CN101306585B - Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine - Google Patents
Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine Download PDFInfo
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- CN101306585B CN101306585B CN2008101270483A CN200810127048A CN101306585B CN 101306585 B CN101306585 B CN 101306585B CN 2008101270483 A CN2008101270483 A CN 2008101270483A CN 200810127048 A CN200810127048 A CN 200810127048A CN 101306585 B CN101306585 B CN 101306585B
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- solvent
- adhesive
- scraper
- free
- glue
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000002904 solvent Substances 0.000 title claims abstract description 12
- 238000010030 laminating Methods 0.000 title 2
- 150000001875 compounds Chemical class 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims abstract description 30
- 239000000853 adhesive Substances 0.000 claims description 36
- 230000001070 adhesive effect Effects 0.000 claims description 36
- 238000013329 compounding Methods 0.000 claims description 22
- 238000007774 anilox coating Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000084 colloidal system Substances 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000007602 hot air drying Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract 4
- 238000007634 remodeling Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 11
- 238000012857 repacking Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a method for remodeling a common dry compound machine into a dry and solvent-free compound machine. The manner that a scraper of a glue spreading unit in the prior dry compound machine scrapes unwanted tackiness agents on a knurled roll from top to bottom is changed into the manner that the unwanted tackiness agents are scraped on the other side of the knurled roll from bottom to top. Two baffle plates are arranged between the scraper and the knurled roll, and the scraper, the baffle plates and the knurled roll form a new glue groove; a platen heater is arranged on the back surface of the scraper. The remodeled glue spreading unit not only can spread solvent type tackiness agents, but also can spread solvent-free tackiness agents, thereby leading the remodeled compound machine to not only execute the dry compound production, but also to realize the solvent-free compound production.
Description
Technical field
The present invention relates to a kind of technology reforming scheme of plastic sheeting composite production device, especially existing common dry method compounding machine repacking dry method, solvent free dual-purpose compounding machine method
Background technology
At present, known plastic sheeting composite production device mainly contain the dry method compounding machine, extrude compounding machine, solvent-free composite machine etc.Wherein, the dry method compounding machine is similar to the solvent-free composite machine combination process, all is to adopt rubber roll that adhesive is applied to a certain composite base material surface for the treatment of, fits with another base material then, obtains composite membrane through curing.Different is need behind the compound gluing of dry method in dry drying tunnel, the organic solvent in the adhesive is excluded again compound, and solvent-free be compounded in can directly carry out behind the gluing compound.Dry method compounding machine and solvent-free composite machine have much in common, and the both has two to unreel unit, a rolling unit, a coating unit, a recombiner unit.Difference is that the dry method compounding machine has dry drying tunnel, and solvent-free composite machine does not have.In addition, because the adhesive different in kind, both have than big-difference by coating unit.The adhesive that existing common dry method compounding machine uses is a solvent type adhesive, can use about 12 hours after deployed.Because of using the long period,, by scraper unnecessary adhesive is struck off then, again oven dry, compound so general employing of existing dry method compounding machine soaked an edition mode gluing (promptly adhesive is placed in the glue dish, the anilox roll Lower Half is immersed in the adhesive).And solvent-free compound general employing double component solvent-free adhesive, this adhesive, generally will react at deployed back about 20 minutes so reaction is very fast owing to do not contain solvent, and exhaustless words will be discarded in 20 minutes.Soak an edition mode gluing if adopt, because of the adhesive in the glue dish is with sordid, even add the reaction that new adhesive does not stop existing adhesive yet.So solvent-free compound, general glue groove volume is all very little, and the automatic glue supply machine of the general employing of glue allotment is now with the current.In sum, it is compound that solvent-free composite machine can not carry out dry method, and that the dry method compounding machine can not carry out is solvent-free compound.
Solvent-free compound owing to do not contain organic solvent in the used adhesive, than compound energy-saving and environmental protection, safety, the efficient height wanted of dry method, the product of producing does not have dissolvent residual aborning for it.But because the present at home production technology of solvent-free composite machine is still immature, fail to form large-scale production, and the import solvent-free composite machine costs an arm and a leg, this brings very big difficulty for solvent-free compound popularizing.
Summary of the invention
Can not carry out solvent-free compound shortcoming in order to overcome existing dry method compounding machine, the invention provides a kind of equipment modification method, by this method existing common dry method compounding machine be reequiped, it is compound to make it can not only carry out dry method, and can carry out solvent-free compound.
