CN101334591A - Levelling focusing mechanism possessing great range control function - Google Patents

Levelling focusing mechanism possessing great range control function Download PDF

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Publication number
CN101334591A
CN101334591A CNA2008101450490A CN200810145049A CN101334591A CN 101334591 A CN101334591 A CN 101334591A CN A2008101450490 A CNA2008101450490 A CN A2008101450490A CN 200810145049 A CN200810145049 A CN 200810145049A CN 101334591 A CN101334591 A CN 101334591A
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China
Prior art keywords
leveling
focusing
wedge
big stroke
base plate
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CNA2008101450490A
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Chinese (zh)
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CN101334591B (en
Inventor
周清华
李志龙
李生强
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Shanghai Micro Electronics Equipment Co Ltd
Shanghai Micro and High Precision Mechine Engineering Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
Shanghai Micro and High Precision Mechine Engineering Co Ltd
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Application filed by Shanghai Micro Electronics Equipment Co Ltd, Shanghai Micro and High Precision Mechine Engineering Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to CN 200810145049 priority Critical patent/CN101334591B/en
Publication of CN101334591A publication Critical patent/CN101334591A/en
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Publication of CN101334591B publication Critical patent/CN101334591B/en
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Abstract

The invention provides a levelling and focus-adjusting mechanism with a large stroke adjusting function, comprising a small stroke levelling and focus-adjusting mechanism and a large stroke adjusting mechanism which is arranged at the lower part of the small levelling and focus-adjusting mechanism; the Z-direction large stroke is realized by an independent wedge-shaped mechanism; the Z-direction micro-adjustment is driven by the wedge-shaped mechanism and realized by the guiding of a spring leaf. The levelling and focus-adjusting mechanism with the large stroke adjusting function provided by the invention can realize the Z-direction large stroke adjustment and the Z-direction micro-adjustment, can improve the dynamic performance and the adjusting precision, and is applicable to different application sites and different silicon sheet thickness specifications.

