistance.
Although the present invention discloses as above with preferred embodiment; so it is not in order to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when doing a little modification and perfect, therefore protection scope of the present invention is worked as with being as the criterion that claims were defined.
Claims (7)
1. for a temperature compensation for thermal resistance collection module, it is characterized in that, comprise the steps:
A) gather in advance the measured value of thermal resistance collection module with the sample data of variation of ambient temperature;
B) sample data collecting is carried out to data fitting and obtain thermal resistance sampled value variation with temperature curve, and the temperature compensation curve using this change curve as thermal resistance collection module;
C) during actual measurement, thermal resistance collection module obtains after thermal resistance sampled value, and the environment temperature current according to thermal resistance collection module, compensates thermal resistance sampled value by temperature compensation curve.
2. the temperature compensation for thermal resistance collection module as claimed in claim 1, it is characterized in that, described step a) in to multiple thermal resistance collection modules of same model carry out data acquisition calculating mean value as the measured value of the thermal resistance collection module of this model the sample data with variation of ambient temperature.
3. the temperature compensation for thermal resistance collection module as claimed in claim 1, it is characterized in that, the described step a) measured value of middle thermal resistance collection module is the resistance maximal value of every kind of thermal resistance with variation of ambient temperature, and the scope of described variation of ambient temperature is-20 ℃～70 ℃.
4. the temperature compensation for thermal resistance collection module as claimed in claim 1, is characterized in that, described step is carried out data fitting to every kind of thermal resistance sampled value in b), obtains thermal resistance sampled value variation with temperature curve separately.
5. the temperature compensation for thermal resistance collection module as claimed in claim 1, it is characterized in that, the principle of utilizing the resistance value read under Current Temperatures and resistance value under 25 ℃ of environment temperatures to equate with the ratio of corresponding 2 on compensated curve in described step c), try to achieve 25 ℃ of resistance values under environment temperature, thereby realize temperature compensation.
6. the temperature compensation for thermal resistance collection module as claimed in claim 1, it is characterized in that, described step b) in temperature compensation curve after matching be S=a+b*exp (c*x), wherein, S is the sampled value of thermal resistance collection module to certain type of thermal resistance, and x is the current environment temperature of thermal resistance collection module, a, b, c is temperature compensation fitting parameter.
7. the temperature compensation for thermal resistance collection module as claimed in claim 1, is characterized in that, described thermal resistance is copper 50, copper 100, platinum 1000, platinum 500, platinum 200 or platinum 100.
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| CN107449521A (en) * | 2017-07-31 | 2017-12-08 | 深圳市泰和安科技有限公司 | Method, terminal device and the computer-readable recording medium of temperature-compensating |
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| CN109991153A (en) * | 2017-12-29 | 2019-07-09 | 长野科学株式会社 | Temperature characteristic evaluation method |
| CN111096649A (en) * | 2018-10-26 | 2020-05-05 | 佛山市顺德区美的电热电器制造有限公司 | Operation control method, device, cooking appliance and computer readable storage medium |
| CN112268633A (en) * | 2020-10-22 | 2021-01-26 | 合肥中科离子医学技术装备有限公司 | Temperature and resistance value conversion method for industrial platinum resistance within 30 to 73K |
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| CN113419120A (en) * | 2021-05-08 | 2021-09-21 | 同济大学 | Method and system for measuring thermal resistance of dielectric film and metal interface |
| CN113960256A (en) * | 2021-10-21 | 2022-01-21 | 上海朝辉压力仪器有限公司 | Temperature compensation method for water content instrument |
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| CN116027248A (en) * | 2022-12-26 | 2023-04-28 | 深圳市锐能微科技有限公司 | Temperature compensation device and method and electric energy meter |
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| CN105404324A (en) * | 2015-11-26 | 2016-03-16 | 重庆晟初科技有限公司 | Temperature control method and system applied to specific electromagnetic spectrum therapeutic apparatus |
| CN105527038A (en) * | 2015-12-02 | 2016-04-27 | 湖南威铭能源科技有限公司 | Error correction method for platinum thermal resistance sensor and calorimeter measuring temperature using the same method |
| CN105527038B (en) * | 2015-12-02 | 2017-12-05 | 湖南威铭能源科技有限公司 | Platinum thermal resistance sensor error correcting method and the calorimeter with this method thermometric |
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| CN107449521A (en) * | 2017-07-31 | 2017-12-08 | 深圳市泰和安科技有限公司 | Method, terminal device and the computer-readable recording medium of temperature-compensating |
| CN109991153A (en) * | 2017-12-29 | 2019-07-09 | 长野科学株式会社 | Temperature characteristic evaluation method |
| CN109991153B (en) * | 2017-12-29 | 2024-02-23 | 长野科学株式会社 | Temperature characteristic evaluation method |
| CN108196491B (en) * | 2018-04-08 | 2023-12-29 | 暨南大学 | Tramcar internal environment real-time monitoring system and working method thereof |
| CN108196491A (en) * | 2018-04-08 | 2018-06-22 | 暨南大学 | A kind of tramcar environment inside car real-time monitoring system and its method of work |
| CN111096649A (en) * | 2018-10-26 | 2020-05-05 | 佛山市顺德区美的电热电器制造有限公司 | Operation control method, device, cooking appliance and computer readable storage medium |
| CN111096649B (en) * | 2018-10-26 | 2021-11-19 | 佛山市顺德区美的电热电器制造有限公司 | Operation control method, device, cooking appliance and computer readable storage medium |
| CN113208437A (en) * | 2020-01-21 | 2021-08-06 | 上海朴道水汇净水设备有限公司 | Water dispenser hot liner water temperature detection method and system, storage medium and terminal |
| CN112268633A (en) * | 2020-10-22 | 2021-01-26 | 合肥中科离子医学技术装备有限公司 | Temperature and resistance value conversion method for industrial platinum resistance within 30 to 73K |
| CN113419120A (en) * | 2021-05-08 | 2021-09-21 | 同济大学 | Method and system for measuring thermal resistance of dielectric film and metal interface |
| CN113960256B (en) * | 2021-10-21 | 2023-11-21 | 上海朝辉压力仪器有限公司 | Temperature compensation method of water meter |
| CN113960256A (en) * | 2021-10-21 | 2022-01-21 | 上海朝辉压力仪器有限公司 | Temperature compensation method for water content instrument |
| CN114281131A (en) * | 2021-12-20 | 2022-04-05 | 广东美的厨房电器制造有限公司 | Temperature control method, electric appliance and computer readable storage medium |
| CN116027248A (en) * | 2022-12-26 | 2023-04-28 | 深圳市锐能微科技有限公司 | Temperature compensation device and method and electric energy meter |
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