CN101325386A - Pipe type heat-recovering semiconductor thermal difference generation method and apparatus - Google Patents

Pipe type heat-recovering semiconductor thermal difference generation method and apparatus Download PDF

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Publication number
CN101325386A
CN101325386A CNA2008100213661A CN200810021366A CN101325386A CN 101325386 A CN101325386 A CN 101325386A CN A2008100213661 A CNA2008100213661 A CN A2008100213661A CN 200810021366 A CN200810021366 A CN 200810021366A CN 101325386 A CN101325386 A CN 101325386A
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China
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generation module
heat
electric generation
semi
radiator
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CNA2008100213661A
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周正
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WUXI MINGHUITONG SCIENCE AND TECHNOLOGY Co Ltd
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WUXI MINGHUITONG SCIENCE AND TECHNOLOGY Co Ltd
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Abstract

Disclosed is a pipe type heat recovery semiconductor thermo-electric generation method of the invention and a device, wherein the gas heat source or the liquid heat source for emitting the residual heat passes through the channel of the hud type collector, and the collector adsorbs the heat to transfer to the hot face of the semiconductor thermo-electric generation module; a telescoping radiator is arranged on the cold face of the outside of the semiconductor thermo-electric generation module, which cools the cold face to the temperature lower than that of the hot face, thereby generating the temperature difference at the two end faces of the semiconductor thermo-electric generation module. Due to the Bessel effect in the semiconductor, the electric potential difference is generated, outputted through the voltage stabilization and inverting circuit, namely as the power supply. The structure of the device comprises a semiconductor thermo-electric generation module, a hud type collector, a telescoping radiator, which has the advantages of directly converting the recovery waste beat into the electric energy, to cause the electric power generation process free of noise, abrasion and dielectric leakage, and having small volume, light weight, convenient movement, no maintenance and long service life and the like.

