CN101332477B - 半导体器件硅铝键合线制造方法 - Google Patents
半导体器件硅铝键合线制造方法 Download PDFInfo
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- CN101332477B CN101332477B CN2007100149887A CN200710014988A CN101332477B CN 101332477 B CN101332477 B CN 101332477B CN 2007100149887 A CN2007100149887 A CN 2007100149887A CN 200710014988 A CN200710014988 A CN 200710014988A CN 101332477 B CN101332477 B CN 101332477B
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CN2007100149887A CN101332477B (zh) | 2007-06-28 | 2007-06-28 | 半导体器件硅铝键合线制造方法 |
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CN2007100149887A CN101332477B (zh) | 2007-06-28 | 2007-06-28 | 半导体器件硅铝键合线制造方法 |
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CN101332477A CN101332477A (zh) | 2008-12-31 |
CN101332477B true CN101332477B (zh) | 2010-09-29 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104588431A (zh) * | 2014-12-12 | 2015-05-06 | 西南铝业(集团)有限责任公司 | 铝合金导轨型材的制备方法 |
CN104894440A (zh) * | 2015-05-27 | 2015-09-09 | 安徽捷澳电子有限公司 | 一种超极细硅铝扁丝带及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1302913A (zh) * | 1999-10-22 | 2001-07-11 | 何建国 | 铝硅合金线的生产工艺 |
EP1160344A1 (en) * | 2000-05-31 | 2001-12-05 | Tanaka Denshi Kogyo Kabushiki Kaisha | Gold wire for semiconductor element connection and semiconductor element connection method |
CN1392008A (zh) * | 2002-08-02 | 2003-01-22 | 黄国兴 | 集成电路键合用铝-1%硅细丝母料的电磁铸造法 |
CN1575512A (zh) * | 2001-10-23 | 2005-02-02 | 住友电工运泰克株式会社 | 键合线 |
CN1718314A (zh) * | 2005-07-12 | 2006-01-11 | 天津世星电子材料有限公司 | 铝硅键合线的无模连铸工艺方法 |
CN1730233A (zh) * | 2005-07-12 | 2006-02-08 | 天津世星电子材料有限公司 | 集成电路用键合铝线极细丝的生产工艺 |
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2007
- 2007-06-28 CN CN2007100149887A patent/CN101332477B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1302913A (zh) * | 1999-10-22 | 2001-07-11 | 何建国 | 铝硅合金线的生产工艺 |
EP1160344A1 (en) * | 2000-05-31 | 2001-12-05 | Tanaka Denshi Kogyo Kabushiki Kaisha | Gold wire for semiconductor element connection and semiconductor element connection method |
CN1575512A (zh) * | 2001-10-23 | 2005-02-02 | 住友电工运泰克株式会社 | 键合线 |
CN1392008A (zh) * | 2002-08-02 | 2003-01-22 | 黄国兴 | 集成电路键合用铝-1%硅细丝母料的电磁铸造法 |
CN1718314A (zh) * | 2005-07-12 | 2006-01-11 | 天津世星电子材料有限公司 | 铝硅键合线的无模连铸工艺方法 |
CN1730233A (zh) * | 2005-07-12 | 2006-02-08 | 天津世星电子材料有限公司 | 集成电路用键合铝线极细丝的生产工艺 |
Non-Patent Citations (3)
Title |
---|
柳建.Al-1%wtSi键合线线材的研制及组织和纯度对其性能的影响.兰州理工大学硕士学位论文.2007,全文. * |
汤安.半固态成形过共晶Al-Si合金高温性能研究.昆明理工大学硕士学位论文.2007,全文. * |
陈宇.集成电路封装用新型Al-1%Si键合线的研制.兰州理工大学硕士学位论文.2004,第19页第3段、第21页第2段、第34页第1段、第36页第1段、第39页第2段、第46页第2段、第47页第3段及图4-11、表4-5. * |
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CN101332477A (zh) | 2008-12-31 |
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