CN101338888A - A street light fixture with a light-emitting diode cooling device - Google Patents

Abstract

The invention relates to a street lamp which is provided with a LED heat radiator, an outdoor illuminating device applied to streets or public squares. The street lamp comprises a lamp box; an illuminating window is arranged on the lower body of the lamp box; a transparent lamp house is mounted on the illuminating window; the lower box body is connected with an upper box body; an arched framework with a vaulted cross-section is arranged at the lower box body; a plurality of luminescent modules are mounted on the lower surface of the arched framework, and radiating members are mounted on the upper surface of the arched framework. The luminescent LED of the luminescent module is connected with a rapid radiating metal-base printed circuit board in a heat-conducting manner. The invention adopts a rapid radiating metal-base printed circuit board; the structure and material ensure that heat produced during the operation of the LED can be transmitted to the heat radiator rapidly and efficiently. The invention also includes a series of heat radiating members made of solid conducting mediums with sound heat-conducting performance which can transmit the heat directly into outdoor air; and the solid medium can protect the electric apparatus inside the lamp box from being eroded by winds, rains and dusts.

Description

A street light fixture with a light-emitting diode cooling device

technical field

The invention relates to a street light fixture with a light-emitting diode cooling device, which is a lighting device for outdoor lighting of roads or squares, is a lighting device that combines a plurality of light-emitting diodes into a light source, and is a lighting device for lighting Diodes can effectively dissipate heat from street lights under the premise of waterproof and dustproof.

Background technique

Using light-emitting diodes as the lighting light of street lamps will become the mainstream of street lighting sources. How to solve the heat dissipation problem of high-power light-emitting diodes in use is the key to popularizing light-emitting diode street lights. Chinese patent "High Power LED Street Lamp)" (application number: 200710044400.2, application date July 31, 2007) proposes a high-power light-emitting diode street lamp. Although the patent has noticed the problem of heat dissipation, there is no special structural solution This problem is simply a description of the use of heat sinks for heat dissipation. The heat dissipation of high-power LED street lamps mainly means that the interface temperature between LEDs and circuit boards should be controlled below 65°C. Therefore, simply using the heat sink cannot quickly and effectively transfer the heat from the interface between the light-emitting diode and the circuit board to the heat sink. In addition, although the heat sink exposed in the open air can play a role in heat dissipation, it cannot be realized in practical applications. Because the climatic conditions in the field are very complicated, the commonly made heat sinks can adapt to these complicated conditions. The first is the problem of waterproofing, so it is more difficult to solve the problem of insulation if it is exposed to the air and exposed to wind and rain. In southern China, the anti-corrosion performance of bare metal must be better to resist rainy weather, which will inevitably increase the manufacturing cost of heat sinks. In the climate with many sandstorms in northern China, the dust falling on the heat sink will block the gaps between the heat sinks, making the heat sink unable to dissipate heat. If a layer of shell is added outside the heat sink, whether it can effectively dissipate heat is still a problem. So not only heat dissipation but also dustproof and waterproof is one of the reasons why the light-emitting diode street lamps of the prior art cannot be popularized.

Contents of the invention

The object of the present invention is to provide a street light fixture with a light-emitting diode cooling device, which can effectively dissipate the heat generated by the high-power light-emitting diode to the air outside the light fixture quickly, so that the working temperature of the light-emitting diode can be stabilized at Below 65 ℃, the life of the light-emitting diode can reach tens of thousands of hours, and it has the effect of waterproof and dustproof.

The purpose of the present invention is achieved in this way: a street lamp with a light emitting diode cooling device has a lamp box, a lighting window is arranged on the lower box body of the lamp box, a transparent lampshade is installed on the lighting window, and the lower box body is installed An upper box, characterized in that an arched frame with an arched cross section is arranged in the lower box, a plurality of light-emitting modules are installed on the lower surface of the arched frame, and a heat dissipation component is installed on the upper surface of the arched frame ; The light-emitting module includes at least one light-emitting diode, and the light-emitting diode is thermally connected to a fast heat dissipation metal-based printed circuit board.

