CN101329055A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN101329055A CN101329055A CNA2007100751994A CN200710075199A CN101329055A CN 101329055 A CN101329055 A CN 101329055A CN A2007100751994 A CNA2007100751994 A CN A2007100751994A CN 200710075199 A CN200710075199 A CN 200710075199A CN 101329055 A CN101329055 A CN 101329055A
- Authority
- CN
- China
- Prior art keywords
- radiator
- heat carrier
- radiating fin
- heat
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A radiator used for carrying out heat dissipation by LED modules comprises a heat conductor and a plurality of groups of radiating fins formed at the periphery of the heat conductor, wherein, the radiating fins surround the heat conductor, and the LED modules are respectively and closely arraned on the outermost radiating fins of each group of radiating fins. In the radiator, the outermost radiating fins which surround the heat conductor are directly contacted with the LED module; therefore, the radiator can carry out heat dissipation for a plurality of LED modules on different planes simultaneously.
Description
Technical field
The present invention relates to a kind of radiator, particularly a kind of radiator that light emitting diode is dispelled the heat.
Background technology
Along with the develop rapidly of electronic industry, the electronic component speed of service constantly promotes, and produces a large amount of heats during operation, and itself and system temperature are raise, and influences the stability of its system then.For guaranteeing that electronic component can normally move, a radiator is installed usually, thereon to discharge the heat that it is produced.
The traditional solution of electronic element radiating problem is normally installed a radiator on each heat-generating electronic elements, this radiator comprises the base plate that closely contacts with electronic component, is located at the some radiating fins on the base plate.But, not on same plate face, so then can't use common radiator it is dispelled the heat for some special heat-generating electronic elements and radiator.
For example, in the less led lamp of some volumes, need come with the radiator that a volume is limited very for a short time relatively simultaneously some light emitting diode module to be dispelled the heat, this be that common radiator can't be accomplished.
Summary of the invention
In view of this, be necessary to provide a kind of radiator that can be simultaneously at grade a plurality of light emitting diode module be not dispelled the heat.
A kind of radiator, being used for light emitting diode module dispels the heat, it comprises a heat carrier, is formed at some groups of radiating fins of this heat carrier periphery, described some groups of radiating fins are around described heat carrier, and described light emitting diode module is attached at respectively and respectively organizes in the radiating fin on the outermost radiating fin.
Be looped around the outermost radiating fin of described heat carrier in the above-mentioned radiator and directly contact with luminous thermal diode module, radiator of the present invention thus just can dispel the heat to a plurality of light emitting diode module on Different Plane simultaneously.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the stereogram of radiator of the present invention.
Fig. 2 is the vertical view of radiator among Fig. 1.
The specific embodiment
Shown in Fig. 1-2, radiator of the present invention is used for light emitting diode module (figure does not show) is dispelled the heat, and it is integrally formed by heat conductivility good material such as metal materials such as aluminium, copper.
This radiator center has a heat carrier, this heat carrier is a heat conduction cylindrical shell 10 cylindraceous in the present embodiment, these heat conduction cylindrical shell 10 inwalls fin 12 in some bar shapeds that extended internally, fins 12 are about these heat conduction cylindrical shell 10 central axis branch symmetrically in these, and they are along the radially extension of this heat conduction cylindrical shell 10, the thickness of fin 12 begins inwardly to diminish gradually from cylinder inboard wall in being somebody's turn to do, and the drift angle tip is passivated shape so its cross section roughly is acute triangle.It radially is extended with some Thermal Arms 14 to this heat conduction cylindrical shell 10 to the outer, these Thermal Arms 14 all distribute symmetrically about these cylindrical shell 10 central axis, and its concrete quantity is six Thermal Arms 14 by the quantity decision of electronic component in the concrete application in the present embodiment.The extended line of these Thermal Arms 14 will intersect at the central axis of this cylindrical shell 14, this Thermal Arm 14 vertically is extended with the some to radiating fin 140 of parallel interval to both sides, each also is distributed in this Thermal Arm 14 both sides to radiating fin 140 symmetrically perpendicular to this Thermal Arm 14, and the length of these radiating fins 140 is increased progressively to the other end away from this cylindrical shell 10 by the end of this Thermal Arm 14 near these cylindrical shells 10.Lean on outermost a pair of radiating fin 140 to be symmetrically distributed in the end of this heat carrier 14, this outer surface to radiating fin 140 forms a smooth surfaces.
In use, each of above-mentioned radiator all contacts with the light emitting diode module of arranging at grade outermost radiating fin 140, and this radiator just can dispel the heat to a plurality of electric component group or electronic component on Different Plane simultaneously like this.
This radiator bottom can directly contact with light emitting diode module or other electron component and to its heat radiation in other embodiments, also the heat carrier at radiator center can be designed to a solid cylinder or a column-type heat tube, the bottom surface of this heat carrier contacts with electronic component again.
Claims (10)
1. radiator, being used for light emitting diode module dispels the heat, it comprises a heat carrier, is formed at some groups of radiating fins of this heat carrier periphery, it is characterized in that: described some groups of radiating fins are around described heat carrier, and described light emitting diode module is attached at respectively and respectively organizes in the radiating fin on the outermost radiating fin.
2. radiator as claimed in claim 1 is characterized in that: described heat carrier is a solid cylinder.
3. radiator as claimed in claim 1 is characterized in that: described heat carrier is a column-type heat tube.
