CN101314303A - Chiseling apparatus and method for chiseling pattern on composite packing material - Google Patents

Chiseling apparatus and method for chiseling pattern on composite packing material Download PDF

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Publication number
CN101314303A
CN101314303A CNA200810029016XA CN200810029016A CN101314303A CN 101314303 A CN101314303 A CN 101314303A CN A200810029016X A CNA200810029016X A CN A200810029016XA CN 200810029016 A CN200810029016 A CN 200810029016A CN 101314303 A CN101314303 A CN 101314303A
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CN
China
Prior art keywords
laser beam
laser
chiseling
speculum
package material
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Pending
Application number
CNA200810029016XA
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Chinese (zh)
Inventor
高虎
邹燕红
杨进
王忠林
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HUIZHOU BAOBAI PACKAGE CO Ltd
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HUIZHOU BAOBAI PACKAGE CO Ltd
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Priority to CNA200810029016XA priority Critical patent/CN101314303A/en
Publication of CN101314303A publication Critical patent/CN101314303A/en
Pending legal-status Critical Current

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Abstract

The present invention discloses a device and a method for laser etching on a composite packaging material. The device comprises a laser generating device, a laser beam superior reflex device, a laser beam concentrating and transmitting device which concentrates the laser beam reflected by the laser beam superior reflex device to transmit to the composite packaging bag, a material conveying device and a control device. The laser etching device is simple in structure, convenient in operation, high in flexibility, good in etching effect, accurate in positioning and high in production efficiency. The device can realize the laser etching for any graphics, and is suitable for the flow production of a full automatic product line.

