CN101337593B - Fluid packing forming device and method thereof - Google Patents
Fluid packing forming device and method thereof Download PDFInfo
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- CN101337593B CN101337593B CN2007100290358A CN200710029035A CN101337593B CN 101337593 B CN101337593 B CN 101337593B CN 2007100290358 A CN2007100290358 A CN 2007100290358A CN 200710029035 A CN200710029035 A CN 200710029035A CN 101337593 B CN101337593 B CN 101337593B
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Abstract
The invention relates to a fluid encapsulation forming device and a method thereof. An upper thin film and a lower thin film are respectively placed on a middle die seat and a lower die seat, fluid is infused into the lower die seat, through sealing a vacuum cavity body where the middle die seat and the lower die seat are positioned through a valve, the gas in the vacuum cavity body can be extracted by using a vacuum pump unit to form a state close to the vacuum state, and by performing hot pressure sealing to the vertically butted sealing seats formed by the middle die seat and the lower die seat, one-time sealing is performed to the circumferences of the upper thin film and the lower thin film under the state close to the vacuum state to cause the fluid to be clad, and no bubbles remain in the fluid. The fluid encapsulation forming device and the method thereof have the advantages of avoiding pollution, enhancing stability of the finished product, reducing working procedure time and reducing manufacturing cost.
Description
Technical field
The present invention relates to a kind of encapsulated moulding technique device and method, particularly a kind of fluid encapsulated moulding device and method.
Background technology
Present common silicon gel sealing method, it is the involution operation that in bar pressure, coats, promptly earlier two film sealings are become a bag by the film sealing machine, and on bag, keep an inlet, then the silicon gel is injected in the bag by inlet, make bag fill silicon gel and air, push bag with manual type again, bubble and air in the bag are discharged through the bag inlet.Behind bubble and air exhaustion, pass through the film sealing machine again with the inlet involution, promptly finish the involution operation that the silicon gel coats.Yet the operation of above-mentioned silicon gel involution need be carried out at twice, and is quite time-consuming really, take a lot of work, and makes manufacturing cost high.
Because the silicon gel is to finish the involution operation in air environment, make and be full of air in the formed bag of film, have bubble and air existence when causing the perfusion of silicon gel, must labor intensive be extruded by bubble and air, not only production capacity can't promote, and can cause the pollution of bacterium or other pollutants.In addition, the mode of manual compression can't squeeze out bubble and air fully, makes silicon gel products (as: air transport process) under environmental modification or inclement condition, can cause silicon gel and film contact surface that the possibility of peeling off is arranged, and then fraction defective is significantly increased.
Therefore, how to improve silicon gel sealing method, reduce the work flow of silicon gel involution, shorten production time simultaneously, promoting the production efficiency of silicon gel involution, and solve the problem that silicon gel and film are peeled off, reach the purpose of reduction manufacturing cost with this, and then solve because of the problem that manual compression polluted, be an instant problem to be solved.
Summary of the invention
Goal of the invention of the present invention provides a kind of both can having avoided and pollutes, and can improve the involution effect again, the fluid encapsulated moulding device and method of the stability behind the lifting finished product involution.
In view of this, the present invention proposes a kind of fluid encapsulated moulding device, and comprise: support comprises vacuum cavity; Valve is used to intercept vacuum cavity and extraneous space; The vacuum pump unit connects vacuum cavity, is used for the gas in the extracting vacuum cavity and forms near vacuum state; Die shoe is used to settle down film, and contains the fluid on following film; Middle die holder is used to settle upper film; And seal seat, and be positioned at vacuum cavity, form and dock up and down with middle die holder, die shoe, be used for the Heat Sealing upper film and coat fluid with the periphery of following film.Wherein, the periphery of upper film and following film is at involution near hot pressing under the vacuum state, and fluid not have bubble residual.
Here, fluid is to be selected from the group that liquid-state silicon gel (Silicone Gel) and liquid silicon rubber (Silicone Rubber) are constituted.
Above-mentioned disclosed structure, die shoe can be at vacuum cavity outer filling fluid on following films, also can be in vacuum cavity perfusion of fluid on film down.And seal seat can be arranged in the top of die holder or the below of die shoe, and to seal seat be to carry out Heat Sealing in the hot melt adhesive mode, also can adopt high frequency bonding mode or ultrasonic bonding mode to carry out Heat Sealing.In addition, the vacuum pump unit can be provided with at least one pore, and wherein pore is used for the gas in the extracting vacuum cavity and forms near vacuum state, and gas can be sent in the vacuum cavity and remove near vacuum state.
