CN101326597A - Inductance component - Google Patents
Inductance component Download PDFInfo
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- CN101326597A CN101326597A CNA2007800005291A CN200780000529A CN101326597A CN 101326597 A CN101326597 A CN 101326597A CN A2007800005291 A CNA2007800005291 A CN A2007800005291A CN 200780000529 A CN200780000529 A CN 200780000529A CN 101326597 A CN101326597 A CN 101326597A
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- 239000011159 matrix material Substances 0.000 claims description 81
- 230000002093 peripheral effect Effects 0.000 claims description 34
- 238000009413 insulation Methods 0.000 claims description 10
- 239000000696 magnetic material Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 10
- 230000008602 contraction Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 49
- 239000000843 powder Substances 0.000 description 20
- 210000002683 foot Anatomy 0.000 description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005755 formation reaction Methods 0.000 description 9
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- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229910001021 Ferroalloy Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 210000003491 skin Anatomy 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 5
- 229910000640 Fe alloy Inorganic materials 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910017061 Fe Co Inorganic materials 0.000 description 2
- 229910002546 FeCo Inorganic materials 0.000 description 2
- 229910002555 FeNi Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910017318 Mo—Ni Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000003287 bathing Methods 0.000 description 2
- -1 organic siliconresin Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019819 Cr—Si Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 229910017706 MgZn Inorganic materials 0.000 description 1
- 229910003962 NiZn Inorganic materials 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
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- 230000005389 magnetism Effects 0.000 description 1
- WQLQSBNFVQMAKD-UHFFFAOYSA-N methane;silicon Chemical class C.[Si] WQLQSBNFVQMAKD-UHFFFAOYSA-N 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
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- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Coils Or Transformers For Communication (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
Provided is an inductance component having high reliability without having stress locally applied, even under a condition where heat is applied to the entire component, such as in solder mounting. The inductance component is provided with a base body (5), a coil (6) formed in the base body (5) and terminals (7, 8) electrically connected to the coil (6). Magnetic layers (9A, 9B) arranged substantially parallel to the winding flat surface of the coil (6) are formed in the base material (5), and the entire magnetic layers (9A, 9B) are covered with a material having a uniform heat expansion/contraction rate.
Description
Technical field
The present invention relates to for example to be used for the sensing device of the power circuit of mobile phone.
Background technology
Existing this sensing device constitutes as chip coil (chip coil), as shown in figure 23, is formed with coil 2 in the tabular matrix (plain body) 1, is electrically connected with terminal 3 on this coil 2, is formed with magnetic layer 4 at upper surface, the lower surface of matrix 1.
And, insulating properties lining 20 is set so that cover this magnetic layer 4 and whole substrate 1, prevent thus and being electrically connected of other part.
In addition, the prior art documentation ﹠ info as about this application for example has, disclosed patent documentation 1.
But the problem of so existing sensing device is its poor reliability.
That is, in the above-mentioned existing formation, because the thermal expansion rate of matrix 1 and insulator 5 is different, the temperature during by welded and installed etc. can apply local stress, consequently reliability variation to magnetic layer 4.
Patent documentation 1: the spy opens the 2006-32587 communique
Summary of the invention
The present invention can improve its reliability in the sensing device with magnetic layer.
Sensing device of the present invention for this reason comprises matrix, is formed at coil in this matrix, is electrically connected on the terminal of this coil, and is formed with a plurality of magnetic layers that are configured to the coiling plane almost parallel of described coil in described matrix.
Sensing device of the present invention, owing to be that the magnetic layer is formed at formation in the matrix, therefore all magnetic layers are covered by the material of thermal expansion rate homogeneous, when welded and installed etc., even under the situation that part all is heated, can not produce local stress yet, thereby can realize higher reliability magnetic.
Other forms of the present invention in addition are, a plurality of magnetic layers are set and accompany the sensing device of the part of matrix between a plurality of magnetic layers.According to this invention, can increase the saturation flux amount, even and the coefficient of thermal expansion difference between the self-evident ground matrix, magnetic layer, between each magnetic layer the situation that the magnetic layer is peeled off from matrix can not take place yet, can realize higher reliability.
Another other forms of the present invention in addition are the sensing device that at least a portion of terminal is formed by magnetic.Thus, the occupied area that does not need to strengthen the area of sensing device itself or reduce coil just can improve magnetic susceptibility, and its result can improve influence value.
Another other forms of the present invention in addition are, forming groove on the magnetic layer and filled the sensing device of the part of matrix in this groove.Thus, though when welded and installed etc. under the situation that part all is heated, can not take place magnetic is produced local stress yet, can realize higher reliability.
Another other forms of the present invention in addition are, at the parallel a plurality of sensing device of expanding and be roughly the groove of V-shape from its zigzag part towards the peripheral direction of magnetic layer of magnetic layer.Can significantly be suppressed at the generation of the vortex flow of magnetic layer peripheral part thus.
Another other forms of the present invention in addition are, at least in the inside portion of magnetic layer, parallel a plurality of from its zigzag part towards the peripheral direction expansion of magnetic layer and be roughly the groove of V-shape, be formed with the sensing device of the radial groove that extends towards peripheral direction from the center position of this magnetic layer in the outside portion of magnetic layer.According to this invention, can make the interval homogeneous of the groove of the maximum magnetic layer inside portions of the inflow of magnetic flux, can significantly suppress the generation of vortex flow.
Another other forms of the present invention in addition are, on the matrix of the interior Zhou Fangxiang of coil, perforated portion is set, pin magnetic layer in the inside of this perforated portion is provided with, and sensing device with the insulation wall of the coiling plane approximate vertical of coil is set on middle pin magnetic layer.Thus, the magnetic susceptibility of pin magnetic layer itself in need not reducing just can reduce the generation of vortex flow, thereby can improve influence value.
Description of drawings
Fig. 1 is the profile of the sensing device of embodiment of the present invention 1.
Fig. 2 is the vertical view of the sensing device of embodiment of the present invention 1.
Fig. 3 is the exploded perspective view of the sensing device of embodiment of the present invention 1.
Fig. 4 be embodiment of the present invention 1 increase the profile of example of magnetic layer.
Fig. 5 is the profile of the sensing device of embodiment of the present invention 2.
Fig. 6 is the vertical view of the sensing device of embodiment of the present invention 2.