Description

A kind of on compound package material the chiseling apparatus and the method for chiseling pattern
Technical field
The invention belongs to the composite packaging technical field, particularly a kind of device and method that on compound package material, carries out laser scoring.
Background technology
At present, on composite soft packaging material, scribe, two kinds of implementation methods are arranged.A kind of is the method for using laser, but can only realize the straight line or the chain-dotted line of machine direction, can not realize other pattern, and its pattern unification can not be satisfied diversified demand; Another kind is the cutting die compacting with controllable depth, and this kind method can realize scribing of arbitrary graphic pattern, but if this kind method changes pattern, need make cutting die again, and its versatility is not strong, and the scope of application is little, so its cost of manufacture height, very flexible.
Summary of the invention
Technical purpose of the present invention is to overcome above-mentioned the deficiencies in the prior art, and a kind of chiseling apparatus at the compound package material chiseling pattern is provided, and this apparatus structure is simple, easy to operate, and the figure of scribing can design arbitrarily, adjust flexibly, cost is low, can adapt to high efficiency modern production.
Another technical purpose of the present invention is to overcome above-mentioned the deficiencies in the prior art, a kind of engrating process at the compound package material chiseling pattern is provided, this engrating process is scribed by laser method, its operating process is simple and convenient, be applicable to the continuous productive process of full-automatic production line, the production efficiency height.
In order to reach above-mentioned first technical purpose, the present invention realizes by following technical scheme:
A kind of on compound package material the chiseling apparatus of chiseling pattern, the higher order reflection device that comprises the laser beam reflection that generating device of laser, generating device of laser produce, higher order reflection device laser light reflected bundle is gathered together and the laser beam of directive compound package material is assembled and penetrating apparatus, comprise also by what certain pattern trace was walked material and walk materials device and control system that this is walked materials device and guarantees that compound package material walks material reposefully according to preset parameters.
Described generating device of laser comprises laser generator and the laser beam that is sent by laser generator.
Described walk materials device mainly comprise unreel partly, traction partly, photoelectricity partly, walk material partly and rolling partly.
Described control system comprises photoelectricity part and control program.
Further improvement as above-mentioned technology, the higher order reflection device of described laser beam is the secondary reflex device, it comprise can make laser beam along the X of compound package material to the first order speculum that moves, and can make laser beam along the Y of packaging bag to the second level speculum that moves, the reflecting surface of described first order speculum and second level speculum is oppositely arranged and the two axis normal, and the described first order speculum and second speculum are all by controlling it around axial rotation with the control device that is connected separately; Specifically, the control device of described first order speculum is first servomotor, and the control device of described second level speculum is second servomotor; The gathering of described laser beam and penetrating apparatus are lens.
In order to reach above-mentioned second technical purpose, the present invention realizes by following technical scheme:
For being implemented in the laser scoring that carries out arbitrary graphic on the compound package material, this device carries out work according to following book step:
(1) walks materials device and send triggering signal to laser instrument according to predefined parameter;
(2) generating device of laser is received away the triggering signal that materials device sends, and produces laser beam.
(3) the higher order reflection device of the laser beam directive laser beam that generating device of laser is produced;
(4) the higher order reflection device passes the laser beam that reflects in the gathering and penetrating apparatus directive compound package material of laser beam;
(5) by setting the movement locus of higher order reflection device, laser beam is moved according to projected path, thereby carry out laser scoring to form different track pattern in certain part on the top layer of compound package material;
(6) degree of depth of laser scoring can be regulated by the power of regulating laser, and laser power is high more, and the degree of depth of then scribing is dark more, otherwise the degree of depth of then scribing is shallow more.
As the further improvement of above-mentioned engrating process, it can realize scribing of arbitrary shape, and the realization concrete steps of its arbitrary shape are as follows:
(1) preestablishes the required figure of scribing, the i.e. movement locus of laser beam.
(2) control of control system is partly controlled corresponding servomotor according to predefined movement locus.
(3) laser generator is received triggering signal and is produced laser beam;
(4) first servomotors drive first order speculum around its axis rotation or transfixion according to predefined movement locus, second servomotor drives second level speculum around its axis rotation or transfixion, the first order speculum of laser beam directive rotation according to predefined movement locus; Then, the second level speculum of the laser beam directive rotation that reflects of first order transmitting mirror; On the laser beam directive photoscope that moves along circular trace that second level speculum will reflect again, local location on the above-mentioned compound package material of directive again after laser beam that photoscope will move is assembled, thus scribing of predetermined pattern on this local location, finished.
Compared with prior art, the invention has the beneficial effects as follows:
(1) the present invention has expanded the application of laser scoring in the composite soft packaging material field.
(2) the present invention is by the reflection unit of multistage laser beam being set, controlling laser beam effectively and scribe on compound package material, and it scribes effective, can scribe arbitrary graphic, the flexibility height, and can accurate positioning.
