CN101332973A - Anode linking device - Google Patents
Anode linking device Download PDFInfo
- Publication number
- CN101332973A CN101332973A CNA2008100484305A CN200810048430A CN101332973A CN 101332973 A CN101332973 A CN 101332973A CN A2008100484305 A CNA2008100484305 A CN A2008100484305A CN 200810048430 A CN200810048430 A CN 200810048430A CN 101332973 A CN101332973 A CN 101332973A
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- exocoel
- heat insulating
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Abstract
The invention provides an anodic bonding device which essentially comprises an outer cavity, a pressure device, electrodes and a self-leveling device that is positioned at the bottom of the outer cavity; the self-leveling device is provided with a substrate which is equipped with a base plate and a lug boss positioned on the base plate; the interior of the lug boss is evenly provided with at least three counter bores which are internally provided with springs; the upper end of the spring is provided with a ball-end columella, the other end of the ball-end columella, which is in a hemispheric shape, extends out of the counter bore and is connected with the thermal insulation substrate, the periphery of the lug boss on the base plate is provided with three gag lever posts which are evenly distributed, the gag lever post is slightly higher than the contact face of the ball-end columella and the thermal insulation substrate, so as to limit thermal insulation substrate. In the invention, the self-leveling device can ensure that the whole bonding device forms an up and down floating structure, thus realizing the self-leveling during sample plate bonding and uniform attachment of sample plates.
Description
Technical field
The present invention relates to the MEMS field, particularly relate to anode linking device.
Background technology
Anode linkage is the bonding technology of a kind of extensive use in MEMS field, mainly is the permanent bonding of realizing between metal and the insulator.Its main feature be closely paste at a certain temperature and two prints under the effect of electrostatic field, forms permanent paste with, finally obtain the new material that meets.
Process kind in operation, paste between the print and quality directly have influence on the result and the quality of bonding, if paste between the print and inhomogeneous then may cause final bonding failure, therefore design the device that to adjust automatically and can effectively guarantee finishing smoothly of bonding.Provided some levelling devices that help print evenly to fit in the prior art, but structure is comparatively complicated, effect is not remarkable.
Existing in addition anode linkage technology is slightly inadequate aspect functions of the equipments, under many actual conditions, bonding that need be under certain environmental conditions, as vacuum environment, the special atmosphere environment, and hyperbaric environment or the like, and before the bonding operation, need print is carried out specially treated and operation under some situation, these requirements all need para-linkage equipment to design targetedly, and will take into account factors such as easy and simple to handle, reliability and efficient.Therefore the anode linkage equipment of the suitable various operating environments requirements of design can be widened the range of application of anode linkage technology effectively.
Summary of the invention
The object of the present invention is to provide a kind of anode linkage equipment, have automatic levelling function, make two bonding prints evenly be adjacent to.
A kind of anode linkage equipment, comprise exocoel, pressue device 15, electrode 11, electrode 11 is made of top electrode and bottom electrode, exocoel top is provided with pressue device 15, down place heat insulation material backing plate 14, upper heater 13, second insulating pad 12 and the top electrode successively from pressue device 15, it is characterized in that
Also comprise the substrate 4 that is positioned at the exocoel bottom, substrate 4 comprises chassis and position boss thereon, boss inside evenly has at least three counterbores along the same circumference of horizontal plane, place spring 6 in the counterbore, the upper ends ball head column 7 of spring 6, this ball head column 7 contacts with heat insulating substrate 8 for a hemispheric other end stretches out counterbore, place, outer at upper end, chassis boss is provided with three equally distributed gag lever posts 5, gag lever post 5 is a little more than the contact-making surface of ball head column and heat insulating substrate 8, plays the effect spacing to heat insulating substrate 8; Up place heater 9, first insulating pad 10 and the bottom electrode down successively from heat insulating substrate 8, bottom electrode is corresponding with the top electrode position.
As improvement of the present invention, described anode linkage equipment also comprises respectively vacuum acquiring system 20, air-path interface 16, vacuum detecting instrument 18 and the High-pressure measurement Instrument table 19 that joins with exocoel 1.
