CN109952000A - Device housing - Google Patents
Device housing Download PDFInfo
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- CN109952000A CN109952000A CN201910231534.8A CN201910231534A CN109952000A CN 109952000 A CN109952000 A CN 109952000A CN 201910231534 A CN201910231534 A CN 201910231534A CN 109952000 A CN109952000 A CN 109952000A
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- China
- Prior art keywords
- shells
- radiating part
- connecting portion
- device housing
- interconnecting piece
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The present invention discloses a kind of device housing, and it includes the first shells and the second shells.First shells includes interconnecting piece and the radiating part in conjunction with the interconnecting piece, and first shells is via the interconnecting piece to form accommodating space in conjunction with second shells.Wherein, the interconnecting piece and the radiating part material are different thermoplastic material, so that the combination of the interconnecting piece and second shells designs, and are conducive to the radiating part and provide the preferable heat dissipation effect of device assembly being placed in the accommodating space.
Description
Technical field
The present invention is about a kind of modular appliance shell, espespecially a kind of modular appliance shell that can provide heat dissipation.
Background technique
Many electronic devices can generate comparable heat when running, therefore its device housing needs to radiate.Such as power supply turns
Device is connect, when its exportable power is higher, the heat of generation when Yu Yunzuo is also higher in principle.If the device of power-supply adapter
Shell can not radiate in time, so that the thermal accumlation of generation when running is in the running in device housing, causing power-supply adapter
Temperature is high, influences power supply conversion efficiency, also influences its service life.When the volume design of power-supply adapter is smaller and smaller
When, this problem will more shape it is serious.Also, the device housing of general power-supply adapter adopts modular design, each group is usually adopted at shell
With the plastic material production of general single material, in order to combine, such as composition shell is combined by way of ultrasonic welding.
But generally plastic material thermal conductivity is poor, accumulated heat is difficult to dissipate.If composition shell adopts the preferable material production of thermal conductivity, group
It may be unfavorable for ultrasonic welding at shell, be formed and faced a difficult choice.
Summary of the invention
In view of the problems of the prior art, the present invention provides a kind of shell to solve the above problems.
Therefore, technical problem to be solved by the present invention lies in a kind of shell is provided, which includes:
First shells, first shells include first connecting portion and the first radiating part in conjunction with the first connecting portion, are somebody's turn to do
First connecting portion and the first radiating part material are different thermoplastic material；And
Second shells, first shells is via the first connecting portion to form accommodating space in conjunction with second shells.
As optional technical solution, the first connecting portion is annular in shape and with the first side and relative to the of first side
Two sides, first radiating part are bound to first side, which is bound to second side.
As optional technical solution, second shells include second connecting portion and in conjunction with the second connecting portion second
Radiating part, the second connecting portion and the second radiating part material are different thermoplastic material, first shells and the second shell
Part be combined with each other via the first connecting portion and the second connecting portion.
As optional technical solution, which has opening, which has groove, the groove pair
The neat opening, the second connecting portion contact the groove via the opening.
As optional technical solution, the opening is identical as the groove profile.
As optional technical solution, which has periphery and is set to the occlusion structure of the periphery, this
One interconnecting piece is mutually combined closely with the occlusion structure.
As optional technical solution, which is the thermoplastic material containing multiple conductive particles.
As optional technical solution, which includes thermal conductive contact portion, prominent towards the accommodating space.
As optional technical solution, which includes fin structure, is extended outwardly.
As optional technical solution, which, which has flat part and bend from a side of the flat part, extends
Side wall portion.
Compared with the prior art, the device of the invention shell includes the first shells and the second shells.First shells includes
Interconnecting piece and the radiating part in conjunction with the interconnecting piece, the interconnecting piece and the radiating part material are different thermoplastic material.This
One shells is via the interconnecting piece to form accommodating space in conjunction with second shells.Whereby, the interconnecting piece and second shells
In conjunction with can be without considering the heat sinking function of the radiating part in design principle, and the material selection of the radiating part can focus on heat dissipation
Function, without considering that the combination of the interconnecting piece and second shells designs.Also, the interconnecting piece and the radiating part are thermoplasticity material
Material, can be easily formed any shape, the combination being also conducive between the two.Therefore, the device of the invention shell can have both shells
In conjunction with design and heat sinking function, the double-barreled question in prior art is effectively solved.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1 is the schematic diagram according to the electronic device of the embodiment of the present invention.
Fig. 2 is the explosive view of electronic device in Fig. 1.
The sectional view that Fig. 3 is X-X along electronic device in Fig. 1.
Fig. 4 is the first radiating part enlarged drawing according to the embodiment in Fig. 2 at circle A.
Fig. 5 is the first radiating part enlarged drawing according to the embodiment in Fig. 2 at circle A.
Fig. 6 is the first radiating part enlarged drawing according to the embodiment in Fig. 2 at circle A.