(3) operating process of the present invention is simple and convenient, is applicable to the continuous productive process of full-automatic production line, the production efficiency height.
Description of drawings
Below in conjunction with the drawings and specific embodiments the present invention is described in detail:
Fig. 1 is the side sectional view of the bag wall of the beverage packets pack among the present invention;
Fig. 2 is the structural representation of the set different graphic of above-mentioned combined package bag upper epidermis;
Fig. 3 is the apparatus structure schematic diagram that carries out laser scoring on compound package material of the present invention.
The specific embodiment
A kind of as shown in Figure 1 and Figure 2 compound package material, these packaging material can be by Biaxially oriented polypropylene, biaxial tension nylon, and biaxial stretching polyester, aluminium foil, aluminizer, polyvinyl alcohol, EVOH, EAA, EMAA, EVA, any combination thereof such as ionomer form.On compound package material, carry out laser scoring as required.
Below with regard to of the present invention on compound package material the chiseling apparatus and the engrating process thereof of chiseling pattern be described in detail.
As shown in Figure 3, of the present invention a kind of on compound package material the chiseling apparatus of chiseling pattern, comprise laser aid 1, with the laser beam higher order reflection device of the generation of laser aid 1, and laser higher order reflection device laser light reflected bundle gathered together and the laser beam of directive beverage packets pack is assembled and penetrating apparatus, also comprise by what certain pattern trace was walked material and walk materials device and control system; Described walk materials device mainly comprise unreel partly, traction partly, photoelectricity partly, walk material partly and rolling partly, this is walked materials device and has guaranteed that compound package material walks material reposefully according to preset parameters; Described control system comprises photoelectricity part and control program.
Described laser aid 1 comprises laser generator 11 and the laser beam 12 that is sent by laser generator 11.For convenience, the higher order reflection device of described laser beam is a secondary reflex device 2, its specifically comprise can make laser beam along the X of packaging bag to the first order speculum 21 that moves, and can make laser beam along the Y of packaging bag to the second level speculum 22 that moves, the reflecting surface of described first order speculum 21 and second level speculum 22 is oppositely arranged and the two axis normal, and the described first order speculum 21 and second speculum 22 are all by controlling it around axial rotation with the control device that is connected separately.The control device of described first order speculum 21 is first servomotor 23, and the control device of described second level speculum 22 is second servomotor 24.In addition, in the present invention, laser beam is assembled and penetrating apparatus 3 is specially photoscope.
The present invention carries out laser scoring on compound package material concrete operations step is: (following steps are that circular internal layer is that the preparation method of the pre-opening of cross fork-shaped pattern is that example specifies with the periphery)
(1) on the top layer 41 of combined package bag 4, form an X to laser rays: at first, laser generator 11 gives off laser beam 12, first servomotor 23 drives first order speculum 21 rotates it vertically, at this moment, rotating first speculum 21 of laser beam 12 directives that laser generator 11 sends, like this, the laser beam of launching by first speculum 21 along X to moving, and this moment, second level speculum 22 is non-rotary; Then, the static second level speculum 22 of laser beam directive that moves that reflects of first order transmitting mirror 21; Then, by second level speculum 22 again with on the laser beam directive photoscope that reflects, photoscope will form an X to laser rays along X certain local location on the top layer 41 of directive compound package material 4 again after the laser beam that moves focuses on this local location;
(2) on the top layer 41 of compound package material 4, form one with above-mentioned X to the Y of laser rays square crossing setting to laser rays: laser generator 11 continues to give off laser beam 12, first order speculum 21 does not rotate, this moment, second servomotor, 24 driving second level speculums 22 made it along its axis rotation, the laser beam 12 directive first order speculums 21 that laser generator 11 sends; The laser beam directive that first order transmitting mirror 21 reflects is around the second level of axial rotation speculum 22; On the laser beam directive photoscope that moves that second level speculum 22 will reflect again, photoscope will along Y after the light beam that moves focuses on again the above-mentioned top layer 41 of directive be equipped with the local location of X to laser rays, thereby on this local location, form a Y to laser rays, this Y is provided with to the laser rays square crossing to laser rays and above-mentioned X, promptly forms cross fork-shaped laser rays;
(3) form the circular laser rays of a sealing in the periphery of above-mentioned cross fork-shaped laser rays: laser generator 11 continues to give off laser beam 12, first servomotor 23 drives first order speculum 21 around its axis rotation, second servomotor 24 drive second level speculums 22 around its axis and first order speculum 21 with rotate the first order speculum 21 that laser beam 12 directives rotate fastly; The second level speculum 22 of the laser beam directive rotation that reflects by first order transmitting mirror 21 then; On the laser beam directive photoscope that moves along circular trace that second level speculum 22 will reflect again, the pairing local peripheral of the cross fork-shaped laser rays position on the above-mentioned top layer 41 of directive again after laser beam that photoscope will move is assembled, thereby can form the laser rays of a rounded track on this local location, promptly forming peripheral is that circular internal layer is a cross fork-shaped pattern.
In the present invention, the pattern 411 of laser scoring can also be multiple mode in the described packaging bag 4, as long as suitably control the rotation situation of first speculum 21 and second speculum 22, behind the top layer 41 of laser beam by the pack of photoscope directive beverage packets of the orbiting motion that the two being of reflecting is certain, can on its top layer 41, get suitable track 411, for example: U-shaped, V-arrangement, the pattern that is certain track such as L shaped.