As a further improvement on the present invention, set up two brace tables, 2, two brace tables 2 and support a guide rail respectively between described exocoel 1 bottom and substrate 4, described substrate 4 is put on two guide rails.
The present invention makes whole bonding apparatus form the structure that fluctuates by leveling spring 6, realizes automatic leveling when the print bonding, and print is evenly fitted.Set up vacuum acquiring system 20, air-path interface 16, vacuum detecting instrument 18 and High-pressure measurement Instrument table 19, to adapt to the different application environment requirement, exocoel can be realized the vacuum of setting by vacuum acquiring system 20, can realize obtaining of specific gas environment in conjunction with air-path interface 16, satisfy the anode linkage under the given atmosphere condition interior from the vacuum to the high pressure on a large scale.The present invention also is provided with guide rail, realizes picking and placeing of print with the convenient exocoel of coming in and going out.
Description of drawings
Fig. 1 is a structural representation of the present invention.
The specific embodiment
Specify the present invention below in conjunction with the drawings and specific embodiments.
Anode linkage equipment of the present invention as shown in Figure 1, vacuum chamber 1, vacuum acquiring system 20 and air-path interface 16 can be realized the acquisition of vacuum chamber 1 interior vacuum and high pressure particular atmosphere environment, be specially: 20 pairs of vacuum chambers of vacuum system vacuumize, have vacuum detecting instrument 18 to detect the interior vacuum of vacuum chamber, vacuum acquiring system 20 can adopt mechanical pump or vavuum pump; Hyperbaric environment for specific gas vacuumizes earlier, charges into specific gas by air-path interface 16 then, shows with high-tension measurement instrument 19; Vacuum links to each other with vacuum chamber 1 by high airtight valve 17 with the high-tension measurement instrument, isolates the high-tension measurement instrument when vacuumizing, isolates vacuum measuring instrument during operation with high pressure.
Be provided with the bonding platform at vacuum chamber 1 inner bottom part, the bonding platform comprises two brace tables 2 that are placed in vacuum chamber 1 inner bottom, is respectively applied for to support two guide rails 3, and this structure can realize bonding print conveniently picking and placeing in vacuum chamber 1.3 placement workbench of two guide rails substrate 4, substrate 4 comprises square chassis and position round boss thereon, boss inside evenly has five counterbores along same circumference, place spring 6 in the counterbore, the upper ends ball head column 7 of spring 6, this ball head column 7 contacts with spring 6 for a columniform end, contacts with heat insulating substrate 8 for a hemispheric end stretches out counterbore, in order to support heat insulating substrate 8.Place, outer at upper end, the chassis of bonding platform boss is provided with three equally distributed gag lever posts 5, and gag lever post 5 is a little more than the contact-making surface of ball head column and heat insulating substrate 8, plays the effect spacing to heat insulating substrate 8.Heat insulating substrate 8 upper surfaces are provided with groove, are used to lay down heater 9, and following heater 9 tops are by first insulating pad 10 and electrode 11 insulation.
Vacuum chamber 1 top is provided with pressue device 15, and available cylinder or hydraulic cylinder are realized; Pressue device 15 bottoms are connected with upper heater 13 by heat insulation material backing plate 14, and heater 13 lower ends are by second insulating pad 12 and electrode 11 insulation.
Electrode 11 comprises top electrode and bottom electrode.Heater and last lower table closely press close to realize the heating to sample between the workbench about making after pressue device 15 is depressed.
During operation, earlier the bonding platform is pulled out outside the vacuum chamber 1 by guide rail 3, between electrode, place print, advance vacuum chamber 1 inside, starting pressue device 15 depresses upper heater 13, the bonding platform is compressed, the print between two electrodes 11 evenly is adjacent to, utilize vacuum acquiring system 20 and air-path interface 16 to make then and reach the requirement environment in the vacuum chamber.Start two heaters, to be heated behind design temperature, add DC voltage up and down between the electrode, bonding begins.