Description

Pipe type heat-recovering semiconductor thermal difference generation method and device
Technical field
What the present invention relates to is pipe type heat-recovering semiconductor thermal difference generation method and device, is to be converted to core technology with thermoelectricity, is the new energy development applied technical field of target with the industrial afterheat recovery generating.
Background technology
China is power consumption big country, the industrial exhaust heat enormous amount, no matter be solid-state, gaseous state, that liquid state all has a large amount of industrial exhaust heats to have is to be recycled, thereby these waste heats in the enterprise production process recycled for energy efficiency very large society, economic benefit are arranged.Aspect the recovery of gaseous state and liquid waste heat, domestic most employing waste heat boiler and heat exchange of heat pipe, waste heat boiler from be designed into the processing and manufacturing cycle long, cost is higher, occupied ground is bigger, and will be through the secondary energy sources conversion, efficient is lower, is unsuitable for using the said equipment in some occasion in addition.
Summary of the invention
The present invention is to provide a kind of recovery, utilize the device of gaseous state cogeneration, be intended to gaseous state, the liquid product waste heat that produces in industrial enterprise's production process reclaimed and generate electricity, solve gaseous state, the UTILIZATION OF VESIDUAL HEAT IN of liquid product reclaims problem by discharge of pipes.
Technical solution of the present invention: pipe type heat-recovering semiconductor thermal difference generation method, the gaseous state, the liquid heat source that it is characterized in that dissipate excess heat pass through hub-type heat collector passage, lead to the absorption heat by the hub-type heat collector, and the heat transferred of collecting is arrived the hot side of semi-conductor thermo-electric generation module inboard; The bushing type radiator is arranged in the huyashi-chuuka (cold chinese-style noodles) in the semi-conductor thermo-electric generation module outside, radiator is cooled to a temperature lower than hot side with huyashi-chuuka (cold chinese-style noodles), make both ends of the surface produce a bigger temperature difference at semi-conductor thermo-electric generation module, semi-conductor thermo-electric generation module directly converts temperature difference to electrical potential difference by the Bezier effect, after voltage stabilizing circuit and AC-DC conversion, use as power supply; Semi-conductor thermo-electric generation module is the circumferential layout on perpendicular to the thermal source flow direction, form pipe-like, and radiator and heat collector are arranged in parallel along thermal source flow direction and semi-conductor thermo-electric generation module; Heat collector is made the wheel hub shape, is pipe-like in the middle of the spoke joint portion, this pipe interior filling heat insulator; Radiator is the bushing type of hollow, and the middle coolant that feeds is taken away the heat in the radiator.
Pipe type heat-recovering semiconductor thermal difference generation device, its structure are to comprise semi-conductor thermo-electric generation module, hub-type heat collector, bushing type radiator; Wherein semi-conductor thermo-electric generation module is clipped in the middle of duct type heat collector and the radiator, the hub-type heat collector is close to the hot side of semi-conductor thermo-electric generation module inboard, the bushing type radiator is close to the outer huyashi-chuuka (cold chinese-style noodles) of semi-conductor thermo-electric generation module, hub-type heat collector, bushing type radiator are bonding with semi-conductor thermo-electric generation module respectively with heat-conducting glue, and semi-conductor thermo-electric generation module closely is clipped in the middle of tunnel type heat collector and the radiator.
Advantage of the present invention: waste heat can be directly changed into electric energy, need not earlier thermal power transfer to be become mechanical energy, again mechanical energy be converted to the complex process of electric energy, thereby improved the reliability and the useful life of conversion efficiency of thermoelectric and generator by traditional mode; Compare with other forms of waste-heat recovery device, the present invention is a kind of all solid state power conversion mode, has in power generation process noiselessness, does not have wearing and tearing, no dielectric leakage, volume are little, in light weight, conveniently moving, long service life; Apparatus of the present invention are simple in structure, are convenient to processing, and utilize industrial afterheat power generation, can reduce enterprise energy consumption, meet national industrial policies, are easy to apply.
Description of drawings
Accompanying drawing 1 is a cross section structure schematic diagram of the present invention.
Accompanying drawing 2 is semiconductor thermoelectric effect principle figure.
Accompanying drawing 3 is temperature-difference power generation module schematic diagram of the function.
Among the figure 1 is semi-conductor thermo-electric generation module, the 2nd, hub-type heat collector, 3 bushing type radiators, and the 4th, hub-type heat collector passage, gaseous state or liquid heat source pass through in the middle of spoke; The 5th, the pipeline of hub-type heat collector spoke junction, filling heat insulator; The 6th, the radiator center-aisle, in order to the circulation coolant, the 7th, high temperature conductor, the 8th, cryoconductor, the 9th, electric conductor, the 10th, release heat (hot junction), the 11st absorbs heat (cold junction), the 12nd, P﹠amp; N type semiconductor, the 13rd, electrical insulator, the 14th, heat energy, the 15th, electron stream.
Embodiment