Fig. 7 is the profile of the sensing device of embodiment of the present invention 3.
Fig. 8 is the profile of the sensing device of embodiment of the present invention 4.
Fig. 9 is the exploded perspective view of the sensing device of embodiment of the present invention 4.
Figure 10 is the plane graph of the shape of the groove that forms on the magnetic layer of expression embodiment of the present invention 5.
Figure 11 is the plane graph of other shapes of the groove that forms on the magnetic layer of expression embodiment of the present invention 5.
Figure 12 is the plane graph of another shape of the groove that forms on the magnetic layer of expression embodiment of the present invention 5.
Figure 13 is the plane graph of the shape of the groove that forms on the magnetic layer of expression embodiment of the present invention 6.
Figure 14 is the profile of the sensing device of embodiment of the present invention 7.
Figure 15 is the vertical view of other sensing devices of embodiment of the present invention 7.
Figure 16 is the vertical view of another sensing device of embodiment of the present invention 7.
Figure 17 is the vertical view of another sensing device of embodiment of the present invention 7.
Figure 18 is the vertical view of another sensing device of embodiment of the present invention 7.
Figure 19 is the vertical view of another sensing device of embodiment of the present invention 7.
Figure 20 is the vertical view of another sensing device of embodiment of the present invention 7.
Figure 21 is the vertical view of another sensing device of embodiment of the present invention 7.
Figure 22 is the vertical view of another sensing device of embodiment of the present invention 7.
Figure 23 is the profile of existing sensing device.
Description of reference numerals
1,5,26 matrixes
2,6,6A, 6B, 27,27A, 27B coil
3,7,8,28,29 terminals
4,9,9A, 9B, 9C, 9D, 30A, 30B, 30C, 30D magnetic layer
6AA, 6BB coil lead division
6D, 27C coil connection through hole
Foot in 10,31
11 outer foots
12,12A, 12B groove
The inside portion of 13A magnetic layer
The outside portion of 13B magnetic layer
14 perforated portions
15,15A, 15B, 15C insulation wall
16,16A, pin magnetic layer among the 16B
17 magnetic flux
18 insulation divisions
The lining of 20 insulating properties
Embodiment
(execution mode 1)
Below, referring to profile Fig. 1, vertical view Fig. 2 of identical sensing device of the sensing device of embodiments of the present invention 1, exploded perspective view Fig. 3 of identical sensing device, the sensing device of embodiments of the present invention 1 is described.
Among Fig. 1, in tabular matrix 5, form coil 6, be formed with terminal 7,8 as shown in Figure 2 in the outside of this coil 6.And, as shown in Figure 1, constitute in the matrix 5 between planar coil 6A, the 6B of coil 6 and be formed with through hole 6D, and be formed with in the matrix 5 of the top of coil 6 in the matrix 5 of below of magnetic layer 9A, coil 6 and be formed with magnetic layer 9B.
At this, magnetic layer 9A, 9B are configured to the coiling plane almost parallel with respect to coil 6.Be magnetic layer 9A, 9B for the high magnetic susceptibility of configuration on the passage of the magnetic flux that takes place by coil 6.
At this, coil 6 is made of also passable one deck, but is to constitute with two- layer planar coil 6A, 6B in the present embodiment.The planar coil 6A on upper strata reels with swirl shape towards interior Zhou Fangxiang from terminal 7, the interior perimembranous of this planar coil 6A is connected by through hole 6D with the interior perimembranous of the planar coil 6B of lower floor, this planar coil 6B is reeled with swirl shape towards the direction (peripheral direction) of terminal 8, thereby constitute coil 6.
At this, preferably planar coil 6A, 6B reel with equidirectional mutually.This is because the magnetic flux that magnetic flux that the planar coil 6A that do not need to cancel out each other is taken place and planar coil 6B are taken place just can be realized bigger influence value.
At this,, make the thickness of each magnetic layer 9A, 9B be 2 times thickness less than skin depth (skin depth) (epidermis effect thickness) in order to suppress the generation of vortex flow.
In addition, in order to improve influence value,, thereby make the magnetic coupling between upper magnetic body layer 9A and the bottom magnetic layer 9B more tight in the outer foot (outer core) 11 that the arranged outside of coil 6 is made of magnetic.
Like this, by magnetic layer 9A, 9B being respectively formed at the structure in the matrix 5, promptly, the structure that is all covered of each magnetic layer 9A, 9B by the matrix 5 of thermal expansion rate homogeneous, when welded and installed etc., even under the situation that part all is heated, can not produce local stress to magnetic layer 9A, 9B, can obtain higher reliability.
And, by magnetic layer 9A, 9B are set, can realize the sensing device that influence value is higher.
In addition, be in the present embodiment, above the coil 6, below dispose the structure of 1 piece of magnetic layer 9A, 9B respectively, but the structure by more multi-layered number can improve saturation flux density, and can obtain higher influence value.And, can change the number of plies of the magnetic layer of the above and below that is formed on coil 6.But, if above coil 6, below in a side have when being difficult for flowing through the part of magnetic flux, therefore influence value can descend, preferably following configuration: under the situation of the magnetic layer that uses same thickness, make the number of plies of above and below of coil 6 identical; Under the situation of the magnetic layer that uses different-thickness, make the above and below that is aggregated in coil 6 of its thickness identical.
In addition, the section of coil 6 can not be square, but circular, but can obtain bigger coil basal area under square situation, therefore can lower copper loss, and is therefore preferred.
In addition, the thickness by making planar coil 6A, 6B can corresponding big electric current more than 10 μ m, and is therefore preferred.
In addition, consider that preferably, magnetic layer 9A, 9B use the metallicl magnetic material by Fe or Fe alloy composition from magnetic density, magnetic loss.When using the Fe alloy on this magnetic layer 9A, 9B, preferably, the ratio of components of Fe is more than 30 quality %.This is because the amount by making the contained Fe of magnetic layer 9A, 9B has the high saturation magnetic flux metric density thus, and can realize that what is called has the raising of the magnetic characteristic of low coercive force more than 30 quality %.And, make the nickel amount when 80% left and right sides, become high magnetic susceptibility, can obtain big influence value.
And, consider from high flux density, low magnetic loss, as the Fe alloy that is used for magnetic layer 9A, 9B, preferably by the metallicl magnetic material that constitutes of forming that contains among FeNi, FeNiCo, the FeCo any one.