Description

Leveling and focusing mechanism with big stroke adjustment function
Technical field
The present invention relates to a kind of leveling and focusing mechanism, relate in particular to a kind of silicon chip platform leveling and focusing mechanism with big stroke adjustment function with big stroke adjustment function.
Background technology
Whole focusing and leveling generally is to carry out the defocusing amount measurement at 3 of silicon chip surfaces or 3 above diverse location places, calculate and proofread and correct the defocusing amount and the tilt quantity on whole silicon wafer surface, essence is exactly to regulate θ x in coordinate system, θ y and Z are to three degree of freedom, (wherein θ x is the rotation around X-axis, θ y is the rotation around Y-axis), reach the purpose of silicon chip focusing, leveling.
Patent US005204712A discloses the micropositioner of a 3DOF.This ultimate principle is by three groups of cam mechanisms, is distributed on three points, and three drive points are connected on the wafer-supporting platform by a compliant mechanism, and with the reed guiding, drives wafer-supporting platform jointly, thereby realizes leveling and focusing function.This 3 degree of freedom regulated quantitys are little, and especially Z can not realize big stroke adjustment to degree of freedom.
Chinese patent CN2580470 discloses a kind of 3 freedom degree ultra-precise locating platform.This stage body inside is equilateral triangle and is fixed with three groups of piezoelectric ceramics pre-tightening mechanisms independently separately.This compact conformation, precision is higher, but range of adjustment is little, and piezoelectric ceramics easily generates heat, and also is difficult for carrying out thermostatic control.
Summary of the invention
A kind of leveling and focusing mechanism with big stroke adjustment function provided by the invention can realize that Z regulates to trace to big stroke adjustment and Z, has improved dynamic property and degree of regulation, adapts to different application scenarios and different silicon wafer thickness specifications.
In order to achieve the above object, the invention provides a kind of leveling and focusing mechanism, comprise with big stroke adjustment function:
Little stroke leveling and focusing mechanism and the big stroke control mechanism that is arranged on this little stroke leveling and focusing mechanism bottom;
Described little stroke leveling and focusing mechanism comprises:
The leveling and focusing base plate;
The center is arranged on the reed on the leveling and focusing base plate, and this reed has some free ends;
Upper flat plate;
The some little stroke wedge mechanism that connects described reed free end and upper flat plate;
The some little stroke driving mechanism that connects described little stroke wedge mechanism;
Described little stroke wedge mechanism comprises:
The set square that connects described reed, this set square flexibly connect piece by one and connect described upper flat plate;
Be arranged on the leveling and focusing roller of described set square bottom;
Be fixed on the guide rail on the described leveling and focusing base plate;
Be arranged on the wedge on the described guide rail, the upper surface of this wedge has the gradient, and this wedge can slide along guide rail;
Described little stroke driving mechanism comprises:
The card extender that connects described wedge;
Be arranged on the screw rod on the described card extender opposite side, this screw rod drives card extender by nut and produces horizontal shift;
The drive motor that connects described screw rod;
Connect some crack extension springs that disappear of described card extender and drive motor, eliminate the backhaul gap of screw rod, improve bearing accuracy;
Described little stroke leveling and focusing mechanism also comprises the measurement feedback module of the corresponding setting of some and little stroke wedge mechanism; And the control and driving module that connects described measurement feedback module and drive motor;
Described little stroke leveling and focusing mechanism also comprises the spring of described leveling and focusing base plate of some connections and reed;
Described big stroke control mechanism comprises:
Base plate;
Be arranged on the some arc guide rails on the base plate;
Be arranged on the wedge drive plate on the described arc guide rail, this drive plate has some free ends, and this free end can slide along described arc guide rail;
Be arranged on the some big stroke wedge mechanism on the described wedge shape drive plate free end;
The big stroke driving mechanism that connects described wedge shape drive plate;
Be arranged on the some leveling and focusing base plate guiding mechanisms on the described base plate, this guiding mechanism has limited the leveling and focusing base plate can only be at Z to motion;
Described big stroke wedge mechanism comprises:
Be arranged on the roller of described leveling and focusing base plate downside;
Be arranged on the big stroke wedge on the described wedge shape drive plate free end;
Also comprise the wedge governor motion that connects described big stroke wedge, when assembling, can regulate the first holding position of big stroke wedge by this wedge governor motion, thus the assembling depth of parallelism of regulating the leveling and focusing platform;
Described big stroke driving mechanism comprises:
The adaptor that connects described wedge shape drive plate;
Be arranged on the screw rod on the described adaptor, this screw rod drives adaptor by nut and produces displacement;
The big stroke drive motor that connects described screw rod;
Connect some crack extension springs that disappear of described card extender and big stroke drive motor, bearing accuracy is improved in the backhaul gap of eliminating screw rod;
Described leveling and focusing base plate guiding mechanism comprises:
Be arranged on the vertical guide rail on the described base plate, be installed on the base plate by the guide rail mounting blocks;
Be arranged on the slide block adaptor on the described vertical guide rail, the upper end of this slide block adaptor connects the bottom of described leveling and focusing base plate, can slide along vertical guide rail;
Connect some extension springs of described base plate and leveling and focusing base plate, make the leveling and focusing base plate tightly and big stroke wedge mechanism combine;
Described big stroke control mechanism also comprises the control module that connects described big stroke wedge mechanism and big stroke driving mechanism.
Principle of work of the present invention is as follows:
Z is to big stroke adjustment: control module control motor rotates, the drive screw rod rotates, through nut and adaptor, the rotation of screw rod is converted to the rotation of wedge shape drive plate along arc guide rail, thereby make big stroke wedge do rectilinear motion, roller drives the leveling and focusing base plate and is Z to rectilinear motion under the promotion of big stroke wedge, realizes the silicon wafer thickness compensation;
Z is to little stroke adjustment: according to measuring the feedback module feedback data, the control and driving module drive motor passes to screw rod to rotation, through nut and card extender, at last the rotation of motor is converted to the rectilinear motion of wedge, under the promotion of wedge, leveling and focusing roller drive set square to moving linearly, realizes that the three-degree-of-freedom motion of vertical direction compensate thereby drive upper flat plate along Z.
A kind of leveling and focusing mechanism provided by the invention with big stroke adjustment function, realize that Z regulates to trace to big stroke adjustment and Z, dynamic property and degree of regulation have been improved, Z can reach micron order to the bearing accuracy of big stroke adjustment, the movement locus good linearity, steering logic is simple, and Z can reach tens nanometer to the bearing accuracy of little stroke adjustment, adapts to different application scenarios and different silicon wafer thickness specifications.
