CN101304857A - Resin molding process and resin molding apparatus - Google Patents

Resin molding process and resin molding apparatus Download PDF

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Publication number
CN101304857A
CN101304857A CNA2006800422967A CN200680042296A CN101304857A CN 101304857 A CN101304857 A CN 101304857A CN A2006800422967 A CNA2006800422967 A CN A2006800422967A CN 200680042296 A CN200680042296 A CN 200680042296A CN 101304857 A CN101304857 A CN 101304857A
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China
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mentioned
thermoplastic resin
electromagnetic wave
resin
shaping mould
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CNA2006800422967A
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Chinese (zh)
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CN101304857B (en
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栗原文夫
高见正光
阿部公一
矾慎一
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TAKANON RESIN CO Ltd
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TAKANON RESIN CO Ltd
Nihon Rex Co Ltd
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Priority claimed from JP2006037674A external-priority patent/JP4234142B2/en
Priority claimed from JP2006037675A external-priority patent/JP4234143B2/en
Priority claimed from JP2006189411A external-priority patent/JP4252586B2/en
Priority claimed from JP2006223352A external-priority patent/JP2008044271A/en
Application filed by TAKANON RESIN CO Ltd, Nihon Rex Co Ltd filed Critical TAKANON RESIN CO Ltd
Priority claimed from PCT/JP2006/322703 external-priority patent/WO2007058184A1/en
Publication of CN101304857A publication Critical patent/CN101304857A/en
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Publication of CN101304857B publication Critical patent/CN101304857B/en
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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention relates to a resin molding process of charging a thermoplastic resin (3) into a cavity (21) of a rubber-made mold (2) and cooling the resin (3) to form a molding and a resin molding apparatus (1). In charging the thermoplastic resin (3) into the cavity (21), an electromagnetic wave generator (4) is used and the thermoplastic resin (3) is heated selectively against the mold (2) by irradiating the resin (3) with an electromagnetic wave having an intensity peak within the wavelength region of 0.78 to 2[mu]m from the outside of the mold (2). ABS resin, which is a noncrystalline and rubber-modified thermoplastic resin, is used as the thermoplastic resin (3).

Description

Resin molding method and resin forming device
Technical field
The present invention relates to obtain the resin molding method and the resin forming device of synthetic resin by thermoplastic resin.
Background technology
Thermoplastic resin can be made moulding product back and be used by various forming method moulding.According to the height of crystallinity, amorphism or melt viscosity, further come the actual various forming methods such as injection moulding, blow molding, extrusion molding, pressure forming that use according to the shape of moulding product.
Yet, according to kind, the moulding product shape of thermoplastic resin,, make melt viscosity uprise because the temperature of thermoplastic resin reduces in moulding, obtain target moulding product and just become difficult.Therefore, in order to improve this point, the shaping mould that molds the moulding product (metal pattern) with the method for heating such as heater for well-known.
In addition, for example in the resin molding method of patent documentation 1, disclose, then made this thermoplastic resin cool off the method that obtains injection-molded article the intracavitary administration of the thermoplastic resin of fusion to the shaping mould made from silicon rubber.And, be purpose with simple manufacturing surface accuracy, the good synthetic resin of surface smoothness, the composition of the shaping mould of silicon rubber system is studied.
But, in above-mentioned existing resin molding method, especially to locate in the end in filling thermoplastic resin's chamber etc., the temperature of the thermoplastic resin of moulding sometimes can descend, and makes this thermoplastic resin viscosity rise.In this case, thermoplastic resin may take place in the chamber of shaping mould fills bad.
In addition, in patent documentation 1, the heat resisting temperature of silicon rubber for example is about 200 ℃, and when improving heating-up temperature such as heater in order to prevent that resin temperature from reducing, the shaping mould that might produce silicon rubber system is aging, by the problem of the appearance variation of the moulding product of this shaping mould moulding.
In addition, for example in the manufacture method and device thereof of the synthetic resin of patent documentation 2, drop into metal granular or powdery and support by the arm and expect and thermoplastic resin when obtaining moulded products in framed, the METAL HEATING PROCESS mechanism of material can the point type heating of metal be supported by the arm in use.In this manufacture method, make microwave or electromagnetic wave etc. be radiated at metal in framed by METAL HEATING PROCESS mechanism and support by the arm material and go up and make this metal to support by the arm the material heating, utilize this metal to support by the arm after the material heating comes softening or melt thermoplastic resin in framed the extrusion forming synthetic resin.
But the technology of patent documentation 2 is that heating of metal is supported by the arm the technology of material selectively, rather than technology that can heating thermoplastic resin self.In addition, when carrying out heating that metal supports by the arm material, framedly also be heated simultaneously with METAL HEATING PROCESS mechanism.Therefore, can too not heat framed, heating thermoplastic resin optionally.
In addition, the method for carrying out the filling molding of thermoplastic resin with the vacuum impregnating modulus method is for example disclosed in patent documentation 3.
Patent documentation 1:(Japan) spy opens flat 7-178754 communique
Patent documentation 2:(Japan) spy opens flat 10-193370 communique
Patent documentation 3:(Japan) spy opens the 2002-59468 communique
Summary of the invention
The present invention proposes in view of existing problem, provide a kind of can be at the shaping mould of rubber system thermoplastic resin, the resin molding method that can obtain good synthetic resin and the resin forming device in the heating chamber optionally.
First the invention be in the shaping mold cavity of rubber system the filling thermoplastic resin, cool off the resin molding method that this thermoplastic resin obtains synthetic resin,
When filling thermoplastic resin in above-mentioned chamber, to the electromagnetic wave that above-mentioned thermoplastic resin illumination wavelength is 0.78～2 μ m, heat this thermoplastic resin from this shaping mould surface.
Resin molding method of the present invention is such method,, uses the shaping mould of rubber system that is, when synthetic resin that moulding is made by thermoplastic resin, and shaping mould heating thermoplastic resin selectively relatively.
That is, when the moulding synthetic resin, filling thermoplastic resin in the shaping mold cavity of rubber system.Then, when this is filled, be the electromagnetic wave (below, be sometimes referred to as wavelength and be the following near infrared rays of 2 μ m) of 0.78～2 μ m from shaping mould surface lateral thermoplastic resin illumination wavelength.At this moment, because the physical property of the rubber of formation shaping mould and thermoplastic resin is different, compare with the shaping mould of rubber system, significantly the heating thermoplastic resin.
Thus, during the end-of-fill of filling thermoplastic resin in above-mentioned chamber, can keep thermoplastic resin temperature in the chamber than shaping mould temperature height.
Therefore, by resin molding method of the present invention, with respect to the shaping mould of the rubber system thermoplastic resin in the heating chamber selectively, and it is bad to prevent in the chamber filling of thermoplastic resin, obtains good synthetic resin.
In addition, utilizing above-mentioned wavelength is the following near infrared rays of 2 μ m, compares with the shaping mould of above-mentioned rubber system, as the reason that can heat above-mentioned thermoplastic resin selectively, can consider as follows.
That is, can think the following near infrared ray of the lip-deep above-mentioned wavelength 2 μ m of shaping mould of the rubber system of being radiated at respect in the reflection of shaping mould surface or see through the big situation of ratio of shaping mould, the ratio that is absorbed by thermoplastic resin is big.Therefore, can think that the energy of the light that produced by the near infrared ray below the wavelength 2 μ m is preferentially absorbed by thermoplastic resin, selectively the heating thermoplastic resin.
Second the invention be a kind of resin forming device, it has: be formed for the filling thermoplastic resin the chamber rubber system shaping mould and
The electromagnetic wave that is 0.78～2 μ m from this shaping mould surface to above-mentioned thermoplastic resin illumination wavelength when filling above-mentioned thermoplastic resin in above-mentioned chamber heats the electromagnetic wave generating mechanism of this thermoplastic resin.
Resin forming device of the present invention be to use rubber system shaping mould, mold the device of the synthetic resin that constitutes by the thermoplastic resin resin, can be with respect to shaping mould heating thermoplastic resin selectively.
That is, resin forming device of the present invention has the shaping mould of above-mentioned rubber system and shines the electromagnetic electromagnetic wave generating mechanism that above-mentioned wavelength is 0.78～2 μ m.And, when filling thermoplastic resin in the chamber of the shaping mould of rubber system,, shine near infrared ray below the above-mentioned wavelength 2 μ m from the shaping mould surface to thermoplastic resin by the electromagnetic wave generating mechanism.At this moment, because the physical property of the rubber of formation shaping mould and thermoplastic resin is different, compare with the shaping mould of rubber system, significantly the heating thermoplastic resin.
Thus, during the end-of-fill of filling thermoplastic resin in above-mentioned chamber, can keep the temperature height of the temperature of the thermoplastic resin in the chamber than shaping mould.