The beneficial effects produced by the present invention are: to ensure the heat dissipation of the light-emitting diodes during operation, the present invention uses a fast heat dissipation metal base printed circuit board. The metal-based structure of the fast-dissipating metal-based printed circuit board and the nano-materials of each layer of rapid heat dissipation ensure that the heat emitted by the light-emitting diode during work is quickly and effectively conducted to the heat dissipation device, ensuring that the temperature of the interface between the light-emitting diode and the circuit board is controlled at 65°C In the following, the technical problem of heat dissipation of high-power light-emitting diodes is really solved. The present invention also transmits the heat directly to the air outside the lamp through a heat dissipation assembly composed of a series of solid conduction media with excellent thermal conductivity, so that the working environment of the light-emitting diode is kept below 65°C, ensuring that the light-emitting diode lifespan. At the same time, these solid heat-conducting media including the lamp box also play a role in protecting the electrical devices in the lamp box, so that the electrical appliances in the lamp box are protected from the erosion of wind, rain and dust, and ensure that the light-emitting diode can replace the existing lighting source outdoors. use. The use of the lamp of the present invention can achieve obvious effects of energy saving and environmental protection.

Description of drawings

The present invention will be further described below in conjunction with drawings and embodiments.

Fig. 1 is an outline structure diagram of a street lamp according to Embodiment 1 of the present invention;

Fig. 2 is a schematic view of the internal structure of the street lamp according to Embodiment 1 of the present invention, which is a sectional view of A-A in Fig. 1;

3 is a schematic diagram of the distribution of copper foil on the circuit board in the street lamp according to Embodiment 1 of the present invention;

Fig. 4 is a schematic cross-sectional structure diagram of a rapid heat dissipation metal-based printed circuit board according to Embodiment 2 of the present invention;

Fig. 5 is a schematic diagram of an orthogonal arrangement of light-emitting diodes on a printed circuit board according to Embodiment 5 of the present invention;

Fig. 6 is a schematic diagram of staggered arrangement of light emitting diodes on a printed circuit board according to Embodiment 6 of the present invention;

Fig. 7 is a structural diagram of the arch skeleton described in Embodiment 7 of the present invention;

FIG. 8 is a schematic diagram of the air circulation structure of the heat dissipation assembly described in Embodiment 10 of the present invention;

Fig. 9 is a schematic diagram of the liquid circulation structure of the heat dissipation assembly according to the eleventh embodiment of the present invention.

Detailed ways

Embodiment one:

This embodiment is a street lamp with a light-emitting diode cooling device. The appearance of the lamp is shown in FIG. 1 , and the internal structure is shown in FIG. 2 . The present embodiment has a lamp box, the lower box body 2 of the lamp box is provided with a lighting window 3, and a transparent lampshade is installed on the lighting window. The lower box body is equipped with an upper box body 1, the upper box body and the lower box body can be connected together by a hinge, and locked with a locking device in the closed state, or can be fastened together with screws, or with elastic clips, stuck together. The upper box and the lower box are made of metal materials with good thermal conductivity, such as aluminum alloy, stainless steel, brass, etc., so that the heat in the box can be effectively dissipated to the outside of the box. An arched skeleton 5 with an arched cross section is arranged in the lower box body. This arched skeleton is the center of the whole light fixture, and all parts are installed on this arched skeleton. Two baffles are closed on both sides of the arched frame, so that the part of the baffle, the arched frame, and the lower box body where the transparent lampshade is installed forms a relatively closed space. The function of installing the baffle is for aesthetics on the one hand, and on the other hand, it also separates this part of the space from other parts of the lamp box to provide conditions for heat dissipation of other parts of the lamp box. The arch frame also uses metal materials with good thermal conductivity. A plurality of light-emitting modules 4 are installed on the lower surface of the arched skeleton, and these light-emitting modules are composed of fast heat dissipation metal-based printed circuit boards 41 and light-emitting diodes 42 neatly arranged on them. The light emitting module is equipped with at least one light emitting diode. The light-emitting diode is thermally connected to the copper foil of the fast heat dissipation metal base printed circuit board. The heat dissipation assembly 6 is installed on the upper surface of the arched skeleton. This heat dissipation assembly can have many forms, and its main purpose is to effectively dissipate heat.

