CN101336474A - 包含微型电路的元件管壳 - Google Patents

包含微型电路的元件管壳 Download PDF

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CN101336474A
CN101336474A CNA2006800521055A CN200680052105A CN101336474A CN 101336474 A CN101336474 A CN 101336474A CN A2006800521055 A CNA2006800521055 A CN A2006800521055A CN 200680052105 A CN200680052105 A CN 200680052105A CN 101336474 A CN101336474 A CN 101336474A
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shell
substrate
flexible
lift
described substrate
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S·阿洛斯
K·图尔哈恩
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种包含一个或多个微型电路(6)的元件管壳，其中微型电路元件被放置在基板上，最适合地是被放置在印刷电路板上，所述元件通过公知的倒装电路或者丝线键合方法与基板连接，基板具有放置在所述元件周围的抬起部分(5)。基板是挠性的，为了加固结构而在它的上面放置刚性结构如金属薄片(10)、元件或其它相似的层结构，并且使用胶或塑料填充管壳的内部中央空间。

Description

包含微型电路的元件管壳
本发明涉及一种包含一个或多个微型电路的元件管壳(component case)，其中微型电路元件被放置在基板上，最适合地是被放置在印刷电路板上，所述元件使用公知的倒装电路或者丝线键合方法与基板连接，并且基板具有放置在所述元件周围的抬起部分，在它们的顶部放置把管壳封闭的封盖。
现有公知的电路管壳结构用于表面接合，例如IC电路管壳，其中有
1.1金属框架和塑料管壳
电路被安装在金属框架的中央并被丝线键合在框架带上。在塑料管壳中通过模制(mould)形成金属框架，金属边缘被切断。
1.2硬层压基板
硬层压基板通常被用作印刷电路板材料。层压板具有很多导电层。微型电路通过倒装电路或者丝线键合方法被安装在它们上面。在电路上，模制塑料封盖。在底面上，有通过模制形成的用于把元件接合到最终产品上的接合接触。
在本公开的发明中提出了对现有技术的显著改进，根据本发明的元件管壳的第一实施例的特征在于基板是挠性的，为了加固结构而在它的顶部放置刚性结构如金属薄片、元件或其它相似的层结构，并且使用胶或塑料填充管壳的内部中央空间。
根据本发明的第二实施例的特征在于基板是挠性的，为了加固结构而在它的顶部放置另一挠性子结构如另一印刷电路板，并且使用胶或塑料填充管壳的内部中央空间。
根据本发明的元件管壳的优点是元件能够非常紧密地被放置在很多层中，由此提高封装的紧凑性。层与层之间的接合可以通过例如焊接进行。但是，与当前可供选择的相比，该元件结构可以更好地被测试。挠性基板能够使管壳弯转到与管壳的面成90度的角度，或者进入另一种几乎自由的形态。
下面，通过参考附图披露本发明，其中
图1展示了使用薄片加固的元件管壳的层结构；
图2展示了使用元件加固的元件管壳的结构。
图1展示了IC电路管壳，其中电路6被放置在厚度为100μm或小于100μm的薄挠性基板的顶部。基板至少在一个方向上是挠性的。基板由表面保护层7、包含铜部件的导电层8、和它下面的保护层9形成。IC电路6被围绕其周围的边缘部件5保护，边缘部件5的高度为125μm。边缘部件的抬起部分通过粘合被固定到基板上，边缘部件5被模制到基板上。在边缘部件上固定薄片10，其用以加固结构。抬起部分不形成从基板到最上层的薄片10的任何电连接。最上层的薄片仅仅是一个保护性的加固薄片。管壳的底面上也有一个用于焊接的保护，例如具有25μm的厚度。
图2展示了第一实施例的另一个实现方式，其中IC电路的元件3和2处于基板上的由抬起部分5形成的空腔中，同时基板如图1中所示。结构刚性通过把元件1固定于抬起部分5上获得。关于元件1还可以包括一些薄片结构12。从基板到顶面上的元件的必要的电连接通过抬起部分5设置。在这种情况下管壳通过放置在抬起部分5上的元件1被加固。
在本发明的第二实施例中，管壳的封盖也是一个挠性膜、印刷电路板或相似物，通过使用胶或其它公知填充物填充管壳实现管壳的刚性。
此外，可以通过例如在前一个管壳的抬起部分5上用粘合固定另一管壳以获得管壳的刚性。总之，在元件2、3、6已经被放置时，如果需要，在抬起部分5之间保持的空腔能够用胶、塑料或其它公知的填充物填充。

Claims (7)

1.一种包含一个或多个微型电路(6)的元件管壳，其中微型电路元件(3，2，6)被放置在基板上，最适合地是被放置在印刷电路板上，所述元件通过公知的倒装电路或者丝线键合方法与所述基板接合，所述基板具有放置在所述元件周围的抬起部分(5)，在这些抬起部分的顶部放置把管壳封闭的封盖，其特征在于：所述基板是挠性的，为了加固结构而在其上放置刚性结构如金属薄层(12，10)、元件(1)或者其它类似的层结构，并且使用胶或塑料填充所述管壳的内部中央空间。
2.一种包含一个或多个微型电路(6)的元件管壳，其中微型电路元件(3，2，6)被放置在基板上，最适合地是被放置在印刷电路板上，所述元件通过公知的倒装电路或者丝线键合方法与所述基板接合，所述基板具有放置在所述元件周围的抬起部分(5)，在这些抬起部分的顶部放置封闭管壳的封盖，其特征在于：所述基板是挠性的，为了加固结构而在其上放置另一挠性结构如第二印刷电路板，并且使用胶或塑料填充所述管壳的内部中央空间。
3.根据权利要求1或2所述的元件管壳，其特征在于：抬起部分(5)通过用合金(composition metal)模制而制成或者通过把抬起部分部件粘合而制成。
4.根据权利要求1或2所述的元件管壳，其特征在于：抬起部分(5)形成与元件(1)或者在所述管壳上用作刚性元件的其它挠性基板的电接触。
5.根据权利要求1或2所述的元件管壳，其特征在于：至少在元件(2，3，6)的两侧存在抬起部分(5)。
6.根据权利要求1或2所述的元件管壳，其特征在于：所述基板是在两个方向上具有挠性的薄膜。
7.根据权利要求1所述的元件管壳，其特征在于：所述元件管壳由几个管壳层形成。
CNA2006800521055A 2005-12-01 2006-12-01 包含微型电路的元件管壳 Pending CN101336474A (zh)

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FI20051228A0 (fi) 2005-12-01
FI20051228L (sv) 2007-07-27
KR20080083293A (ko) 2008-09-17
WO2007063170A1 (en) 2007-06-07

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