CN101309563A - Housing connection construction of electronic apparatus - Google Patents
Housing connection construction of electronic apparatus Download PDFInfo
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- CN101309563A CN101309563A CNA2007101039070A CN200710103907A CN101309563A CN 101309563 A CN101309563 A CN 101309563A CN A2007101039070 A CNA2007101039070 A CN A2007101039070A CN 200710103907 A CN200710103907 A CN 200710103907A CN 101309563 A CN101309563 A CN 101309563A
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- housing
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- protuberance
- extension
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Abstract
The invention relates to a casing body connecting structure of an electronic device, which at least comprises a first casing body and a second casing body, wherein, the first casing body is provided with a jointing part, and the jointing part is provided with a first extending part and a first groove from the external lateral surface to the internal lateral surface in sequence; the second casing body is provided with a jointing part, and the jointing part is provided with a first bulge. The first groove of the jointing part of the first casing body is relative to the first bulge of the jointing part of the second casing body, and the internal lateral surface of the first extending part of the jointing part of the first casing body is adjoined with the external lateral surface of the jointing part of the second casing body, thereby, the first casing body is mutually jointed with the second casing body.
Description
Technical field
The present invention relates to a kind of casing joint structure, particularly a kind of casing joint structure of electronic installation.
Background technology
People use electronic installation miscellaneous through regular meeting in daily life, for example power-supply adapter, transformer, power supply unit and power connector etc.Therefore these electronic installations all can utilize housing that these electronic components and circuit are coated owing to electronic component on its internal circuit carrier and circuit need be done suitable isolation and protection, contact to avoid direct and extraneous.Because casing joint structure design and juncture can have influence on outward appearance, structural strength and the electrical characteristic of electronic installation, the casing joint structure that therefore how to design suitable electronic installation just becomes considerable research and development problem.
See also Fig. 1, it is for showing the casing joint structure schematic diagram of traditional electronic devices.As shown in Figure 1, the casing joint structure of traditional electronic devices mainly comprises upper shell 1 and lower house 2, wherein upper shell 1 has junction surface 11, and lower house 2 has corresponding engagement portion 21, be bonded with each other with lower house 2 junction surfaces 21 by upper shell 1 junction surface 11, can make upper shell 1 and lower house 2 finish combination.
See also Fig. 2, it is for being the structure enlarged drawing of going up the lower house junction surface in the structure shown in Figure 1.As shown in Figure 2, upper shell 1 junction surface 11 forms first protuberance 112, first groove 113 and second protuberance 114 in regular turn from its lateral surface 110 to medial surface 111 directions.In addition, lower house 2 junction surfaces 21 form first recess 212, first protuberance 213 and second recess 214 in regular turn from its lateral surface 210 to medial surface 211 directions, and first protuberance 112, first groove 113 with junction surface 11 is relative with second protuberance 114 respectively.In addition, has fin 215 on first protuberance 213 at junction surface 21, and the width of junction surface 21 first protuberances 213 is slightly less than the width of first groove 113 at junction surface 11, when upper shell 1 engaged with lower house 2, first protuberance 213 at junction surface 21 just can be placed in first groove 113 at junction surface 11 thus.
See also the juncture schematic diagram that Fig. 3 a and Fig. 3 b show structure shown in Figure 2.Shown in Fig. 3 a, when desiring to carry out the housing joint, at first with first protuberance 112 at upper shell 1 junction surface 11, first groove 113 and second protuberance 114 respectively with first recess 212 at lower house 2 junction surfaces 21, first protuberance 213 is relative with second recess 214, utilize the ultrasonic wave connection technology then, directly on housing, produce the sound wave vibrations of ultra-high frequency by the soldering tip (Horn) of ultrasonic wave plastic cement heat sealing machine, make lower house 1,2 produce violent friction each other after, make the fin 215 on first protuberance 213 at junction surface 21 fuse into first groove, 113 inwalls at junction surface 11 in moment, shown in the 3rd figure (b), thus to reach lower house 1,2 purposes that engage.
Yet no matter be to adopt which kind of casing joint structure, last lower house all needs to produce via the step of plastic rubber ejaculate molding.The plastic rubber ejaculate molding product often has finished product and produces not problem and shortcoming such as gloss or finished product distortion of shade (shadow) or flow liner (flowmark), finished surface.Wherein, the reason that causes ejection formed piece to produce flow liner comprises that raw materials melt is not good, mold temperature is too low, issuing velocity too soon or too slow, to penetrate pressure too high or too low, or finished product section thickness differs factor such as too big; The reason that causes ejection formed piece to produce shade then is a housing junction surface meat thickness ununiformity etc.Because the generation of shade or flow liner can have influence on attractive in appearance that housing engages, therefore how to reduce shade or flow liner just for improving the considerations of housing outward appearance.