Due to the well-known problems of incandescent, sodium and mercury lamps, people began to consider using other electric light sources instead of incandescent, sodium and mercury lamps as light sources for street lighting. In recent years, people pay more and more attention to light-emitting diodes with high light efficiency and long life. The life of traditional electric light sources is usually only a few thousand hours. The average life of a better sodium lamp is 6,000 to 7,000 hours, while the average life of a light-emitting diode is more than 50,000 hours. Especially in recent years, technological progress has made great progress in the power of light-emitting diodes. The power of a single light-emitting diode has developed from a few milliwatts to several watts, and the brightness has also increased from a few lumens to more than one hundred lumens. The combination of multiple high-power light-emitting diodes is already capable of lighting large areas. In the case of the same lighting requirements, the power consumed by high-power light-emitting diodes is much less than other electric light sources. Another feature of high-power light-emitting diodes is high color temperature, good color rendering, and close to natural light. The human eye is not easy to fatigue under the light of light-emitting diodes, which is unmatched by any traditional electric light source. However, like other high-power electric light sources, high-power light-emitting diodes will also generate excess heat during operation, and the interface temperature between high-power light-emitting diodes and circuit boards must be controlled in a working environment below 65°C, otherwise the life of light-emitting diodes will be shortened. Big discount. The price of the light-emitting diode itself is higher, but its long life several times that of other lamps effectively makes up for this defect. If the temperature of the interface between the light-emitting diode and the circuit board cannot be guaranteed to be controlled below 65°C in the working environment, the LED lamp cannot guarantee longevity and cannot compete with other lamps. To ensure that the working temperature of the interface between the LED and the circuit board is below 65°C, heat dissipation is extremely important.

Based on the above reasons, this embodiment adopts a special heat dissipation measure. There are two keys to this particular cooling measure. One is a light emitting module, and the other is a heat dissipation component.

The light-emitting point of a high-power light-emitting diode is the PN junction of the diode. The PN junction is usually only a few millimeters in size. The energy of several watts concentrated in a volume of a few millimeters in size produces relatively considerable heat. Therefore, the first key to ensure the work of LEDs is to quickly diffuse the heat of the heat source at the PN node of the LEDs. The heat from a point heat source can spread in all directions, and the speed of diffusion can be accelerated through a good heat-conducting medium. The light-emitting module described in this embodiment is composed of a light-emitting diode and a solid medium with excellent thermal conductivity tightly combined with it, and uses a well-designed printed circuit board that can quickly dissipate heat. This solid medium with excellent thermal conductivity, that is, a metal-based printed circuit board with rapid heat dissipation, can rapidly expand the point heat temperature field generated by the PN junction of the light-emitting diode. Due to the excellent thermal conductivity of this solid medium, the temperature gradient between the heat source point and the surrounding area is small during operation, the heat distribution is uniform, and the heat can be quickly diffused to meet the requirements of maintaining the working temperature of the LED. The light-emitting module is the most important part of this embodiment. Only when the light-emitting module is well designed and the working environment between the light-emitting diode and the printed circuit board interface is kept below 65°C can the requirement of ensuring the longevity of the light-emitting diode be met. The light emitting diode used in this embodiment is thermally connected to the copper foil of the fast heat dissipation printed circuit board. The copper foil of the fast heat dissipation printed circuit board can dissipate heat and conduct electricity. Copper has good thermal conductivity. Copper foil is directly deposited on the fast heat dissipation printed circuit board. The heat from the light-emitting diode can be quickly diffused through the copper foil and quickly transferred to the fast heat dissipation printed circuit board. When designing the conductive lines of the rapid heat dissipation printed circuit board, this embodiment reserves a large number of copper foils that do not conduct any current on the rapid heat dissipation printed circuit board, as shown in FIG. 3 . The non-conductive heat-conducting copper foil 4112 in the figure is in direct thermal contact with the light-emitting diode (the dotted square part in the figure is the chip of the light-emitting diode) to form a good heat-conducting channel. The two narrow copper foils on the left and right in the figure are conductive copper foils 4111, which are used to connect the positive and negative poles of the LED and the power supply. As shown in the figure, the heat enters the wide part of the copper foil along the direction of the arrow, and then conducts the heat to other structural layers of the fast heat dissipation metal-based printed circuit board through these wide parts.