The present invention solves the scheme that its technical problem adopts: the scraper that will have dry method compounding machine coating unit now changes at the anilox roll opposite side and strikes off the unnecessary adhesive of anilox roll from bottom to top by striking off the unnecessary adhesive mode of anilox roll from top to bottom.Two baffle plates are installed between scraper and anilox roll, and scraper, baffle plate and anilox roll constitute new glue groove, are used to deposit unnecessary adhesive.Electric hot plate is equipped with at the scraper back side, by temperature controller control, by to the scraper heating, the adhesive temperature in the glue groove is raise, and to reduce the viscosity of solvent-free adhesive, is beneficial to coating.
Carrying out the dry method compound tense, the solvent type adhesive for preparing in the glue bucket is being delivered in the glue groove by pipeline, adjusting valve, controlling the adhesive flow velocity well, making adhesive can satisfy the gluing needs and don't overflow the glue groove according to machine speed.Open air intake machine, exhaust blower and hot air drying system, the solvent in the adhesive that is coated on the base material is fully vapored away, carry out compound with another base material again.
Carry out solvent-free compound tense, changing the anilox roll of a high line number, low depth according to the glue-spread needs.To be installed in glue groove top for the liquid level sensor and the mixed glue shower nozzle of colloid system, open for colloid system, for colloid system the double component solvent-free adhesive is injected mixed glue shower nozzle by two pipelines in proportion by liquid level sensor control, the glue groove reinjects after mixed glue shower nozzle mixes.Open electric hot plate as required.Do not need to open air intake machine, exhaust blower and hot air drying system, with the base material of coated solvent-free adhesive directly and another base material carry out compound.
The invention has the beneficial effects as follows that it is compound that the dry method compounding machine after the repacking not only can carry out dry method, and can carry out solvent-free compound.This method is simple, practical, and is workable.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is existing dry method compounding machine coating unit schematic diagram.
Fig. 2 is repacking back dry method, solvent free dual-purpose compounding machine coating unit schematic diagram.
Fig. 3 is an embodiment coating unit schematic diagram
Among the figure, 1. scraper, 2. anilox roll, 3. glue groove, 4. baffle plate, 5. electric hot plate, 6. thin axle, 7. active joint, 8. cylinder, 9. support, 10. worm gear, 11. thick axles, 12. worm screws.
The specific embodiment
In the embodiment shown in fig. 3, two baffle plates (4) are fixed on the thin axle (6), and thin axle (6) is fixed on two sidewall panels.Scraper (1) is connected by active joint (7) with two supports (9), and support (9) is fixed on the thick axle (11).Worm gear (10) is fixed on thick axle (11) one sides, and thick axle (11) is connected with two sidewall panels.Worm screw (12) is joined with worm gear (10), and is fixed on the framed side wallboard.Electric hot plate (5) is fixed on scraper (1) back side.Cylinder (8) one ends link to each other with support (9), and the other end is connected with scraper (1).