Therefore, by resin forming device of the present invention, with respect to the shaping mould of rubber system, the thermoplastic resin in the heating chamber can prevent that the filling of generation thermoplastic resin is bad in the chamber selectively, obtains good synthetic resin.
In addition,, compare,, think identical with the first aspect of foregoing invention as the reason that can heat above-mentioned thermoplastic resin selectively with the shaping mould of above-mentioned rubber system with the following near infrared ray of above-mentioned wavelength 2 μ m.
Description of drawings
Fig. 1 is the resin forming schematic representation of apparatus among the expression embodiment 1.
Fig. 2 gets wavelength (nm) to be the longitudinal axis, the expression curve map about the transmitance of the light of transparent silicon rubber and translucent silicon rubber for the transmitance (%) of transverse axis, light in embodiment 1.
Fig. 3 is the resin forming schematic representation of apparatus among the expression embodiment 2.
Fig. 4 is illustrated among the embodiment 3 the resin forming schematic representation of apparatus before the filling thermoplastic resin in shaping mould.
Fig. 5 is illustrated in the resin forming schematic representation of apparatus that makes the state that falls in the resin acceptance division of resin solid bodies in being arranged at shaping mould among the embodiment 3.
Fig. 6 is the resin forming schematic representation of apparatus that is illustrated in the state that carries out the filling thermoplastic resin among the embodiment 3 in shaping mould.
Fig. 7 is the stereogram that is illustrated in the resin solid bodies among the embodiment 3.
Fig. 8 is the resin forming schematic representation of apparatus of filling thermoplastic resin's state in shaping mould that is illustrated among the embodiment 4.
Fig. 9 is illustrated in the resin forming schematic representation of apparatus of using in the validation test 1.
Figure 10 is the generalized section of the resin forming device of the state of having filled thermoplastic resin in the chamber of shaping mould among the expression embodiment 5.
Figure 11 is in the chamber of shaping mould the generalized section of the resin forming device of state filling thermoplastic resin before of expression among the embodiment 5.
Figure 12 is the schematic diagram of the formation state in the chamber in the shaping mould of representing among the embodiment 5.
Figure 13 is the schematic perspective view of the formation state in the chamber in the shaping mould of representing among the embodiment 5.
Figure 14 is the schematic diagram of representing under the open mode of the different another kind of shaping mould of the parting line in embodiment 5.
Figure 15 is the generalized section of the resin forming device among the expression embodiment 6.
Figure 16 is the generalized section of the another kind of resin forming device among the expression embodiment 6.
Figure 17 is the generalized section of the another kind of resin forming device among the expression embodiment 6.
Figure 18 is the generalized section of the resin forming device of the state of having filled thermoplastic resin in the chamber of shaping mould among the expression embodiment 7.
Figure 19 is in the chamber of shaping mould the generalized section of the resin forming device of state filling thermoplastic resin before of expression among the embodiment 7.
Figure 20 is the generalized section of the wave filter periphery in the pressure vessel of representing among the embodiment 7.
Figure 21 is the schematic diagram of the formation state in the chamber in the shaping mould of representing among the embodiment 7.
Figure 22 is the curve map that wavelength (nm) is formed the transmitance of the light in the wave filter in the thick gap (moisture film) of 1mm in embodiment 7 as transverse axis, the transmitance of light (%) as the longitudinal axis, expression.
Figure 23 is the curve map that wavelength (nm) is formed the transmitance of the light in the wave filter in the thick gap (moisture film) of 3mm in embodiment 7 as transverse axis, the transmitance of light (%) as the longitudinal axis, expression.
Figure 24 is illustrated among the embodiment 7 generalized section that external container side in the transparent window portion that is made of withstand voltage glass sets the resin forming device that wave filter forms.
The specific embodiment
Describe with regard to the preferred implementation in above-mentioned first, second invention.
In above-mentioned first, second invention, as to via the electromagnetic wave of above-mentioned shaping mould, be not only the electromagnetic wave that wavelength is 0.78～2 mu m range to above-mentioned thermoplastic resin irradiation, also can comprise its electromagnetic wave of scope in addition.At this moment, by shaping mould to the electromagnetic wave of thermoplastic resin irradiation or see through electromagnetic wave preferably comprise wavelength be 0.78～2 mu m range electromagnetic wave its in addition more than the electromagnetic wave of scope.
In above-mentioned first, second invention, electromagnetic wave generating sources such as above-mentioned electromagnetic wave generating mechanism can use not only ground use a plurality of.In addition, in above-mentioned shaping mould, can also shine above-mentioned electromagnetic wave from a plurality of directions not only from a direction.
In first invention, when filling thermoplastic resin in above-mentioned chamber, use ejaculation wavelength is the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and makes wavelength surpass the wave filter of the electromagnetic transit dose minimizing of 2 μ m, can make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, shining to above-mentioned thermoplastic resin via above-mentioned shaping mould, heat this thermoplastic resin through the electromagnetic wave that sees through behind this wave filter.
In addition, in second invention, above-mentioned resin forming device has that to penetrate wavelength be that the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and the wavelength that makes that is configured between this electromagnetic wave generating mechanism and the above-mentioned shaping mould surpass the wave filter of the electromagnetic transit dose minimizing of 2 μ m, when in above-mentioned chamber, filling above-mentioned thermoplastic resin, can make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, make through the electromagnetic wave that sees through behind this wave filter and shine to above-mentioned thermoplastic resin via above-mentioned shaping mould.
Under above-mentioned these situations, when filling thermoplastic resin in the chamber of the shaping mould of rubber system, penetrating wavelength from the electromagnetic wave generating mechanism is the electromagnetic wave of 0.78～4 μ m, makes through the electromagnetic wave that sees through behind the wave filter, shines to thermoplastic resin via shaping mould.Then, the electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism, comprise the electromagnetic wave that wavelength surpasses 2 μ m, but owing to used wave filter, the electromagnetic wave that wavelength surpasses 2 μ m can not shine shaping mould as far as possible yet.Thus, for the thermoplastic resin in the chamber that is filled in shaping mould, illumination wavelength is the following near infrared rays of 2 μ m effectively.Therefore, utilize the following near infrared ray of wavelength 2 μ m, can be not too hot briquetting mould, heating thermoplastic resin effectively.
In addition, in first invention, comprise: the vacuum process that makes vacuum state in the shaping mold cavity of rubber system, in the chamber of above-mentioned vacuum state, fill the filling work procedure of the thermoplastic resin of molten condition, cool off the refrigerating work procedure that thermoplastic resin in the above-mentioned chamber obtains synthetic resin; In above-mentioned filling work procedure, can heat this thermoplastic resin by above-mentioned shaping mould to the electromagnetic wave that above-mentioned thermoplastic resin illumination wavelength is 0.78～2 μ m.
In addition, in second invention, above-mentioned resin forming device has the vacuum mechanism that makes formation vacuum state in the above-mentioned chamber and penetrates wavelength is the electromagnetic electromagnetic wave generating mechanism of 0.78～2 μ m, when in the above-mentioned chamber that makes vacuum state with above-mentioned vacuum mechanism, filling above-mentioned thermoplastic resin, can shine above-mentioned electromagnetic wave to above-mentioned thermoplastic resin by this shaping mould.
Under above these situations,, can make thermoplastic resin fully spread all over chamber integral body by forming vacuum state in the chamber.
In addition, so-called vacuum state is not only meaned the state of absolute vacuum, as long as can the filling thermoplastic resin, also comprises decompression state ground and is called vacuum state.
In addition, in first invention, comprise: rubber is made the vacuum process that makes vacuum state in the chamber of pattern, in the chamber of above-mentioned vacuum state, filled the filling work procedure of the thermoplastic resin of molten condition, cool off the refrigerating work procedure that thermoplastic resin in the above-mentioned chamber obtains synthetic resin; In above-mentioned filling work procedure, can use and penetrate wavelength is the wave filter that the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and the electromagnetic transit dose that makes wavelength surpass 2 μ m reduce, make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, shine through the electromagnetic wave that sees through behind this wave filter to above-mentioned thermoplastic resin through above-mentioned shaping mould, heat this thermoplastic resin.
In addition, in second invention, above-mentioned resin forming device has makes the vacuum mechanism that becomes vacuum state in the above-mentioned chamber, penetrating wavelength is the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m, and be configured in and make wavelength surpass the wave filter that the electromagnetic transit dose of 2 μ m reduces between this electromagnetic wave generating mechanism and the above-mentioned shaping mould, can constitute, when in the above-mentioned chamber of causing vacuum state with above-mentioned vacuum mechanism, filling above-mentioned thermoplastic resin, make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, shine through the electromagnetic wave that sees through behind this wave filter to above-mentioned thermoplastic resin by above-mentioned shaping mould.
Under above these situations,, can make thermoplastic resin fully spread all over chamber integral body by forming vacuum state in the chamber.