Although the light-emitting module diffuses heat in the light-emitting module, if the heat cannot be dissipated, the heat in the light-emitting module will accumulate too much, which will also affect the service life of the light-emitting diode. How to dissipate the heat in the light emitting module to the air outside the lamp is another key point of this embodiment. This embodiment adopts a set of heat dissipation components, which are installed on the arch frame connected to the light emitting module, and conduct the heat on the light emitting module to the upper box body through various media, and the upper box body conducts the heat to the In the wild air. The light-emitting module is a straight board type, and the upper box body has a round and beautiful appearance, and is not easy to deposit dust. To generate effective heat conduction between the two, the key component heat dissipation assembly of this embodiment must be used. The heat dissipation assembly described in this embodiment can adopt multiple conduction paths: one is a rigid heat dissipation fin. Rigid heat sinks are usually approximately perpendicular to the plane of the arched frame, and are mounted side by side on the arched frame in groups. The bottom of the rigid heat sink contacts the plane of the arched frame as much as possible, so as to conduct heat well. Rigid heat sinks are used to dissipate heat to the lamp space surrounded by the upper box and the arched frame, and the air in this part of the space is used to conduct heat, and the heat is transferred to the inner surface of the upper box. The heat transfer method using only air as the medium is not enough, so this embodiment also adopts another heat conduction method: flexible heat sink. The flexible heat sink is a metal mesh woven by metal wires. The metal mesh is stacked in several layers, and the flexible heat sink is installed vertically on the arch frame like a rigid heat sink. The upward extension of the flexible heat sink is relatively long, and when the upper box body is tightly covered, the flexible heat sink comes into surface contact with the inner surface of the upper box body. The heat can be smoothly conducted to the upper box through the flexible heat sink. The upper box itself is also made of metal with good thermal conductivity, and its wide and smooth surface quickly dissipates heat to the outdoor air. In this embodiment, the artificial circulation method can also be used to make the air around the rigid heat sink and the flexible heat sink flow quickly to accelerate heat dissipation. Or further make watertight between the arch frame and the upper box, which is filled with a liquid cooling medium, and use a circulating pump to forcibly circulate the liquid medium in it to achieve a better heat dissipation effect.

Embodiment two:

This embodiment is an improvement of the rapid heat dissipation printed circuit board described in the first embodiment. A schematic cross-sectional view of the rapid heat dissipation metal-based printed circuit board described in this embodiment is shown in FIG. 4 . The rapid heat dissipation metal-based printed circuit board 41 described in this embodiment includes: a copper foil layer 411 formed of a copper foil that can dissipate heat and conduct electricity, and is connected to the light-emitting diode 42 by heat conduction; Nano-coating 412 , an insulating layer 413 combined with the heat-absorbing nano-coating, a metal-based layer 414 as a substrate of a printed circuit board combined with the insulating layer, and a heat-radiating nano-coating 415 combined with the metal-based layer.

The copper foil layer in this embodiment is basically the same as the copper foil layer of a common printed circuit board, but in addition to having a conductive function, the copper foil layer in this embodiment also has a heat dissipation function. Copper itself is a material with good thermal conductivity. In this embodiment, the light-emitting diode is directly installed on this layer of copper foil layer, and is closely connected with the copper foil layer to form a good heat conduction path. The heat generated by the light-emitting diode is first transferred to the copper foil layer. foil layer. The copper foil layer can quickly conduct heat away. Below the copper foil layer is a heat-absorbing nano-coating. The development of modern nanotechnology can produce many materials that were unimaginable in the past. This heat-absorbing nano-coating is actually a coating that can quickly absorb and conduct heat to other structural layers. This coating can adopt prior art, can buy in the market. The bottom of the heat-absorbing nano-coating is an insulating layer, because the copper foil is to be conductive, and it is the way to connect the power supply of the light-emitting diode. In this embodiment, the substrate of the metal-based printed circuit board for rapid heat dissipation is the metal base layer, which is a metal plate that can conduct electricity, instead of the epoxy resin fiberboard that can be insulated for general printed circuit boards, so the copper foil must be covered with an insulating layer. The layer and the metal base layer are isolated to ensure the smooth flow of the circuit. This insulating layer must also have good thermal conductivity. Below the insulating layer is a metal base layer. The metal base layer described in this embodiment is a metal plate with good thermal conductivity, and the metal base layer is a substrate of a printed circuit board. The substrate of ordinary printed circuit boards is epoxy fiberboard, which is a poor conductor of heat. If epoxy fiberboard is used as the substrate of the printed circuit board of the light-emitting module, it is difficult to spread and dissipate the heat emitted by the light-emitting diode during operation. Therefore, in this embodiment, a metal plate is used as the substrate of the printed circuit board, and metal, which is a good heat conductor, can ensure that the heat generated by the light-emitting diode is quickly conducted away. The metal base layer described in this embodiment can be steel plate, alloy aluminum plate, copper plate, other alloy plates, etc., provided that the thermal conductivity is excellent. Below the metal base layer is a heat radiation nano layer. This thermal radiation nano-layer is a nano-coating that can quickly absorb heat and quickly conduct it into the air or other solid media. The heat radiation nano layer can also adopt the existing technology, and the coating product of this heat radiation nano layer can be purchased in the market. The thermal conductivity of the printed circuit board described in this embodiment can reach 29W/m ² K by carefully selecting a printed circuit board substrate with good heat dissipation performance and applying a nano heat-conducting layer. However, the thermal conductivity of ordinary printed circuit boards can only reach 15W/m ² K, which is nearly doubled, effectively ensuring the working environment of light-emitting diodes below 65°C.