When making magnetic layer 9A, 9B, for example, can use galvanoplastic.
At this moment, employed plating contains Fe ion or other metal ions in bathing in electroplating engineering.
In addition, as the various additives that plating is bathed, preferably, put into stress relaxation agent (stress-relaxing agent), pit prevents agent (pit preventative), mistakeization agent (complexing agent).As this stress relaxation agent, can exemplify asccharin (benzoic sulfimide).Because asccharin is the material that contains sulfonate, thereby can bring into play its effect.By putting into such stress relaxation agent, thicker even magnetic layer 9A, 9B form, also can form and not take place to ftracture and magnetic layer 9A, 9B that homogeneity is outstanding.For example, when using asccharin as stress relaxation agent, just can see its effect by making plating contain 0.1～5g/L in bathing, but, therefore can control by the setting suitable condition because the amount of bringing into play the stress relaxation effect according to the plating condition of current density etc. can change.
And as the mistake agent, making it contain amino acid, unsaturated monocarboxylic acid, dicarboxylic acids, citric acid in order to stablize each metal ion species is main organic molecule or inorganic molecule, can form the wrong fount stable with metal ion thus.
Utilize such plating to bathe and form the ferroalloy film, but also can form the ferroalloy film of magnetic characteristic brilliance by the operation of in plating apparatus that has separated anode or magnetic field, carrying out plating etc. according to common electrolysis plating method.
In addition, the example that has increased the situation of magnetic layer is represented with profile in Fig. 4.The inscape identical with Fig. 1 used same mark, and omit its explanation.In Fig. 4, form a plurality of magnetic layer 9A, 9B in the matrix 5 above coil 6, form a plurality of magnetic layer 9C, 9D in the matrix 5 below coil 6.And, be between each magnetic layer 9A, 9B, 9C, 9D of a plurality of magnetic layers across the structure of the part of matrix 5.
A plurality of magnetic layer 9A, 9B, 9C, 9D are configured to the coiling plane almost parallel with respect to coil 6.This is magnetic layer 9A, 9B, 9C, 9D for the high magnetic susceptibility of configuration on the passage of magnetic flux.
In order to suppress the generation of vortex flow, the thickness of each magnetic layer 9A, 9B, 9C, 9D is respectively 2 times thickness less than skin depth.
Like this, owing to be that a plurality of magnetic layer 9A, 9B, 9C, 9D are respectively formed at structure in the matrix 5, promptly, the structure that is all covered of magnetic layer 9A, 9B, 9C, 9D by matrix 5, even therefore between each magnetic layer 9A, 9B, 9C, the 9D, or the thermal expansion rate difference between matrix 5 and magnetic layer 9A, 9B, 9C, the 9D, the situation that magnetic layer 9A, 9B, 9C, 9D are stripped from from matrix 5 can not take place yet, can obtain higher reliability.
And then, constitute by the material of the matrix 5 adjacent with thermal expansion rate homogeneous with each magnetic layer 9A, 9B, 9C, 9D, the difference of the thermal expansion rate between each magnetic layer 9A, 9B, 9C, 9D and the matrix 5 and the pressure that takes place thus, it is all to be applied to each magnetic layer 9A, 9B, 9C, 9D equably, thus the decline of the reliability that the local power that can prevent to apply between magnetic layer 9A, 9B, 9C, 9D and the matrix 5 causes.
And then, since be between each magnetic layer 9A, 9B, 9C, 9D across the structure of the part of matrix 5, can prevent the vortex flow in each magnetic layer 9A, 9B, 9C, the 9D.
And then owing to be provided with a plurality of layers magnetic layer 9A, 9B, 9C, 9D, the saturation flux amount increases with its number of plies with being directly proportional, realizes the good overlapping characteristic of DC, and can realize higher influence value.
In addition, in the present embodiment, above the coil 6, below dispose 2 pieces magnetic layer 9A, 9B, the structure of magnetic layer 9C, 9D respectively, but also can constitute with the more number of plies, can obtain higher magnetic flux saturated density, influence value thus.And, can make the number of plies difference of the magnetic layer of the above and below that is formed on coil 6, but because up, influence value can descend when a side of below had the part that is not easy to flow through magnetic flux, preferred thus configuration is: when using the magnetic layer of same thickness, make the number of plies of top, below of coil 6 identical; When using the magnetic layer of different-thickness, make the above and below that is aggregated in coil 6 of its thickness identical.
(execution mode 2)
Next, the sensing device to embodiments of the present invention 2 describes referring to drawing.Fig. 5 is the profile of the sensing device of embodiment of the present invention 2.
In Fig. 5, in tabular matrix 5, be formed with coil 6, be formed with terminal 7,8 in the outside of this coil 6, be formed with through hole 6D in the matrix 5 between the planar coil 6A, the 6B that constitute coil 6.And the part of terminal 7,8 is made of the formed magnetic terminal of magnetic 7A, 8A.
At this, consider from magnetic density, magnetic loss, as the material of magnetic terminal 7A, 8A, preferably use the metallicl magnetic material of forming that constitutes by iron or ferroalloy.When using ferroalloy on this magnetic terminal 7A, 8A, preferably, the ratio of components of iron is more than 30 quality %.Reason is, the amount by making the contained iron of magnetic terminal 7A, 8A can be realized high saturation magnetic flux metric density, and the magnetic characteristic of so-called low coercive force more than 30 quality %.And, make the nickel amount when 80% left and right sides, can reach high magnetic susceptibility, can obtain bigger influence value, thus preferred.
And, as the ferroalloy that is used for magnetic terminal 7A, 8A, consider from high flux density, low magnetic loss, preferably use and contain the metallicl magnetic material that the composition of any one constitutes among FeNi, FeNiCo, the FeCo.
When making this magnetic terminal 7A, 8A, for example can use galvanoplastic.
At this, coil 6 can be one deck, but the structure in present embodiment 2 is two-layer planar coil 6A, 6B.Upper strata planar coil 6A is reeled with swirl shape from the inside Zhou Fangxiang of terminal 7 beginnings, by through hole 6D the interior perimembranous of the planar coil 6B of the interior perimembranous of this planar coil 6A and lower floor is connected, this planar coil 6B is reeled with swirl shape and constitutes coil 6 towards the direction (peripheral direction) of terminal 8.
