CN101334266B - Circuit board defect off-line checking method based on large-capacity image storage technology - Google Patents

Circuit board defect off-line checking method based on large-capacity image storage technology Download PDF

Info

Publication number
CN101334266B
CN101334266B CN2008101168502A CN200810116850A CN101334266B CN 101334266 B CN101334266 B CN 101334266B CN 2008101168502 A CN2008101168502 A CN 2008101168502A CN 200810116850 A CN200810116850 A CN 200810116850A CN 101334266 B CN101334266 B CN 101334266B
Authority
CN
China
Prior art keywords
image
file
tmap
circuit board
information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008101168502A
Other languages
Chinese (zh)
Other versions
CN101334266A (en
Inventor
郑众喜
李鹏杰
刘明星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Youna Technology Co.,Ltd.
Original Assignee
UNIC TECHNOLOGIES Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UNIC TECHNOLOGIES Inc filed Critical UNIC TECHNOLOGIES Inc
Priority to CN2008101168502A priority Critical patent/CN101334266B/en
Publication of CN101334266A publication Critical patent/CN101334266A/en
Application granted granted Critical
Publication of CN101334266B publication Critical patent/CN101334266B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Image Processing (AREA)

Abstract

The invention discloses an off-line detecting method for the defects of a circuit board on the basis of large-capacity image storage technology. The method comprises the following steps: 1) the circuit boards need to be detected are photographed region by region by using a camera, and the image of each local region is preserved; 2) the images in a plurality of single regions are spliced into an integrated image according to the position relation of the photographed regions by using an image splicing method; 3) a circuit board defect detecting formula is compiled by using off-line circuit board defect detecting software; 4) the defects of the circuit board are detected by using the off-line circuit board defect detecting software. By using the method and the technology, an engineer can occupy circuit detecting equipment on the PCB production line minimumly, can obtain the completely same observation vision when in the state of offline, thus obviously improving the utilization rate of the circuit board detecting equipment on the PCB production line and reducing the time for manufacturing the defect detecting formula.