The disclosed fluid encapsulated moulding of the present invention device also comprises displacement module, is used to drive die shoe and moves between this vacuum cavity is inside and outside.And fluid encapsulated moulding device yet comprises the lifting module, is used for driving die holder decline or die shoe and rises, and die holder forms with die shoe and docks up and down in making.
In addition, fluid encapsulated moulding device of the present invention also comprises operational module, is used for for user's On/Off valve, and can adjusts the parameters that the vacuum pump unit carries out extracting gases, and seal the parameters that seat carries out Heat Sealing.And fluid encapsulated moulding device yet comprises two safety switches, and the user must push two safety switches ability On/Off valves simultaneously, improves processing safety with this.
The present invention also proposes a kind of fluid encapsulated moulding method, comprises the following step: settle upper film on middle die holder; Film is on die shoe under settling; Perfusion of fluid is on following film; The vacuum cavity at closed mold seat and die shoe place; Gas in the extracting vacuum cavity and forming near vacuum state; Ordering about die holder forms in vacuum cavity with die shoe and docks up and down; And at involution near the periphery of hot pressing upper film under the vacuum state and following film, and it is residual to make upper film not have bubble with following film coating fluid.
Here, fluid is to be selected from the group that liquid-state silicon gel (Silicone Gel) and liquid silicon rubber (Silicone Rubber) are constituted.
Above-mentioned disclosed method, wherein the step of perfusion of fluid is to carry out in vacuum cavity, also can carry out outside vacuum cavity.And the step of the periphery of Heat Sealing upper film and following film is to carry out Heat Sealing in the hot melt adhesive mode, also can adopt high frequency bonding mode or ultrasonic bonding mode to carry out Heat Sealing, and after the step of the periphery of Heat Sealing upper film and following film, gas sent in the vacuum cavity and releasing near vacuum state.
Fluid encapsulated moulding method of the present invention is after this fluid step of perfusion, driving this die shoe moves in this vacuum cavity, thereafter die holder descends or the die shoe rising in driving again, die holder forms with die shoe and docks up and down in making, and after the step of the periphery of Heat Sealing upper film and following film, releasing is near vacuum state and drive die shoe and moving to outside the vacuum cavity.
In addition, the step of the vacuum cavity at closed mold seat and die shoe place is to intercept vacuum cavity and extraneous space with valve, and wherein this step more comprises the step of pushing two safety switches simultaneously, and after pushing two safety switches the On/Off valve.
The present invention does not need labor intensive that bubble and air are extruded at the finished product near Heat Sealing under the vacuum state, not only can avoid the pollution of bacterium or other pollutants, more can improve the stability of the finished product behind the Heat Sealing, solve the problem that silicon gel and film are peeled off in the prior art.In addition, bubble and air are not extruded, made the time of work flow significantly reduce, not only can improve production capacity, also can reduce manufacturing cost effectively because of finished product does not need labor intensive.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described in further detail:
Fig. 1 is the block diagram of fluid encapsulated moulding device of the present invention;
Fig. 2 is the front view of fluid encapsulated moulding device of the present invention;
Fig. 3 is the scheme drawing of fluid encapsulated moulding device of the present invention when coating fluid;
Fig. 4 is the action scheme drawing of fluid encapsulated moulding device of the present invention when coating fluid;
Fig. 5 is the action scheme drawing of fluid encapsulated moulding device of the present invention when coating fluid;
Fig. 6 is the action scheme drawing of fluid encapsulated moulding device of the present invention when coating fluid.
Description of reference numerals
1 support
10 vacuum cavities
11 bracing frames
2 valves
3 vacuum pump units
31 pores
41 die shoes
411 die cavitys
Die holder in 42
421 die cavitys
5 seal seat
6 operational modules
61 action buttons
62 safety switches
7 displacement modules
8 lifting modules
90 fluids
91 times films
92 upper films
The specific embodiment
As Fig. 1 and shown in Figure 2, be the fluid encapsulated moulding device of the present invention's exposure.
Fluid encapsulated moulding device comprises: support 1, valve 2, vacuum pump unit 3, die shoe 41, middle die holder 42, seal the seat 5, operational module 6.
In addition, vacuum pump unit 3 also can be provided with a plurality of pores 31, one of them pore 31 is exclusively used in discharges and forms the gases in the vacuum cavity 10 near vacuum state, and another pore 31 is exclusively used in to be sent into gas in the vacuum cavity 10 and remove near vacuum state.
Die shoe 41 is positioned at outside the vacuum cavity 10, and at least one die cavity 411 is set, and is used to settle down film 91, and the fluid 90 on the film 91 under the splendid attire.
