CN101315409A - Mobile phone circuit board testing method - Google Patents
Mobile phone circuit board testing method Download PDFInfo
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- CN101315409A CN101315409A CNA2007100746290A CN200710074629A CN101315409A CN 101315409 A CN101315409 A CN 101315409A CN A2007100746290 A CNA2007100746290 A CN A2007100746290A CN 200710074629 A CN200710074629 A CN 200710074629A CN 101315409 A CN101315409 A CN 101315409A
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Abstract
The invention discloses a method for testing the electrical performance of mobile phone circuit boards. The method comprises the steps as follows: firstly, a group of qualified mobile phone circuit boards is selected, the tested pin signals of the group of qualified mobile phone circuit boards are tested, and the current value of each tested pin signal is recorded; secondly, according to the current value of each tested pin signal of the group of qualified mobile phone circuit boards, the upper limit I1 and the lower limit I2 of the current value of each tested pin signal of the qualified mobile phone circuit boards are determined; and thirdly, the current value I of each tested pin signal of the mobile phone circuit boards to be tested is tested. If I is larger than I2 and smaller than I1, the mobile phone circuit boards are non-defective products. If I is larger than I1 or smaller than I2, the mobile phone circuit boards are defective products.
Description
[technical field]
The invention belongs to the mobile phone producing test field, relate in particular to a kind of mobile phone manufacture in to the method for the electric performance test of circuit board of mobile phone.
[background technology]
Along with the universal use of various different systems (as GSM, CDMA) mobile phone, the mobile phone manufacturing is produced with considerable scale in the whole world.Because people are vigorous to the handset demand of high-performance low price, the inevitable requirement mobile phone manufacturer enhance productivity as far as possible, reduces production costs.Usually, test in the mobile phone production run and calibration phase often need radio frequency parameter, electric parameter (standby current, audio-frequency current, emissive power), battery or the like are tested.Yet these tests often require a great deal of time, and the various instrument prices of test usefulness are also relatively more expensive, therefore become the bottleneck of restriction mobile phone manufacturer production efficiency.
The test of circuit board of mobile phone belongs to an important content of mobile phone electric test, because circuit board of mobile phone only avoid occurring in process of production some rosin joint, short circuit, unfavorable condition such as open circuit, like this, to the electric performance test of the circuit board of mobile phone test procedure that is absolutely necessary, the test macro of circuit board of mobile phone is at present: circuit board of mobile phone to be measured links to each other with computing machine, digital power, testing tool by the testing mobile phone anchor clamps.Its test process is as follows: (a) computing machine is controlled described digital power by interface card, the output adjustable voltage; (b) described computing machine is given an order by the RS232 serial ports, the electric performance test that circuit board of mobile phone to be measured is carried out by described mobile phone anchor clamps.Yet, the testing tool of using in the above-mentioned test process, optics Automatic Check-out And Readiness Equipment for example, this instrument by three only stereoscopic image identification can judge directly whether tested circuit board of mobile phone has open circuit and short circuit, but these testing tool complex structures, price high (millions of unit), bulky, therefore, make mobile phone test become the factor that restriction mobile phone manufacturing cost further reduces.
[summary of the invention]
The method of testing that the purpose of this invention is to provide a kind of circuit board of mobile phone electrical property utilizes simple proving installation to finish test to the unit for electrical property parameters of circuit board of mobile phone.
Realize above-mentioned purpose, the technical solution of the utility model is:
Technical scheme of the present invention is as follows:
A kind of method of testing of circuit board of mobile phone electrical property, it comprises:
1, select a combination lattice circuit board of mobile phone, the tested leg signal of testing this combination lattice circuit board of mobile phone writes down the current value of each tested leg signal;
2,, determine the upper limit I1 and the lower limit I2 of each tested leg signal current value of qualified circuit board of mobile phone according to the current value of this each tested leg signal of combination lattice circuit board of mobile phone;
3, the current value I of test each tested leg signal of circuit board of mobile phone to be measured as I2＜I＜I1, then is a non-defective unit, as I＞I1 or I＜I2, then is defective products.