Like this,, thereby its magnetic susceptibility can be improved, consequently, influence value can be improved because at least a portion of terminal 7,8 is to be formed by magnetic terminal 7A, 8A.
And then, in the area that is seized of originally being used as terminal 7,8 magnetic terminal 7A, 8A are set, therefore do not need to strengthen the area of sensing device itself, or reduce the occupied area of coil 6.
In addition, by in the inboard of the coil 6 of matrix 5, form foot (center core) 10 in the magnetic that constitutes by magnetic, can obtain higher influence value thus.
Fig. 6 is the vertical view of the sensing device of embodiment of the present invention 2.As shown in Figure 6, by in the outside of the coil 6 of matrix 5 and then form foot (outer core) 11 outside the magnetic that constitutes by magnetic, can obtain higher influence value thus.Like this can the bigger electric current of correspondence, therefore preferred.
At this, foot 10 is made of the mixture of magnetic powder and resin at least in the magnetic.As the magnetic powder, can use the ferrite powder or with Fe, Ni or Co metallic magnetic gonosome powder as principal component.
In addition, foot 10 can utilize metallic magnetic gonosome or oxide magnetic compact etc. and constitutes in the magnetic, if but utilize the mixture of magnetic powder and resin and when constituting, owing to can improve the resistance value in the foot 10 in the magnetic, thereby can suppress the generation of vortex flow, therefore preferred.
Specifically, MnZn ferrite powder, NiZn ferrite powder, MgZn ferrite powder, hexagonal crystal ferrite powder, garnet sections hydrochlorate powder, the Fe powder, the Fe-Si series alloy powder, the Fe-Si-Al series alloy powder, the Fe-Ni series alloy powder, the Fe-Co series alloy powder, the Fe-Mo-Ni series alloy powder, the Fe-Cr-Si series alloy powder, the magnetic powder that Fe-Si-B series alloy powder etc. has soft magnetism just can use, but more preferably, particularly use the Fe-Ni series alloy powder, the Fe-Co series alloy powder, the high magnetic powder of saturation flux density of Fe-Mo-Ni series alloy powder etc.
The magnetic powder adopts under the situation of metallic magnetic gonosome powder, its particle footpath preferably 0.5 μ m above, below the 100 μ m, further preferably, 2 μ m are above, below the 30 μ m.Reason is that when particle diameter was excessive, the eddy current losses under the high-frequency can become greatly, and on the contrary, when particle diameter was too small, magnetic susceptibility can descend because the quantitative change of required resin is many.
As the resin that is used for magnetic foot 10, so long as have can using of adhibit quality, but the thermal endurance when Strong degree after pasting and use is considered, preferably, uses the thermosetting resin of epoxy resin, phenolic resins, organic siliconresin, polyimide resin etc.In addition, in order to improve dispersiveness, the resin property with the magnetic powder, can add the dispersant, plasticizer of trace etc.And then, in order to adjust the viscosity of presclerotic slurry, or, preferably add the 3rd composition in order to improve the insulating properties under the situation of using metallic magnetic gonosome powder.As the 3rd such composition, can enumerate silicon methane series coupling material or titanium is coupling material, titanium alkoxide, water, glass, boron nitride, talcum, mica, barium sulfate, tetrafluoroethene etc.
(execution mode 3)
Below, describe referring to the sensing device of accompanying drawing embodiment of the present invention 3.Fig. 7 is the profile of the sensing device of embodiment of the present invention 3.
Among Fig. 7, in tabular matrix 26, form coil 27, on the outermost perimembranous of this coil 27, form terminal 28,29, be formed with through hole 27C in the matrix 26 that between the planar coil 27A, the 27B that constitute coil 27, forms.
And the above and below of the coil 27 in the matrix 26 is formed with magnetic layer 30A, 30B, 30C, 30D respectively.
And the part of terminal 28,29 is formed by magnetic terminal 28A, the 29A that magnetic constituted.
And then, in the present embodiment, upper surface, lower surface that the magnetic terminal 28A of this terminal 28,29,29A also are formed on matrix 26.
And the inboard of the coil 27 of matrix 26 is formed with foot 31 in the magnetic that is made of magnetic.
Like this, because at least a portion of terminal 28,29 is made of magnetic terminal 28A, 29A, therefore can improve its magnetic susceptibility, its result can improve influence value.
And, by with magnetic terminal 28A, 29A, and magnetic layer 30A, 30B, 30C, 30D be disposed at top, the below of coil 27, thereby the magnetic flux that foot 31 emits in the magnetic incides the major part in the path till the foot 31 in the magnetic once again, can only constitute, therefore can obtain the further raising of influence value by high magnetic permeable material.
And then, in the area that is seized of originally being used as terminal 28,29 magnetic layer 28A, 29A are set, the occupied area that does not need to increase the area of sensing device itself thus or reduce coil 27.
And then the outside by the coil in matrix 26 27 forms foot (not shown) outside the magnetic that is made of magnetic, can obtain higher influence value thus.
(execution mode 4)
Expression is according to the profile of the sensing device of embodiment of the present invention 4 among Fig. 8.The exploded perspective view of the identical sensing device of expression in Fig. 9.To with Fig. 1 and Fig. 2 just as inscape with identical symbolic representation, and detailed.
As shown in Figure 9, be formed with groove 12A, 12B on magnetic layer 9A, the 9B, in this groove 12A, 12B, fill the part of matrix 5 shown in Figure 8.
At this, preferably, magnetic layer 9A, 9B are with respect to almost parallel ground, the coiling plane configuration of coil 6.This is magnetic layer 9A, 9B for the high magnetic susceptibility of configuration on the passage of the magnetic flux that is taken place by coil 6.
Like this, magnetic layer 9A, 9B are respectively formed in the matrix 6, and be the structure that groove 12A, the 12B that will be arranged at this magnetic layer 9A, 9B fills with the part of matrix 5, thereby the matrix 5 that can reach with thermal expansion rate homogeneous covers all formations of each magnetic layer 9A, 9B, when welded and installed etc., even under the situation that part all is heated, can not produce local stress to magnetic layer 9A, 9B, can obtain higher reliability.
And, by groove 12A, 12B are set, can suppress the generation of the vortex flow in magnetic layer 9A, the 9B.