In addition, the electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism, also comprise the electromagnetic wave that wavelength surpasses 2 μ m, but, can not surpass the electromagnetic wave of 2 μ m as far as possible to the shaping mould illumination wavelength owing to used wave filter.Thus, for the thermoplastic resin in the chamber that is filled into shaping mould, illumination wavelength is the following near infrared rays of 2 μ m effectively.Therefore, with the following near infrared ray of wavelength 2 μ m, can be not hot briquetting mould ground heating thermoplastic resin effectively too.
In addition, in first, second invention, above-mentioned wave filter can be to make wavelength surpass the quartz glass of the electromagnetic transit dose minimizing of 2 μ m.
In addition, as wave filter,, also can be the material beyond the quartz glass so long as have the material of the character that the electromagnetic transit dose that makes wavelength surpass 2 μ m reduces.For example, as wave filter, beyond quartz glass, also can use porous glass (バ イ コ one Le (registration mark) glass is for example arranged), silicic-boric acid glass (パ イ レ Star Network ス (registration mark) glass is for example arranged) etc.
In addition, in first, second invention, above-mentioned electromagnetic wave can have the peak value of intensity in the wave-length coverage of 0.78～2 μ m.
At this moment, with the following near infrared ray of wavelength 2 μ m can be further heating thermoplastic resin effectively.
In addition, in first invention, it is desirable using the temperature higher than above-mentioned shaping mould to heat above-mentioned thermoplastic resin.
At this moment, it is bad further to prevent from the chamber to take place the filling of thermoplastic resin effectively.
In addition, in first invention, above-mentioned thermoplastic resin injects in the chamber of above-mentioned shaping mould under molten condition, and it is desirable that the viscosity that prevents the thermoplastic resin of above-mentioned molten condition reaches more than the 5000Poise.
At this moment, can suppress the thermoplastic resin melt viscosity increases, and prevents easily that further the filling of generation thermoplastic resin in the chamber of shaping mould is bad.
In addition, when the concerning of the melt viscosity relative temperature of understanding thermoplastic resin in advance, by to above-mentioned shaping mould irradiation electromagnetic wave, it is low that the temperature that can prevent thermoplastic resin reaches the temperature of 5000Poise when above than melt viscosity, and can be in the chamber filling thermoplastic resin.
In addition, when the thermoplastic resin viscosity of molten condition in above-mentioned chamber reaches 5000Poise when above, thermoplastic resin might take place in the chamber fill bad problem.
In addition, the viscosity of the molten condition thermoplastic resin in above-mentioned chamber is preferably as much as possible little.That is, in above-mentioned filling work procedure,, prevent that thermoplastic resin viscosity from reaching 1000Poise is desirable, especially prevents to reach then even more ideal more than the 500Poise by to shaping mould irradiation electromagnetic wave.
In addition, in first invention, above-mentioned shaping mould be pre-configured in can reduce pressure and the pressure vessel of supercharging in, in above-mentioned vacuum process, make decompression in the above-mentioned pressure vessel, make to become vacuum state in the above-mentioned chamber, in above-mentioned filling work procedure, inject above-mentioned thermoplastic resin in above-mentioned chamber after, making above-mentioned pressure vessel interior is desirable from above-mentioned vacuum state supercharging.
In addition, in second invention, above-mentioned shaping mould be configured in can reduce pressure and the pressure vessel of supercharging in, constitute in this pressure vessel, with the above-mentioned vacuum mechanism vacuum state that reduces pressure, the pressure state that is pressurized to after having carried out above-mentioned injection more than the atmospheric pressure is desirable before the injection of carrying out in above-mentioned chamber injecting above-mentioned thermoplastic resin.
Under above these situations, behind the thermoplastic resin that in the chamber of vacuum state, injects molten condition, fully spread all over close clearance in the chamber etc. on the whole by making supercharging in the pressure vessel, can make the thermoplastic resin that is injected in the chamber.
In addition, in first, second invention, when having disposed shaping mould in above-mentioned pressure vessel, electromagnetic wave generating sources such as above-mentioned electromagnetic wave generating mechanism also can be configured in the pressure vessel or the outer arbitrary place of pressure vessel.Especially, to be configured in pressure vessel be outward desirable to electromagnetic wave generating source.At this moment, can cool off the electromagnetic wave generating source of heating effectively.
In addition, in first, second invention, in the time of outside electromagnetic wave generating source configuration pressure vessel, above-mentioned wave filter also can be configured in the pressure vessel or the outer arbitrary place of pressure vessel.In addition, wave filter also can be used as the wall configuration that constitutes pressure vessel.Especially, can be configured on the wall that constitutes this pressure vessel this moment wave filter as inject electromagnetic window in pressure vessel.
In addition, in first invention, above-mentioned thermoplastic resin before filling in above-mentioned chamber is to form the above resin solid bodies of capacity of filling above-mentioned chamber, and it is desirable utilizing the thermoplastic resin after the above-mentioned resin solid bodies of fusion the deadweight of this thermoplastic resin to be filled in the above-mentioned chamber.
Yet in the chamber in the shaping mould of rubber system, when injecting on the particle fusion ground that makes thermoplastic resin, particle gases such as air each other may be sneaked in the chamber.To this, by the above-mentioned resin solid bodies of fusion and be filled in the chamber, can prevent from the chamber, to sneak into above-mentioned gas.
In addition owing to can keep the temperature height of the temperature of the thermoplastic resin the chamber in than shaping mould, so can not apply big injection pressure (for example 10～50MPa), can utilize the deadweight of thermoplastic resin in the chamber, to fill this thermoplastic resin.
In addition, the thermoplastic resin of the above-mentioned resin solid bodies of fusion also can utilize the angle of rake deadweight that pushes this thermoplastic resin from the top, fills in the chamber.
In addition, in first invention, the absorbance of above-mentioned thermoplastic resin is greatly desirable than the absorbance of the shaping mould of above-mentioned rubber system.
In this case, by shining above-mentioned near infrared ray, when the shaping mould of the above-mentioned rubber system of heating and thermoplastic resin, selectivity heating thermoplastic resin easily.In addition, absorbance can be measured with for example UV3100 of Shimadzu Seisakusho Ltd.'s system.
In addition, in first invention, above-mentioned thermoplastic resin is that the amorphism thermoplastic resin is desirable.
Yet in first, second invention, the cooling velocity of thermoplastic resin is all slow mostly.For this reason, the situation that the crystallinity of thermoplastic resin uprises in cooling is arranged, thus, the dimensional accuracy of synthetic resin reduces sometimes, and the resistance to impact of synthetic resin descends sometimes.To this, can prevent the reduction of above-mentioned synthetic resin dimensional accuracy and the following degradation of resistance to impact by thermoplastic resin being configured to the amorphism thermoplastic resin.
As the amorphism thermoplastic resin, can use for example phenylethylene resin series such as styrene acrylonitrile copolymer, styrene anhydrous maleic acid copolymer, styrene methylmethacrylate copolymer, ABS resin (acrylonitrile butadiene styrene resin), AES resin (acrylonitrile ethylene, propylene styrene resin), ASA resin rubber modified thermoplastic resins such as (acrylate styreneo-acrylonitrile resins) or polyisobutene acid methyl esters, polycarbonate resin (PC), the rubber modified thermoplastic resin alloy of PC/ etc.Wherein, it is desirable especially using rubber modified thermoplastic resin, and then uses ABS resin then better.
In addition, in first invention, the preferably rubber modified thermoplastic resin of above-mentioned thermoplastic resin.
In this case, use above-mentioned electromagnetic wave, can be more easily with respect to the shaping mould of rubber system heating thermoplastic resin selectively.
Be not particularly limited as rubber modified thermoplastic resin, be preferably under the existence of rubber mass copolymer and comprise the copolymer that makes the glycerol polymerization of ethene base system list amount body more than a kind or 2 kinds.
Be not particularly limited as above-mentioned rubber mass copolymer, can enumerate polybutadiene, butadienestyrene copolymer, butadiene acrylonitrile copolymer, ethylene propylene copolymer, ethylene, propylene non-conjugated diene copolymer, ethene butadiene-1 copolymer, ethene butadiene-1 non-conjugated diene copolymer, ACM, silicon rubber etc., they can independent a kind of uses or are used in combination more than 2 kinds.
In addition, as above-mentioned rubber mass copolymer, preferably use polybutadiene, butadienestyrene copolymer, ethylene propylene copolymer, ethylene, propylene non-conjugated diene copolymer, ACM; As above-mentioned rubber modified thermoplastic resin, can use for example ABS resin, AES resin, ASA resin etc.Wherein, especially preferably use ABS resin.
In addition, in first invention, above-mentioned shaping mould preferably is made up of silicon rubber.
