CN101306585A - Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine - Google Patents

Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine Download PDF

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Publication number
CN101306585A
CN101306585A CNA2008101270483A CN200810127048A CN101306585A CN 101306585 A CN101306585 A CN 101306585A CN A2008101270483 A CNA2008101270483 A CN A2008101270483A CN 200810127048 A CN200810127048 A CN 200810127048A CN 101306585 A CN101306585 A CN 101306585A
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China
Prior art keywords
solvent
dry
scraper
laminating machine
free
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CNA2008101270483A
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Chinese (zh)
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CN101306585B (en
Inventor
李永山
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JIANGSU ZHENMEI PACKAGING TECHNOLOGY CO., LTD.
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李永山
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Priority to CN2008101270483A priority Critical patent/CN101306585B/en
Publication of CN101306585A publication Critical patent/CN101306585A/en
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Publication of CN101306585B publication Critical patent/CN101306585B/en
Expired - Fee Related legal-status Critical Current
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  • Coating Apparatus (AREA)

Abstract

The invention discloses a method for remodeling a common dry compound machine into a dry and solvent-free compound machine. The manner that a scraper of a glue spreading unit in the prior dry compound machine scrapes unwanted tackiness agents on a knurled roll from top to bottom is changed into the manner that the unwanted tackiness agents are scraped on the other side of the knurled roll from bottom to top. Two baffle plates are arranged between the scraper and the knurled roll, and the scraper, the baffle plates and the knurled roll form a new glue groove; a platen heater is arranged on the back surface of the scraper. The remodeled glue spreading unit not only can spread solvent type tackiness agents, but also can spread solvent-free tackiness agents, thereby leading the remodeled compound machine to not only execute the dry compound production, but also to realize the solvent-free compound production.

Description

Common dry method compounding machine repacking dry method, solvent free dual-purpose compounding machine method
Technical field
The present invention relates to a kind of technology reforming scheme of plastic sheeting composite production device, especially existing common dry method compounding machine repacking dry method, solvent free dual-purpose compounding machine method.
Background technology
At present, known plastic sheeting composite production device mainly contain the dry method compounding machine, extrude compounding machine, solvent-free composite machine etc.Wherein, the dry method compounding machine is similar to the solvent-free composite machine combination process, all is to adopt rubber roll that adhesive is applied to a certain composite base material surface for the treatment of, fits with another base material then, obtains composite membrane through curing.Different is need behind the compound gluing of dry method in dry drying tunnel, the organic solvent in the adhesive is excluded again compound, and solvent-free be compounded in can directly carry out behind the gluing compound.Dry method compounding machine and solvent-free composite machine have much in common, and the both has two to unreel unit, a rolling unit, a coating unit, a recombiner unit.Difference is that the dry method compounding machine has dry drying tunnel, and solvent-free composite machine does not have.In addition, because the adhesive different in kind, both have than big-difference by coating unit.So it is compound that solvent-free composite machine can not carry out dry method, and that the dry method compounding machine can not carry out is solvent-free compound.
Because do not contain organic solvent in the solvent-free compound used adhesive, than compound energy-saving and environmental protection, safety, the efficient height wanted of dry method, the product of producing does not have dissolvent residual aborning for it.But because the present at home production technology of solvent-free composite machine is still immature, fail to form large-scale production, and the import solvent-free composite machine costs an arm and a leg, this brings very big difficulty for solvent-free compound popularizing.
Summary of the invention
Can not carry out solvent-free compound shortcoming in order to overcome existing dry method compounding machine, the invention provides a kind of equipment modification method, by this method existing common dry method compounding machine be reequiped, it is compound to make it can not only carry out dry method, and can carry out solvent-free compound.
The present invention solves the scheme that its technical problem adopts: the scraper that will have dry method compounding machine coating unit now changes at the anilox roll opposite side and strikes off the unnecessary adhesive of anilox roll from bottom to top by striking off the unnecessary adhesive mode of anilox roll from top to bottom.Two baffle plates are installed between scraper and anilox roll, and scraper, baffle plate and anilox roll constitute new glue groove, are used to deposit unnecessary adhesive.Electric hot plate is equipped with at the scraper back side, by temperature controller control, by to the scraper heating, the adhesive temperature in the glue groove is raise, and to reduce the viscosity of solvent-free adhesive, is beneficial to coating.
Carrying out the dry method compound tense, the solvent type adhesive for preparing in the glue bucket is being delivered in the glue groove by pipeline,, controlling the adhesive flow velocity well, making adhesive can satisfy the gluing needs and don't overflow the glue groove according to the machine speed control valve.Open air intake machine, exhaust blower and hot air drying system, the solvent in the adhesive that is coated on the base material is fully vapored away, carry out compound with another base material again.
Carry out solvent-free compound tense, changing the anilox roll of a high line number, low depth according to the glue-spread needs.To be installed in glue groove top for the liquid level sensor and the mixed glue shower nozzle of colloid system.Open for colloid system, the double component solvent-free adhesive is injected by two pipelines in proportion for colloid system by liquid level sensor control and mix the glue shower nozzle, the glue groove reinjects after mixed glue shower nozzle mixes.Open electric hot plate as required.Do not need to open air intake machine, exhaust blower and hot air drying system.With the base material of coated solvent-free adhesive directly and another base material carry out compound.
The invention has the beneficial effects as follows that it is compound that the dry method compounding machine after the repacking not only can carry out dry method, and can carry out solvent-free compound.This method is simple, practical, and is workable.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is existing dry method compounding machine coating unit schematic diagram.
Fig. 2 is repacking back dry method, solvent free dual-purpose compounding machine coating unit schematic diagram.
Fig. 3 is an embodiment coating unit schematic diagram
Among the figure, 1. scraper, 2. anilox roll, 3. glue groove, 4. baffle plate, 5. electric hot plate, 6. thin axle, 7. active joint, 8. cylinder, 9. support, 10. worm gear, 11. thick axles, 12. worm screws.
The specific embodiment
In the embodiment shown in fig. 3, two baffle plates (4) are fixed on the thin axle (6), and thin axle (6) is fixed on two sidewall panels.. scraper (1) is connected by active joint (7) with two supports (9), and support (9) is fixed on the thick axle (11).Worm gear (10) is fixed on thick axle (11) one sides, and thick axle (11) is connected with two sidewall panels.Worm screw (12) is joined with worm gear (10), and is fixed on the framed side wallboard.Electric hot plate (5) is fixed on scraper (1) back side.Cylinder (8) one ends link to each other with support (9), and the other end is connected with scraper (1).