As the shape of this groove 12A, 12B, can exemplify as shown in Figure 9 cross shape or, from central division with shape of radial extension etc.If make the shape of being shaped as from central division of groove 12A, 12B with radial extension, then maximum in the circulation of magnetic flux, it is the most incidental core of vortex flow, the ratio of the area occupied of groove 12A, the 12B of its magnetic layer 9A, 9B can become many, thereby it is can effectively prevent vortex flow, thereby preferred.
And then, groove 12A, 12B are set, and in this groove 12A, 12B, fill the part of matrix 5, can increase the contact area of magnetic layer 9A, 9B and matrix 5 thus, can improve their compactness.
And the structure by planar coil 6A, 6B are reeled respectively at grade can realize short sensing device.
In addition, in the present embodiment, above the coil 6, below dispose the magnetic layer 9A of one deck, the configuration of 9B respectively, but the structure by more multi-layered number can obtain higher influence value.
(execution mode 5)
Expression in present embodiment 5, the execution mode of sensing device with shape of the groove that can effectively suppress magnetic layer vortex flow.Figure 10～Figure 12 is the plane graph that the shape of the groove that is formed at the magnetic layer in present embodiment 5 has been described.Therefore profile and exploded perspective view omit owing to roughly the same with execution mode 1.
As shown in figure 10, on magnetic layer 9A, 9B, be formed with a plurality of parallel groove 12A that are roughly V-shape, from the zigzag part of described groove 12A towards the peripheral direction of magnetic layer 9A, 9B and expand.
The interval of the groove 12A that is roughly V-shape shown in Figure 10, its thickness prevent the vortex flow that takes place thus less than the twice of skin depth on the formation in-plane of magnetic layer 9A, 9B.
Like this, on magnetic layer 9A, 9B as shown in figure 10, parallel a plurality of groove 12A that is roughly V-shape that expands towards the peripheral direction of magnetic layer 9A, 9B from its zigzag part and forming, because such structure, interval homogeneous on magnetic layer 9A, 9B central portion and peripheral part of groove 12A can be made, near the generation of the vortex flow the magnetic layer 9A, 9B peripheral part can be significantly suppressed.
And then, make the groove 12A that is roughly V-shape, become the formation of expansion from its zigzag part towards peripheral direction, the existence of groove 12A shown in Figure 10 thus, to the magnetic flux that takes place from coil 6 central portions via magnetic layer 9A, 9B, the obstruction that is dissipated into peripheral direction from its zigzag part is less, can obtain higher influence value.
And then, by adopting structure shown in Figure 11, that is, be roughly parallel a plurality of structures that are roughly the groove 12A of V-shape on the groove 12B of cross shape, the vortex flow of its all middle body of body layer 9A that can further deperm thus.
And then, by adopting structure as shown in figure 12, promptly, a plurality of groove 12A that are roughly V-shape are walked abreast with the groove 12B that is roughly cross shape, and be provided with the structure of the groove 12C of the zigzag part that is used for cross-section these a plurality of groove 12A that are roughly V-shape, can further reduce the vortex flow of the central portion (zigzag part of V-shape) that is formed at the magnetic layer 9A between a plurality of groove 12A that are roughly V-shape thus.
In addition, preferably, the shape of the groove of magnetic layer 9A, 9B and dispose identical.This is because if the part that some magnetic flux is difficult to pass through, then the influence value of this part is restricted.
In addition, magnetic layer 9A, 9B are formed in the matrix 5, and the formation that is formed in its upper surface or lower surface also has not big harm, but by magnetic layer 9A, 9B are formed in the matrix 5, and will be arranged at the structure of filling the part of matrix 5 among groove 12A, the 12B of this magnetic layer 9A, 9B, can reach all structures that cover each magnetic layer 9A, 9B with the matrix 5 of thermal expansion rate homogeneous thus.Thus, though when welded and installed etc. under whole coil components is heated De Zhuan Condition, can not produce local stress yet, can obtain higher reliability to magnetic layer 9A, 9B.
And then, groove 12A, 12B are set, and this groove 12A, 12B are filled with the part of matrix 5, increase the contact area of magnetic layer 9A, 9B and matrix 5 thus, can improve the compactness between them.
In addition, in Figure 10～Figure 12, preferably the zigzag part of the groove 12A of a plurality of V-shapes is positioned at the position with respect to the central part of the coil 6 of magnetic layer 9A, 9B.Reason is, the magnetic flux that takes place at the central part by coil 6 is when the peripheral direction of magnetic layer 9A, 9B is dispersed, and its magnetic flux is owing to the obstruction that the existence of groove 12A is subjected to is minimum.
(execution mode 6)
In present embodiment 6, expression possesses the sensing device of the groove shape that the vortex flow that can further suppress the magnetic layer is effectively arranged.Figure 13 is the plane graph that the shape of the groove 12A, the 12B that are formed at magnetic layer 9 has been described.Profile is identical with Fig. 1 of explanation in the execution mode 1, therefore omits.
As shown in figure 13, the inside portion 13A of magnetic layer 9 is formed with a plurality of parallel groove 12A, and described groove 12A is towards the expansion of the peripheral direction of magnetic layer 9 and be roughly V-shape from its zigzag part 12AA.
At this, formed under the situation of the outer foot 11 that constitutes by magnetic material on the peripheral direction of the coil 6 in the matrix 5, preferably, will be roughly the direction of end foot 11 outside this of the groove 12A of V-shape, and be formed up to till the position of this outer foot 11.Reason is that the groove 12A that is roughly V-shape can not hinder the magnetic flux foot 11 outside the inside portion 13A flow direction of magnetic layer 9 that is taken place by coil 6 central parts.Consequently, can obtain higher influence value.
And 13B is formed with in the outside portion of magnetic layer 9, the radial groove 12B that extends towards peripheral direction from the center position of magnetic layer 9.
At this, the inside portion 13A of magnetic layer 9 is meant the zone that magnetic flux is concentrated especially, comprises the area inside in the interior week of coil 6 at least.The outside portion 13B of magnetic layer 9 is meant the outside of inside portion.