Contrast accompanying drawing 1, its structure comprises semi-conductor thermo-electric generation module 1, hub-type heat collector 2, bushing type radiator 3.It is middle with bushing type radiator 3 that wherein semi-conductor thermo-electric generation module 1 is clipped in hub-type heat collector 2, hub-type heat collector 2 is close to the inboard of semi-conductor thermo-electric generation module 1 hot side, radiator 3 is close to the outside of semi-conductor thermo-electric generation module 1 huyashi-chuuka (cold chinese-style noodles), semi-conductor thermo-electric generation module 1, heat collector 2, radiator 3 is pasted combination with heat-conducting glue respectively, so that reduce contact heat resistance as far as possible, improves the efficient that heat is transmitted.Semi-conductor thermo-electric generation module closely is clipped in the middle of heat collector and the radiator.
Described semi-conductor thermo-electric generation module 1, form by polylith semiconductor power-generating chip, every chip block is by a plurality of semiconductor PNs be in series (referring to Fig. 3), its electricity generating principle is based on the Bezier effect, electronics in the semi-conducting material can flow to low-temperature end from temperature end under the driving of temperature difference, thereby forms electrical potential difference.
Described hub-type heat collector 2 is the modules of collecting heat energy, is located at the most inboard of whole device, is the wheel hub shape, makes pipeline in the middle of the spoke joint portion, fills with heat-insulating material in the pipeline, prevents that heat from transmitting to the center.Heat collector directly contacts with gaseous state or liquid heat source, absorbs the heat of thermal source during work, again with heat exchange pattern with heat transferred semiconductor electricity generation module.Heat collector adopts this shape, is in order to enlarge the area of heat-transfer area, and flowing of disturbance thermal source obtains higher thermal transmission coefficient, reaches the purpose of the heat that collection thermal source as much as possible distributes.
Described bushing type radiator 3, be the module that the heat with the semiconductor module huyashi-chuuka (cold chinese-style noodles) distributes, be arranged in the outside of semi-conductor thermo-electric generation module, be the sleeve pipe form, logical coolant in the middle of sleeve pipe during work relies on flowing of coolant to take away heat with conduction and heat convection mode.
Pipe type heat-recovering semiconductor thermal difference generation method, at the gaseous state of dissipate excess heat or liquid heat source during through the passage of hub-type heat collector 2, heat collector 2 absorbs its heat, and with the heat transferred collected to the semi-conductor thermo-electric generation module hot side, and bushing type radiator 3 is arranged in the semiconductor electricity generation module 1 huyashi-chuuka (cold chinese-style noodles) outside, radiator can be cooled to huyashi-chuuka (cold chinese-style noodles) a temperature lower than hot side, thereby the both ends of the surface at semi-conductor thermo-electric generation module 1 produce a bigger temperature difference, under the ordering about of Bezier effect, electronics in the semi-conductor thermo-electric generation module 1 flows to low-temperature end from temperature end, form electrical potential difference at cold junction, process voltage stabilizing rectification (prior art) and AC-DC conversion (prior art) can connect load and use as power supply afterwards.
Waste heat to the high-temperature flue gas that produces in iron and steel enterprise's production process reclaims, and is specific embodiment that this device is used.The high-temperature flue gas that emits from converter, its temperature can before emitting, have a large amount of heats to be dispersed in the environment up to more than 1100 ℃.This device is arranged in the discharge tube of high-temperature flue gas, high-temperature flue gas gives out heat in flow process, after the hub-type heat collector absorbs these heats, it is delivered to the hot side of semi-conductor thermo-electric generation module.The hot side of semi-conductor thermo-electric generation module can be with heat transferred to huyashi-chuuka (cold chinese-style noodles), huyashi-chuuka (cold chinese-style noodles) is with the heat transferred radiator, the coolant that feeds in the bushing type radiator can be taken away these heats by flowing, make huyashi-chuuka (cold chinese-style noodles) keep a relatively low temperature, two end faces at semi-conductor thermo-electric generation module have just formed a bigger temperature difference like this.Because the Bezier effect, semiconductor module will produce electrical potential difference.By circuit this electrical potential difference output promptly be can be used as power supply.
Semi-conductor thermo-electric generation module 1 is the core component of this device, and it can convert temperature difference to electrical potential difference and be about to thermal power transfer and become electric energy.Its operation principle is based on the Bezier effect of semi-conducting material:
See Fig. 2, in P (N) N-type semiconductor N, the hole of temperature end (electronics) concentration ratio low-temperature end is big, and under the driving of this concentration gradient, hole (electronics) can spread to low-temperature end from temperature end, thereby form a kind of electrical potential difference owing to the thermal diffusion effect.The hot junction of P type and N type semiconductor is linked to each other, then can obtain a voltage at cold junction, such PN junction just can utilize the temperature difference between high temperature heat source and the low-temperature heat source directly to change heat energy into electric energy.
Contrast Fig. 3, shown the schematic diagram of semi-conductor thermo-electric generation module among the figure, temperature difference makes each to producing electrical potential difference in the PN junction, will be much to being together in series, just can obtain sufficiently high voltage, and become a thermal generator.

