CN101329992B - Fluid temperature regulating equipment - Google Patents
Fluid temperature regulating equipment Download PDFInfo
- Publication number
- CN101329992B CN101329992B CN2007101233210A CN200710123321A CN101329992B CN 101329992 B CN101329992 B CN 101329992B CN 2007101233210 A CN2007101233210 A CN 2007101233210A CN 200710123321 A CN200710123321 A CN 200710123321A CN 101329992 B CN101329992 B CN 101329992B
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- reaction liquid
- chemical reaction
- cylindrical shell
- fluid temperature
- mozzle
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Abstract
The invention discloses a liquid temperature control system and a temperature regulating device thereof, which comprise a liquid reactive tank, a temperature sensor, a temperature regulating device, a first outflow pipeline and a first inflow pipeline, wherein, the first outflow pipeline and the first inflow pipeline are communicated between the liquid reactive tank and the temperature regulating device; the temperature of the reaction liquid in the reactive tank is regulated by the temperature regulating device; for instance, when the reaction liquid flows through the first outflow pipeline and then into the temperature regulating device, a work for raising or reducing the temperature of the reaction liquid is carried out, and after reaching a preset work temperature, the reaction liquid flows back to the reactive tank through the first inflow pipeline so that the subsequent work can proceed.
Description
Technical field
The present invention especially is applicable on the fluid temperature control system relevant for a kind of design of temperature regulating equipment.
Background technology
When making semiconductor device, how the semiconductor device fabrication with integrated circuit etc. becomes the wafer semiconductor, comprise the wafer semiconductor is cleaned or etched step and in the process of making, have, generally speaking, this step usually in a liquid reactions groove device chemical liquid is arranged, do for wafer semiconductor etc. and to clean or etched action, but with because the relation of chemical characteristic, above-mentioned action all needs just can do at a certain temperature to carry out chemical reaction.So practise having all to need in the equipment and dispose a heating tank and consistent cold trap, when the wafer semiconductor need heat, need mobile wafer semiconductor in heating tank, to heat, when lowering the temperature, needs then need mobile wafer semiconductor to the refrigeration groove, because the wafer semiconductor is in moving process, may cause unnecessary pollution or damage, so the manufacture that mobile wafer semiconductor is not a best.
Summary of the invention
In order to make feature of the present invention and technical advantage that clearer presenting can be arranged, described in detail especially exemplified by a preferred embodiment.
The invention provides a kind of fluid temperature control system and temperature regulating equipment thereof, to solve the problem that known wafer need move around between heating tank and refrigeration groove.
The fluid temperature control system that one embodiment of the invention provided mainly combines the liquid reactions groove with temperature regulating equipment, include the liquid reactions groove, temperature inductor, temperature regulating equipment, first flows out pipeline and first flows into pipeline, wherein the first outflow pipeline and first flows into pipeline connection between liquid reactions groove and temperature regulating equipment, come the reaction liquid in the liquid reactions groove is carried out the adjustment of temperature by temperature regulating equipment, for example when reaction liquid enters in temperature regulating equipment via the first outflow pipeline, the operation that can heat up or lower the temperature reaction liquid, after question response liquid arrives default processing temperature, flow into pipeline by first again and be back in the liquid reactions groove, so can proceed follow-up operation.
Therefore purpose of the present invention is providing a kind of fluid temperature control system and temperature regulating equipment thereof exactly, the wafer semiconductor is being cleaned or reaction liquid during the etching operation, the action that in same equipment, can heat up or lower the temperature, and reach the preset temperature that can work.
Description of drawings
Fig. 1 is provided with schematic diagram for the system of preferred embodiment of the present invention;
Fig. 2 is the schematic perspective view of temperature regulating equipment preferred embodiment;
Fig. 3 is the STRUCTURE DECOMPOSITION schematic diagram of temperature regulating equipment preferred embodiment;
Fig. 4 is the generalized section of temperature regulating equipment preferred embodiment.