Middle die holder 42 is provided with at least one die cavity 421, be used to settle upper film 92, and the periphery of the die cavity 411 of die shoe 41 is corresponding mutually with the periphery of the die cavity 421 of middle die holder 42.
Operational module 6, be positioned at the side of support 1, a plurality of action buttons 61 and two safety switches 62 are set, and action button 61 is available for users to adjust the parameters that vacuum pump unit 3 carries out extracting gases, and adjusts and seal the parameters that seat 5 carries out Heat Sealing.But and two safety switches 62 On/Off valve 2 when being pressed simultaneously, could start fluid encapsulated moulding device comes into operation, can guarantee that with this user is absorbed in the operation of fluid encapsulated moulding device, prevent that the user is subjected to problems such as valve 2 weighs wounded and takes place, improve processing safety.
According to the disclosed structure of the present invention, wherein fluid encapsulated moulding device also comprises displacement module 7, in order to drive die shoe 41 in vacuum cavity 10, displacement between outer, and be provided with at least one lifting module 8 in the vacuum cavity 10 of support 1, die holder 42 descended during one of them lifting module 8 drove, and seat 5 declines are sealed in 8 drives of startup another one lifting module, die holder 42 in making, die shoe 41 and seal seat 5 threes and form butt joint up and down, moreover, also can one lifting module 8 drive in die holder 42 rise, and seat 5 risings, die holder 42 in also can making are sealed in 8 drives of startup another one lifting module, die shoe 41 and seal seat 5 threes and form butt joint up and down.In addition, during also visual actual design need drive respectively with a lifting module 8 die holder 42 with seal seat 5 and descend or rise.
The operational module 6 of above-mentioned explanation can be adjusted the parameter of vacuum pump unit 3, include the pumpdown time, let out vacuum time etc., the parameter of sealing seat 5 includes heat-sealing time, heat-sealing temperature etc., in addition, operational module 6 also can start/close displacement module 7, reaches the distance that displacement module 7 moves.
Extremely shown in Figure 6 as Fig. 3, the die cavity 421 of die holder 42 during the user is placed in upper film 92 earlier, and middle die holder 42 placed bracing frame 11 in the vacuum cavity 10, to descend film 91 to be placed in the die cavity 411 of die shoe 41 again, and fluid 90 is poured in down on the film 91, after treating that perfusion is finished, start displacement module 7 and drive die shoe 41 and move in the vacuum cavity 10, restart valve 2 sealing supports 1 and make vacuum cavity 10 form closed states.Gas is discharged and formed near vacuum state according to the parameter that the user presets with the pore 31 of vacuum pump unit 3 then, make vacuum cavity 10 and fluid 90 no longer include gas and exist.Then start respectively different lifting module 8 drive in die holder 42 with seal seat 5 and descend, carry out Heat Sealing by sealing seat 5 after die holder 42 coincides with die shoe 41 in making, the periphery that makes upper film 92 and following film 91 is at involution near hot pressing under the vacuum state, and fluid 90 not have bubble residual.After treating that Heat Sealing is finished, the pore 31 of vacuum pump unit 3 is sent into gas in the vacuum cavity 10 and is removed near vacuum state, restarting valve 2 opens support 1 and makes vacuum cavity 10 remove closed state, drive die shoes 41 with displacement module 7 then and move to outside the vacuum cavity 10, can take out the finished product behind the Heat Sealing.
In the above-mentioned explanation, the user also can start displacement module 7 earlier, driving die shoe 41 moves in the vacuum cavity 10, in vacuum cavity 10, fluid 90 is filled on the following film 91 again, after treating that perfusion is finished, the parameter that the pore 31 by vacuum pump unit 3 is preset according to the user is discharged gas and is formed near vacuum state.In addition, above-mentioned explanation seal the top that seat 5 is arranged on the bracing frame 11 in the vacuum cavity 10, also can be arranged on the below of die shoe 41 and carry out Heat Sealing.
And fluid encapsulated moulding method comprises the following step:
Step 1: settle upper film 92 in middle die holder 42.
Step 2: film 91 is in die shoe 41 under settling.
Step 3: perfusion of fluid 90 is on following film 91.
The step of perfusion of fluid 90 can be carried out outside vacuum cavity 10, and drives die shoes 41 by displacement module 7 and move in the vacuum cavity 10 in that perfusion of fluid is after 90s.Move in the vacuum cavity 10 and before the step of perfusion of fluid 90, also can drive die shoes 41 by displacement module 7, and in vacuum cavity 10 perfusion of fluid 90.