Description

A kind of circuit board defect off-line checking method based on large-capacity image storage technology
Technical field
The present invention relates to printed circuit board (PCB) (Printed Circuit Board, be called for short PCB) production technology and quality assurance field, detect circuit board defect formula editor, the detection method of (Automatic Optical Inspection is called for short AOI) equipment especially for automated optical.
Background technology
Along with the continuous development of electronic technology and the raising of production technology, the automaticity that printed circuit board (PCB) (PCB) is produced is more and more higher, and automated optical detects (AOI) equipment by widespread usage.Thereby the major function of AOI equipment is to detect PCB to produce the defective assurance product quality that each stage produces.
Using AOI equipment to carry out defects detection at first needs the slip-stick artist to make the defects detection formula, this formula is mainly noted down the physical location and the content (concrete formula format and content is slightly different according to the design producer of AOI equipment) that needs to detect of each components and parts on the pcb board that needs to detect, after formula completes, generally need on AOI equipment, carry out on-line debugging, could formal being applied to carry out testing on the production line after debugging is finished.Editor, debugging defects detection formula mainly contain dual mode in present commercial Application, a kind of is to carry out on the AOI of platform independent checkout equipment, and another kind is to carry out on the AOI of industrial production line equipment.This dual mode all has very distinct issues, AOI equipment is all quite expensive, the debugging of using a special AOI equipment to carry out formula is very big waste, must bring whole production line out of service and use equipment on the production line to debug, thereby influence the efficient of production line.Because the back a kind of method of present most of PCB manufacturer's uses is carried out the design and the debugging of formula, and whole design may reach several hours with debug time according to the different of circuit board, this can cause very big manufacturing schedule to delay and the equipment waste, therefore how to reduce the holding time in formula making and the debug process as much as possible, become the problem that PCB manufacturer is concerned about most.
The off-line editing of defective formula and debugging are the methods that most of AOI device fabrication producer is pursued, but owing to can not well reappear detected state when online, present off-line editing and adjustment method all do not have really to substitute on-line debugging and are applied in the actual production.
Summary of the invention
The present invention uses the image mosaic and the large-capacity image storage technology of original creation, reappeared the detected state when PCB is online fully, make the slip-stick artist just can obtain by PC under the situation of off-line with AOI equipment on same debugging effect, maximum minimizing the holding time of making, debugging defects detection formula, thereby improved production efficiency.
The present invention finishes the offline inspection of PCB defective as follows: 1) regulate AOI equipment to testing conditions, take each local image of pcb board to be detected, and be saved on the local computer or the webserver.The present invention supports multiple picture format commonly used such as bmp, jpg, tiff etc.2) the image mosaic technology of use the present invention recommendation is spliced into complete image according to the physical location of photographic images, and the high capacity image preservation form that uses the present invention to recommend, and preserves into the TMAP file.3) use off-line AOI formula editing system to open the TMAP image of preservation, editor's defects detection formula on local computer.4) use the formula of off-line AOI formula editing system based on TMAP image debugging design, the detection of analog PCB plate.
Preferably, the brightness of the described step 1) light source that specifically need regulate AOI equipment when PCB detects;
Further, the CCD camera of use face battle array or linear array take each local image of pcb board and store local computer into or the webserver on.
Preferably, described step 2) specifically be spatial relation according to each topography, use based on the relevant method of image, be spliced into the image of a complete PCB plate.
Further, store complete PCB plate image according to the call format of TMAP image.
Preferably, the AOI formula editing system that described step 3) is concrete need be supported the making with formula browsed of TMAP image file.The form of the formula of making is identical with the form of online AOI Equipment Inspection.
Preferably, the AOI formula editing system that described step 4) is concrete need be supported to detect simulation based on the circuit board defect of TMAP image file, the true PCB image that obtains when promptly this system detects by the partial simulation AOI equipment that extracts the TMAP image is online, further, simulate the effect of online detection by the operation detection algorithm identical with the online detection of AOI.Further adjust parameter and design in the formula according to Simulation result.
Further, repeating said steps 3) and described step 4) up to reaching the formula that can be applied to online detection.
Off-line checking method by above PCB defective, the slip-stick artist can be minimum take circuit board checkout equipment on the PCB production line, identical observation scene when off-line state can obtain on line state, thereby improved the utilization factor of circuit board checkout equipment on the PCB production line significantly, reduced the time of making the defects detection formula.
Description of drawings
Fig. 1 is a steps flow chart sketch of the present invention;
Fig. 2 is the relative position synoptic diagram of shooting area in the invention process example;
Fig. 3 is the structured flowchart of the TMAP file that uses of the present invention;
Fig. 4 is the present invention opened, showed a TMAP file in embodiment a flow chart of steps;
Fig. 5 is the present invention's detailed steps process flow diagram in embodiment.
Embodiment
The present invention aims to provide a kind of AOI off-line defective formula editor, detection system of practicality, its core concept is by gathering the pcb board regional area image under the actual online detected status, by stitching algorithm a plurality of area images are spliced into a view picture pcb board image, and store by the TMAP mode, the slip-stick artist by on local computer, open the TMAP picture editting, debugging is used for online AOI defects detection formula.Concrete steps can mainly be divided into for 4 steps as shown in Figure 1:
1) takes each regional image of circuit board;
2) splice each regional image by spatial relation, be stored as the TMAP image;
3) editor's circuit board defect is checked formula under off-line state;
4) carrying out circuit board defect under off-line state detects.
Fig. 2 to Fig. 5 has showed the key step and the method for a preferred embodiment of the invention, and concrete implementation step realizes as shown in Figure 5 by the following method.
Step S1: prepare AOI equipment, be written into the pcb board that needs detection.
Step S2: the optical system of adjusting the AOI system is to the actual detected state, and preferably, this example is specially lighting source intensity and the camera lens enlargement factor of adjusting the AOI system.
