CN101329055B - Heat radiator - Google Patents

Heat radiator Download PDF

Info

Publication number
CN101329055B
CN101329055B CN2007100751994A CN200710075199A CN101329055B CN 101329055 B CN101329055 B CN 101329055B CN 2007100751994 A CN2007100751994 A CN 2007100751994A CN 200710075199 A CN200710075199 A CN 200710075199A CN 101329055 B CN101329055 B CN 101329055B
Authority
CN
China
Prior art keywords
radiator
radiating fin
heat
heat carrier
thermal arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007100751994A
Other languages
Chinese (zh)
Other versions
CN101329055A (en
Inventor
张文祥
余光
郑世崧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QUANYIDA TECHNOLOGY (FOSHAN) Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN2007100751994A priority Critical patent/CN101329055B/en
Publication of CN101329055A publication Critical patent/CN101329055A/en
Application granted granted Critical
Publication of CN101329055B publication Critical patent/CN101329055B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A radiator used for carrying out heat dissipation of LED modules comprises a heat conductor and a plurality of spaced heat conductive arms protruding from the outer wall of the heat conductor to outside. Each heat conductive arm is provided with a group of radiating fins, and a plane to which the LED modules are adhered is formed on the most lateral radiating fins among each group of radiating fins. The most lateral radiating fins among each group of radiating fins are directly thermally contacted with the LED modules. Therefore, the radiator can simultaneously carry out heat dissipation for a plurality of LED modules on different planes.

Description

Radiator
Technical field
The present invention relates to a kind of radiator, particularly a kind of radiator that light emitting diode is dispelled the heat.
Background technology
Along with the develop rapidly of electronic industry, the electronic component speed of service constantly promotes, and produces a large amount of heats during operation, and itself and system temperature are raise, and influences the stability of its system then.For guaranteeing that electronic component can normally move, a radiator is installed usually, thereon to discharge the heat that it is produced.
The traditional solution of electronic element radiating problem is normally installed a radiator on each heat-generating electronic elements, this radiator comprises the base plate that closely contacts with electronic component, is located at the some radiating fins on the base plate.But, not on same plate face, so then can't use common radiator it is dispelled the heat for some special heat-generating electronic elements and radiator.
For example, in the less led lamp of some volumes, need come with the radiator that a volume is limited very for a short time relatively simultaneously some light emitting diode module to be dispelled the heat, this be that common radiator can't be accomplished.
Summary of the invention
In view of this, be necessary to provide a kind of radiator that can be simultaneously at grade a plurality of light emitting diode module be not dispelled the heat.
A kind of radiator, being used for light emitting diode module dispels the heat, it comprises that a heat carrier reaches the Thermal Arm from the outward extending some intervals of heat carrier outer wall, be formed with one group of radiating fin on described each Thermal Arm, be formed with a plane that supplies described light emitting diode module to be sticked in described every group of radiating fin on the outermost radiating fin.
Outermost radiating fin directly contacts with luminous thermal diode module in the above-mentioned radiator, and radiator of the present invention thus just can dispel the heat to a plurality of light emitting diode module on Different Plane simultaneously.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the stereogram of radiator of the present invention.
Fig. 2 is the vertical view of radiator among Fig. 1.
The specific embodiment
Shown in Fig. 1-2, radiator of the present invention is used for light emitting diode module (figure does not show) is dispelled the heat, and it is integrally formed by heat conductivility good material such as metal materials such as aluminium, copper.
This radiator center has a heat carrier, this heat carrier is a heat conduction cylindrical shell 10 cylindraceous in the present embodiment, these heat conduction cylindrical shell 10 inwalls fin 12 in some bar shapeds that extended internally, fins 12 are about these heat conduction cylindrical shell 10 central axis branch symmetrically in these, and they are along the radially extension of this heat conduction cylindrical shell 10, the thickness of fin 12 begins inwardly to diminish gradually from cylinder inboard wall in being somebody's turn to do, and the drift angle tip is passivated shape so its cross section roughly is acute triangle.It radially is extended with some Thermal Arms 14 to this heat conduction cylindrical shell 10 to the outer, these Thermal Arms 14 all distribute symmetrically about these cylindrical shell 10 central axis, and its concrete quantity is six Thermal Arms 14 by the quantity decision of electronic component in the concrete application in the present embodiment.The extended line of these Thermal Arms 14 will intersect at the central axis of this cylindrical shell 10, this Thermal Arm 14 vertically is extended with the some to radiating fin 140 of parallel interval to both sides, each also is distributed in this Thermal Arm 14 both sides to radiating fin 140 symmetrically perpendicular to this Thermal Arm 14, and the length of these radiating fins 140 is increased progressively to the other end away from this cylindrical shell 10 by the end of this Thermal Arm 14 near these cylindrical shells 10.Lean on outermost a pair of radiating fin 140 to be symmetrically distributed in the end of this heat carrier 14, this outer surface to radiating fin 140 forms a smooth surfaces.
In use, each of above-mentioned radiator all contacts with the light emitting diode module of arranging at grade outermost radiating fin 140, and this radiator just can dispel the heat to a plurality of electric component group or electronic component on Different Plane simultaneously like this.
This radiator bottom can directly contact with light emitting diode module or other electron component and to its heat radiation in other embodiments, also the heat carrier at radiator center can be designed to a solid cylinder or a column-type heat tube, the bottom surface of this heat carrier contacts with electronic component again.