Description of drawings
Fig. 1 is the structural representation with leveling and focusing mechanism of big stroke adjustment function provided by the invention;
Fig. 2 is the structural representation of the little stroke leveling and focusing mechanism of the leveling and focusing mechanism with big stroke adjustment function provided by the invention;
Fig. 3 is the vertical view of the medium and small stroke leveling and focusing mechanism of Fig. 2;
Fig. 4 is the little stroke wedge mechanism of the leveling and focusing mechanism with big stroke adjustment function provided by the invention and the structural representation of little stroke driving mechanism;
Fig. 5 is the vertical view of medium and small stroke wedge mechanism of Fig. 4 and little stroke driving mechanism;
Fig. 6 is the structural representation of the big stroke control mechanism of the leveling and focusing mechanism with big stroke adjustment function provided by the invention;
Fig. 7 is the stereographic map of big stroke control mechanism among Fig. 6.
Embodiment
Following according to Fig. 1~Fig. 7, specify better embodiment of the present invention:
As shown in Figure 1, the invention provides a kind of leveling and focusing mechanism, comprise with big stroke adjustment function:
Little stroke leveling and focusing mechanism and the big stroke control mechanism that is arranged on this little stroke leveling and focusing mechanism bottom;
As shown in Figures 2 and 3, described little stroke leveling and focusing mechanism comprises:
Leveling and focusing base plate 7;
The center is arranged on the reed 2 on the leveling and focusing base plate 7, and this reed 2 has some free ends;
Upper flat plate 1;
The some little stroke wedge mechanism that connects described reed 2 free ends and upper flat plate 1;
The some little stroke driving mechanism that connects described little stroke wedge mechanism;
As shown in Figure 4 and Figure 5, described little stroke wedge mechanism comprises:
The set square 3 that connects described reed 2, this set square 3 flexibly connect piece 14 by one and connect described upper flat plate 1;
Be arranged on the leveling and focusing roller 4 of described set square 3 bottoms;
Be fixed on the guide rail 6 on the described leveling and focusing base plate 7;
Be arranged on the wedge 5 on the described guide rail 6, the upper surface of this wedge 5 has the gradient, and this wedge can slide along guide rail 6;
As shown in Figure 4 and Figure 5, described little stroke driving mechanism comprises:
The card extender 10 that connects described wedge 5;
Be arranged on the screw rod 9 on described card extender 10 opposite sides, this screw rod 9 drives card extender 10 by nut 12 and produces horizontal shift;
The drive motor 8 that connects described screw rod 9;
Connect some crack extension springs 11 that disappear of described card extender 10 and drive motor 8, eliminate the backhaul gap of screw rod 9, improve bearing accuracy;
Described little stroke leveling and focusing mechanism also comprises the measurement feedback module of the corresponding setting of some and little stroke wedge mechanism; And the control and driving module that connects described measurement feedback module and drive motor;
Described little stroke leveling and focusing mechanism also comprises the spring 15 of described leveling and focusing base plate 7 of some connections and reed 2;
As shown in Figure 6 and Figure 7, described big stroke control mechanism comprises:
Base plate 106;
Be arranged on the some arc guide rails 113 on the base plate 106;
Be arranged on the wedge drive plate 107 on the described arc guide rail 113, this drive plate 107 has some free ends, and this free end can slide along described arc guide rail 113;
Be arranged on the some big stroke wedge mechanism on described wedge shape drive plate 107 free ends;
The big stroke driving mechanism that connects described wedge shape drive plate;
Be arranged on the some leveling and focusing base plate guiding mechanisms on the described base plate 106, this guiding mechanism has limited leveling and focusing base plate 7 can only be at Z to motion;
Described big stroke wedge mechanism comprises:
Be arranged on the roller 100 of described leveling and focusing base plate 7 downsides;
Be arranged on the big stroke wedge 101 on described wedge shape drive plate 107 free ends;
Also comprise the wedge governor motion 102 that connects described big stroke wedge 101, when assembling, can regulate the first holding position of big stroke wedge 101 by this wedge governor motion 102, thus the assembling depth of parallelism of regulating the leveling and focusing platform;
Described big stroke driving mechanism comprises:
The adaptor 111 that connects described wedge shape drive plate 107;
Be arranged on the screw rod 112 on the described adaptor 111, this screw rod 112 drives adaptor 111 by nut 110 and produces displacement;
The big stroke drive motor 108 that connects described screw rod 112;
Connect some crack extension springs 109 that disappear of described adaptor 111 and big stroke drive motor 108, bearing accuracy is improved in the backhaul gap of eliminating screw rod;
Described leveling and focusing base plate guiding mechanism comprises:
Be arranged on the vertical guide rail 104 on the described base plate 106, be installed on the base plate 106 by guide rail mounting blocks 105;
Be arranged on the slide block adaptor 103 on the described vertical guide rail 104, the upper end of this slide block adaptor 103 connects the bottom of described leveling and focusing base plate 7, can slide along vertical guide rail 104;
Connect some extension springs 114 of described base plate 106 and leveling and focusing base plate 7, make leveling and focusing base plate 7 tightly and big stroke wedge mechanism combine;
Described big stroke control mechanism also comprises the control module that connects described big stroke wedge mechanism and big stroke driving mechanism.
In the present embodiment, carry out Z to big stroke adjustment, three big stroke wedge mechanism of cover and leveling and focusing base plate guiding mechanisms are set respectively, big stroke motion is measured control by rotary encoder, at first controlling motor 108 rotates, driving screw rod 112 rotates, through nut 110 and adaptor 111, the rotation of screw rod 112 is converted to the rotation of wedge shape drive plate 107 along arc guide rail 113, thereby make big stroke wedge 101 do rectilinear motion, roller 100 drives leveling and focusing base plate 7 and is Z to rectilinear motion under the promotion of big stroke wedge 101, realizes the silicon wafer thickness compensation.
Carry out Z when little stroke adjustment, little stroke wedge mechanism that three covers are identical and little stroke driving mechanism are realized the Three Degree Of Freedom control of leveling and focusing, little stroke wedge mechanism lays respectively at the A1 among Fig. 3, A2 and A3 place, 3 determine a plane, according to being positioned at 16a, 16b, three displacement transducers at 16c place (perhaps current vortex sensor etc.) feedback data, control and driving module drive motor 8 passes to screw rod 9 to rotation, through nut 12 and card extender 10, at last the rotation of motor is converted to the rectilinear motion of wedge 5, under the promotion of wedge 5, leveling and focusing roller 4 drive set square 3 along Z to moving linearly, thereby drive the three-degree-of-freedom motion compensation that upper flat plate 1 is realized vertical direction.
A kind of leveling and focusing mechanism provided by the invention with big stroke adjustment function, realize that Z regulates to trace to big stroke adjustment and Z, dynamic property and degree of regulation have been improved, Z can reach micron order to the bearing accuracy of big stroke adjustment, the movement locus good linearity, steering logic is simple, and Z can reach tens nanometer to the bearing accuracy of little stroke adjustment, adapts to different application scenarios and different silicon wafer thickness specifications.