In this case, shaping mould is easy to manufacture, simultaneously, uses above-mentioned electromagnetic wave, can be heated into pattern ground selectivity heating thermoplastic resin hardly.
In addition, the hardness of silicon rubber is preferably 25～80 in the JIS-A specification is measured.
In addition, in second invention, above-mentioned resin forming device, having the wavelength of ejaculation is the electromagnetic electromagnetic wave generating mechanism of 0.78～2 μ m, above-mentioned chamber forms the 3D shape space that a plurality of tabular spaces are cross-linked, the face direction and the thickness direction vertical with this face direction that form its profile are arranged in above-mentioned each tabular space, above-mentioned electromagnetic wave generating mechanism can constitute, when in above-mentioned chamber, filling above-mentioned thermoplastic resin, shine above-mentioned electromagnetic wave by this shaping mould to above-mentioned thermoplastic resin, simultaneously, the direction or the vertical direction of above-mentioned direction inclination from above-mentioned relatively each tabular space are shone above-mentioned electromagnetic wave.
At this moment, the chamber of shaping mould does not form simple plane shape space, and forms the space with 3D shape that a plurality of tabular spaces of making of above-mentioned direction and above-mentioned thickness direction are cross-linked.Then, when with electromagnetic wave generating mechanism illumination wavelength being the electromagnetic wave (below be sometimes referred to as near infrared ray) of 0.78～2 μ m, when if the parallel direction of face direction from tabular relatively space is shone this near infrared ray, may not can the inboard (leaving a side of electromagnetic wave generating mechanism) of face direction in tabular space shine above-mentioned near infrared ray.
With respect to this, when filling thermoplastic resin in the chamber, use the electromagnetic wave generating mechanism, direction or vertical direction that the face direction from relative each tabular space tilts are shone above-mentioned near infrared ray.Thus, all tabular space WBR near infrared rays that can the synform coelosis.Therefore, can be than the thermoplastic resin temperature in the integral body of high maintenance chamber.
In addition, when direction that above-mentioned direction from above-mentioned relatively each tabular space tilts or vertical direction are shone above-mentioned electromagnetic wave, face direction in above-mentioned a plurality of tabular space in any one tabular space can be the vertical state of relative electromagnetic wave irradiation direction, and the face direction in the remaining tabular space is the state that relative electromagnetic wave irradiation direction tilts.
In addition, above-mentioned tabular space can form the different shape of tabular, bent plate shape.In addition, on the part in tabular space, also can form various overshooting shapes space etc.
In addition, in second invention, above-mentioned resin forming device has: penetrating wavelength is the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m, and be configured in the wave filter that the electromagnetic transit dose that makes wavelength surpass 2 μ m between this electromagnetic wave generating mechanism and the above-mentioned shaping mould reduces, above-mentioned chamber forms the space of the 3D shape that is cross-linked a plurality of tabular spaces, the face direction and the thickness direction vertical with this face direction that form its profile are arranged in above-mentioned each tabular space, above-mentioned electromagnetic wave generating mechanism can be when filling above-mentioned thermoplastic resin in above-mentioned chamber, shine through the electromagnetic wave that sees through behind the above-mentioned wave filter to above-mentioned thermoplastic resin by this shaping mould, simultaneously, direction that tilts from above-mentioned direction in above-mentioned relatively each tabular space or the vertical above-mentioned electromagnetic wave that sees through of direction irradiation.
At this moment, when filling thermoplastic resin in the chamber of the shaping mould of rubber system, penetrating wavelength from the electromagnetic wave generating mechanism is the electromagnetic wave of 0.78～4 μ m, makes through the electromagnetic wave that sees through behind the wave filter and shines thermoplastic resin by shaping mould.And, the electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism, comprise the electromagnetic wave that wavelength surpasses 2 μ m, but by wave filter, the electromagnetic wave that wavelength surpasses 2 μ m can not shine on the shaping mould as much as possible.Thus, in the thermoplastic resin in being filled into the chamber of shaping mould, illumination wavelength is the following near infrared rays of 2 μ m effectively.Therefore, can within reasonly be heated into effectively heating plastic resin of pattern ground with the following near infrared ray of wavelength 2 μ m.
In addition, the chamber of shaping mould of this moment neither form simple plane shape space, but forms the space of 3D shape in a plurality of tabular spaces that had being cross-linked of above-mentioned direction and above-mentioned thickness direction.And, when filling thermoplastic resin in the chamber, shine above-mentioned near infrared ray from the direction or the vertical direction of the face direction inclination in each tabular space relatively with the electromagnetic wave generating mechanism.Thus, all tabular space integral body that can synform coelosis illumination wavelength effectively is the following near infrared rays of 2 μ m.For this reason, can keep the temperature of the thermoplastic resin in the integral body of chamber than the highland.
In addition, in second invention, above-mentioned resin forming device has that to penetrate wavelength be the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and is configured in and makes wavelength surpass the wave filter of the electromagnetic transit dose minimizing of 2 μ m between this electromagnetic wave generating mechanism and the above-mentioned shaping mould, this wave filter is filled the wave filter water and is formed in the gap that the transparent panel that is formed by transparent material forms each other, simultaneously, has the export department that makes this wave filter water flow into the inlet portion in above-mentioned gap and above-mentioned wave filter water is flowed out from above-mentioned gap, reduce the electromagnetic transit dose that above-mentioned wavelength surpasses 2 μ m by above-mentioned wave filter water, simultaneously, can change above-mentioned wave filter water by above-mentioned inlet portion and above-mentioned export department, as above-mentioned electromagnetic wave generating mechanism, when in above-mentioned chamber, filling above-mentioned thermoplastic resin, can shine through the electromagnetic wave that sees through behind the above-mentioned wave filter to above-mentioned thermoplastic resin by this shaping mould, heat above-mentioned thermoplastic resin.
Also comprise the electromagnetic wave that wavelength surpasses 2 μ m the electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism, by wave filter, wavelength surpasses 2 μ m electromagnetic waves and can not shine shaping mould as far as possible.Thus, for the thermoplastic resin that is filled in the shaping mold cavity, illumination wavelength is the following near infrared rays of 2 μ m effectively.Therefore, can use the following near infrared ray of wavelength 2 μ m, the effectively heating thermoplastic resin of pattern ground that is heated within reason.
And then the wave filter of this moment is filled the wave filter water in the gap that above-mentioned transparent panel forms each other.And from the moisture film of electromagnetic wave by being formed by the wave filter water that the electromagnetic wave generating mechanism penetrates, the electromagnetic transit dose that can make wavelength surpass 2 μ m thus reduces, and shines on the thermoplastic resin by shaping mould through the electromagnetic wave that sees through after the wave filter water.
Therefore, can easily constitute the wave filter that makes wavelength surpass the electromagnetic transit dose minimizing of 2 μ m.
In addition, can change the wave filter water by inlet portion and the export department that on wave filter, forms.Thus, absorb,, also can use the wave filter water after other wave filter waters lower than its temperature are changed this temperature rising even the temperature of the wave filter water in the gap rises from a part of electromagnetic wave of electromagnetic wave generating mechanism irradiation.
Therefore, the temperature of rejects trap rises effectively, realizes the cooling Filter Structures with simple structure.
Therefore, the shaping mould of the rubber system thermoplastic resin in the heating chamber selectively relatively can constitute simply and has refrigerating function, is used to improve the wave filter that this adds thermal effect.
In addition, above-mentioned wave filter water can be made of pure water such as running water.In addition, the wave filter water except that with the pure water, also can use the mixture that has mixed the high various solvents of cooling performance in water.
In addition, in second invention, in the space of the 3D shape that has been cross-linked above-mentioned a plurality of tabular spaces, form above-mentioned chamber, shine above-mentioned electromagnetic occasion in direction or vertical direction that above-mentioned direction from above-mentioned relatively each tabular space tilts, and in the gap that the transparent panel of being made up of above-mentioned transparent material forms each other, fill the occasion that above-mentioned wave filter water forms above-mentioned wave filter, above-mentioned resin forming device preferably has makes the vacuum mechanism that forms vacuum state in the above-mentioned chamber, fills above-mentioned thermoplastic resin in the above-mentioned chamber that is formed vacuum state by this vacuum mechanism.
At this moment, by forming vacuum state in the chamber, can make thermoplastic resin fully spread all over whole chamber.At this, so-called vacuum state not only means the absolute vacuum state, needs only the energy filling thermoplastic resin, then refers to also comprise the vacuum state of decompression state.
In addition, in second invention, preferably, described thermoplastic resin before in above-mentioned chamber, filling, be to form the above resin solid bodies of capacity of filling above-mentioned chamber, above-mentioned resin forming device has the heating that keeps and heat above-mentioned resin solid bodies and keeps container, keeps in the container resin solid bodies of semi-molten state being inserted in the resin acceptance division that disposes the top that is located at above-mentioned chamber from this heating.