Please consult Fig. 2 again, in traditional case of electronic device connected structure, the junction surface 11 of upper shell 1 from its lateral surface 110 to medial surface 111 directions owing to produce the section poor of first protuberance 112 and first groove 113,11 section thickness differs too many or housing meat thickness ununiformity at the junction surface to make upper shell 1, therefore just can be when upper shell 1 ejection formation after at the junction surface 11 lateral surfaces, 110 generation shade or flow liners 120.When the section difference of first protuberance 112 and first groove 113 is big more, formed shade or flow liner 120 scopes also relatively increase, and so will have clearly shade or flow liner in housing outer surface after last lower house 1,2 combinations.
In addition, after last lower house 1,2 engaged, 11,21 the formed electric creepage distances in its junction surface still fell short of, and the situation that therefore also has electric electric leakage produces, and affects indirectly the electrical characteristic of electronic installation.What is more, upper shell 1 is not good with the bond strength of lower house 2, it is lower to make electronic installation bear the external force collision ability, and therefore the junction surface 11 that need increase upper shell 1 for head it off and junction surface 21 thickness of lower house 2 can increase material cost to for example more than about 3mm.In addition, for increasing electric creepage distance, second protuberance, 114 length at upper shell 1 junction surface 11 can't reduce, so when external force when clashing into perpendicular to junction surface 11,21 lateral surface directions, second protuberance 114 is easily because of fragile structure ruptures, even destroy casing joint structure.
Therefore, how to avoid the disappearance of above-mentioned known technology, and develop a kind of case of electronic device connected structure that reduces housing shade or flow liner and can after shell combination, increase electric creepage distance and reinforcement housing bond strength, real in pressing for the problem of solution at present.
Summary of the invention
Main purpose of the present invention is for providing a kind of case of electronic device connected structure, can reduce housing shade or flow liner, and after shell combination, increase electric creepage distance and improve the housing bond strength, attractive in appearance with the housing that increases electronic installation thus, structural strength and electrical characteristic.
Another object of the present invention can make housing to reduce the use of material relatively than thin thickness moulding, to reach the purpose that reduces cost under the situation that does not reduce casing joint structure intensity for a kind of case of electronic device connected structure is provided.
For reaching above-mentioned purpose, the invention provides a kind of case of electronic device connected structure, comprise at least: first housing, have the junction surface, this junction surface has first extension and first groove in regular turn from lateral surface to medial surface direction; And second housing, having the junction surface, this junction surface has first protuberance.Wherein, first groove at the first housing junction surface is with respect to first protuberance at the second housing junction surface, and the lateral surface adjacency at the first extension medial surface at the first housing junction surface and the second housing junction surface, and first housing is engaged each other with second housing.
For reaching above-mentioned purpose, this case also provides a kind of case of electronic device connected structure, comprises at least: first housing has the junction surface, this junction surface has first extension and first groove in regular turn from lateral surface to medial surface direction, and wherein first extension defines on first housing and forms an opening; And second housing, having the junction surface, this junction surface has first protuberance.Wherein, first groove at the first housing junction surface is with respect to first protuberance at the second housing junction surface, and second housing is embedded at the opening of first housing, and first housing is engaged each other with second housing.
Description of drawings
Fig. 1 is a traditional electronic devices casing joint structure schematic diagram.
Fig. 2 is a structure enlarged drawing of going up the lower house junction surface in the structure shown in Figure 1.
Fig. 3 a and Fig. 3 b are for showing structural engagement mode schematic diagram shown in Figure 2.
Fig. 4 is the case of electronic device connected structure schematic diagram of this case preferred embodiment.
Fig. 5 is the shell combination schematic diagram of structure shown in Figure 4.
Fig. 6 is the structure enlarged drawing at first and second housing junction surface in the structure shown in Figure 4.
Fig. 7 is the structure enlarged drawing at first and second housing junction surface of another preferred embodiment of this case.
Fig. 8 a and Fig. 8 b are for showing structural engagement mode schematic diagram shown in Figure 6.