Fig. 7 is the schematic diagram of the electronic device of the present invention according to another embodiment.
The sectional view that Fig. 8 is Y-Y along electronic device in Fig. 7.
Fig. 9 is the explosive view of the electronic device of the present invention according to another embodiment.
Figure 10 is the sectional view of electronic device in Fig. 9.
Specific embodiment
To make to have further understanding to the purpose of the present invention, construction, feature and its function, hereby cooperate embodiment detailed
It is described as follows.
It please refers to Fig.1 to Fig.3.Fig. 1 is the schematic diagram according to the electronic device of the embodiment of the present invention；Fig. 2 is electronics in Fig. 1
The explosive view of device；The sectional view that Fig. 3 is X-X along electronic device in Fig. 1.Electronic device 1 according to an embodiment of the present invention, example
Such as, but not limited to, power-supply adapter it includes device housing 12 and accommodates at least one electronic building brick 14 in it (such as but not
It is limited to be formed with a circuit board module, to simplify schema, is showed in Fig. 3 with single entities).Device housing 12 includes first
Shells 122 and the second shells 124, the first shells 122 and the second shells 124 are combined to form an accommodating space 120, to accommodate
At least one electronic building brick 14.First shells 122 include first connecting portion 1222 and combined with first connecting portion 1222 the
One radiating part 1224, first connecting portion 1222 and 1224 material of the first radiating part are different thermoplastic material, therefore in practical behaviour
In work, first connecting portion 1222 can be formed with the first radiating part 1224 by shoot mode, such as leading injection molding first radiates
Portion 1224, then formed and the integrally formed first connecting portion 1222 of the first radiating part 1224 in a manner of being embedded to and projecting.
Second shells 124 includes second connecting portion 1242 and the second radiating part 1244 combined with second connecting portion 1242,
Second connecting portion 1242 and 1244 material of the second radiating part are different thermoplastic material.Similarly, in practical operation, second
Interconnecting piece 1242 can be formed with the second radiating part 1244 by shoot mode, such as the second radiating part of leading injection molding 1244, then
It is formed and the integrally formed second connecting portion 1242 of the second radiating part 1244 in a manner of being embedded to and projecting.First shells 122 and
Two shells 124 are combined via first connecting portion 1222 with second connecting portion 1242.In addition, in this present embodiment, device housing 12
Also having two opening 120a, (another side opening is not depicted in Fig. 1, is such as, but not limited to connected by first connecting portion 1222 and second
Socket part 1242 is collectively formed), so that electronic building brick 14 is connect with external device (ED)；Such as a socket is provided at opening 120a
(such as be fixed on the circuit board of electronic building brick 14 and engage with opening 120a), is equipped with cable in another opening
(such as connect with the circuit board of electronic building brick 14 and wear another opening via protective ring).
In this present embodiment, in the first shells 122, first connecting portion 1222 is used to connect with 124 structure of the second shells,
First radiating part 1224 is used to radiate to electronic building brick 14.It is different with 1224 material of the first radiating part by first connecting portion 1222
Characteristic, first connecting portion 1222 and the first radiating part 1224 can respectively select suitable material to make, to play respective function
Energy.This characteristic also can increase the design flexibility of the first shells 122, design comprising material selection, structure.Such as first connecting portion
1222 materials also can easily radiate with first for thermoplastic material (such as, but not limited to ABS, PC, PC/ABS close glue etc.) convenient for shaping
Portion 1224 combines (such as projecting by embedment).In another example 1224 material of the first radiating part be containing multiple conductive particles (such as
But be not limited to AlN, SiC, Al2O3, graphite, fibrous high thermal conductivity carbon dust, flakey high thermal conductivity carbon dust etc.) thermoplastic material (example
Such as, but not limited to, PPS, PA6/PA66 close glue, LCP, TPE, PC, PP, PPA, PEEK etc.).In general, first connecting portion 1222
Electrical insulating property is all had with the first radiating part 1224,1224 hardness of the first radiating part is greater than first connecting portion 1222, and first connects
Socket part 1222 is easy to moulding compared to the first radiating part 1224.In addition, the first radiating part 1224 is also conducive to lifting device shell
12 structural strength.Similarly, different with 1244 material of the second radiating part by second connecting portion 1242 in the second shells 124
Characteristic, second connecting portion 1242 and the second radiating part 1244 can respectively select suitable material to make, to play respective function
Energy.Illustrate about other of second connecting portion 1242 and the second radiating part 1244, it can direct mutually speaking on somebody's behalf refering to the first shells 122
It is bright, it does not repeat separately.