At this moment, forming after the above resin solid bodies of capacity of filling the chamber makes the semi-molten state, by insertion be configured in be located at top, chamber the resin acceptance division in, in this resin acceptance division, can under the state that does not almost have unwanted gases such as entrained air, receive thermoplastic resin.Therefore, by in the chamber, injecting this thermoplastic resin, can prevent effectively that unwanted gas from sneaking in the chamber from above-mentioned resin acceptance division.
In addition, as long as above-mentioned resin solid bodies has the capacity that can fill the integral body in above-mentioned chamber, for example can form the capacity of 1～1.5 times of the capacity in chamber.
In addition, in second invention, preferably, above-mentioned resin solid bodies has by bottom and the upright in the form of a ring side wall portion of establishing forms from this bottom hollow shape, and above-mentioned heating keeps container to have all interior all heaters in the periphery heater of the above-mentioned side wall portion periphery of heating and the above-mentioned side wall portion of heating.
At this moment, keep to heat the resin solid bodies effectively in the container in heating, and can form the semi-molten state rapidly.
In addition, in being cross-linked the 3D shape space in above-mentioned a plurality of tabular spaces, form above-mentioned chamber, shine above-mentioned electromagnetic occasion, can adopt following various structure from direction or vertical direction that above-mentioned the direction in above-mentioned relatively each tabular space tilts.
Above-mentioned resin forming device has the pressure vessel of accommodating above-mentioned shaping mould and carries out the interior vavuum pump that vacuumizes of this pressure vessel, and above-mentioned shaping mould constitutes in the mode that is placed on the mounting table in the above-mentioned pressure vessel; Above-mentioned the direction that above-mentioned shaping mould can constitute in above-mentioned each tabular space forms the state of the above-mentioned electromagnetic direction of illumination inclination of passing through above-mentioned electromagnetic wave generating mechanism generation relatively or vertical state, is placed on the above-mentioned mounting table.
At this moment, become filling thermoplastic resin in the chamber of vacuum state by synform, can further make this thermoplastic resin spread all over chamber integral body easily.At this, so-called vacuum state not only means the state of absolute vacuum, as long as can the filling thermoplastic resin just refer to also comprise the vacuum state of decompression state.
In addition, at this moment, by the electromagnetic wave generating mechanism, the direction or the vertical direction that can easily form the face direction inclination from relative each tabular space are shone electromagnetic state.
In addition, can constitute resin forming device easily, be placed on shaping mould on the mounting table by replacing with vacuum mechanism, can be in various shaping moulds moulding have the synthetic resin of different shape.
In addition, the electromagnetic wave generating mechanism also can be configured in outside or inner arbitrary place of pressure vessel.
In addition, above-mentioned electromagnetic wave generating mechanism can constitute, and is configured in the side of above-mentioned pressure vessel outside, by the transparent window portion that forms in above-mentioned pressure vessel, shines above-mentioned electromagnetic wave to above-mentioned shaping mould.
At this moment, the configuration of electromagnetic wave generating mechanism is easy, can form pressure vessel compactly.
In addition, above-mentioned shaping mould have with above-mentioned pressure vessel in the placement datum level faced above of mounting table, above-mentioned direction in above-mentioned each tabular space can form state that above-mentioned relatively placement datum level tilts or vertical state.
At this moment, be formed obliquely chamber in the shaping mould, can form the direction that the face direction from each tabular space relatively tilts easily and shine electromagnetic state by datum level staggered relatively.
In addition, above-mentioned electromagnetic wave generating mechanism can constitute, and shines above-mentioned electromagnetic wave from the oblique side that is placed on the above-mentioned shaping mould on the above-mentioned mounting table.
At this moment, by the electromagnetic direction of illumination that relative shaping mould tilts to utilize the electromagnetic wave generating mechanism to produce, the direction that can form the face direction inclination from relative each tabular space is easily shone electromagnetic state.
In addition, above-mentioned resin forming device can constitute, and the above-mentioned shaping mould and the above-mentioned electromagnetic wave generating mechanism that are placed on the above-mentioned mounting table are relatively moved, and the direction that above-mentioned direction from above-mentioned relatively each tabular space tilts is shone above-mentioned electromagnetic wave.
At this moment, by constituting mounting table in the pressure vessel or at least one side in the electromagnetic wave generating mechanism movably, can easily form the direction that the face direction from each tabular space relatively tilts and shine electromagnetic state.
In addition, above-mentioned electromagnetic wave generating mechanism can constitute, and changes the direction of illumination of the above-mentioned electromagnetic wave above-mentioned shaping mould on above-mentioned mounting table staggered relatively.
At this moment, can easier formation the direction that tilts of face direction from each tabular space relatively shine electromagnetic state.
In addition, when the above-mentioned wave filter water of filling forms above-mentioned wave filter in the gap that forms each other to the transparent panel of being made up of above-mentioned transparent material, can adopt following each structure.
In addition, above-mentioned wave filter water can circulation one by one in above-mentioned gap by above-mentioned inlet portion and above-mentioned export department.
At this moment, can absorption portion from the electromagnetic wave of electromagnetic wave generating mechanism irradiation, before wave filter uprises with coolant-temperature gage, change this wave filter water energetically.Therefore, can improve the refrigerating function of wave filter.
In addition, the wave filter water can utilize feed pump etc. to supply to inlet portion being stored in wave filter water in the water tank, from export department the wave filter water after temperature rises is turned back in the water tank once more again, circulates in above-mentioned gap.
In addition, the wave filter water is not only circulation one by one, changes in the time of also can being formed in the temperature that rises to regulation.
In addition, above-mentioned transparent panel gap each other can form the thickness of 0.5～3mm.
At this moment, transparent panel gap each other can keep the wave filter water of suitable thickness, utilizes this wave filter water, can suitably receive and reduce the effect that above-mentioned wavelength surpasses the electromagnetic transit dose of 2 μ m.
In addition, the thickness in above-mentioned gap may not can receive fully that with the wave filter water absorbing wavelength surpasses the electromagnetic effect of 2 μ m during less than 0.5mm.On the other hand, when the thickness in above-mentioned gap surpasses 3mm, the electromagnetic wave that the moisture film that the wave filter water causes not only makes wavelength surpass 2 μ m is difficult to see through, and wavelength is that the following near infrared ray of 2 μ m also is difficult to see through, and it is the following near infrared rays of 2 μ m that the wave filter water also may absorb a lot of wavelength.
In addition, above-mentioned transparent panel can make glass plate.
At this moment, can easily form wave filter with glass plate.
In addition, above-mentioned resin forming device has the pressure vessel of accommodating above-mentioned shaping mould and the vavuum pump that vacuumizes in this pressure vessel, simultaneously, formation is filled above-mentioned thermoplastic resin in the above-mentioned chamber that forms vacuum state with this vavuum pump, above-mentioned wave filter is as the transparent window portion configuration of above-mentioned pressure vessel, above-mentioned electromagnetic wave generating mechanism can be configured in the outside of above-mentioned pressure vessel, simultaneously, by above-mentioned wave filter, to the above-mentioned electromagnetic wave that sees through of above-mentioned shaping mould irradiation as above-mentioned transparent window portion.
At this moment, become filling thermoplastic resin in the chamber of vacuum state by synform, can make that this thermoplastic resin is easier to spread all over whole chamber.At this, so-called vacuum state not only means absolute vacuum state, as long as the energy filling thermoplastic resin then refers to also comprise the vacuum state of decompression state.
In addition, by constitute the transparent window portion in the pressure vessel by wave filter, can form the structure of resin forming device simply.
In addition, above-mentioned resin forming device has the pressure vessel of accommodating above-mentioned shaping mould and the vavuum pump that vacuumizes in this pressure vessel, simultaneously, formation is filled above-mentioned thermoplastic resin in the above-mentioned chamber that utilizes this vavuum pump formation vacuum state, in above-mentioned pressure vessel, the transparent window portion that formation is made of withstand voltage glass, above-mentioned filter configuration is in the external container side of above-mentioned transparent window portion, above-mentioned electromagnetic wave generating mechanism is configured in the outside of above-mentioned pressure vessel, simultaneously, can be by above-mentioned wave filter and above-mentioned transparent window portion, to the above-mentioned electromagnetic wave that sees through of above-mentioned shaping mould irradiation.
At this moment, also can become filling thermoplastic resin in the chamber of vacuum state, more easily make this thermoplastic resin spread all over whole chamber by synform.In addition, by constitute the transparent window portion of pressure vessel by above-mentioned withstand voltage glass, can easily keep the high strength of pressure vessel.And the external container side configuration wave filter by in transparent window portion can easily constitute above-mentioned resin forming device.
In addition, as withstand voltage glass, can use the various glass that can tolerate vacuum pressure.
Embodiment
Below, the embodiment of resin molding method of the present invention and resin forming device is described together with accompanying drawing.