At this, preferably, the end of groove 12A of V-shape and the end of radial groove 12B will be roughly, the structure that is connected at the boundary member of inside portion 13A and outside portion 13B.By adopting following structure, that is, flow through magnetic flux former state ground between the groove 12A that is roughly V-shape and flow through structure between the radial groove 12B, can reduce the situation that flows and hindered by radial groove 12B of magnetic flux, consequently, can realize the raising of influence value.
In addition, the groove 12A that is roughly V-shape of a plurality of peripheral direction that extend to magnetic layer 9 from its zigzag part 12AA that on magnetic layer 9 is all, can walk abreast and forming, but among the magnetic layer outside portion 13B, therefore the flow of the corresponding magnetic flux of unit are is less, considers that the necessity of vortex flow compares less with inside portion 13A.Thereby, preferably on the 13B of this outside portion, form the radial groove 12B that extends towards peripheral direction from the center position of magnetic layer 9, replace this to be roughly the groove 12A of V-shape with this.Reason is, becomes thin at interval by the groove that makes magnetic layer 9 outside portion 13B, does not prevent flowing of magnetic flux, can realize the raising of influence value.
Like this, at least within it the sidepiece 13A of magnetic layer 9 is formed with as shown in figure 13, a plurality of parallel from its zigzag part 12AA towards the peripheral direction of magnetic layer 9 and the groove 12A that is roughly V-shape that expands, because such structure, can be so that the groove of the maximum magnetic layer 9 inside portion 13A of the inflow of magnetic flux homogeneous at interval, consequently, can significantly suppress the generation of vortex flow.
And then, making the groove 12A that is roughly V-shape is following structure, promptly, 12AA expands towards peripheral direction from its zigzag part, disperse towards peripheral direction from its zigzag part 12AA via magnetic layer 9 for magnetic flux as shown in figure 13 thus from the generation of coil 6 central portions, the obstruction that existence brought of groove 12A as shown in figure 13 is less, can obtain higher influence value.
In addition, form the generation of the vortex flow of in-planes in order to prevent magnetic layer 9, the interval of the groove 12A that is roughly V-shape shown in Figure 13 preferably, less than 2 times thickness of skin depth.
In addition, magnetic layer 9 is not formed in the matrix 5, and the structure that is formed in its upper surface or lower surface also is fine, but as shown in figure 13, magnetic layer 9 is formed in the matrix 5, and in the groove 12 that is arranged at this magnetic layer 9, fill the structure of the part of matrix 5, can realize that thus the matrix 5 with thermal expansion rate homogeneous covers all structures of each magnetic layer 9, and when welded and installed etc., even under whole coil components is heated De Zhuan Condition, can not produce local stress to magnetic layer 9, can obtain higher reliability.
And then by fill the structure of the part of matrix 5 in this groove 12, the contact area between magnetic layer 9 and the matrix 5 increases, and can improve the compactness between them.
In addition, among Figure 13, preferably, with a plurality of zigzag part 12AA that are roughly the groove 12A of V-shape, be formed on the pairing position of central part of coil 6 of magnetic layer 9.Its reason is, when the magnetic flux that takes place from the central part of coil 6 diffuses to the peripheral direction of magnetic layer 9, prevents that the existence of dispersing owing to the groove 12A that is roughly V-shape of this magnetic flux from being hindered.Consequently can obtain bigger influence value.
(execution mode 7)
In present embodiment 7, the execution mode (chip coil) to the sensing device with middle foot is improved referring to profile Figure 14 and vertical view Figure 15～Figure 22, describes.
Among Figure 14, substantial middle at tabular matrix 5 is provided with perforated portion 14, in the matrix 5 in the outside of this perforated portion 14, form coil 6, in the matrix 5 of the outermost perimembranous of this coil 6, form coil lead division 6AA, 6BB, form through hole 6D, pin magnetic layer 16 in the inside of perforated portion 14 forms in the matrix 5 between the planar coil 6A, the 6B that constitute coil 6.And coil lead division 6AA, 6BB are electrically connected with the terminal 7,8 of the lateral surface that is arranged at matrix 5 respectively.
And, in this, be provided with the insulation wall 15 of the coiling plane approximate vertical of a plurality of and coil 6 in the pin magnetic layer 16.As the configuration of this wall 15, for example shown in Figure 15, when observing, be configured in parallel to each other with the vertical direction on the coiling plane of coil 6.
By such structure, with the coiling plane approximate vertical of coil 6 (promptly, with respect to the generation plane of vortex flow also approximate vertical) insulation wall 15 can reduce the generation of vortex flow effectively, the magnetic susceptibility of pin magnetic layer 16 itself during the material that does not need to add the low magnetic susceptibility of oxide etc. reduces, therefore, as shown in figure 14, the influence that the circulation of the magnetic flux 17 by perforated portion 14 is hindered tails off, consequently, can realize the sensing device (chip coil) of higher influence value.
In addition, configuration as insulation wall 15, adopt structure as shown in figure 16, promptly, structure is as follows: pin magnetic layer 16 in the inner peripheral surface of perforated portion 14 forms only, form insulation division 18 in its inside, the insulation wall 15 of the coiling plane approximate vertical of a plurality of and coil 6 is set in middle pin magnetic layer 16.The magnetic susceptibility of pin magnetic layer 16 itself can not reduce the generation of vortex flow during such structure also can not reduce.
But as shown in figure 15, middle pin magnetic layer 16 not only is formed on the inner peripheral surface of perforated portion 14, and fills its inboard, and pin magnetic layer 16 effective cross sectional area consequently can improve saturation flux density in can increasing thus.
And then, as shown in figure 17, be configured to 15 one-tenth clathrates of wall when observing with the vertical direction in the coiling plane of coil 6, thus, for emitting or to incide the magnetic flux of perforated portion 14 inboards from peripheral direction, can reduce the vortex flow that takes place by this magnetic flux from perforated portion 14 inboards with radial.Promptly, in the formation of Figure 15, concerning from the direction incident (emitting) of vertical bank to the magnetic flux of a certain wall 15, in the perpendicular plane of its magnetic flux, adjacent wall 15 and the distance between other walls 15 can be elongated when incident obliquely (emitting), therefore vortex flow can take place easily.But, in the formation of Figure 17, owing to be the structure that wall 15 is set with clathrate, concerning from the direction incident (emitting) of vertical bank to the magnetic flux of a certain wall 15, the both sides of perpendicular two walls 15 of its wall 15 with magnetic flux are existed abreast, no matter from which angle incident, wall 15 that the plane vertical with its magnetic flux is adjacent and the fixed distance between other walls 15 can reduce the probability that vortex flow takes place thus.Consequently, can further reduce the generation of vortex flow.