Step S3: by the shooting pcb board each several part image of the CCD camera region-by-region in the mobile AOI system.Preferably, the zone of shooting as shown in Figure 2, adjacent shooting area needs certain overlapping to guarantee that area image can splice accurately at next step.The image of each regional area of taking can be stored in the local computer.
Step S4: according to the spatial relation of preserving each regional area image, be spliced into an entire image, and be stored as the TMAP image so that browse later on.Preferably, use each topography that preserves among the matching algorithm splicing step S3 that is correlated with based on image in this example.
The TMAP file that is used to preserve entire image is to be used for the file memory format that the high capacity image is preserved, and its file structure as shown in Figure 3.Concrete this document structure mainly is made up of following three parts:
File header (Header):
File header has defined the global information of TMAP file type, including, but not limited to following content:
The image file format explanation, " TMAP ";
File layout version number;
The image data file number;
Image essential information: image size, color, compress mode, ratio of compression, maximum multiplying power;
Image layer (Layer) information: maximum figure number of layers; Multiplying power relation between image layer;
Video data block (Tile) information: data block size;
The view data check code;
Reservation information (being used for the data structure upgrading);
Original image information (Image):
Original image information has defined the raw image data information that is used to generate the TMAP data file, includes but not limited to following content:
The Image numbering;
The Image corresponding position information;
The data file numbering of Image correspondence;
The enlargement ratio of Image correspondence;
The data file position and the side-play amount of Image correspondence;
Middle layer image block (Tile):
The middle layer image block has defined the information that generates the middle layer data block that produces automatically in the TMAP data file process, includes but not limited to following content:
The Tile numbering;
The Tile corresponding position information;
The data file numbering of Tile correspondence;
The enlargement ratio of Tile correspondence;
The data file position and the side-play amount of Tile correspondence.
In order to make the TMAP image carrying out fast browsing under the enlargement factor arbitrarily.This document structure adopts the mode of figure layer (Layer) and image block (Tile) combination to come storing image data.Different with traditional image storage mode (view data by rows), TMAP adopts the mode of image block (Tile) to arrange view data.Each blockage is wherein just represented an image block (Tile), the benefit of doing like this is, the user is the browse graph picture on any one time point, it is just passable only the data block (Tile) of user institute browsing area need to be written into demonstration, and traditional image storage mode almost needs to be written into whole image data, almost is can't finishing of task for Large Volume Data.
Step S5: under off-line state, on local computer, use the AOI of off-line to edit, detect the TMAP file of preserving among the software opening steps S4, carry out the editor of PCB defective formula.
The method of specifically opening, browse a TMAP image as shown in Figure 4.When using AOI formula software for editing to open a TMAP file, at first need to go out the data structure that the software needs use according to the information architecture of TMAP file.In this embodiment, adopted a fixedly array information of storing each data block (Tile).The organization definition of each data member is as follows in this array:
The data member structural information:
The horizontal coordinate of image block (Tile);
The vertical coordinate of image block (Tile);
The pairing data file numbering of image block (Tile);
The pairing data file of image block (Tile) position;
The side-play amount of the pairing data file of image block (Tile);
The pairing enlargement ratio of image block (Tile);
Wherein, the coordinate of image block (Tile) is defined according to different coordinate system oneself by the user.Can be known that by Fig. 3 the TMAP file structure had just comprised all information of each layer data block of image (Tile) originally, therefore, these information are easy to and can all obtain by the TMAP file.
In addition, can also from the TMAP file, obtain the multiplying power that maximum figure layer (Layer) is counted and each figure layer is represented that this view data is supported.
After the intact view data of initialization, when the user browsed the TMAP image, on any one time point, the user was in certain zone with certain multiplying power browse graph picture.Can determine the view data that need be written into this moment according to step as described in Figure 4.
At first determine the current selected image enlargement ratio of user; Can come reading of data according to suitable figure layer (Layer) in the enlargement ratio selection TMAP file structure of present image then, undistorted in order to guarantee image, preferably, the figure layer multiplying power of this example selection is the minimal graph layer (Layer) that is higher than the present image enlargement ratio; Further, the image-region of selecting according to the user calculates the coordinate position of this zone on original image; Further, empty image block to be decoded under the current state (Tile) formation, travel through the image block (Tile) of selected figure layer (Layer), obtain the image block (Tile) that common factor is arranged with the zone that needs to show, and the image block in the formation of decoding current image block; Further, in user interface, show decoded picture.
Preferably, the method that this example is handled by multithreading is decoded and demonstration work, accelerates picture browsing and display speed by regulating thread priority.
Step S6: use the AOI defective editor of off-line, detection software that the defective formula of making among the step S5 is carried out offline inspection.Because the TAMP image of preserving has reproduced the actual online testing environment of AOI fully, so testing result should be consistent with online testing result.
Step S7: check whether the testing result that step S6 generates meets the demands, if do not satisfy then return step S5 and revise the defective formula, circulation execution in step S5 meets the demands up to the testing result that step S6 generates to step S7.Think if the result of step S6 meets the demands the defective formula editor, the debugging end-of-job.
Step S8: preserve the defective formula of finishing editor, debugging, be used for the online detection of AOI system.
In sum, the present invention mainly is that the preferable algorithm of employing has spliced each topography of pcb board under the online detected state of AOI, and entire image stored in the mode of TMAP, preserved the image identical like this with online detected state, by based on the demonstration of TMAP image, the off-line AOI formula editor who browses, editor, the debugging that debugging software just can be finished AOI defective formula, thereby the maximum holding time that has reduced debugging work has improved the work efficiency of production line.
The embodiment that more than provides is in order to the practical application of explanation the present invention and it, and therefore makes those skilled in the art can make and use the present invention.But this only is a preferred embodiment, be not that the present invention is done any pro forma restriction, any one professional and technical personnel is in the scope that does not depart from technical solution of the present invention, and above technology of foundation and method do certain modification and the equivalent embodiment that is considered as equivalent variations is worked as in change.