(embodiment 1)
This routine resin molding method as shown in Figure 1, be in the chamber 21 of the shaping mould 2 of rubber system filling thermoplastic resin 3, make these thermoplastic resin 3 coolings obtain the method for synthetic resin.In addition, this routine resin molding method is such method, that is, when the moulding synthetic resin, can be with respect to shaping mould 2 heating thermoplastic resin 3 selectively.
Particularly, as shown in the drawing, in this example, when filling thermoplastic resin 3 in chamber 21, by being the electromagnetic wave (below be sometimes referred to as near infrared ray) of 0.78～2 μ m to thermoplastic resin 3 irradiation peak wavelengths from the surface of shaping mould 2, thereby with respect to shaping mould 2 heating thermoplastic resin 3 selectively.In addition, in this example, use shaping mould 2 with above-mentioned rubber system and the resin forming device 1 that shines above-mentioned near infrared electromagnetic wave generating mechanism 4.
At this, so-called above-mentioned peak wavelength is meant and is using electromagnetic wave generating mechanism 4 in the electromagnetic wave of shaping mould 2 and thermoplastic resin 3 irradiations, the wavelength of the peak value of expression electromagnetic intensity.
Below, this routine resin molding method and resin forming device 1 are described in detail together with Fig. 1.
In this example, as thermoplastic resin 3, be again the ABS resin of rubber modified thermoplastic resin when using as the amorphism thermoplastic resin.
In addition, this routine shaping mould 2 is made by silicon rubber.This shaping mould 2 can make this silicon rubber sclerosis by the main mould (home built material object etc.) of synthetic resin of configuration moulding in the silicon rubber of liquid state, and the silicon rubber after the sclerosis is pulled down main mould and made.
As this routine electromagnetic wave generating mechanism 4, has the near infrared ray halogen heater of the peak value of luminous intensity near about 1.2 μ m of use near infra red region.
In addition, in this example, by in the chamber 21 of shaping mould 2, injecting the thermoplastic resin 3 of molten condition, to the above-mentioned near infrared ray of shaping mould 2 irradiations, the viscosity that prevents the thermoplastic resin 3 of above-mentioned molten condition thus reaches more than the 5000Poise, obtains synthetic resin.
When this routine synthetic resin of moulding, in the chamber 21 of the shaping mould 2 of silicon rubber system, fill ABS resin as thermoplastic resin 3.And, when this is filled, utilize above-mentioned electromagnetic wave generating mechanism 4, shine above-mentioned near infrared ray from the surface of shaping mould 2 to thermoplastic resin 3.At this moment,, compare, can heat ABS resin to a great extent with shaping mould 2 because the physical property of the silicon rubber of formation shaping mould 2 and ABS resin is different.
Thus, before finishing up to the filling of in above-mentioned chamber 21, filling ABS resin during in, can keep the temperature height of the temperature of the ABS resin in the chamber 21 than shaping mould 2.
Therefore, by this routine resin molding method and resin forming device 1, the shaping mould 2 of silicon rubber system heats ABS resin selectively relatively, and ABS resin can fully be spread all in the chamber 21 of shaping mould 2.Thus, can mold outstanding good synthetic resins such as appearance.
In addition, in this example, the synthetic resin of moulding by after the air cooling cooling, takes out in this chamber 21 in the chamber 21 of shaping mould 2.At this moment, because heating thermoplastic resin 3 selectively as described above, it is lower than the temperature of thermoplastic resin 3 therefore can be maintained in pattern 2 temperature.Therefore, can shorten and be used to cool off synthetic resin needed cool time.
In addition,, therefore can be suppressed to the deterioration of pattern 2, and improve the durability of shaping mould 2 because it is lower to be maintained in pattern 2 temperature.
In addition, in this example, use ABS resin as thermoplastic resin 3.As thermoplastic resin 3, in addition, can also use the time and can be absorbed in the near infrared thermoplastic resin 3 that is not absorbed in the shaping mould 2 and sees through to the above-mentioned near infrared ray of surface irradiation of above-mentioned shaping mould 2.
Fig. 2 be to transparent silicon rubber and translucent silicon rubber, get wavelength (nm) on the transverse axis, on the longitudinal axis, get light transmitance (%), represent the curve map of transmitance of the light of each silicon rubber.Shown that in the figure various silicon rubber make the light transmission between the wavelength 200～2200 (nm).Therefore, when the near infrared ray of this wave-length coverage of surface irradiation of the shaping mould 2 of silicon rubber system, can make this near infrared major part see through shaping mould 2 and absorb by thermoplastic resin 3.
(embodiment 2)
This routine resin molding method as shown in Figure 3, be in the chamber 21 of the shaping mould 2 of rubber system filling thermoplastic resin 3, make these thermoplastic resin 3 coolings obtain the method for synthetic resin.In addition, this routine resin molding method is such method, that is, when the moulding synthetic resin, can be with respect to shaping mould 2 heating thermoplastic resin 3 selectively.
Particularly, as shown in the drawing, in this example, when filling thermoplastic resin 3 in chamber 21, use to have the wavelength region may that is used for penetrating at 0.78～4 μ m and have the electromagnetic electromagnetic wave generating mechanism 4 of peak value of intensity and the resin forming device 1 of the wave filter 5 that the electromagnetic transit dose that makes wavelength surpass 2 μ m reduces.Then, make the electromagnetic wave that penetrates from electromagnetic wave generating mechanism 4 see through wave filter 5, after thermoplastic resin 3 irradiations see through this wave filter 5, see through electromagnetic wave, with respect to shaping mould 2 heating thermoplastic resin 3 selectively via shaping mould 2.
Below, this routine resin molding method and resin forming device 1 are described in detail with Fig. 3.
In this example, as thermoplastic resin 3, using as amorphism thermoplastic resin 3 is again the ABS resin of rubber modified thermoplastic resin 3 simultaneously.
In addition, this routine shaping mould 2 is made by silicon rubber.This shaping mould 2 can make this silicon rubber sclerosis by the main mould (home built material object etc.) of the synthetic resin of configuration moulding in aqueous silicon rubber, and the silicon rubber after sclerosis is dismantled main mould, makes thus.
In addition, be the absorbance (expression is to the yardstick of the absorption intensity of the light of specific wavelength) of the electromagnetic wave (light) of 0.78～2 μ m about relative wavelength, the ABS resin that uses as thermoplastic resin 3 likens to the silicon rubber of shaping mould 2 uses of rubber system big.
As this routine electromagnetic wave generating mechanism 4, has the near infrared ray halogen heater of the peak value of luminous intensity near about 1.2 μ m of use in infra-red range.
In addition, this routine wave filter 5 is to make wavelength surpass the quartz glass of the electromagnetic wave transit dose minimizing of 2 μ m.
In addition, in this example, the thermoplastic resin 3 of the state by injecting fusion in the chamber 21 of shaping mould 2 is a near infrared ray below the 2 μ m to the above-mentioned wavelength of shaping mould 2 irradiations, the viscosity that prevents the thermoplastic resin 3 of above-mentioned molten condition reaches more than the 5000Poise, obtains synthetic resin.
When making this routine synthetic resin moulding, in the chamber 21 of the shaping mould 2 of silicon rubber system, fill ABS resin as thermoplastic resin 3.And, when this is filled, penetrate the electromagnetic wave that 0.78～2 mum wavelength scope, has intensity peak from electromagnetic wave generating mechanism 4, shine through the electromagnetic wave that sees through behind the wave filter 5 to thermoplastic resin 3 by shaping mould 2.At this moment, because it is different with the physical property of thermoplastic resin 3 to constitute the rubber of shaping mould 2, compare with the shaping mould 2 of rubber system, significantly the heating thermoplastic resin 3.
Thus, before finishing up to the filling of filling thermoplastic resin 3 in above-mentioned chamber 21 during in, can keep the temperature height of the temperature of the thermoplastic resin 3 in the chamber 21 than shaping mould 2.
In addition, the electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism, though comprise the electromagnetic wave that wavelength surpasses 2 μ m, by using wave filter 5, the electromagnetic wave that wavelength surpasses 2 μ m can not shine shaping mould 2 as far as possible.Thus, for the thermoplastic resin 3 in the chamber 21 that is filled into shaping mould 2, illumination wavelength is the following near infrared rays of 2 μ m effectively.Therefore, be the following near infrared rays of 2 μ m with wavelength, can be heated into pattern 2 within bounds, the heating thermoplastic resin 3 effectively.
Therefore, by this routine resin molding method and resin forming device 1, the shaping mould 2 of silicon rubber system heating thermoplastic resin 3 selectively can fully spread all in the chamber 21 of shaping mould 2 thermoplastic resin 3 relatively.Thus, can mold outstanding good synthetic resins such as appearance.