In addition, contact area, interference can be increased between first connecting portion 1222 and the first radiating part 1224 in practical operation
Structure is to increase the bond strength after being embedded to jetting process to each other.First radiating part 1224 has periphery 1224a and setting
In the occlusion structure of periphery 1224a, the first radiating part 1224 is combined via periphery 1224a with first connecting portion 1222, so that the
One interconnecting piece 1222 is mutually combined closely with the occlusion structure.Such as in embodiment, the occlusion structure is by multiple (triangles)
Sawtooth 1224b forms (or can be formed by multiple rectangular or dovetail sawtooth), as shown in Figure 4.In another example in other embodiments,
The occlusion structure is by multiple through-hole 1224c implementations (or can be also not limited to round hole by blind hole implementation), as shown in Figure 5.In another example
In other embodiments, groove 1224d which is extended by peripherally 1224a other, as shown in Figure 6.Again or this is stung
Close structure can by knurled surfaces, in different directions (such as perpendicular to periphery 1224a extend direction) multiple protrusion shapes outstanding
At or have both the structures of a variety of aforementioned occlusion structures and formed, do not repeat separately.Similarly, preceding description is also applicable to the second connection
Combination between portion 1242 and the second radiating part 1244, does not repeat separately.
In addition, in practical operation, the combination of first connecting portion 1222 and second connecting portion 1242 can be engaged by structure,
The modes such as gluing or ultrasonic welding are realized.Wherein, in practical operation, first connecting portion 1222 and second connecting portion 1242
Multiple welding convex blocks (being illustrated in Fig. 2 with dotted line) can be formed in junction therein, in favor of ultrasonic welding.Due to first
Interconnecting piece 1222 and second connecting portion 1242 are different with the first radiating part 1224 and 1244 material of the second radiating part respectively, and first connects
Material production appropriate, such as the plastics of same material can be selected in socket part 1222 and second connecting portion 1242, molten conducive to ultrasonic
It connects；But invention is not limited thereto.
In addition, in this present embodiment, the first radiating part 1224 includes flat part 12242 and from the opposite of flat part 12242
The two side walls portion 12244 that two sides extend towards the bending of 124 side of the second shells, so that the first radiating part 1224 is in a U on the whole
Shape structure, this is also conducive to be promoted the first radiating part 1224 itself and the whole structural strength of first shell 122, also can increase the
The heat sinking benefit of one radiating part 1224.
In this present embodiment, the first shells 122 and the second shells 124 generally symmetrical configuration, but in practical operation not with
This is limited.Please refer to Fig. 7 and Fig. 8.In other embodiments, electronic device 3 is roughly the same with 1 structure of aforementioned electronic, therefore
Electronic device 3 continues to use the component symbol of electronic device 1 in principle, about other explanations of electronic device 3, please directly refering to electronics
The related description and its variation of device 1, do not repeat separately.In the device housing 32 of electronic device 3, the of the first shells 322
One radiating part 3224 includes thermal conductive contact portion 32242 and fin structure 32244 (including at least one fin).Thermal conductive contact portion
32242 is prominent (protruding inwardly) towards accommodating space 120, can contact electronic building brick 14 (such as control chip, coil transformation
Device) to increase heat conduction efficiency；In practical operation, it can be filled out between thermal conductive contact portion 32242 and the electronic building brick contacted 14
Heat-conducting glue is filled, to increase heat conduction efficiency.Fin structure 32244 extends outwardly, and can increase radiating efficiency；In practical operation,
The fin is not limited with plate, such as column also may be used.
In addition, referring to Fig. 2, in electronic device 1, first connecting portion 1222 it is annular in shape and have the first side 1222a and
Relative to second side 1222b of the first side 1222a, the first radiating part 1224 is bound to the first side 1222a, 124 knot of the second shells
It is bonded to second side 1222b.Wherein, the first shells 122 and the second shells 124 are only via first connecting portion 1222 and second connecting portion
1242 combine, but invention is not limited thereto.Please refer to Fig. 9 and Figure 10.In other embodiments, electronic device 5 and aforementioned electricity
1 structure of sub-device is roughly the same, therefore electronic device 5 continues to use the component symbol of electronic device 1 in principle, about electronic device 5
Other explanations, do not repeat separately refering to the related description and its variation of electronic device 1 directly please.Wherein, the appearance of electronic device 5
Figure can directly refering to fig. 1, and the profile position of Figure 10 is equivalent to Fig. 1 middle line X-X.In electronic device 5, first connecting portion 5222
With opening 5222a, the first radiating part 5224 has groove 5224a, groove 5224a aligned openings 5222a, so that in first shell
Before part 522 is combined with the second shells 524, groove 5224a can expose from opening 5222a.In the first shells 522 and the second shells
When 524 combination, second connecting portion 5242 can contact groove 5224a via opening 5222a；In other words, in the first shells 522 and
After two shells 524 combine, second connecting portion 5242 is combined with first connecting portion 5222 and the first radiating part 5224 simultaneously, and is open
The presence of 5222a and groove 5224a increase the combination contact area of the first shells 522 and the second shells 524, also increase two
The contained effect of the structure of person.In this present embodiment, opening 5222a it is identical as groove 5224a profile, but the present invention not as
Limit.Such as opening 5222a profile is less than groove 5224a (opening) profile, can increase the first shells 522 and the second shells 524
In conjunction with the degree of the constructive interference between rear second connecting portion 5242 and first connecting portion 5222.