Described method of testing, wherein, the tested leg signal of each pin of circuit board of mobile phone is incorporated into single-chip microcomputer by signal wire, is in series with reometer in each signal wire, is provided with test procedure in the single-chip microcomputer.
Described method of testing, wherein, the signal wire of a plurality of tested pins of described circuit board of mobile phone is connected to a relay group, and this relay group connects a reometer, and single-chip microcomputer selects reometer is inserted the signal wire of tested pin by the pilot relay group.
The invention has the beneficial effects as follows by reometer collocation ball bearing made using, finish electric performance test, avoid using expensive testing apparatus, reduced production cost circuit board of mobile phone.Secondly, by using the method for the shared reometer of a plurality of pins, further reduced production cost.The 3rd, whether can judge in rated range by the current value that compares each pin of circuit-under-test plate whether the circuit-under-test plate is defective products, test process is simplified, improved production efficiency.
[description of drawings]
Below by embodiment also in conjunction with the accompanying drawings, the present invention is described in further detail:
Fig. 1 is the theory diagram of circuit board of mobile phone electric performance test of the present invention.
Fig. 2 is the structural representation by relay group Control current table in the circuit board of mobile phone electric performance test of the present invention.
[embodiment]
The principle of work of the method for testing of circuit board of mobile phone electrical property of the present invention is when tested circuit board of mobile phone during in unfavorable condition such as rosin joint, short circuit occur, open circuit, bigger variation will appear in the current value of the signal in the respective pins so, therefore can detect defective products according to this principle.Its concrete steps comprise: 1, select a combination lattice circuit board of mobile phone, test the measured signal of this combination lattice circuit board of mobile phone, write down the current value of each measured signal; 2,, determine the upper limit I1 and the lower limit I2 of qualified each measured signal current value of testing circuit board of mobile phone plate according to the current value of this each measured signal of combination lattice circuit board of mobile phone; 3, the current value I of test each measured signal of circuit board of mobile phone to be measured as I2＜I＜I1, then is a non-defective unit, as I＞I1 or I＜I2, then is defective products.
In this method of testing, the measured signal of each pin of circuit board of mobile phone outputs to the corresponding signal line, each signal wire is incorporated into single-chip microcomputer by flexible circuit board and connector, be in series with reometer in each signal wire, be provided with test procedure in the single-chip microcomputer, by single-chip microcomputer and tested mobile phone circuit board communications, realize test to each pin electric current of circuit board.
Fig. 1 is the theory diagram for a kind of specific embodiment of realizing the inventive method, tested circuit board of mobile phone communicates by various bus interface single-chip microcomputers, this single-chip microcomputer recommends to use the ARM family chip of PHILIPS company, as the Arm2131 chip, this chip possesses multiple bus interface, and is compatible strong, can directly drive most of circuit board of mobile phone, and need not to increase chip for driving, be easy to software programming.Mu balanced circuit is used for making it in running order to tested circuit board of mobile phone power supply.When single-chip microcomputer powered up operation, the test key groups was used to select different test procedures to finish corresponding test event.
Single-chip microcomputer drives relay group and pilot lamp group by the chip for driving UNL2803 of relay, its structural principle as shown in Figure 2, relay group controllable current table inserts different circuits, like this, use a reometer can show the electric current of a plurality of test events in real time, thereby avoid using a large amount of reometers, further save testing cost.
Claims (3)
1, a kind of method of testing of circuit board of mobile phone electrical property comprises the steps:
(1), select a combination lattice circuit board of mobile phone, the tested leg signal of testing this combination lattice circuit board of mobile phone writes down the current value of each tested leg signal;
(2), according to the current value of this each tested leg signal of combination lattice circuit board of mobile phone, determine the upper limit I1 and the lower limit I2 of each tested leg signal current value of qualified circuit board of mobile phone;
(3), the test each tested leg signal of circuit board of mobile phone to be measured current value I, as I2＜I＜I1, then be non-defective unit, as I＞I1 or I＜I2, then be defective products.