Claims (7)

1. circuit board defect off-line checking method based on large-capacity image storage technology, this method is gathered the pcb board regional area image under the actual online detected status, by the image mosaic technology a plurality of regional area image mosaics are become a view picture pcb board image, and be stored on the hard disk, opening TMAP image file editor, debugging on local computer is used for online automated optical and detects the AOI equipment deficiency and detect formula, realization detects the pcb board defect off-line, and this circuit board defect off-line checking method comprises step:
(1) regulates automated optical and detect AOI equipment, take each regional area image of pcb board to be detected, and be saved on the local computer or the webserver to testing conditions;
(2) use the image mosaic technology to be spliced into complete image, and use the high capacity image to preserve form, preserve into a TMAP image file according to the physical location of taking each regional area image;
(3) use the off-line automated optical to detect AOI equipment formula editing system and open the TMAP image file of preservation, editor's defects detection formula on local computer;
(4) use the off-line automated optical to detect the formula of AOI equipment formula editor based on TMAP image file debugging design, the detection of analog PCB plate.
2. circuit board defect off-line checking method according to claim 1, it is characterized by: according to the spatial relation of each regional area image, use is spliced each regional area image based on the relevant matching algorithm of image, is spliced into the image of a complete PCB plate; And according to the call format of TMAP image storage complete PCB plate image.
3. circuit board defect off-line checking method according to claim 2, it is characterized by: described TMAP image file is to be used for the file memory format that the high capacity image is preserved, the mode of this TMAP image file structure employing figure layer Layer and image block Tile combination is come storing image data, and TMAP image file structure comprises following three parts:
3.1 file header
File header has defined the global information of TMAP file type, comprises following content:
The image file format explanation;
File layout version number;
The image data file number;
Image essential information: image size, color, compress mode, ratio of compression, maximum multiplying power;
Image layer information: maximum figure number of layers, multiplying power relation between image layer;
View data block message: data block size;
The view data check code;
Reservation information is used for the data structure upgrading;
3.2 original image information Image
Original image information has defined the raw image data information that is used to generate the TMAP file, comprises following content:
Original image information Image numbering;
Original image information Image corresponding position information;
The data file numbering of original image information Image correspondence;
The enlargement ratio of original image information Image correspondence;
The data file position and the side-play amount of original image information Image correspondence;
3.3 middle layer image block Tile
The middle layer image block has defined the information that generates the middle layer data block that produces automatically in the TMAP data file process, comprises following content:
Middle layer image block Tile numbering;
Middle layer image block Tile corresponding position information;
The data file numbering of middle layer image block Tile correspondence;
The enlargement ratio of middle layer image block Tile correspondence;
The data file position and the side-play amount of middle layer image block Tile correspondence.
4. circuit board defect off-line checking method according to claim 1, it is characterized by: when using off-line automated optical detection AOI formula editing system to open a TMAP image file, at first the information architecture according to the TMAP image file goes out the data structure that the software needs use.
5. circuit board defect off-line checking method according to claim 4 is characterized by: after the intact view data of initialization, come reading of data according to suitable figure layer Layer in the enlargement ratio selection TMAP image file structure of present image; Calculate the coordinate position of this zone on original image according to selected image-region; Travel through the middle layer image block Tile of selected figure layer Layer, obtain the middle layer image block Tile that common factor is arranged with the zone that needs to show, and the image block in the formation of decoding current image block; In user interface, show decoded picture.
6. circuit board defect off-line checking method according to claim 5 is characterized by: when opening a TMAP image file, the method for handling by multithreading is decoded and is shown, and regulates thread priority and accelerate picture browsing and display speed.
7. circuit board defect off-line checking method according to claim 1, it is characterized by: in step (4), automated optical detects AOI equipment formula editing system and detects the true PCB image that obtains when AOI equipment is online to be detected by the partial simulation automated optical that extracts the TMAP image, and detects the identical detection algorithm of the online detection of AOI equipment by operation and automated optical and simulate the effect of online detection.
CN2008101168502A 2008-07-18 2008-07-18 Circuit board defect off-line checking method based on large-capacity image storage technology Active CN101334266B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008101168502A CN101334266B (en) 2008-07-18 2008-07-18 Circuit board defect off-line checking method based on large-capacity image storage technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008101168502A CN101334266B (en) 2008-07-18 2008-07-18 Circuit board defect off-line checking method based on large-capacity image storage technology

Publications (2)

Publication Number Publication Date
CN101334266A CN101334266A (en) 2008-12-31
CN101334266B true CN101334266B (en) 2010-07-14