In conclusion the device of the invention shell includes the first shells and the second shells.First shells includes interconnecting piece
And the radiating part in conjunction with the interconnecting piece, the interconnecting piece and the radiating part material are different thermoplastic material.First shells
Via the interconnecting piece to form accommodating space in conjunction with second shells.Whereby, the combination of the interconnecting piece and second shells is set
Meter can be not necessarily to consider the heat sinking function of the radiating part in principle, and the material selection of the radiating part can focus on heat sinking function,
Without considering that the combination of the interconnecting piece and second shells designs.Also, the interconnecting piece and the radiating part are thermoplastic material, it can
It is easily formed any shape, the combination being also conducive between the two.Therefore, the device of the invention shell can have both shells combination and set
Meter and heat sinking function effectively solve the double-barreled question in prior art.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding changes and modifications, but these corresponding changes and modifications can be made according to the present invention by knowing those skilled in the art
All it should fall within the scope of protection of the appended claims of the present invention.
Claims (10)
1. a kind of device housing, characterized by comprising:
First shells, first shells include first connecting portion and the first radiating part in conjunction with the first connecting portion, this first
Interconnecting piece and the first radiating part material are different thermoplastic material；And
Second shells, first shells is via the first connecting portion to form accommodating space in conjunction with second shells.
2. device housing as described in claim 1, which is characterized in that the first connecting portion is annular in shape and has the first side and phase
For second side of first side, which is bound to first side, which is bound to second side.
3. device housing as claimed in claim 2, which is characterized in that second shells include second connecting portion and with this second
The second radiating part that interconnecting piece combines, the second connecting portion and the second radiating part material are different thermoplastic material, this
One shells be combined with each other with second shells via the first connecting portion and the second connecting portion.
4. device housing as claimed in claim 2, which is characterized in that the first connecting portion has opening, first radiating part
With groove, which is aligned the opening, which contacts the groove via the opening.
5. device housing as described in claim 1, which is characterized in that the opening is identical as the groove profile.
6. device housing as described in claim 1, which is characterized in that first radiating part has periphery and is set to the periphery
Occlusion structure, which mutually combines closely with the occlusion structure.
7. device housing as described in claim 1, which is characterized in that the first radiating part material is to contain multiple conductive particles
Thermoplastic material.
8. device housing as described in claim 1, which is characterized in that first radiating part includes thermal conductive contact portion, and direction should
Accommodating space is prominent.
9. device housing as described in claim 1, which is characterized in that first radiating part includes fin structure, is extended outwardly.
10. device housing as described in claim 1, which is characterized in that first radiating part has flat part and from the plate
The side wall portion that a side bending in portion extends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910231534.8A CN109952000A (en) | 2019-03-26 | 2019-03-26 | Device housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910231534.8A CN109952000A (en) | 2019-03-26 | 2019-03-26 | Device housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109952000A true CN109952000A (en) | 2019-06-28 |
Family
ID=67011811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910231534.8A Pending CN109952000A (en) | 2019-03-26 | 2019-03-26 | Device housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109952000A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309563A (en) * | 2007-05-15 | 2008-11-19 | 台达电子工业股份有限公司 | Housing connection construction of electronic apparatus |
| CN102216530A (en) * | 2008-11-19 | 2011-10-12 | 米歇尔·安吉里柯 | Anti-noise panel |
| CN103547111A (en) * | 2012-07-09 | 2014-01-29 | 光宝电子(广州)有限公司 | Planar heat radiation structure and electronic device |
| CN207883776U (en) * | 2018-02-27 | 2018-09-18 | 杭州本松新材料技术股份有限公司 | A kind of injection molding type battery case |
-
2019
- 2019-03-26 CN CN201910231534.8A patent/CN109952000A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309563A (en) * | 2007-05-15 | 2008-11-19 | 台达电子工业股份有限公司 | Housing connection construction of electronic apparatus |
| CN102216530A (en) * | 2008-11-19 | 2011-10-12 | 米歇尔·安吉里柯 | Anti-noise panel |
| CN103547111A (en) * | 2012-07-09 | 2014-01-29 | 光宝电子(广州)有限公司 | Planar heat radiation structure and electronic device |
| CN207883776U (en) * | 2018-02-27 | 2018-09-18 | 杭州本松新材料技术股份有限公司 | A kind of injection molding type battery case |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20190628 |