Claims (3)
1, a kind of anode linkage equipment, comprise exocoel, pressue device (15), electrode (11), electrode (11) is made of top electrode and bottom electrode, exocoel top is provided with pressue device (15), down place heat insulation material backing plate (14), upper heater (13), second insulating pad (12) and top electrode successively from pressue device (15), it is characterized in that
Also comprise the substrate (4) that is positioned at the exocoel bottom, substrate (4) comprises chassis and position boss thereon, boss inside evenly has at least three counterbores, place spring (6) in the counterbore, the upper ends ball head column (7) of spring (6), this ball head column (7) contacts with heat insulating substrate (8) for a hemispheric other end stretches out counterbore, place, outer at upper end, chassis boss is provided with three equally distributed gag lever posts (5), gag lever post (5) plays the spacing effect of heat insulating substrate (8) a little more than the contact-making surface of ball head column and heat insulating substrate (8); Up place heater (9), first insulating pad (10) and bottom electrode down successively from heat insulating substrate (8), bottom electrode is corresponding with the top electrode position.
2, a kind of anode linkage equipment according to claim 1, it is characterized in that described anode linkage equipment also comprises respectively vacuum acquiring system (20), air-path interface (16), vacuum detecting instrument (18) and the High-pressure measurement Instrument table (19) that joins with exocoel (1).
3, a kind of anode linkage equipment according to claim 1 is characterized in that, sets up two brace tables (2) between described exocoel (1) bottom and substrate (4), and two brace tables (2) support a guide rail respectively, and described substrate (4) is put on two guide rails.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100484305A CN101332973B (en) | 2008-07-16 | 2008-07-16 | Anode bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100484305A CN101332973B (en) | 2008-07-16 | 2008-07-16 | Anode bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101332973A true CN101332973A (en) | 2008-12-31 |
| CN101332973B CN101332973B (en) | 2011-05-11 |
Family
ID=40195898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100484305A Expired - Fee Related CN101332973B (en) | 2008-07-16 | 2008-07-16 | Anode bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101332973B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101332974B (en) * | 2008-07-16 | 2011-05-11 | 华中科技大学 | Thermal bonding device |
| CN102120562A (en) * | 2010-11-09 | 2011-07-13 | 北京理工大学 | Auxiliary pressurizing device for chip bonding |
| CN103523746A (en) * | 2013-10-29 | 2014-01-22 | 苏州大学 | Composite anodic bonding system and method based on multi-energy field coupling |
| CN106734656A (en) * | 2016-12-26 | 2017-05-31 | 东莞市天合机电开发有限公司 | A kind of motor adjusts the semi-automatic laminating mechanism of buffer-type |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2656396Y (en) * | 2003-09-17 | 2004-11-17 | 华中科技大学机械科学与工程学院 | Low light electronic mechanical system air fight packaging clamping device |
| CN1277739C (en) * | 2005-01-28 | 2006-10-04 | 华中科技大学 | Vacuum package device for micro system |
| CN101332974B (en) * | 2008-07-16 | 2011-05-11 | 华中科技大学 | Thermal bonding device |
-
2008
- 2008-07-16 CN CN2008100484305A patent/CN101332973B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101332974B (en) * | 2008-07-16 | 2011-05-11 | 华中科技大学 | Thermal bonding device |
| CN102120562A (en) * | 2010-11-09 | 2011-07-13 | 北京理工大学 | Auxiliary pressurizing device for chip bonding |
| CN103523746A (en) * | 2013-10-29 | 2014-01-22 | 苏州大学 | Composite anodic bonding system and method based on multi-energy field coupling |
| CN103523746B (en) * | 2013-10-29 | 2016-09-28 | 苏州大学 | Combined type anode linkage system and method based on Multi-energy field coupling |
| CN106734656A (en) * | 2016-12-26 | 2017-05-31 | 东莞市天合机电开发有限公司 | A kind of motor adjusts the semi-automatic laminating mechanism of buffer-type |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101332973B (en) | 2011-05-11 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20170716 |
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| CF01 | Termination of patent right due to non-payment of annual fee |