[critical piece symbol description]
1: upper shell 11: junction surface
110: lateral surface 111: medial surface
113: the first grooves of 112: the first protuberances
2: lower house 21: junction surface
210: lateral surface 211: medial surface
213: the first protuberances of 212: the first recesses
Recess 215 in 214: the second: fin
4: the second housings of 3: the first housings
31: junction surface 32: opening
41: junction surface 42: outer surface
310: lateral surface 311: medial surface
313: the first grooves of 312: the first extensions
316: medial surface 410: lateral surface
411: 412: the first protuberances of medial surface
Recess 414 in 413: the first: fin
D: thickness of shell
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back.Be understood that the present invention can have various variations on different aspects, its neither departing from the scope of the present invention, and explanation wherein and be shown in the usefulness that ought explain in essence, but not in order to restriction the present invention.
See also Fig. 4, it is for the case of electronic device connected structure schematic diagram of this case preferred embodiment.As shown in Figure 4, case of electronic device connected structure of the present invention mainly by first housing 3 and second housing 4 be engaged with each other the institute constitute, wherein first housing 3 has junction surface 31, and second housing 4 has junction surface 41, be bonded with each other by the junction surface 31 of first housing 3 and the junction surface 41 of second housing 4, can make first housing 3 and second housing 4 finish combination.In certain embodiments, first housing 3 is preferable with for example box body, and second housing 4 is preferable with for example lid, wherein the profile of the opening 32 of first housing 3 cooperates with the peripheral profile phase of second housing 4, and the opening 32 of first housing 3 can be embedded for second housing 4, just can finish shell combination thus after second housing 4 is embedded at the opening 32 of first housing 3, the structure after its combination as shown in Figure 5.
See also Fig. 6, it is the structure enlarged drawing at first and second housing junction surface in the structure shown in Figure 4.As shown in Figure 6, first housing, 3 junction surfaces 31 comprise first extension 312, first groove 313 and first protuberance 314 in regular turn from its lateral surface 310 to medial surface 311 directions.In addition, the junction surface 41 of second housing 4 forms first protuberance 412 and first recess 413 in regular turn from its lateral surface 410 to medial surface 411 directions.In this embodiment, first groove 313 of first housing 3 and first protuberance 314 are respectively with respect to first protuberance 412 and first recess 413 of second housing 4, and the width of first protuberance 412 of second housing 4 is in fact less than the width of first groove 313 of first housing 3.In addition, first extension 31 of first housing 3 is stretched out by the part lateral surface 310 at junction surface 31, and its extended surface is parallel to lateral surface 310 in fact.First extension 31 defines on first housing 3 and forms this opening 32, but since second housing, 4 close-fittings be embedded at the opening 32 of first housing 3, therefore first extension, 312 medial surfaces 316 at junction surface 31 can with second housing, 4 junction surfaces, 41 lateral surfaces, 410 direct adjacency, and after second housing 4 was embedded at first housing, 3 openings 32, first extension, 312 ends and second housing, 4 outer surfaces 42 were positioned in fact on the same level face.
In certain embodiments, have more fin 315 on first protuberance 314 of first housing 3, thus when first housing 3 and second housing 4 utilize that for example the ultrasonic wave connection technology engages, fin 315 on first protuberance 314 of first housing 3 just can fuse into or implant the inwall of first recess 413 of second housing 4, so that first housing 3 and second housing 4 are bonded with each other.Certainly, in certain embodiments, as shown in Figure 7, also can form fin 414 on first protuberance, 412 surfaces of second housing 4, similarly can be when first housing 3 utilizes the ultrasonic wave connection technology to engage with second housing 4, make fin 414 on first protuberance 412 of second housing 4 fuse into or implant the inwall of first groove 313 of first housing 3, so that first housing 3 and second housing 4 are bonded with each other.