Embodiment three:

This embodiment is an improvement of the light-emitting module described in the second embodiment, which is an improvement of the metal base layer of the fast-dissipating metal-based printed circuit board on the light-emitting module. The metal of the metal base layer of the rapid heat dissipation metal-based printed circuit board described in this embodiment uses a steel plate with iron as the main component.

Embodiment four:

This embodiment is an improvement of the light-emitting module described in the second embodiment, which is an improvement of the metal base layer of the fast-dissipating metal-based printed circuit board on the light-emitting module. The metal used for the metal base layer of the rapid heat dissipation metal base printed circuit board is an aluminum alloy plate. The metal of the metal base layer of the fast heat dissipation metal base printed circuit board can also use copper plates. Both aluminum alloy and copper are good heat-conducting materials, but the price is higher.

Embodiment five:

This embodiment is an improvement of the light-emitting module described in Embodiment 2. The arrangement of the plurality of light-emitting diodes on the light-emitting module, and the arrangement of the plurality of light-emitting diodes on the rapid heat dissipation metal-based printed circuit board in this embodiment is Orthogonal way. That is, a plurality of light emitting diodes are arranged horizontally and vertically on the fast heat dissipation metal-based printed circuit board, as shown in FIG. 5 . Such an arrangement makes the distances between the light emitting diodes completely equal, which is very beneficial to the heat dissipation of the light emitting diodes on the metal-based printed circuit board for rapid heat dissipation. This arrangement is more suitable for street lamps with larger spaces.

Embodiment six:

This embodiment is an improvement of the light-emitting module described in the second embodiment. A plurality of light-emitting diodes on the light-emitting module are aligned horizontally and arranged vertically and staggeredly on the fast heat dissipation metal-based printed circuit board, as shown in FIG. 6 . Such an arrangement reduces the distance between two rows of LEDs, but does not reduce the distance between two LEDs. This arrangement is more suitable for street lamps with limited space.

Embodiment seven:

This embodiment is an improvement of Embodiment 5 or 6, and is an improvement of the arch skeleton described in Embodiment 5 or 6, as shown in FIG. 7 , the cross-sectional view of the arch skeleton. An upper plate 51 is arranged on the arched skeleton, an inclined middle plate 52 is respectively connected to both sides of the upper plate, and an inclined side plate 53 is connected to each of the two middle plates, and the angle between the upper plate and the middle plate is 145°～155°; the angle between the upper plate and the side plate is 115°～125°. Arranging the arched skeleton in this way is for uniform lighting. The light emitted by the light-emitting diode is similar to a spotlight, and has strong directivity, and the angle of diffusion of the irradiated beam of light is small. For this reason, several light-emitting modules are usually arranged in a lamp, and each module illuminates outwards at different angles, as shown in the figure, and the result obtained is to illuminate an area.