Claims (8)

1. the leveling and focusing mechanism with big stroke adjustment function is characterized in that, comprises:
Little stroke leveling and focusing mechanism and the big stroke control mechanism that is arranged on this little stroke leveling and focusing mechanism bottom;
Described little stroke leveling and focusing mechanism comprises:
Leveling and focusing base plate (7); The center is arranged on the reed (2) on the leveling and focusing base plate (7), and this reed (2) has some free ends; Upper flat plate (1); The some little stroke wedge mechanism that connects described reed (2) free end and upper flat plate (1); The some little stroke driving mechanism that connects described little stroke wedge mechanism;
Described big stroke control mechanism comprises:
Base plate (106); Be arranged on the some arc guide rails (113) on the base plate (106); Be arranged on the wedge drive plate (107) on the described arc guide rail (113), this drive plate (107) has some free ends, and this free end can slide along described arc guide rail (113); Be arranged on the some big stroke wedge mechanism on described wedge shape drive plate (107) free end; The big stroke driving mechanism that connects described wedge shape drive plate; Be arranged on the some leveling and focusing base plate guiding mechanisms on the described base plate (106).
2. the leveling and focusing mechanism with big stroke adjustment function as claimed in claim 1 is characterized in that, described little stroke wedge mechanism comprises:
The set square (3) that connects described reed (2), this set square (3) flexibly connect piece (14) by one and connect described upper flat plate (1);
Be arranged on the leveling and focusing roller (4) of described set square (3) bottom;
Be fixed on the guide rail (6) on the described leveling and focusing base plate (7);
Be arranged on the wedge (5) on the described guide rail (6), the upper surface of this wedge (5) has the gradient, and this wedge can slide along guide rail (6).
3. the leveling and focusing mechanism with big stroke adjustment function as claimed in claim 1 is characterized in that, described little stroke driving mechanism comprises:
The card extender (10) that connects described wedge (5);
Be arranged on the screw rod (9) on described card extender (10) opposite side, this screw rod (9) drives card extender (10) by nut (12) and produces horizontal shift;
The drive motor (8) that connects described screw rod (9);
Connect some crack extension springs (11) that disappear of described card extender (10) and drive motor (8).
4. the leveling and focusing mechanism with big stroke adjustment function as claimed in claim 1 is characterized in that, described little stroke leveling and focusing mechanism also comprises the measurement feedback module of the corresponding setting of some and little stroke wedge mechanism; And the control and driving module that connects described measurement feedback module and drive motor; The spring (15) that also comprises described leveling and focusing base plates of some connections (7) and reed (2).
5. the leveling and focusing mechanism with big stroke adjustment function as claimed in claim 1 is characterized in that, described big stroke wedge mechanism comprises:
Be arranged on the roller (100) of described leveling and focusing base plate (7) downside;
Be arranged on the big stroke wedge (101) on described wedge shape drive plate (107) free end;
Also comprise the wedge governor motion (102) that connects described big stroke wedge (101).
6. the leveling and focusing mechanism with big stroke adjustment function as claimed in claim 1 is characterized in that, described big stroke driving mechanism comprises:
The adaptor (111) that connects described wedge shape drive plate (107);
Be arranged on the screw rod (112) on the described adaptor (111), this screw rod (112) drives adaptor (111) by nut (110) and produces displacement;
The big stroke drive motor (108) that connects described screw rod (112);
Connect some crack extension springs (109) that disappear of described adaptor (111) and big stroke drive motor (108).
7. the leveling and focusing mechanism with big stroke adjustment function as claimed in claim 1 is characterized in that, described leveling and focusing base plate guiding mechanism comprises:
Be arranged on the vertical guide rail (104) on the described base plate (106), be installed on the base plate (106) by guide rail mounting blocks (105);
Be arranged on the slide block adaptor (103) on the described vertical guide rail (104), the upper end of this slide block adaptor (103) connects the bottom of described leveling and focusing base plate (7), can slide along vertical guide rail (104);
Connect some extension springs (114) of described base plate (106) and leveling and focusing base plate (7).
8. the leveling and focusing mechanism with big stroke adjustment function as claimed in claim 1 is characterized in that, described big stroke control mechanism also comprises the control module that connects described big stroke wedge mechanism and big stroke driving mechanism.
CN 200810145049 2007-12-21 2008-07-29 Levelling focusing mechanism possessing great range control function Active CN101334591B (en)