Claims (2)

1, pipe type heat-recovering semiconductor thermal difference generation method, the gaseous state, the liquid heat source that it is characterized in that dissipate excess heat pass through hub-type heat collector passage, lead to the absorption heat by the hub-type heat collector, and the heat transferred of collecting is arrived the hot side of semi-conductor thermo-electric generation module inboard; The bushing type radiator is arranged in the huyashi-chuuka (cold chinese-style noodles) in the semi-conductor thermo-electric generation module outside, radiator is cooled to a temperature lower than hot side with huyashi-chuuka (cold chinese-style noodles), make both ends of the surface produce a bigger temperature difference at semi-conductor thermo-electric generation module, semi-conductor thermo-electric generation module converts temperature difference to electrical potential difference by the Bezier effect, after voltage stabilizing circuit and AC-DC conversion, use as power supply; Semi-conductor thermo-electric generation module is the circumferential layout on perpendicular to the thermal source flow direction, form pipe-like, and radiator and heat collector are arranged in parallel along thermal source flow direction and semi-conductor thermo-electric generation module; Heat collector is made the wheel hub shape, is pipe-like in the middle of the spoke joint portion, this pipe interior filling heat insulator; Radiator is the bushing type of hollow, and the middle coolant that feeds is taken away the heat in the radiator.
2, pipe type heat-recovering semiconductor thermal difference generation device, it is characterized in that the conductor temperature-difference power generation module is clipped in the middle of duct type heat collector and the bushing type radiator, the hub-type heat collector is close to the hot side of semi-conductor thermo-electric generation module inboard, the bushing type radiator is close to the huyashi-chuuka (cold chinese-style noodles) in the semi-conductor thermo-electric generation module outside, and hub-type heat collector, bushing type radiator are pasted with heat-conducting glue respectively with semi-conductor thermo-electric generation module and combined.
CNA2008100213661A 2008-08-01 2008-08-01 Pipe type heat-recovering semiconductor thermal difference generation method and apparatus Pending CN101325386A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102072641A (en) * 2010-12-22 2011-05-25 中国科学院广州能源研究所 Generating system using surface residual heat of dry cement rotary kiln
CN102377371A (en) * 2010-08-13 2012-03-14 余哲锐 Method for generating electricity by using motor waste heat
US8704077B2 (en) 2009-07-15 2014-04-22 Hon Hai Precision Industry Co., Ltd. Heat recycling system
CN104167956A (en) * 2013-05-17 2014-11-26 宝山钢铁股份有限公司 Flue gas waste heat thermoelectric recovery device
CN109510511A (en) * 2018-09-21 2019-03-22 湖南泰通能源管理股份有限公司 A kind of waste heat from tail gas conversion equipment and method based on semiconductor temperature differential generating
CN111534674A (en) * 2020-03-25 2020-08-14 佛山津西金兰冷轧板有限公司 Annealing hydrogen processing system
CN113063294A (en) * 2020-09-16 2021-07-02 佛山高砂工业窑炉有限公司 Firing roller kiln with waste heat recovery function and waste heat recovery and conversion method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8704077B2 (en) 2009-07-15 2014-04-22 Hon Hai Precision Industry Co., Ltd. Heat recycling system
CN101958670B (en) * 2009-07-15 2014-08-13 鸿富锦精密工业(深圳)有限公司 Waste heat recovering system
CN102377371A (en) * 2010-08-13 2012-03-14 余哲锐 Method for generating electricity by using motor waste heat
CN102072641A (en) * 2010-12-22 2011-05-25 中国科学院广州能源研究所 Generating system using surface residual heat of dry cement rotary kiln
CN104167956A (en) * 2013-05-17 2014-11-26 宝山钢铁股份有限公司 Flue gas waste heat thermoelectric recovery device
CN104167956B (en) * 2013-05-17 2016-10-05 宝山钢铁股份有限公司 Fume afterheat thermoelectricity retracting device
CN109510511A (en) * 2018-09-21 2019-03-22 湖南泰通能源管理股份有限公司 A kind of waste heat from tail gas conversion equipment and method based on semiconductor temperature differential generating
CN111534674A (en) * 2020-03-25 2020-08-14 佛山津西金兰冷轧板有限公司 Annealing hydrogen processing system
CN113063294A (en) * 2020-09-16 2021-07-02 佛山高砂工业窑炉有限公司 Firing roller kiln with waste heat recovery function and waste heat recovery and conversion method thereof

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Open date: 20081217