Embodiment eight:

This embodiment is an improvement of the second embodiment, the improvement of the heat dissipation assembly described in the second embodiment, see FIG. 2 . The heat dissipation assembly includes a plurality of rigid heat dissipation fin groups 61 composed of metal sheets that are substantially perpendicular to the upper surface of the arched skeleton, and the heat dissipation assembly also includes a plurality of flexible heat dissipation fin groups 61 composed of wire mesh. One end of the flexible cooling fin is fixedly installed on the arch frame, and the other end extends upwards to contact with the inner surface of the upper box.

The rigid heat sink group is composed of multiple metal sheets that are basically perpendicular to the arched skeleton. The roots of these metal sheets are closely connected to the arched skeleton, so that the heat on the arched skeleton can be quickly conducted to these metal sheets. Since these metal sheets are in contact with the air inside the luminaire, the heat can quickly spread to the air in the space inside the luminaire. The air in the lamp conducts heat to the upper box covering the heat dissipation assembly. On the other hand, a group of flexible cooling fins is also installed on the arched skeleton. The flexible heat sink group is some metal window screens woven by metal wires similar to those used on screen windows. But the biggest difference from the window screen is that the material of the braided flexible heat sink group is a metal material with good thermal conductivity. The heat conduction mesh is made of multi-layer wire braids, forming a sheet shape. The sheet-shaped flexible heat sink group is installed on the arch frame relatively perpendicular to the arch frame. The bottom of the flexible heat sink group is closely connected to the arch frame. contact for heat conduction. The upward extension of the flexible heat sink group exceeds the height of the rigid heat sink group, and also exceeds the height of the arched frame to the upper box body. (See Figure 2) Since the flexible heat sink group is flexible, when the upper box body is put down and the lower box body When the body is combined, the flexible heat sink group is pressed down, and the elongated part contacts the inner wall of the upper box body to form a path for heat conduction. Since the flexible heat sink group is solid and is a good heat-conducting medium, most of the heat on the arched frame can be conducted to the upper box, effectively dissipating the heat generated by the light-emitting diodes. The structure of the flexible heat sink group will not affect the air circulation in the lamp, and the heat dissipation effect is better.

Embodiment nine:

This embodiment is an improvement of the eighth embodiment, and is an improvement of the material of the arch frame and the heat dissipation assembly described in the eighth embodiment.

In this embodiment, the rigid heat sink group and the flexible heat sink group of the arch frame and heat dissipation assembly are made of stainless steel, or the skeleton and the rigid heat sink group are made of stainless steel or aluminum alloy, and the flexible heat sink group is made of copper. Or other materials with good thermal conductivity can be used in combination, the key is good thermal conductivity, and the price factor should be considered.

Embodiment ten:

This embodiment is an improvement of the first embodiment, and is an improvement of the heat dissipation assembly described in the first embodiment. In order to further improve the heat dissipation conditions in the lamp box, this embodiment uses the method of artificial air circulation. The heat dissipation assembly also includes a heat dissipation air inlet 64 arranged at the front of the lower box body and a heat dissipation exhaust hole 63 arranged at the rear of the lower box body. As shown in Figure 8. For effective heat dissipation, the rigid heat sink group and the flexible heat sink group are arranged between the heat dissipation air inlet and the heat dissipation exhaust hole, and a fan 65 is arranged at the heat dissipation air intake hole or the heat dissipation exhaust hole to promote air flow. In order to avoid water ingress, arrange the heat dissipation air intake and heat dissipation exhaust holes on the lower box body, and it is best to install air filter devices in the heat dissipation air intake holes and heat dissipation exhaust holes to prevent excessive dust from entering the lamp.

Embodiment eleven:

This embodiment is an improvement of the heat dissipation assembly described in the sixth embodiment. In order to further improve the heat dissipation in the lamp box, this embodiment seals between the arch frame and the upper box body, so that the two form a watertight liquid heat dissipation chamber, and the liquid heat dissipation chamber is connected with part of the light pole 7, and uses a The pipe 71 forms a circulation channel. A liquid cooling medium 69 is filled in the liquid cooling chamber and part of the light pole, and a circulating pump 68 may also be provided to promote the circulation of the liquid cooling medium, as shown in FIG. 9 . The circulation pump pushes the cooling medium from the liquid heat dissipation chamber into part of the light pole and returns to the closed space through circulation. Due to the addition of some light poles, the contact area between the cooling medium and the external air is increased, and the cooling effect is more obvious.