And, by adopting structure as shown in figure 18, promptly, a plurality of walls 15 that are roughly V-shape are walked abreast with the magnetic layer 16A that is roughly cross shape, the structure of the magnetic layer 16B that is roughly V-shape is set between these a plurality of walls 15 that are roughly V-shape, compares with the structure of Figure 15 and can improve influence value.Promptly, when adopting structure as shown in figure 15, emitting (incident) from perforated portion 14 to the magnetic flux of matrix 5 upper surfaces (lower surface) direction, for with the magnetic flux of wall 15 parallel directions, the existence of wall 15 can not hinder it and flow, but concerning the magnetic flux of direction beyond it, wall 15 can hinder it and flow.With respect to this, by structure as shown in figure 18, wall 15 can not hinder to the mobile of magnetic flux all around emitting (incident), can improve influence value.
And then, by adopting structure as shown in figure 19, promptly, be roughly parallel a plurality of wall 15B that are roughly V-shape on the wall 15A of cross shape, between these a plurality of wall 15B that are roughly V-shape, and a plurality ofly be roughly the wall 15B of V-shape and be roughly between the wall 15A of cross shape, setting is roughly the structure of the magnetic layer 16 of V-shape, can reduce the vortex flow of the middle body that is roughly cross shape magnetic layer 16A as shown in figure 18.
And then, by adopting structure as shown in figure 20, promptly, a plurality of wall 15B that are roughly V-shape are walked abreast with the wall 15A that is roughly cross shape, between these a plurality of wall 15B that are roughly V-shape and a plurality ofly be roughly the wall 15B of V-shape and be roughly between the wall 15A of cross shape, setting is roughly the magnetic layer 16 of V-shape, and be provided for the wall 15C of the central part of cross-section a plurality of wall 15B that are roughly V-shape, thus, can reduce the vortex flow of magnetic layer 16 middle body that are roughly V-shape as shown in figure 19.
In addition, by adopting as Figure 21, structure shown in Figure 22, promptly, magnetic layer 16 not only is formed on the inner peripheral surface of perforated portion 14, and fills it when forming medially, and as Figure 15, structure shown in Figure 17 in the same manner, do not reduce the magnetic susceptibility of magnetic layer 16 itself, can realize further reducing the generation of vortex flow, and can increase the effective cross sectional area of magnetic layer 16, can improve saturation flux density.
But as shown in figure 22, if wall 15 is configured to disperse from central authorities when observing with the perpendicular direction in the coiling plane of coil 6, then at outer peripheral portion, the interval between wall 15 and other walls 15 can broaden, so vortex flow takes place this part easily.Thereby as Figure 15, Figure 17～shown in Figure 21, preferably the structure that is spaced apart almost fixed between wall 15 and other walls 15 can more effectively reduce the generation of vortex flow.For example, in the frequency range of 1～10M Hz, with its be arranged at interval 20 μ m when following its effect improve.
In addition, the formation of present embodiment as shown in figure 14, perforated portion 14 is built in the matrix 5, is filled with magnetic layer 16 in this perforated portion 14.But, if constitute perforated portion 14 as through hole, and from the upper surface of matrix 5, when lower surface forms magnetic layer 16 continuously, then can reduce magnetic leakage flux.
Industrial utilization
Sensing device of the present invention has the reliability height, and the high feature of influence value, is applicable to mobile electricity The various electrical equipments of words etc.
Claims (22)
1, a kind of sensing device,
Comprise: matrix;
Be formed on the coil in this matrix;
Be electrically connected on the terminal of this coil, and
In described matrix, be formed with the magnetic layer that is configured to the coiling plane almost parallel of described coil.
2, sensing device according to claim 1, wherein,
Described magnetic layer is formed with a plurality of, clips the part of described matrix between described a plurality of magnetic layers.
3, sensing device according to claim 2, wherein,
The thickness of described magnetic layer is less than the twice of skin depth.
4, sensing device according to claim 1, wherein,
At least a portion of described terminal is formed by magnetic.
5, sensing device according to claim 1, wherein,
Be formed with groove on the described magnetic layer, and in this groove, be filled with the part of described matrix.
6, sensing device according to claim 5, wherein,
Described groove is the groove that is roughly V-shape, is to be roughly a plurality of parallel groove of the zigzag part of V-shape towards the peripheral direction expansion of described magnetic layer from it.
7, sensing device according to claim 6, wherein,
The interval of described groove is less than the twice of skin depth.
8, sensing device according to claim 6, wherein,
On the position in described magnetic layer, be formed with the described zigzag part that is roughly the groove of V-shape with respect to hub of a spool portion.
9, sensing device according to claim 5, wherein,
Described groove comprises, be roughly the described groove and the described groove that is roughly V-shape of cross shape, the described groove that is roughly V-shape, be and the described parallel groove of groove that is roughly cross shape, and be to be roughly a plurality of parallel groove of the zigzag part of V-shape towards the peripheral direction expansion of described magnetic layer from it.
10, sensing device according to claim 9, wherein,
The interval of the described groove that is roughly V-shape is less than the twice of skin depth.
11, sensing device according to claim 5, wherein,
Described groove is formed in the groove that is roughly V-shape of the inside portion at least of described magnetic layer, and is to be roughly a plurality of parallel described groove of the zigzag part of V-shape towards the peripheral direction expansion of described magnetic layer from it.
12, sensing device according to claim 11, wherein,
Further be formed with the radial groove that extends towards peripheral direction from the center position of this magnetic layer in the outside portion of described magnetic layer.
13, sensing device according to claim 12, wherein,
One end of the described groove that is roughly V-shape and an end of described radial groove link together.
14, sensing device according to claim 11, wherein,
The outer foot that the arranged outside of the described coil in described matrix is made of magnetic material, and an end of described groove is formed up to till the position of described outer foot.
15, sensing device according to claim 1, wherein,
On the described matrix of the inboard of described coil, perforated portion is set, forms the magnetic layer, and insulation wall with the coiling plane approximate vertical of described coil is set at described magnetic layer in the inside of this perforated portion.