Step 4: the vacuum cavity 10 at closed mold seat 42 and die shoe 41 places.
The user forms closed state with valve closed vacuum cavity body 10, to intercept vacuum cavity 10 and extraneous space.Wherein, the user must push two safety switches 62 simultaneously, can Open valve 2 and closed vacuum cavity body 10 can guarantee that with this user is absorbed in operation, prevent that the user is subjected to problems such as valve 2 weighs wounded and takes place, and improve processing safety.
Step 5: gases in the extracting vacuum cavity 10 and forming near vacuum state.
The user discharges gas and form near vacuum state according to the parameter that the user presets with the pore 31 of vacuum pump unit 3, makes vacuum cavity 10 and fluid 90 no longer include gas and exists.
Step 6: die holder 42 forms in vacuum cavity 10 with die shoe 41 and docks up and down in ordering about.
Die holder 42 descended during the user drove with lifting module 8, and die holder 42 forms with die shoe 41 and docks up and down in making, or rose with lifting module 8 drive die shoes 41, and die holder 42 forms with die shoe 41 and docks up and down in also can making.
Step 7: at involution near the periphery of hot pressing upper film under the vacuum state 92 and following film 91, and it is residual to make upper film 92 not have bubble with following film 91 coating fluids 90.
Lifting module 8 drives seals seat 5 and descends, and Heat Sealing is carried out by sealing seat 5 in die holder 42 and die shoe 41 back that coincides in making, and the periphery that makes upper film 92 and following film 91 is at involution near hot pressing under the vacuum state, and fluid 90 not have bubble residual.
Step 8: remove near vacuum state and the finished product after taking out Heat Sealing.
After treating that Heat Sealing is finished, the pore 31 of vacuum pump unit 3 is sent into gas in the vacuum cavity 10 and is removed near vacuum state, restarting valve 2 opens support 1 and makes vacuum cavity 10 remove closed state, drive die shoes 41 by displacement module 7 then and move to outside the vacuum cavity 10, can take out the finished product behind the Heat Sealing.
Though cited in the above description content is that to carry out Heat Sealing in the hot melt adhesive mode be example, but sealing seat 5 also can adopt ultrasonic bonding mode or high frequency bonding mode to carry out Heat Sealing, in addition, the fluid 90 of above-mentioned explanation is to be selected from the group that liquid-state silicon gel (Silicone Gel) and liquid silicon rubber (Silicone Rubber) are constituted, but and unrestricted fluid 90 of the present invention only be liquid-state silicon gel (Silicone Gel) or liquid silicon rubber (Silicone Rubber).
Claims (28)
1. fluid encapsulated moulding device comprises:
Support comprises vacuum cavity;
Valve is in order to intercept this vacuum cavity and extraneous space;
The vacuum pump unit connects this vacuum cavity, forms near vacuum state in order to extract the gas in this vacuum cavity;
Die shoe in order to settling down film, and is contained in the fluid on this time film;
Middle die holder is in order to settle upper film; And
Seal seat, be positioned at this vacuum cavity, form and dock up and down, coat this fluid in order to the periphery of this upper film of Heat Sealing and this time film with die holder, this die shoe in this;
It is characterized in that: this fluid is to be selected from the group that liquid-state silicon gel and liquid silicon rubber are constituted; This vacuum cavity is integrally formed vacuum cavity, and this die shoe and this middle die holder be positioned at this vacuum cavity; Should comprise a film cave by middle die holder, and this upper film is positioned on this film cave; The periphery of this upper film and this time film this near hot pressing under the vacuum state involution, and this fluid not have bubble residual.
2. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: this vacuum pump unit comprises at least one pore, is used to extract the gas in this vacuum cavity and forms this near vacuum state.
3. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: this vacuum pump unit comprises at least one pore, is used for gas sent in this vacuum cavity and remove should be near vacuum state.
4. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: this seals seat and carries out Heat Sealing with the ultrasonic bonding mode.
5. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: this seals seat and carries out Heat Sealing with the high frequency bonding mode.
6. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: this seals seat and carries out Heat Sealing in the hot melt adhesive mode.
7. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: this seals the top that seat is arranged in this die holder.
8. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: this seals the below that seat is positioned at this die shoe.
9. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: also comprise displacement module, be used to drive this die shoe and move between this vacuum cavity is inside and outside.
10. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: also comprise at least one lifting module, be positioned at this vacuum cavity, be used for driving this and seal seat and this die holder decline, and dock up and down with this die shoe formation.
11. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: also comprise at least one lifting module, be positioned at this vacuum cavity, be used for driving this and seal that seat rises with this die shoe and dock up and down with this die holder formation.