Claims (9)

1. the chiseling apparatus of a chiseling pattern on compound package material, it is characterized in that: the higher order reflection device that comprises the laser beam reflection that generating device of laser, generating device of laser produce, higher order reflection device laser light reflected bundle is gathered together and the laser beam of directive compound package material is assembled and penetrating apparatus, also comprise by what certain pattern trace was walked material and walk materials device and control system.
2. according to claim 1 on compound package material the chiseling apparatus of chiseling pattern, it is characterized in that: described generating device of laser comprises laser generator and the laser beam that is sent by laser generator.
3. according to claim 1 on compound package material the chiseling apparatus of chiseling pattern, it is characterized in that: described walk materials device mainly comprise unreel partly, traction partly, photoelectricity partly, walk material partly and rolling partly.
4. according to claim 1 on compound package material the chiseling apparatus of chiseling pattern, it is characterized in that: described control system comprises that photoelectricity is partly and control program.
According to claim 1 to 4 each described on compound package material the chiseling apparatus of chiseling pattern, it is characterized in that: the higher order reflection device of described laser beam is the secondary reflex device, it comprise can make laser beam along the X of compound package material to the first order speculum that moves, and can make laser beam along the Y of packaging bag to the second level speculum that moves, the reflecting surface of described first order speculum and second level speculum is oppositely arranged and the two axis normal, and the described first order speculum and second speculum are all by controlling it around axial rotation with the control device that is connected separately.
6. according to claim 5 on compound package material the chiseling apparatus of chiseling pattern, it is characterized in that: the control device of described first order speculum is first servomotor, the control device of described second level speculum is second servomotor.
7. according to claim 6 on compound package material the chiseling apparatus of chiseling pattern, it is characterized in that: the gathering of described laser beam and penetrating apparatus are lens.
8. according to claim 1 on compound package material the engrating process of chiseling pattern, the step of scribing that its arbitrary graphic pattern is scribed is:
(1) walks materials device and send triggering signal to laser instrument according to predefined parameter;
(2) generating device of laser is received away the triggering signal that materials device sends, and produces laser beam.
(3) generating device of laser is with the higher order reflection device of the laser beam directive laser beam of generation;
(4) the higher order reflection device passes the laser beam that reflects in the gathering and penetrating apparatus directive compound package material of laser beam;
(5) by setting the movement locus of higher order reflection device, laser beam is moved according to projected path, thereby carry out laser scoring to form different track pattern in certain part on the top layer of compound package material;
(6) degree of depth of laser scoring can be regulated by the power of regulating laser.
9. according to claim 8 on compound package material the engrating process of chiseling pattern, its concrete steps are:
(1) preestablishes the required figure of scribing, the i.e. movement locus of laser beam.
(2) control program of control system is controlled corresponding servomotor according to predefined movement locus.
(3) laser generator receives triggering signal and produces laser beam;
(4) first servomotors drive first order speculum around its axis rotation or transfixion according to predefined movement locus, second servomotor drives second level speculum around its axis rotation or transfixion, the first order speculum of laser beam directive rotation according to predefined movement locus; Then, the second level speculum of the laser beam directive rotation that reflects of first order transmitting mirror; On the laser beam directive photoscope that moves along circular trace that second level speculum will reflect again, local location on the above-mentioned compound package material of directive again after laser beam that photoscope will move is assembled, thus scribing of predetermined pattern on this local location, finished.
CNA200810029016XA 2008-06-25 2008-06-25 Chiseling apparatus and method for chiseling pattern on composite packing material Pending CN101314303A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA200810029016XA CN101314303A (en) 2008-06-25 2008-06-25 Chiseling apparatus and method for chiseling pattern on composite packing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA200810029016XA CN101314303A (en) 2008-06-25 2008-06-25 Chiseling apparatus and method for chiseling pattern on composite packing material

Publications (1)

Publication Number Publication Date
CN101314303A true CN101314303A (en) 2008-12-03

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CNA200810029016XA Pending CN101314303A (en) 2008-06-25 2008-06-25 Chiseling apparatus and method for chiseling pattern on composite packing material

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101987554B (en) * 2009-08-07 2013-04-17 深圳市大族激光科技股份有限公司 Laser engraving device
CN105259623A (en) * 2015-10-30 2016-01-20 武汉电信器件有限公司 Laser and grating coupler packaging structure and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101987554B (en) * 2009-08-07 2013-04-17 深圳市大族激光科技股份有限公司 Laser engraving device
CN105259623A (en) * 2015-10-30 2016-01-20 武汉电信器件有限公司 Laser and grating coupler packaging structure and method

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Application publication date: 20081203