16, sensing device according to claim 16, wherein,
Comprise: matrix;
Be formed at the coil in this matrix;
Be electrically connected on the terminal of this coil;
Be arranged at described coil above or below the magnetic layer, and
Be formed with a plurality of grooves that are roughly V-shape at described magnetic layer, described groove is to expand towards the peripheral direction of described magnetic layer and parallel mutually groove from its zigzag part.
17, sensing device according to claim 16, wherein,
Further be formed with the groove that is roughly cross shape at described magnetic layer, and make the described V-shape groove that is roughly be parallel to the described groove that is roughly cross shape.
18, a kind of sensing device, wherein,
Comprise: matrix;
Be formed at the coil in this matrix;
Be electrically connected on the terminal of this coil;
Be arranged at described coil above or below at least one side's magnetic layer, and be formed with a plurality of grooves that are roughly V-shape in the inside portion at least of described magnetic layer, described groove is to expand towards the peripheral direction of described magnetic layer and parallel mutually groove from its zigzag part.
19, sensing device according to claim 17, wherein,
Further be formed with the radial groove that extends towards peripheral direction from the center position of this magnetic layer in the outside portion of described magnetic layer.
20, sensing device according to claim 19, wherein,
A described end that is roughly the groove of V-shape is connected in an end of described radial groove.
21, sensing device according to claim 18, wherein,
The outer foot that the arranged outside of the described coil in described matrix is made of magnetic material, and an end of described groove is formed up to till the position of described outer foot.
22, a kind of sensing device, wherein,
Comprise: matrix;
Be arranged on the perforated portion of the substantial middle portion of this matrix;
The coil that in the described matrix in the outside of this perforated portion, forms;
Be electrically connected on the terminal of this coil;
Be formed on the magnetic layer of the inside of described perforated portion, and the insulation wall on the coiling plane that is approximately perpendicular to described coil is set on this magnetic layer.
Applications Claiming Priority (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006082278A JP5082271B2 (en) | 2006-03-24 | 2006-03-24 | Chip coil and manufacturing method thereof |
| JP082278/2006 | 2006-03-24 | ||
| JP2006113152A JP5082282B2 (en) | 2006-04-17 | 2006-04-17 | Inductance component and manufacturing method thereof |
| JP113152/2006 | 2006-04-17 | ||
| JP113151/2006 | 2006-04-17 | ||
| JP2006113151A JP5286645B2 (en) | 2006-04-17 | 2006-04-17 | Inductance component and manufacturing method thereof |
| JP2006131329A JP2007305717A (en) | 2006-05-10 | 2006-05-10 | Inductance component, and its manufacturing process |
| JP131329/2006 | 2006-05-10 | ||
| JP133305/2006 | 2006-05-12 | ||
| JP2006133305A JP5082293B2 (en) | 2006-05-12 | 2006-05-12 | Inductance component and manufacturing method thereof |
| JP180661/2006 | 2006-06-30 | ||
| JP2006180663A JP2008010697A (en) | 2006-06-30 | 2006-06-30 | Inductance component |
| JP180663/2006 | 2006-06-30 | ||
| JP2006180661A JP2008010695A (en) | 2006-06-30 | 2006-06-30 | Inductance component |
| PCT/JP2007/055535 WO2007119426A1 (en) | 2006-03-24 | 2007-03-19 | Inductance component |
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| CN101326597A true CN101326597A (en) | 2008-12-17 |
| CN101326597B CN101326597B (en) | 2012-05-02 |
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| CN2007800005291A Expired - Fee Related CN101326597B (en) | 2006-03-24 | 2007-03-19 | Inductance component |
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| JP (1) | JP5082271B2 (en) |
| CN (1) | CN101326597B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170838A (en) * | 2014-04-25 | 2016-11-30 | 株式会社自动网络技术研究所 | chip and reactor |
| CN109427467A (en) * | 2017-08-23 | 2019-03-05 | 三星电机株式会社 | Inductor |
| US11735355B2 (en) | 2017-09-25 | 2023-08-22 | Nitto Denko Corporation | Inductor and producing method thereof |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5359842B2 (en) * | 2009-12-11 | 2013-12-04 | Ｔｄｋ株式会社 | Multilayer type common mode filter |
| KR101862409B1 (en) * | 2011-12-22 | 2018-07-05 | 삼성전기주식회사 | Chip inductor and method for manufacturing chip inductor |
| KR101681406B1 (en) * | 2015-04-01 | 2016-12-12 | 삼성전기주식회사 | Coil electronic component and manufacturing method thereof |
| US10269481B2 (en) | 2016-05-27 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked coil for wireless charging structure on InFO package |
| JP7081667B2 (en) * | 2018-07-25 | 2022-06-07 | 味の素株式会社 | Magnetic paste |
| KR102617535B1 (en) * | 2018-07-25 | 2023-12-27 | 아지노모토 가부시키가이샤 | Magnetic paste |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2986520B2 (en) * | 1990-07-31 | 1999-12-06 | ティーディーケイ株式会社 | Electronic component and method of manufacturing the same |
| JPH04101403A (en) * | 1990-08-21 | 1992-04-02 | Tdk Corp | Electronic component and its manufacturing method |
| JP2003158017A (en) * | 2001-11-21 | 2003-05-30 | Jhc Osaka:Kk | Transformer |
-
2006
- 2006-03-24 JP JP2006082278A patent/JP5082271B2/en not_active Expired - Fee Related
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170838A (en) * | 2014-04-25 | 2016-11-30 | 株式会社自动网络技术研究所 | chip and reactor |
| CN106170838B (en) * | 2014-04-25 | 2018-05-11 | 株式会社自动网络技术研究所 | chip and reactor |
| CN109427467A (en) * | 2017-08-23 | 2019-03-05 | 三星电机株式会社 | Inductor |
| US10818426B2 (en) | 2017-08-23 | 2020-10-27 | Samsung Electro-Mechanics Co., Ltd. | Inductor |
| CN109427467B (en) * | 2017-08-23 | 2021-09-10 | 三星电机株式会社 | Inductor |
| US11735355B2 (en) | 2017-09-25 | 2023-08-22 | Nitto Denko Corporation | Inductor and producing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007258521A (en) | 2007-10-04 |
| CN101326597B (en) | 2012-05-02 |
| JP5082271B2 (en) | 2012-11-28 |
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