[figure number explanation]
Liquid reactions groove 10 temperature inductors 20
Temperature regulating equipment 30 cylindrical shells 31
The 311 first chemical reaction liquid outlet 312 that enters the mouth of first chemical reaction liquid
313 cold mouthfuls of outlets of cold water inlet 314
The 315 second chemical reaction liquid outlet 316 that enters the mouth of second chemical reaction liquid
Chiller 34 controllers 35
The first chemical reaction mozzle, 36 second chemical reaction mozzles 37
Locating ring 391,392 first flows out pipeline 40
Second flows out pipeline 41 first flows into pipeline 50
Second flows into pipeline 51
Embodiment
In order to make feature of the present invention more clear, below will disclose embodiments of the invention, the execution mode of various features for example, so it is not in order to limit the present invention.
Please refer to Fig. 1, the preferred embodiment of fluid temperature control system of the present invention includes liquid reactions groove 10, temperature inductor 20, temperature regulating equipment 30, first flows out pipeline 40 and first flows into pipeline 50, wherein first flows out pipeline 40 and first and flows into pipeline 50 and be communicated in 30 of liquid reactions groove 10 and temperature regulating equipments, and temperature inductor 20 is arranged in the liquid reactions groove 10, use the reaction liquid temperature in the monitoring liquid reactions groove 10, in addition, more come the reaction liquid in the liquid reactions groove 10 is carried out the adjustment of temperature by temperature regulating equipment 30, for example when reaction liquid enters in temperature regulating equipment 30 via the first outflow pipeline 40, the operation that can heat up or lower the temperature reaction liquid, after question response liquid arrives default processing temperature, flow into pipeline 50 by first again and be back in the liquid reactions groove 10, so can proceed follow-up operation.
In addition, more include second in the present embodiment and flow out the pipeline 41 and the second inflow pipeline 51, wherein second flows out pipeline 41 and second and flows into pipeline 51 and be communicated in 30 of liquid reactions groove 10 and temperature regulating equipments equally, using provides reaction liquid more flow line, further improve and make the flow rate of reaction liquid, and allow liquid reactions groove 10 interior reaction liquids can reach default processing temperature faster in 30 of liquid reactions groove 10 and temperature regulating equipments.
Be formation that more clearly demonstrates temperature regulating equipment of the present invention and the mode of adjusting the reaction liquid temperature thereof, see also Fig. 2 and shown in Figure 3, include cylindrical shell 31 in the preferred embodiment of temperature regulating equipment 30 of the present invention, lid 32, heater 33, chiller 34, controller 35, the first chemical reaction mozzle 36 and the second chemical reaction mozzle 37, below please consult shown in Figure 4 jointly, the top of its middle cylinder body 31 has opening 317, lid 32 is covered on the opening, enter the mouth 311 and on the sidewall of cylindrical shell, have first chemical reaction liquid, first chemical reaction liquid outlet 312, cold water inlet 313, cold mouthful of outlet 314, second chemical reaction liquid inlet, 315 and second chemical reaction liquid outlet 316, wherein first chemical reaction liquid inlet 311 is connected in the first outflow pipeline 40, second chemical reaction liquid inlet 315 is connected in the second outflow pipeline, 41, the first chemical reaction liquid outlet 312 and is connected in the first inflow pipeline 50, second chemical reaction liquid outlet 316 is connected in second and flows into pipeline 51.Heater 33 includes a plurality of electrothermal tubes 331, and the one end is linked on the lid 32, and the other end extends in cylindrical shell 31.Chiller 34 is used to provide the cold water of cooling usefulness, and it for example is the cold feed group, and it is outer and be connected with cold water inlet 313 and cold water outlet 314 respectively to be arranged at cylindrical shell 31.Controller 35 is arranged on the lid 32, and links with heater 33 and chiller 34 respectively, controls the keying state of heater 33 and chiller 34 by controller 35.The first chemical reaction liquid mozzle 36 and the second chemical reaction liquid mozzle 37, be a helical form pipeline, and the first chemical reaction liquid mozzle 36 and the second chemical reaction liquid mozzle 37 are crisscross arranged, and be positioned at 33 of cylindrical shell 31 inwalls and heaters, wherein two ends of the first chemical reaction liquid mozzle 36 two ends that are communicated in this first chemical reaction liquid inlet 311 and these first chemical reaction liquid outlet, 312, the second chemical reaction liquid mozzles 37 respectively are communicated in this second chemical reaction liquid inlet 315 and this second chemical reaction liquid outlet 316 respectively.