See also Fig. 8 a and Fig. 8 b, it shows structural engagement mode schematic diagram shown in Figure 6.Shown in Fig. 8 a, when desiring to carry out the housing joint, at first with first groove 313 of first housing 3 with first protuberance 314, first protuberance 412 with second housing 4 is relative with first recess 413 respectively, and second housing 4 is embedded at the opening 32 of first housing 3, and makes junction surface 41 lateral surfaces, 410 adjacency of first extension, 312 medial surfaces 316 and second housing 4 at junction surface 31.Then with for example ultrasonic wave connection technology, directly on housing, produce the sound wave vibrations of ultra-high frequency by the soldering tip (Horn) of ultrasonic wave plastic cement heat sealing machine, after making first housing 3 and second housing 4 produce violent friction each other, make fin 315 on first housing, 3 first protuberances 314 fuse into or implant the inwall of first recess 413 of second housing 4 in moment, shown in Fig. 8 b, first housing 3 and second housing 4 are bonded with each other with junction surface 31 and 41 and reach the purpose of combination.Certainly, juncture of the present invention is not limited to the ultrasonic wave connection technology that the foregoing description is mentioned.For example, when the fin on first housing, 3 first protuberances 314 315 omits, can also engage with the jog close-fitting at 31,41 at second housing, 4 junction surfaces by first housing 3, or the mode of sticking together with viscose, or with screw with first housing 3 and second housing, 4 locking modes, or with the formed buckle structure manner of first housing 3 and second housing, 4 edges, to reach the purpose of combination.
Can understand by structure shown in Figure 6, no matter be first housing 3 or second housing 4, because the direction of the junction surface 31,41 of these housings from its lateral surface to medial surface do not have the situation that meat thickness ununiformity and section thickness have big difference with respect to traditional structure, therefore shade or flow liner just are difficult for resulting from first housing 3 or second housing, 4 lateral surfaces 310,410 when first housing 3 and second housing, 4 ejection formations.Though therefore when first housing 3 and second housing 4 be for example to utilize ultrasonic wave fusion, stick together, engage or mode such as screw closure when engaging, the housing after the assembling does not relatively more have the existence of shade or flow liner.In addition, because first housing 3 is with after second housing 4 engages, the electric creepage distance that is formed at 31,41 at junction surface can utilize first extension 312 at junction surface 31 to increase, and makes insulation distance relatively enough, therefore can increase the electrical insulative property of electronic installation.In addition, first extension 312 at first housing, 3 junction surfaces 31 is with its medial surface 316 and second housing, 4 junction surfaces, 41 lateral surfaces, 410 adjacency, and second housing 4 can be embedded at the opening 32 of first housing 3, therefore when external force is clashed into by the lateral surface 310 at vertical first housing 3 junction surfaces 31, second housing 4 can assist first extension 312 at first housing, 3 junction surfaces 31 that the strength of replacing is provided, and can increase the crashworthiness ability of housing thus.In addition, the height of first protuberance 314 at junction surface 31 relatively can reduce, and does not take place and can not produce the situation that is easy to rupture as conventional art herein, even have influence on shell structure intensity.
In addition, first extension 312 at junction surface 31 is stretched out by part lateral surface 310, and the lateral surface 310 that is parallel to junction surface 31 in fact, therefore, the thickness of shell d of first housing 3, as shown in Figure 6, still can reduce under the situation of shell structure intensity need not, make thickness thinner relatively, for example can be reduced to below the 2mm, reduce material usage thus, to reach cost-effective purpose.
In sum, case of electronic device connected structure of the present invention is to be reached in the specific profile design on composition surface by the junction surface of first and second housing, produce shade or flow liner in the time of not only can reducing the housing ejection formation by such structural design and juncture, and can increase electric creepage distance and the electrical characteristic that increases electronic installation.On the other hand, case of electronic device connected structure of the present invention can be strengthened the intensity of shell structure, and can save material cost.
But this case those skilled in the art revise arbitrarily, but the scope of neither disengaging such as the desire protection of attached claims institute.
Claims (10)
1. the casing joint structure of an electronic installation comprises at least:
First housing has the junction surface, and this junction surface has first extension and first groove in regular turn from lateral surface to medial surface direction; And
Second housing, has the junction surface, this junction surface has first protuberance, wherein, this first groove at this junction surface of this first housing is with respect to this first protuberance at this junction surface of this second housing, and this junction surface lateral surface adjacency of this first extension medial surface at this junction surface of this first housing and this second housing makes this first housing engage each other with this second housing thus.
2. case of electronic device connected structure as claimed in claim 1, this junction surface that it is characterized in that this first housing has this first extension, this first groove and first protuberance in regular turn from lateral surface to medial surface direction, and this junction surface of this second housing has this first protuberance and first recess in regular turn from lateral surface to medial surface direction, and wherein this first protuberance of this first housing is with respect to this first recess of this second housing.
3. case of electronic device connected structure as claimed in claim 2, it is characterized in that also having fin on this first protuberance at this junction surface of this first housing, with when this first housing engages with this second housing, make this fin implant this first recess inwall of this second housing.