In addition, in this example, the synthetic resin of moulding by after the air cooling cooling, takes out in this chamber 21 in the chamber 21 of shaping mould 2.At this moment, because heating thermoplastic resin 3 selectively as described above, it is lower than the temperature of thermoplastic resin 3 therefore can be maintained in pattern 2 temperature.Therefore, can shorten and be used to cool off synthetic resin needed cool time.
In addition,, therefore can be suppressed to the deterioration of pattern 2, and improve the durability of shaping mould 2 because it is lower to be maintained in pattern 2 temperature.
In addition, in this example, used ABS resin as thermoplastic resin 3.As thermoplastic resin 3, in addition, can also use the thermoplastic resin 3 that to the above-mentioned electromagnetic wave of surface irradiation of above-mentioned shaping mould 2 time, can absorb to the electromagnetic wave that in shaping mould 2, is difficult to absorbed wavelength.
(embodiment 3)
The resin molding method that this is routine such as Fig. 4～shown in Figure 6, be with the vacuum impregnating modulus method in the chamber 21 of the shaping mould 2 of rubber system filling thermoplastic resin 3, make these thermoplastic resin 3 coolings obtain the method for synthetic resin.In addition, this routine resin molding method is such method, that is, when the moulding synthetic resin, shaping mould 2 heating thermoplastic resin 3 selectively relatively.
Particularly, as shown in the drawing, in this example, implemented following operation: the chamber 21 interior vacuum process that form vacuum state that make the shaping mould 2 of rubber system; In the chamber 21 of vacuum state, fill the filling work procedure of the thermoplastic resin 3 of molten condition; Obtain the refrigerating work procedure of synthetic resin by the thermoplastic resin 3 in the cooling chamber 21.And, in filling work procedure, being radiated at the electromagnetic wave that has intensity peak in 0.78～2 mum wavelength zone to thermoplastic resin 3 via shaping mould 2, relative shaping mould 2 is heating thermoplastic resin 3 selectively.In addition, in this example, utilize above-mentioned electromagnetic wave, thermoplastic resin 3 is heated to the temperature higher than shaping mould 2.
In addition, in this example as shown in Figure 4, use shaping mould 2, make the resin forming device 1 that becomes the vacuum mechanism 60 of vacuum states in the chamber 21 and shine above-mentioned near infrared electromagnetic wave generating mechanism 4 with the rubber system that forms above-mentioned chamber 21.
Below, this routine resin molding method and resin forming device 1 are described in detail with Fig. 4～Fig. 7.
In this example, as thermoplastic resin 3, use be the amorphism thermoplastic resin be again the ABS resin of rubber modified thermoplastic resin simultaneously.
In addition, this routine shaping mould 2 is made by silicon rubber.This shaping mould 2 can make this silicon rubber sclerosis by the main mould (home built material object etc.) of the synthetic resin of configuration moulding in the silicon rubber of liquid state, and the silicon rubber after sclerosis takes out main mould, makes thus.
In addition, as the absorbance (yardstick of absorption intensity of representing the light of relative specific wavelength) that at wavelength is the electromagnetic wave (light) of 0.78～2 μ m, it is big that the ABS resin that uses as thermoplastic resin 3 likens the silicon rubber that the shaping mould 2 as rubber system uses to.
As shown in Figure 4, as this routine electromagnetic wave generating mechanism 4, has the near infrared ray halogen heater of the peak value of luminous intensity near about 1.2 μ m of use near infra red region.
In addition, in this example, by in the chamber 21 of shaping mould 2, injecting the thermoplastic resin 3 of molten condition, to the above-mentioned near infrared ray of shaping mould 2 irradiations, the viscosity that prevents the thermoplastic resin 3 of above-mentioned molten condition thus reaches more than the 5000Poise, obtains synthetic resin.
In addition, as shown in the drawing, this routine shaping mould 2 be configured in can reduce pressure and the pressure vessel 61 of supercharging in.This routine pressure vessel 61 is the containers that are used to carry out the vacuum injection molding.In addition, above-mentioned vacuum mechanism 60 is the vavuum pumps that are configured in the pressure vessel 61, carries out vacuumizing in the pressure vessel 61.
As shown in Figure 7, under the A-stage of this routine thermoplastic resin 3 before in chamber 21, filling, be the resin solid bodies 31 that forms the capacity of filling chamber 21 integral body.This resin solid bodies 31 has by bottom 311 and the upright in the form of a ring side wall portion of establishing 312 forms from this bottom 311 hollow shape.
In addition, as shown in Figure 4, the top in the chamber 21 in shaping mould 2 is formed for inserting the resin acceptance division 22 that disposes thermoplastic resin 3.And in shaping mould 2, the top in the bottom of resin acceptance division 22 and chamber 21 is connected by injecting cast gate 23.
In addition, as shown in Figure 4, this routine resin forming device 1 has the heating maintenance container 7 that keeps heating resin solid bodies 31.This heating keeps container 7 to have being formed for inserting the container peripheral part 71 of hollow hole 711 of resin solid bodies 31 and the container sliding part 72 that can slide in hollow hole 711.Container sliding part 72 has to form with the payload portion 721 of hollow hole 711 roughly the same diameters with from this payload portion 721 to be given prominence to formation and is configured in the protrudent pin portion 722 that inserts in the side wall portion 312 that is disposed at the resin solid bodies 31 in the hollow hole 711.
On container peripheral part 71, dispose the periphery heater 73 of the periphery of the side wall portion 312 that heats resin solid bodies 31, in the protrudent pin portion 722 of container sliding part 72, dispose interior all heaters 74 in the interior week of the side wall portion 312 that heats resin solid bodies 31.
By using above-mentioned resin solid bodies 31, can prevent useless gas such as entrained air in chamber 21 easily.In addition, resin solid bodies 31 is formed above-mentioned hollow shape,, can evenly heat resin solid bodies 31 as much as possible by using periphery heater 73 and interior all heaters 74.
In addition, as shown in Figure 7, above-mentioned resin solid bodies 31 has in its bottom 311 and is the outstanding jut 313 of taper.This jut 313 has circular section, and 311 front end forms undergauge towards the bottom.
In addition, as shown in Figure 4, on the bottom 311 of above-mentioned resin acceptance division 22, formation is along the reducing diameter part 221 of the taper of the jut 313 of resin solid bodies 31.And, as shown in Figure 5, make its jut 313 towards below when making the resin solid bodies 31 of semi-molten state drop in the resin acceptance division 22, the jut 313 of resin solid bodies 31 is by the center of reducing diameter part 221 guiding resin acceptance divisions 22.Thus, semi-molten state resin solid bodies 31 can obtain stable under the state that positions, and insertion is configured in the resin acceptance division 22.
The heating of this example keeps container 7 to constitute in the mode of upset up and down, forms the resin discharging state 702 of protrudent pin portion 722 towards the resin accepting state 701 of top and protrudent pin portion 722 as shown in Figure 5 towards the below as shown in Figure 4.
Heating keeps container 7 as shown in Figure 4, in resin accepting state 701, keeps resin solid bodies 31, by periphery heater 73 and interior all heaters 74 these resin solid bodies 31 of heating, forms the semi-molten state.On the other hand, heating keeps container 7 as shown in Figure 5, in resin discharging state 702, the resin solid bodies 31 of semi-molten state is dropped in the resin acceptance division 22 that is located at 21 tops, chamber.
In addition, as shown in Figure 6, in this routine shaping mould 2, keep container 7 to receive the thermoplastic resin 3 of semi-molten state from heating after, can utilize its deadweight that thermoplastic resin 3 is filled in the chamber 21.In addition, heating maintenance container 7 can be after the resin solid bodies 31 that makes the semi-molten state falls in the resin acceptance division 22, be turned to resin accepting state 701 again, the resin solid bodies 31 of the molten condition in the resin acceptance division 22 pushed to the below by the payload portion in the container sliding part 72 721.
Below, the method with above-mentioned resin forming device 1 moulding resin moulding product is elaborated.
In this example, carry out following vacuum process, preparation heating process, filling work procedure and cooling and take out operation, obtain synthetic resin by thermoplastic resin 3.
When the moulding synthetic resin, at first, as shown in Figure 4,, carry out vacuumizing in the above-mentioned pressure vessel 61 with above-mentioned vacuum mechanism 60 as vacuum process, making in the chamber 21 of shaping mould 2 of rubber system becomes vacuum state.
Then, as shown in the drawing, as the preparation heating process, in being in the heating maintenance container 7 of resin accepting state 701, insert the resin solid bodies 31 of configuration as thermoplastic resin 3, use periphery heater 73 and interior all heaters 74 heating resin solid bodies 31 and form molten condition.
In addition, in the preparation heating process, also can use above-mentioned electromagnetic wave generating mechanism 4, the resin acceptance division 22 that is arranged in the shaping mould 2 is prepared heating.