In addition, temperature regulating equipment 30 more includes insulating element 38 and positioning component 39, wherein be laid with plurality of through holes 381 on the insulating element 38, and insulating element 38 is arranged at the electrothermal tube 331 of the first chemical reaction liquid mozzle 36, the second chemical reaction liquid mozzle 37 and heater 33, by this insulating element 38 can completely cut off the first chemical reaction liquid mozzle 36, the second chemical reaction liquid mozzle 37 directly directly contacts with heater 33.Positioning component 39 is incorporated on these cylindrical shell 31 lateral walls, and is made of two 391,392 corresponding of locating rings, by this two locating ring 391,392, can allow temperature regulating equipment 30 be fixed on the special object.
In sum, utilize the temperature regulating equipment 30 of fluid temperature control system of the present invention to adjust the temperature of controlling liquid reactive tank 10 internal reaction liquid, for example when needs reduce the reaction liquid temperature, controller 35 is opened chiller 34 and is closed heater 33, at this moment, chiller 34 provides cold water to enter in cylindrical shell 31 via cold water inlet 313, and with the first chemical reaction mozzle 36 and the second chemical reaction mozzle 37 in reaction liquid, carry out heat exchange, the heat of reaction liquid is taken out of, to reach the purpose of cooling, and through the higher water of exchange heat excess temperature, then flow into again in the chiller 34 and cool off via cold water outlet 314, make it return back to default cold water temperature again, so the reaction liquid of repetitive cycling until liquid reactions groove 10 in arrives till the temperature of presetting, and detects reaction liquid when reaching preset temperature at temperature inductor 20, promptly can notification controller 35 stops the start of chiller 34.
Otherwise, when desire heating reaction liquid, controller 35 activates heater 33, and chiller 34 is closed in affirmation, at this moment, still keep full water state in the cylindrical shell 31, electrothermal tube 331 at heater 33 heats, its hot water that absorbs heat will be via the perforation 381 of insulating element 38 to outdiffusion, and to the reaction liquid in the first chemical reaction mozzle 36 and the second chemical reaction mozzle 37, carry out heat exchange, after the reaction liquid heat absorption, its temperature will promote, after circulation several times, reaction liquids in the liquid reactions groove 10 just can arrive default temperature, same detect reaction liquid when reaching preset temperature at temperature inductor 20, promptly can notification controller 35 stop the start of heater 33.Thus, by the design of temperature regulating equipment 30, just can reach the purpose of controlling liquid reactive tank internal reaction fluid temperature.
In addition, in the preferable enforcement of fluid temperature control system provided by the present invention and temperature regulating equipment thereof, include the chemical reaction liquid mozzle of two covers, its purpose is more to quicken the rate of heat exchange of reaction liquid, but do not lie in qualification quantity, for example only use a cover chemical reaction mozzle also can carry out the heat exchange operation.
Therefore the present invention has novelty and progressive, and fills and part meet the important document of applying for patent of invention, so file an application in accordance with the law, prays an ancient unit of weight office and grants quasi patent early, and the true feeling moral just.
Below the present invention has been done a detailed description, yet the above person only is preferred embodiment of the present invention, when not limiting scope of the invention process.Be that all equalizations of doing according to the present patent application scope change and modify etc., all should still belong in the patent covering scope of the present invention.
Claims (9)
1. a fluid temperature (F.T.) is adjusted equipment, comprising:
One cylindrical shell, its top has an opening, and has one first chemical reaction liquid inlet, the outlet of one first chemical reaction liquid, a cold water inlet and one cold mouthful of outlet on its sidewall;
One lid is covered on this opening;
One heater is linked to this lid and extends in this cylindrical shell;
One chiller, it is outer and be connected with this cold water inlet and this cold water outlet respectively to be arranged at this cylindrical shell;
One controller is arranged on this lid, and links with this heater and this chiller respectively; And
One first chemical reaction liquid mozzle is arranged in this cylindrical shell, and is positioned between the inwall of this heater and this cylindrical shell, and wherein two ends of this first chemical reaction liquid mozzle are communicated in this first chemical reaction liquid inlet and the outlet of this first chemical reaction liquid respectively.