2, the method for testing of circuit board of mobile phone electrical property as claimed in claim 1 is characterized in that: the tested leg signal of described each pin of circuit board of mobile phone is incorporated into single-chip microcomputer by signal wire, and each signal wire is in series with reometer, is provided with test procedure in the single-chip microcomputer.
3, the method for testing of circuit board of mobile phone electrical property as claimed in claim 2, it is characterized in that: the signal wire of a plurality of tested pins of described circuit board of mobile phone is connected to a relay group, this relay group connects a reometer, single-chip microcomputer selects reometer is inserted the signal wire of tested pin by the pilot relay group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100746290A CN101315409A (en) | 2007-05-28 | 2007-05-28 | Mobile phone circuit board testing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100746290A CN101315409A (en) | 2007-05-28 | 2007-05-28 | Mobile phone circuit board testing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101315409A true CN101315409A (en) | 2008-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100746290A Pending CN101315409A (en) | 2007-05-28 | 2007-05-28 | Mobile phone circuit board testing method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957402A (en) * | 2010-08-31 | 2011-01-26 | 上海华岭集成电路技术股份有限公司 | System and method for testing instantaneous current |
| CN101975906A (en) * | 2010-08-19 | 2011-02-16 | 上海展英通信息技术有限公司 | Detection equipment for mainboard of mobile phone |
| CN103592560A (en) * | 2013-11-01 | 2014-02-19 | 福建升腾资讯有限公司 | Method for testing dismantlement prevention function of main board |
| CN103901336A (en) * | 2014-03-05 | 2014-07-02 | 江苏欣锐新能源技术有限公司 | Method and device for calibrating reference voltage inside integrated circuit chip |
| CN104049199A (en) * | 2014-06-16 | 2014-09-17 | 武汉新芯集成电路制造有限公司 | Failure analysis system |
| CN109031088A (en) * | 2018-06-11 | 2018-12-18 | 成都京蓉伟业电子有限公司 | A kind of circuit board multichannel current test method and its system |
| CN113687218A (en) * | 2021-08-31 | 2021-11-23 | 上海威固信息技术股份有限公司 | Method for testing connectivity of power supply and ground pin of integrated circuit |
-
2007
- 2007-05-28 CN CNA2007100746290A patent/CN101315409A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101975906A (en) * | 2010-08-19 | 2011-02-16 | 上海展英通信息技术有限公司 | Detection equipment for mainboard of mobile phone |
| CN101957402A (en) * | 2010-08-31 | 2011-01-26 | 上海华岭集成电路技术股份有限公司 | System and method for testing instantaneous current |
| CN103592560A (en) * | 2013-11-01 | 2014-02-19 | 福建升腾资讯有限公司 | Method for testing dismantlement prevention function of main board |
| CN103592560B (en) * | 2013-11-01 | 2016-03-30 | 福建升腾资讯有限公司 | The method of testing of tamper function in a kind of mainboard |
| CN103901336A (en) * | 2014-03-05 | 2014-07-02 | 江苏欣锐新能源技术有限公司 | Method and device for calibrating reference voltage inside integrated circuit chip |
| CN104049199A (en) * | 2014-06-16 | 2014-09-17 | 武汉新芯集成电路制造有限公司 | Failure analysis system |
| CN109031088A (en) * | 2018-06-11 | 2018-12-18 | 成都京蓉伟业电子有限公司 | A kind of circuit board multichannel current test method and its system |
| CN113687218A (en) * | 2021-08-31 | 2021-11-23 | 上海威固信息技术股份有限公司 | Method for testing connectivity of power supply and ground pin of integrated circuit |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081203 |