Family

ID=40197027

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101168502A Active CN101334266B (en) 2008-07-18 2008-07-18 Circuit board defect off-line checking method based on large-capacity image storage technology

Country Status (1)

Country Link
CN (1) CN101334266B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL213530A (en) * 2010-06-15 2016-03-31 Camtek Ltd Method and system for monitoring an operator of a printed circuit board verification station
CN101988901A (en) * 2010-09-20 2011-03-23 深圳市日联科技有限公司 Scanned type automatic optical detection system and method
CN102323070B (en) * 2011-06-10 2015-04-08 北京华兴致远科技发展有限公司 Method and system for detecting abnormality of train
CN103366027A (en) * 2012-03-30 2013-10-23 北大方正集团有限公司 Method and device for manufacturing materials for AOI (automatic optic inspection) equipment
CN102914549B (en) * 2012-09-10 2015-03-25 中国航天科技集团公司第五研究院第五一三研究所 Optical image matching detection method aiming at satellite-borne surface exposed printed circuit board (PCB) soldering joint quality
CN104463783A (en) * 2014-10-31 2015-03-25 杭州美诺瓦医疗科技有限公司 Processing and displaying method for controlling image through local multi-parameter and multi-picture shortcut key
CN105115979A (en) * 2015-09-09 2015-12-02 苏州威盛视信息科技有限公司 Image mosaic technology-based PCB working sheet AOI (Automatic Optic Inspection) method
CN105184739A (en) * 2015-09-09 2015-12-23 苏州威盛视信息科技有限公司 Printed circuit board AOI detection image stitching method
CN105335931A (en) * 2015-11-09 2016-02-17 广州视源电子科技股份有限公司 Board card image stitching method, processing device and system
CN105718499B (en) * 2015-12-11 2019-07-19 中国地质调查局发展研究中心 Geologic information data cleaning method and system
CN108010010B (en) * 2017-10-20 2020-03-27 浙江理工大学 Complete image rapid extraction method of online PCBA (printed circuit board assembly)
CN109493318A (en) * 2018-10-09 2019-03-19 广东仙童智能机器人科技有限公司 A kind of image parallel processing method, device and computer storage medium

Also Published As

Publication number Publication date
CN101334266A (en) 2008-12-31

Similar Documents

Publication Publication Date Title
CN101334266B (en) Circuit board defect off-line checking method based on large-capacity image storage technology
US20060236251A1 (en) Apparatus with thumbnail display
CN103676234B (en) A kind of detection device, array substrate detection system and method thereof
CN101275831B (en) Image off-line processing system and method
JP2011008764A (en) Inspection system, mobile terminal, inspection method and program
CN102256057A (en) Information processing apparatus, method and program and camera apparatus
CN102495064A (en) Touch screen screen-printed circuit automatic optic inspection system
CN107959810A (en) A kind of data burning method and data recording system for CCD camera assembly
CN1981302B (en) Image processing device and method
JP4958114B2 (en) Information processing apparatus, information processing method, and computer program
CN114418861B (en) Camera image splicing processing method and system
KR101261016B1 (en) method and apparatus for automatic optical inspection of flat panel substrate
CN112730442A (en) Automatic online product surface defect detection device and system based on machine vision
JP2006189318A (en) Object image display device
JP7131127B2 (en) APPEARANCE INSPECTION SYSTEM, APPEARANCE INSPECTION RESULT DISPLAY METHOD AND APPEARANCE INSPECTION RESULT DISPLAY PROGRAM
CN114994046A (en) Defect detection system based on deep learning model
JP2006308351A (en) Inspection method of electronic component and inspection system of electronic component using the method
CN115222728A (en) Screen detection method and device based on visual technology and computer equipment
CN105976848B (en) Mixed material bottoming processing method for digital film post-production
JP2008186487A (en) Display method for two-dimensional information code
CN101236164B (en) Method and system for defect detection
JP4241803B2 (en) Two-dimensional information code reading method and reading apparatus
CN112213081A (en) Screen body detection equipment
CN112614059A (en) Transformer substation detection method and device, storage medium and processor
CN116743978B (en) Video processing method, device, computer equipment and computer readable storage medium

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SUZHOU SUNIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: BEIJING UNITECH TECHNOLOGIES INC.

Effective date: 20111206

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 100085 HAIDIAN, BEIJING TO: 215163 SUZHOU, JIANGSU PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20111206

Address after: 215163 Suzhou New District kolding Road No. 2 Software Park 12 Building 1 layer

Patentee after: Suzhou Youna Technology Co.,Ltd.

Address before: 100085, Beijing, Haidian District on the East Road, No. 9, building on the first floor, No. 5 North District

Patentee before: UNIC Technologies Inc.