Embodiment 12:

This embodiment is an improvement of the tenth and eleventh embodiments, and is an improvement of the heat dissipation assembly. In this embodiment, a temperature sensor 67 is provided in the lamp box, and the sensor is electrically connected to a fan or a circulating pump through a controller 66 . In order to accurately and effectively control the temperature in the lamp box, a temperature sensor is set to measure the temperature in the lamp, and the fan or circulation pump is turned on or off through the controller to control the flow of the heat transfer medium, which is energy-saving and environmentally friendly. The temperature sensor can be installed on the light emitting module, also can be installed on the arch frame, or installed on the rigid heat sink group. Or set multiple sensors to measure the temperature of each point separately to obtain more precise control. The sensor can be an ordinary thermocouple, or a general temperature sensor such as a bimetal strip temperature sensor. In the case of a single sensor and the control accuracy is not high, the controller may not be used. In the case of multiple sensors, or when higher control accuracy is required, the controller is used. The controller can be a general-purpose discrete element controller, or a large-scale integrated circuit controller such as a single-chip microcomputer.

Claims (10)

1. road lamp that has LED radiating device, a light fixture box is arranged, on the lower box body of light fixture box illuminating window is set, Transparent lamp shade is installed on the illuminating window, described lower box body is installed a upper cartridge body, it is characterized in that, the arched framework that in the described lower box body cross section to be set be arch, a plurality of light emitting modules are installed on the described arched framework lower surface, on the described arched framework upper surface radiating subassembly are installed; Described light emitting module comprises at least one light emitting diode, and this light emitting diode heat conduction is connected on the quick heat radiating metal base printed circuit board.

2. road lamp according to claim 1, it is characterized in that described quick heat radiating metal base printed circuit board sets gradually from top to bottom: the copper foil layer that is connected with Light-Emitting Diode heat conduction, the heat absorption nano coating that combines with described copper foil layer, the insulating barrier that combines with described heat absorption nano coating, the metal substrate layer that combines with described insulating barrier, the heat radiation nano coating that combines with metal substrate layer.

3. road lamp according to claim 2 is characterized in that, described metal substrate layer is used steel sheet material.

4. road lamp according to claim 2 is characterized in that, described metal substrate layer is used a kind of in aluminum alloy plate materials, the copper sheet material.

5. road lamp according to claim 2 is characterized in that, the arrangement that is orthogonal on the quick heat radiating metal base printed circuit board of a plurality of Light-Emitting Diodes in the described light emitting module.

6. road lamp according to claim 2 is characterized in that, a plurality of Light-Emitting Diodes in the described light emitting module become staggered arrangement on the quick heat radiating metal base printed circuit board.

7. road lamp according to claim 2, it is characterized in that described arched framework has a upper plate, respectively connect plate in the inclination in the both sides of described upper plate, described two blocks of middle plates respectively connect the side plate of an inclination, and the angle between described upper plate and the middle plate is 145 °～155 °; Angle degree between described upper plate and the side plate is 115 °～125 °.

8. road lamp according to claim 2, it is characterized in that, described radiating subassembly comprises the rigidity groups of fins that is made of sheet metal that multi-disc and described arched framework upper surface are vertical substantially, the bottom of the sheet metal of described rigidity groups of fins is installed on the skeleton, described radiating subassembly also comprises the flexible heat sink sheet group that multi-disc is made of woven wire, described flexible heat sink sheet bottom is installed on the arched framework, and the other end extends upward with the heat conduction of described upper cartridge body inner surface and is connected.

9. road lamp according to claim 8 is characterized in that, the rigidity groups of fins of described arched framework, radiating subassembly and flexible heat sink sheet group are used a kind of in stainless steel material, aluminum alloy materials, the copper material.

10. road lamp according to claim 8, it is characterized in that, described radiating subassembly also comprises the heat radiation air admission hole that is arranged on the lower box body front portion and is arranged on the heat radiation steam vent at lower box body rear portion, described rigidity groups of fins and flexible heat sink sheet group are arranged between heat radiation air admission hole and the heat radiation steam vent, are provided with the fan that promotes that air flows at described heat radiation air admission hole or heat radiation steam vent place.

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