4. radiator as claimed in claim 1 is characterized in that: described heat carrier is a cylindric hollow cylinder.
5. as each described radiator in the claim 1 to 4, it is characterized in that: described cylinder body outer wall extends the Thermal Arm that is provided with some intervals, and the described radiating fin of respectively organizing is formed on these Thermal Arms.
6. radiator as claimed in claim 5 is characterized in that: be distributed in described Thermal Arm both sides to the radiating fin vertical symmetry on described each Thermal Arm, these radiating fins are parallel to each other.
7. radiator as claimed in claim 6 is characterized in that: the length of the radiating fin on described each Thermal Arm by this Thermal Arm near radiator one end to increasing progressively away from this heat carrier one end.
8. radiator as claimed in claim 4 is characterized in that: described cylinder inboard wall extended internally some in fins.
9. radiator as claimed in claim 8 is characterized in that: fin thickness inwardly diminishes gradually from cylinder inboard wall in described.
10. radiator as claimed in claim 1 is characterized in that: described outermost radiating fin forms a plane that is sticked for described light emitting diode module, the setting of being separated by of described outermost radiating fin and described heat carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100751994A CN101329055B (en) | 2007-06-22 | 2007-06-22 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100751994A CN101329055B (en) | 2007-06-22 | 2007-06-22 | Heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101329055A true CN101329055A (en) | 2008-12-24 |
| CN101329055B CN101329055B (en) | 2011-05-11 |
Family
ID=40204987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100751994A Expired - Fee Related CN101329055B (en) | 2007-06-22 | 2007-06-22 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101329055B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588785A (en) * | 2012-02-08 | 2012-07-18 | 深圳市骅圣照明科技有限公司 | LED energy-saving lamp |
| CN105023891A (en) * | 2015-06-11 | 2015-11-04 | 华中科技大学 | An igbt radiator |
| CN108488644A (en) * | 2018-03-28 | 2018-09-04 | 杭州和顺建设有限公司 | A kind of high-efficient heat-dissipating LED lamp |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2644878Y (en) * | 2003-08-14 | 2004-09-29 | 葛世潮 | Light emitting diode |
| CN2713301Y (en) * | 2004-07-01 | 2005-07-27 | 苏国棻 | Spotlight radiator and spotlight |
| CN1834534A (en) * | 2006-04-14 | 2006-09-20 | 东南大学 | Integral array type large power LED lamp |
| CN201206807Y (en) * | 2008-05-23 | 2009-03-11 | 富准精密工业(深圳)有限公司 | Heat radiator |
-
2007
- 2007-06-22 CN CN2007100751994A patent/CN101329055B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588785A (en) * | 2012-02-08 | 2012-07-18 | 深圳市骅圣照明科技有限公司 | LED energy-saving lamp |
| CN105023891A (en) * | 2015-06-11 | 2015-11-04 | 华中科技大学 | An igbt radiator |
| CN108488644A (en) * | 2018-03-28 | 2018-09-04 | 杭州和顺建设有限公司 | A kind of high-efficient heat-dissipating LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101329055B (en) | 2011-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103732976A (en) | Lighting device | |
| CN108692200B (en) | Light-emitting diode lamp with heat dissipation effect | |
| US20080007955A1 (en) | Multiple-Set Heat-Dissipating Structure For LED Lamp | |
| KR101765857B1 (en) | Led lighting device | |
| US20090095448A1 (en) | Heat dissipation device for led chips | |
| US20090314471A1 (en) | Heat pipe type heat sink and method of manufacturing the same | |
| CN201206807Y (en) | Heat radiator | |
| CN101329055B (en) | Heat radiator | |
| JP2014517447A5 (en) | ||
| Mraz et al. | Case study of liquid cooling of automotive headlights with hollow fiber heat exchanger | |
| US20140184050A1 (en) | Lighting Apparatus | |
| CN106594690B (en) | Lamps and lanterns and its cooling mechanism | |
| CN109564909A (en) | Folded metal sheet heat radiator | |
| CN100471374C (en) | Heat pipe radiator | |
| CN105066078A (en) | LED lamp radiator | |
| KR101022485B1 (en) | Heat radiation structure of led illuminating device using heat pipe module | |
| CN104344379A (en) | Radiator and lighting device comprising radiator | |
| US20170051908A1 (en) | Heat dissipation structure for led and led lighting lamp including the same | |
| CN103458648A (en) | Heat-dissipating device, electronic device and lighting device both comprising heat-dissipating device | |
| CN114923164A (en) | LED lamp adopting aluminum-based flat heat pipe for heat transfer | |
| CN204005868U (en) | LED radiator | |
| CN204213874U (en) | A kind of active/passive radiator structure of LASER Light Source | |
| EP2733737B1 (en) | Heat dissipating device | |
| KR101343045B1 (en) | Heat-dissipating apparatus for LED module | |
| CN102444876A (en) | Turbulence radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHAMP TECH OPTICAL (FOSHAN) CORPORATION Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20130325 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 518109 FOSHAN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130325 Address after: 518109 Guangdong province Foshan City Warburg West Industrial Zone Chancheng District Road No. 35 Patentee after: Quanyida Technology (Foshan) Co., Ltd. Patentee after: Foxconn Precision Industry Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. Patentee before: Foxconn Precision Industry Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20140622 |
|
| EXPY | Termination of patent right or utility model |