4. case of electronic device connected structure as claimed in claim 2, it is characterized in that having more fin on this first protuberance at this junction surface of this second housing, with when this first housing engages with this second housing, make this fin implant this first groove inwall of this first housing.
5. case of electronic device connected structure as claimed in claim 2, the width of this first protuberance that it is characterized in that this second housing is less than the width of this first groove of this first housing.
6. case of electronic device connected structure as claimed in claim 1 is characterized in that this first housing is to engage in the ultrasonic fusing mode with this second housing, and this first housing is box body, and this second housing is a lid.
7. case of electronic device connected structure as claimed in claim 1, this first extension that it is characterized in that this junction surface of this first housing are that the part lateral surface by this junction surface stretches out, and this first extension is parallel in fact with this lateral surface.
8. case of electronic device connected structure as claimed in claim 1, it is characterized in that this first extension forms an opening in this first housing definition, and this second housing is embedded at this opening of this first housing, wherein this second housing is after being embedded at this opening of this first housing, and the outer surface of the end of this first extension and this second housing is positioned in fact on the same level face.
9. case of electronic device connected structure comprises at least:
First housing has the junction surface, and this junction surface has first extension and first groove in regular turn from lateral surface to medial surface direction, and wherein this first extension defines on this first housing and forms opening; And
Second housing has the junction surface, and this junction surface has first protuberance,
Wherein, this first groove at this junction surface of this first housing is with respect to this first protuberance at this junction surface of this second housing, and this second housing is embedded at this opening of this first housing, and this first housing is engaged each other with this second housing.
10. case of electronic device connected structure as claimed in claim 9 is characterized in that this first extension medial surface at this junction surface of this first housing and this junction surface lateral surface adjacency of this second housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101039070A CN101309563A (en) | 2007-05-15 | 2007-05-15 | Housing connection construction of electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101039070A CN101309563A (en) | 2007-05-15 | 2007-05-15 | Housing connection construction of electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101309563A true CN101309563A (en) | 2008-11-19 |
Family
ID=40125720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101039070A Pending CN101309563A (en) | 2007-05-15 | 2007-05-15 | Housing connection construction of electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101309563A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102340071A (en) * | 2010-07-27 | 2012-02-01 | 康舒电子(东莞)有限公司 | Power supply unit shell |
| CN108112204A (en) * | 2018-01-22 | 2018-06-01 | 浙江博峰建筑科技有限公司 | A kind of new inspection device |
| CN108307596A (en) * | 2017-01-13 | 2018-07-20 | 光宝电子(广州)有限公司 | Shell, the electronic module with the shell and its manufacturing method |
| CN109952000A (en) * | 2019-03-26 | 2019-06-28 | 苏州达方电子有限公司 | Device housing |
| WO2021184188A1 (en) * | 2020-03-17 | 2021-09-23 | 元锦生物科技股份有限公司 | Detachable joint structure |
| CN115066990A (en) * | 2020-02-20 | 2022-09-16 | 夏普株式会社 | Electrical device |
-
2007
- 2007-05-15 CN CNA2007101039070A patent/CN101309563A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102340071A (en) * | 2010-07-27 | 2012-02-01 | 康舒电子(东莞)有限公司 | Power supply unit shell |
| CN102340071B (en) * | 2010-07-27 | 2013-06-19 | 康舒电子(东莞)有限公司 | Power supply unit shell |
| CN108307596A (en) * | 2017-01-13 | 2018-07-20 | 光宝电子(广州)有限公司 | Shell, the electronic module with the shell and its manufacturing method |
| CN108307596B (en) * | 2017-01-13 | 2020-07-03 | 光宝电子(广州)有限公司 | Housing, electronic module having the same, and method of manufacturing the same |
| CN108112204A (en) * | 2018-01-22 | 2018-06-01 | 浙江博峰建筑科技有限公司 | A kind of new inspection device |
| CN108112204B (en) * | 2018-01-22 | 2024-05-24 | 李志强 | Novel patrol and examine device |
| CN109952000A (en) * | 2019-03-26 | 2019-06-28 | 苏州达方电子有限公司 | Device housing |
| CN115066990A (en) * | 2020-02-20 | 2022-09-16 | 夏普株式会社 | Electrical device |
| WO2021184188A1 (en) * | 2020-03-17 | 2021-09-23 | 元锦生物科技股份有限公司 | Detachable joint structure |
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Open date: 20081119 |