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CNA2007101728035A CN101241307A (en) 2007-12-21 2007-12-21 Levelling focusing mechanism possessing great stroke control function
CN200710172803.5 2007-12-21
CN 200810145049 CN101334591B (en) 2007-12-21 2008-07-29 Levelling focusing mechanism possessing great range control function

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Publication number Priority date Publication date Assignee Title
CN108680093A (en) * 2018-06-20 2018-10-19 中国科学院西安光学精密机械研究所 Focussing distance measuring device and measuring method in a kind of optical focusing mechanism
CN110962674A (en) * 2018-09-30 2020-04-07 上海微电子装备(集团)股份有限公司 AGV battery replacing device and AGV battery replacing method
CN111025855A (en) * 2019-12-23 2020-04-17 中国科学院光电技术研究所 Non-contact automatic center alignment overlay projection photoetching machine
CN114384276A (en) * 2020-10-22 2022-04-22 航天科工惯性技术有限公司 Accelerometer gauge outfit assembling structure and method
CN114509923A (en) * 2022-01-28 2022-05-17 复旦大学 Focusing and leveling device in design of deep ultraviolet objective lens and application thereof

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CN102680477B (en) * 2012-04-24 2013-06-12 浙江大学 High precision leveling method and high precision leveling device for large optical element
CN105374718A (en) * 2015-12-04 2016-03-02 沈阳仪表科学研究院有限公司 Dicing saw sucker circumference flatness adjusting apparatus
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Publication number Priority date Publication date Assignee Title
CN108680093A (en) * 2018-06-20 2018-10-19 中国科学院西安光学精密机械研究所 Focussing distance measuring device and measuring method in a kind of optical focusing mechanism
CN108680093B (en) * 2018-06-20 2023-09-01 中国科学院西安光学精密机械研究所 Focusing distance measuring device and measuring method in optical focusing mechanism
CN110962674A (en) * 2018-09-30 2020-04-07 上海微电子装备(集团)股份有限公司 AGV battery replacing device and AGV battery replacing method
CN110962674B (en) * 2018-09-30 2023-10-13 上海微电子装备(集团)股份有限公司 AGV battery replacing device and AGV battery replacing method
CN111025855A (en) * 2019-12-23 2020-04-17 中国科学院光电技术研究所 Non-contact automatic center alignment overlay projection photoetching machine
CN114384276A (en) * 2020-10-22 2022-04-22 航天科工惯性技术有限公司 Accelerometer gauge outfit assembling structure and method
CN114509923A (en) * 2022-01-28 2022-05-17 复旦大学 Focusing and leveling device in design of deep ultraviolet objective lens and application thereof
CN114509923B (en) * 2022-01-28 2023-11-24 复旦大学 Focusing and leveling device in deep ultraviolet objective lens design and application thereof

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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525

Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd.

Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd

Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525

Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd.

Patentee before: Shanghai Micro Electronics Equipment Co., Ltd.