Claims (9)

1. radiator, be used for light emitting diode module is dispelled the heat, it comprises that a heat carrier reaches the Thermal Arm from the outward extending some intervals of heat carrier outer wall, be formed with one group of radiating fin on described each Thermal Arm, and be formed with a plane that supplies described light emitting diode module to be sticked in described every group of radiating fin on the outermost radiating fin.
2. radiator as claimed in claim 1 is characterized in that: described heat carrier is a solid cylinder.
3. radiator as claimed in claim 1 is characterized in that: described heat carrier is a column-type heat tube.
4. radiator as claimed in claim 1 is characterized in that: described heat carrier is a cylindric hollow cylinder.
5. as each described radiator in the claim 1 to 4, it is characterized in that: be distributed in described Thermal Arm both sides to the radiating fin vertical symmetry on described each Thermal Arm, these radiating fins are parallel to each other.
6. radiator as claimed in claim 5 is characterized in that: the length of the radiating fin on described each Thermal Arm by this Thermal Arm near radiator one end to increasing progressively away from this heat carrier one end.
7. radiator as claimed in claim 4 is characterized in that: described cylinder inboard wall extended internally some in fins.
8. radiator as claimed in claim 7 is characterized in that: fin thickness inwardly diminishes gradually from cylinder inboard wall in described.
9. radiator as claimed in claim 1 is characterized in that: the vertical described Thermal Arm setting of described outermost radiating fin.
CN2007100751994A 2007-06-22 2007-06-22 Heat radiator Expired - Fee Related CN101329055B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007100751994A CN101329055B (en) 2007-06-22 2007-06-22 Heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2007100751994A CN101329055B (en) 2007-06-22 2007-06-22 Heat radiator

Publications (2)

Publication Number Publication Date
CN101329055A CN101329055A (en) 2008-12-24
CN101329055B true CN101329055B (en) 2011-05-11

Family

ID=40204987

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007100751994A Expired - Fee Related CN101329055B (en) 2007-06-22 2007-06-22 Heat radiator

Country Status (1)

Country Link
CN (1) CN101329055B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102588785A (en) * 2012-02-08 2012-07-18 深圳市骅圣照明科技有限公司 LED energy-saving lamp
CN105023891A (en) * 2015-06-11 2015-11-04 华中科技大学 An igbt radiator
CN108488644A (en) * 2018-03-28 2018-09-04 杭州和顺建设有限公司 A kind of high-efficient heat-dissipating LED lamp

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2644878Y (en) * 2003-08-14 2004-09-29 葛世潮 Light emitting diode
CN2713301Y (en) * 2004-07-01 2005-07-27 苏国棻 Spotlight radiator and spotlight
CN1834534A (en) * 2006-04-14 2006-09-20 东南大学 Integral array type large power LED lamp
CN201206807Y (en) * 2008-05-23 2009-03-11 富准精密工业(深圳)有限公司 Heat radiator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2644878Y (en) * 2003-08-14 2004-09-29 葛世潮 Light emitting diode
CN2713301Y (en) * 2004-07-01 2005-07-27 苏国棻 Spotlight radiator and spotlight
CN1834534A (en) * 2006-04-14 2006-09-20 东南大学 Integral array type large power LED lamp
CN201206807Y (en) * 2008-05-23 2009-03-11 富准精密工业(深圳)有限公司 Heat radiator

Also Published As

Publication number Publication date
CN101329055A (en) 2008-12-24

Similar Documents

Publication Publication Date Title
US7926982B2 (en) LED illumination device and light engine thereof
US20100309671A1 (en) Led lamp heat dissipating module
KR101765857B1 (en) Led lighting device
CN103732976A (en) Lighting device
US20090095448A1 (en) Heat dissipation device for led chips
CN108692200B (en) Light-emitting diode lamp with heat dissipation effect
US20090314471A1 (en) Heat pipe type heat sink and method of manufacturing the same
CN101329055B (en) Heat radiator
JP2014517447A5 (en)
US20140184050A1 (en) Lighting Apparatus
CN201206807Y (en) Heat radiator
CN106575641A (en) Design and methods to package and interconnect high intensity led devices
KR101022485B1 (en) Heat radiation structure of led illuminating device using heat pipe module
CN204213874U (en) A kind of active/passive radiator structure of LASER Light Source
EP2733737B1 (en) Heat dissipating device
KR101457601B1 (en) A heat-dissipating device for LED lighting apparatus
CN108369986B (en) LED lighting module
CN114923164A (en) LED lamp adopting aluminum-based flat heat pipe for heat transfer
CN204005868U (en) LED radiator
CN101146428B (en) Heat radiation module
KR101343045B1 (en) Heat-dissipating apparatus for LED module
CN209389065U (en) Heat radiator
CN109786541B (en) Heat dissipation device
CN201167448Y (en) Radiating device
KR101516615B1 (en) LED lamp manufacturing method comprising a radiation system using the PCB ground

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CHAMP TECH OPTICAL (FOSHAN) CORPORATION

Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD.

Effective date: 20130325

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 518109 FOSHAN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20130325

Address after: 518109 Guangdong province Foshan City Warburg West Industrial Zone Chancheng District Road No. 35

Patentee after: Quanyida Technology (Foshan) Co., Ltd.

Patentee after: Foxconn Precision Industry Co., Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd.

Patentee before: Foxconn Precision Industry Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110511

Termination date: 20140622

EXPY Termination of patent right or utility model