Claims (1)

1. a common dry method compounding machine is reequiped dry method, solvent free dual-purpose compounding machine method, it is characterized in that: the scraper that will have dry method compounding machine coating unit now changes at the anilox roll opposite side and strikes off the unnecessary adhesive of anilox roll from bottom to top by striking off the unnecessary adhesive mode of anilox roll from top to bottom, two baffle plates are housed between scraper and the anilox roll, and electric hot plate is equipped with at the scraper back side.
CN2008101270483A 2008-06-19 2008-06-19 Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine Expired - Fee Related CN101306585B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008101270483A CN101306585B (en) 2008-06-19 2008-06-19 Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008101270483A CN101306585B (en) 2008-06-19 2008-06-19 Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine

Publications (2)

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CN101306585A true CN101306585A (en) 2008-11-19
CN101306585B CN101306585B (en) 2011-11-09

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CN2008101270483A Expired - Fee Related CN101306585B (en) 2008-06-19 2008-06-19 Process for refitting general dry laminating machine to be dry and solvent free dual-purpose laminating machine

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103691641A (en) * 2014-01-03 2014-04-02 无锡市金谷塑业有限公司 Scaling gluing method for thin films
CN103911781A (en) * 2014-03-07 2014-07-09 浙江华生经编新材料有限公司 Base cloth sizing device
CN104148234A (en) * 2013-05-14 2014-11-19 台湾立凯电能科技股份有限公司 Application device
CN110466236A (en) * 2018-05-10 2019-11-19 无锡莱恩科技有限公司 A kind of solar cell backboard manufacturing method and manufacture system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1308296A (en) * 1969-03-11 1973-02-21 Dufaylite Dev Ltd Honeycomb materials
CN1640657A (en) * 2004-01-08 2005-07-20 上海人民塑料印刷厂 Solvenjt-free compounding process and its use for soft packaging field
CN200995125Y (en) * 2007-01-26 2007-12-26 神力集团有限公司 Double-component adhesive washer with metering and mixing functions for non-solvent composite apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104148234A (en) * 2013-05-14 2014-11-19 台湾立凯电能科技股份有限公司 Application device
CN104148234B (en) * 2013-05-14 2017-01-11 英属盖曼群岛商立凯电能科技股份有限公司 Application device
CN103691641A (en) * 2014-01-03 2014-04-02 无锡市金谷塑业有限公司 Scaling gluing method for thin films
CN103911781A (en) * 2014-03-07 2014-07-09 浙江华生经编新材料有限公司 Base cloth sizing device
CN110466236A (en) * 2018-05-10 2019-11-19 无锡莱恩科技有限公司 A kind of solar cell backboard manufacturing method and manufacture system

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Owner name: JIANGSU ZHENMEI PACKAGING TECHNOLOGY CO., LTD.

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Effective date of registration: 20120929

Address after: 224171, Xinfeng, Yancheng City province Jiangsu Dafeng Industrial Concentration Zone No. 2

Patentee after: JIANGSU ZHENMEI PACKAGING TECHNOLOGY CO., LTD.

Address before: 224001, No. 108, army building East Road, Ting Hu District, Jiangsu, Yancheng City

Patentee before: Li Yongshan

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111109

Termination date: 20180619