Claims (1)
1. a common dry method compounding machine is reequiped dry method, solvent free dual-purpose compounding machine method, and described common dry method compounding machine comprises electric-control system, supplies colloid system, glue groove, anilox roll; It is characterized in that: the scraper that will have dry method compounding machine coating unit now changes at the anilox roll opposite side and strikes off the unnecessary adhesive of anilox roll from bottom to top by striking off the unnecessary adhesive mode of anilox roll from top to bottom, two baffle plates are installed between scraper and anilox roll, scraper, baffle plate and anilox roll constitute new glue groove, be used to deposit unnecessary adhesive, electric hot plate is equipped with at the scraper back side, control by temperature controller, by scraper is heated, adhesive temperature in the glue groove is raise, to reduce the viscosity of solvent-free adhesive, be beneficial to coating; Carrying out the dry method compound tense, the solvent type adhesive for preparing in the glue bucket is delivered in the glue groove by pipeline, according to the machine speed control valve, control the adhesive flow velocity well, make adhesive can satisfy the gluing needs and don't overflow the glue groove, open air intake machine, exhaust blower and hot air drying system afterwards, the solvent in the adhesive that is coated on the base material is fully vapored away, carry out compound with another base material again; Carrying out solvent-free compound tense, change the anilox roll of a high line number, low depth according to the glue-spread needs, to be installed in glue groove top for the liquid level sensor and the mixed glue shower nozzle of colloid system, open for colloid system, for colloid system the double component solvent-free adhesive is injected mixed glue shower nozzle by two pipelines in proportion by liquid level sensor control, the glue groove reinjects after mixed glue shower nozzle mixes, open electric hot plate as required, do not need to open air intake machine, exhaust blower and hot air drying system, with the base material of coated solvent-free adhesive directly and another base material carry out compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101270483A CN101306585B (en) | 2008-06-19 | 2008-06-19 | Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101270483A CN101306585B (en) | 2008-06-19 | 2008-06-19 | Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101306585A CN101306585A (en) | 2008-11-19 |
| CN101306585B true CN101306585B (en) | 2011-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008101270483A Expired - Fee Related CN101306585B (en) | 2008-06-19 | 2008-06-19 | Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine |
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| CN (1) | CN101306585B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201442786A (en) * | 2013-05-14 | 2014-11-16 | Advanced Lithium Electrochemistry Co Ltd | Coating apparatus |
| CN103691641A (en) * | 2014-01-03 | 2014-04-02 | 无锡市金谷塑业有限公司 | Scaling gluing method for thin films |
| CN103911781B (en) * | 2014-03-07 | 2016-01-20 | 浙江华生经编新材料有限公司 | A kind of base cloth quetsch |
| CN110466236A (en) * | 2018-05-10 | 2019-11-19 | 无锡莱恩科技有限公司 | A kind of solar cell backboard manufacturing method and manufacture system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1308296A (en) * | 1969-03-11 | 1973-02-21 | Dufaylite Dev Ltd | Honeycomb materials |
| CN1640657A (en) * | 2004-01-08 | 2005-07-20 | 上海人民塑料印刷厂 | Solvenjt-free compounding process and its use for soft packaging field |
| CN200995125Y (en) * | 2007-01-26 | 2007-12-26 | 神力集团有限公司 | Double-component adhesive washer with metering and mixing functions for non-solvent composite apparatus |
-
2008
- 2008-06-19 CN CN2008101270483A patent/CN101306585B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1308296A (en) * | 1969-03-11 | 1973-02-21 | Dufaylite Dev Ltd | Honeycomb materials |
| CN1640657A (en) * | 2004-01-08 | 2005-07-20 | 上海人民塑料印刷厂 | Solvenjt-free compounding process and its use for soft packaging field |
| CN200995125Y (en) * | 2007-01-26 | 2007-12-26 | 神力集团有限公司 | Double-component adhesive washer with metering and mixing functions for non-solvent composite apparatus |
Non-Patent Citations (6)
| Title |
|---|
| 刘宁等."浅析无溶剂复合工艺".《国外塑料》.2006,第24卷(第1期),第42-45页. |
| 无."多功能涂布复合机".《印刷技术》.1999,第80页. |
| 朱建梁."未来趋势：水性和无溶剂粘合剂".《中国包装报》.2006, |
| 朱建梁."未来趋势:水性和无溶剂粘合剂".《中国包装报》.2006, * |
| 陈昌杰."无溶剂复合 一种值得倡导的塑料薄膜复合方法".《中国包装报》.2002, |
| 陈昌杰."无溶剂复合-一种值得高度关注的生产工艺".《塑料包装》.2005,第15卷(第6期),第23-28页. |
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| CN101306585A (en) | 2008-11-19 |
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Owner name: JIANGSU ZHENMEI PACKAGING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: LI YONGSHAN Effective date: 20120929 |
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Free format text: CORRECT: ADDRESS; FROM: 224001 YANCHENG, JIANGSU PROVINCE TO: 224171 YANCHENG, JIANGSU PROVINCE |
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Effective date of registration: 20120929 Address after: 224171, Xinfeng, Yancheng City province Jiangsu Dafeng Industrial Concentration Zone No. 2 Patentee after: JIANGSU ZHENMEI PACKAGING TECHNOLOGY CO., LTD. Address before: 224001, No. 108, army building East Road, Ting Hu District, Jiangsu, Yancheng City Patentee before: Li Yongshan |
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Granted publication date: 20111109 Termination date: 20180619 |
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| CF01 | Termination of patent right due to non-payment of annual fee |