12. fluid encapsulated moulding device as claimed in claim 1 is characterized in that: also comprise operational module, be used for for this valve of user's On/Off.
13. fluid encapsulated moulding device as claimed in claim 12 is characterized in that: also comprise two safety switches, must push these two safety switches simultaneously could this valve of On/Off.
14. fluid encapsulated moulding device as claimed in claim 12 is characterized in that: this operational module is to be available for users to adjust the parameters that this vacuum pump unit carries out extracting gases.
15. fluid encapsulated moulding device as claimed in claim 12 is characterized in that: this operational module is to be available for users to adjust this to seal the parameters that seat carries out Heat Sealing.
16. a fluid encapsulated moulding method comprises the following step:
Settle upper film in middle die holder, die holder comprises a film cave in this, and this upper film is positioned on this film cave;
Film is in die shoe under settling;
Perfusion of fluid is on this time film, and this fluid is to be selected from the group that liquid-state silicon gel and liquid silicon rubber are constituted;
Seal the vacuum cavity of die holder and this die shoe place in this;
Extract the gas in this vacuum cavity and form near vacuum state;
Ordering about in this die holder forms in this vacuum cavity with this die shoe and docks up and down; And
This near the periphery of this upper film of hot pressing under the vacuum state and this time film an involution, and make this upper film and this time film coat this fluid and not have bubble residual.
17. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: the step of pouring into this fluid is to carry out in this vacuum cavity.
18. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: the step of pouring into this fluid is to carry out outside this vacuum cavity.
19. fluid encapsulated moulding method as claimed in claim 18 is characterized in that: after the step of this fluid of perfusion, drive this die shoe and move in this vacuum cavity.
20. fluid encapsulated moulding method as claimed in claim 19 is characterized in that: after driving the step that this die shoe moves, drive should in die holder descend, make that die holder docks up and down with this die shoe formation in this.
21. fluid encapsulated moulding method as claimed in claim 19 is characterized in that: after driving the step that this die shoe moves, drive this die shoe and rise, make that die holder docks up and down with this die shoe formation in this.
22. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: sealing the step of this vacuum cavity of die holder and this die shoe place in this, is to intercept this vacuum cavity and extraneous space with valve.
23. fluid encapsulated moulding method as claimed in claim 22 is characterized in that: also comprise the step of pushing two safety switches simultaneously, and after pushing these two safety switches this valve of On/Off.
24. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: after the step of the periphery of this upper film of Heat Sealing and this time film, drive this die shoe and move to outside this vacuum cavity.
25. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: the step of the periphery of this upper film of Heat Sealing and this time film is to carry out Heat Sealing with the ultrasonic bonding mode.
26. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: the step of the periphery of this upper film of Heat Sealing and this time film is to carry out Heat Sealing with the high frequency bonding mode.
27. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: the step of the periphery of this upper film of Heat Sealing and this time film is to carry out Heat Sealing in the hot melt adhesive mode.
28. fluid encapsulated moulding method as claimed in claim 16 is characterized in that: after the step of the periphery of this upper film of Heat Sealing and this time film, gas sent in this vacuum cavity and remove should be near vacuum state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100290358A CN101337593B (en) | 2007-07-05 | 2007-07-05 | Fluid packing forming device and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100290358A CN101337593B (en) | 2007-07-05 | 2007-07-05 | Fluid packing forming device and method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101337593A CN101337593A (en) | 2009-01-07 |
| CN101337593B true CN101337593B (en) | 2011-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007100290358A Active CN101337593B (en) | 2007-07-05 | 2007-07-05 | Fluid packing forming device and method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170150785A1 (en) * | 2015-11-30 | 2017-06-01 | Nike, Inc. | Method of Filling Electrorheological Fluid Structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610703A (en) * | 2011-01-20 | 2012-07-25 | 陈惠美 | Encapsulating method for photoelectric elements |
| CN103303526B (en) * | 2013-06-21 | 2014-05-14 | 瑞安市诚达机械有限公司 | Double-blister paper-plastic packer |
| CN104015954A (en) * | 2014-05-30 | 2014-09-03 | 安徽先知缘食品有限公司 | Table type vacuum packaging machine |
| CN106240895A (en) * | 2016-08-04 | 2016-12-21 | 江苏中大包装材料有限公司 | A kind of intelligent vacuum packer |
| CN111315461A (en) | 2017-08-31 | 2020-06-19 | 耐克创新有限合伙公司 | Degassing electrorheological fluid |
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| CN101337593A (en) | 2009-01-07 |
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