2. fluid temperature (F.T.) as claimed in claim 1 is adjusted equipment, more includes an insulating element, is arranged between this first chemical reaction liquid mozzle and this heater.
3. fluid temperature (F.T.) as claimed in claim 2 is adjusted equipment, wherein is laid with plurality of through holes on this insulating element.
4. fluid temperature (F.T.) as claimed in claim 1 is adjusted equipment, and wherein heater includes a plurality of electrothermal tubes.
5. fluid temperature (F.T.) as claimed in claim 1 is adjusted equipment, wherein have more one second chemical reaction liquid inlet and the outlet of one second chemical reaction liquid on the sidewall of this cylindrical shell, wherein this first chemical reaction liquid inlet and this second chemical reaction liquid inlet are located at the left and right sides of fragment position under the cylinder lateral wall respectively, and this first chemical reaction liquid outlet and the outlet of this second chemical reaction liquid then are arranged at the left and right sides of fragment position on the cylindrical shell respectively.
6. fluid temperature (F.T.) as claimed in claim 5 is adjusted equipment, more include one second chemical reaction liquid mozzle, be arranged in this cylindrical shell, and be positioned between the inwall of this heater and this cylindrical shell, wherein two ends of this second chemical reaction liquid mozzle are communicated in this second chemical reaction liquid inlet and the outlet of this second chemical reaction liquid respectively.
7. fluid temperature (F.T.) as claimed in claim 6 is adjusted equipment, wherein this first chemical reaction liquid mozzle and this second chemical reaction liquid mozzle are a helical form pipeline, and this first chemical reaction liquid mozzle and this second chemical reaction liquid mozzle are crisscross arranged.
8. fluid temperature (F.T.) as claimed in claim 1 is adjusted equipment, more includes certain hyte part, is arranged at the outer wall of this cylindrical shell, and wherein this positioning component is made of two corresponding locating rings, is incorporated on this cylindrical shell lateral wall.
9. fluid temperature (F.T.) as claimed in claim 1 is adjusted equipment, and wherein this chiller comprises a cold feed group, uses the cold water that cooling usefulness is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101233210A CN101329992B (en) | 2007-06-20 | 2007-06-20 | Fluid temperature regulating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101233210A CN101329992B (en) | 2007-06-20 | 2007-06-20 | Fluid temperature regulating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101329992A CN101329992A (en) | 2008-12-24 |
| CN101329992B true CN101329992B (en) | 2010-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101233210A Expired - Fee Related CN101329992B (en) | 2007-06-20 | 2007-06-20 | Fluid temperature regulating equipment |
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| Country | Link |
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| CN (1) | CN101329992B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106975636A (en) * | 2017-05-02 | 2017-07-25 | 惠科股份有限公司 | Substrate etch cleaning machine, basal plate cleaning system and substrate-cleaning method |
| CN111453998B (en) * | 2020-05-25 | 2022-07-12 | 福建和达玻璃技术有限公司 | High-efficiency glass casing metal texture surface treatment equipment and method |
| CN114752017B (en) * | 2022-04-22 | 2023-07-18 | 北京理工大学 | Rigidity-variable composite material, rigidity-variable system and grabbing equipment |
| CN115415245A (en) * | 2022-09-06 | 2022-12-02 | 赫曼半导体技术(深圳)有限公司 | Ultrasonic substrate cleaning and cooling device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6310323B1 (en) * | 2000-03-24 | 2001-10-30 | Micro C Technologies, Inc. | Water cooled support for lamps and rapid thermal processing chamber |
| CN1470344A (en) * | 2003-07-07 | 2004-01-28 | 北京科技大学 | High-smelting-point semi-solid metal sizing-material continuous preparation process and apparatus |
-
2007
- 2007-06-20 CN CN2007101233210A patent/CN101329992B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6310323B1 (en) * | 2000-03-24 | 2001-10-30 | Micro C Technologies, Inc. | Water cooled support for lamps and rapid thermal processing chamber |
| CN1470344A (en) * | 2003-07-07 | 2004-01-28 | 北京科技大学 | High-smelting-point semi-solid metal sizing-material continuous preparation process and apparatus |
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| Publication number | Publication date |
|---|---|
| CN101329992A (en) | 2008-12-24 |
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