Then, as shown in Figure 5,, keep heating container 7 to be turned to resin discharging state 702, make heating keep the resin solid bodies 31 (thermoplastic resin 3) of the semi-molten state in the container 7 in the resin acceptance division 22 that is located at shaping mould 2, to fall as filling work procedure.
And as shown in Figure 6, be configured in the thermoplastic resin 3 in the resin acceptance division 22, and utilize its deadweight, flow down in chamber 21 by above-mentioned injection cast gate 23.In addition, can make this moment heating keep container 7 to be turned to above-mentioned resin accepting state 701 again, with 721 pairs of thermoplastic resin 3 imposed loads of payload portion in the said vesse sliding part 72.
In addition, after in chamber 21, injecting thermoplastic resin 3, stop to vacuumize, make pressure vessel 61 simultaneously, make to become atmospheric pressure state in the pressure vessel 61 to atmosphere opening by vacuum mechanism 60.Thus, fully spread all over close clearance in the chamber 21 etc. on the whole being injected into thermoplastic resins 3 in the chamber 21.
Like this, in the chamber 21 of vacuum state, fill molten condition thermoplastic resin 3.
In this example, when carrying out above-mentioned preparation heating process and filling work procedure, continue the surface irradiation to shaping mould 2 has intensity peak in 0.78～2 mum wavelength scope electromagnetic wave by above-mentioned electromagnetic wave generating mechanism 4.
Then, the thermoplastic resin 3 usefulness near infrared rays that flow down in chamber 21 from resin acceptance division 22 suppress the temperature reduction.
In addition, to the thermoplastic resin 3 that in chamber 21, flows, by shaping mould 2 irradiation near infrared rays.And the thermoplastic resin 3 of molten condition has prevented that by the irradiation near infrared ray viscosity from reaching more than the 5000Poise.
In addition, when filling thermoplastic resin 3 in chamber 21, because it is different with the physical property of thermoplastic resin 3 to constitute the rubber of shaping mould 2, compare with the shaping mould 2 of rubber system, the heating thermoplastic resin 3 significantly.
Thus, before finishing up to the filling of filling thermoplastic resin 3 in above-mentioned chamber 21 during in, can keep the temperature height of the temperature of the thermoplastic resin 3 in the chamber 21 than shaping mould 2.In addition, owing to become vacuum state in the chamber 21, therefore can make thermoplastic resin 3 fully spread all over whole chamber 21.
After this, take out operation as cooling, the thermoplastic resin 3 in the cooling chamber 21, make the synthetic resin moulding after, be opened into pattern 2, take out the synthetic resin after the moulding in the chamber 21.
In addition, in this example, the synthetic resin of moulding by after the air cooling cooling, takes out in this chamber 21 in the chamber 21 of shaping mould 2.At this moment since can be as described above heating thermoplastic resin 3 selectively, it is lower than the temperature of thermoplastic resin 3 therefore can be maintained in pattern 2 temperature.Therefore, can shorten and be used to cool off synthetic resin needed cool time.
In addition,, therefore can be suppressed to the deterioration of pattern 2, and improve the durability of shaping mould 2 because it is lower to be maintained in pattern 2 temperature.
In addition, in this example, used ABS resin as thermoplastic resin 3.As thermoplastic resin 3, in addition, to the above-mentioned near infrared ray of surface irradiation of above-mentioned shaping mould 2 time, can use to absorb the near infrared thermoplastic resin 3 that in shaping mould 2, is not absorbed and sees through.
Therefore, by this routine resin molding method, the shaping mould 2 of the rubber system interior thermoplastic resin 3 of heating chamber 21 selectively can make thermoplastic resin 3 fully spread all in the chamber 21 relatively.Thus, can mold outstanding good synthetic resins such as appearance.
In addition, in this routine resin molding method, as mentioned above, in the chamber 21 of shaping mould 2, during filling thermoplastic resin 3, can utilize the deadweight of thermoplastic resin 3 and the deadweight of above-mentioned payload portion 721 to fill.Therefore, can not apply big pressure, in the synthetic resin of moulding, hardly residual deformation can take place to thermoplastic resin 3.Therefore, can significantly improve the characteristic such as resistance to chemical reagents, hear resistance of synthetic resin.
In addition, in this routine resin molding method, use the shaping mould 2 of the rubber system of elastically deformable.Therefore, in shaping mould 2, when even so-called undercut shape (shape of interfering with shaping mould 2 parts during synthetic resin after taking out moulding) is arranged, on one side also can make the part strain of this undercut shape, the synthetic resin after the moulding of pressure taking-up on one side.Thus, in the shaping mould 2 that undercut shape is arranged, so-called slide mechanism needn't be set, can make its structure simply.
(embodiment 4)
This routine resin forming device 1 as shown in Figure 8, the wave filter 5 that having ejaculation has the electromagnetic electromagnetic wave generating mechanism 4A of intensity peak and make wavelength surpass 2 μ m in 0.78～2 mum wavelength scope electromagnetic transit dose reduces.This wave filter 5 is configured between the electric electromagnetic ejaculation position and shaping mould 2 of growing among the ripple generating mechanism 4A.This routine wave filter 5 clips pad 51 and is configured on the surface of shaping mould 2.In addition, this routine wave filter 5 is to make wavelength surpass the quartz glass of the electromagnetic transit dose minimizing of 2 μ m.
Other structure in this routine resin forming device 1 is the same with the foregoing description 1.
When carrying out this routine filling work procedure, 4A penetrates above-mentioned electromagnetic wave from the electromagnetic wave generating mechanism, shines through the electromagnetic wave that sees through behind the wave filter 5 to thermoplastic resin 3 by shaping mould 2.At this moment, because it is different with thermoplastic resin 3 rerum naturas to constitute the rubber of shaping mould 2, compare with the shaping mould 2 of rubber system, the heating thermoplastic resin 3 significantly.
Yet, in above-mentioned 0.78～2 mum wavelength scope, have in the electromagnetic wave of intensity peak, though also comprise the electromagnetic wave that wavelength surpasses 2 μ m, by using wave filter 5, the electromagnetic wave that can make wavelength surpass 2 μ m does not shine shaping mould 2 as far as possible.
Thus, for the thermoplastic resin 3 in the chamber 21 that is filled into shaping mould 2, illumination wavelength is the following near infrared rays of 2 μ m effectively.For this reason, with the following near infrared ray of wavelength 2 μ m, can within reasonly be heated into pattern 2, the heating thermoplastic resin 3 effectively.In addition, same for other operation in this routine resin molding method and the foregoing description 3.
Also can receive the action effect same in this example with the foregoing description 3.
(validation test 1)
In this validation test 1, use the affirmation test of the good action effect that resin molding method shown in the foregoing description 1 and resin forming device 1 obtain.
In this validation test 1,, used near infrared ray halogen heater (USHIO motor system point type heating unit UL-SH-01, rated voltage 100V consume electric power 500W, the about 1.2 μ m of the peak wavelength of luminous intensity) as electromagnetic wave generating mechanism 4.In addition, in order to carry out the plasticization of preflood thermoplastic resin 3 in shaping mould 2, used injection (mo(u)lding) machine (the made NN30B of Nigata ironworker).In addition, for temperature and thermoplastic resin 3 temperature of measuring shaping mould 2, used the thermocouple monitor.
In addition, as shown in Figure 9, above-mentioned near infrared ray halogen heater is the product that makes the point type irradiation type that the light polycondensation of irradiation concentrates, and light is 75mm apart from the focal length X1 that penetrates the position.In this example, the distance X 2 from light ejaculation position to shaping mould 2 surfaces is 225mm, makes light across to shaping mould 2 irradiations.
Then, as thermoplastic resin 3 and shaping mould 2, use following four invention product 1～4, from the near infrared ray of electromagnetic wave generating mechanism 4 to the about 1.2 μ m of surface irradiation peak wavelength of shaping mould 2, use the thermocouple monitor, determine the temperature of shaping mould 2 and the temperature of the thermoplastic resin 3 of filling to the chamber 21 of shaping mould 2 in.
In addition, in this validation test 1, in the shaping mould 2 of room temperature (about 25 ℃), inject the thermoplastic resin 3 of molten condition (about 250 ℃) from injection (mo(u)lding) machine.Then, shine above-mentioned near infrared ray from electromagnetic wave generating mechanism 4 to this shaping mould 2, the temperature of the shaping mould 2 when measuring and the temperature of thermoplastic resin 3 through 3 minutes.In addition, when the temperature of thermoplastic resin 3 becomes 250 ℃ in the near infrared ray irradiation, end irradiation, measure the temperature of shaping mould 2 this moment.
Invention thermoplastic resin 3 of product 1～4 and being constructed as follows of shaping mould 2.
(invention product 1) thermoplastic resin 3: the ABS resin of black non transparent; Shaping mould 2: 21 thickness T is the transparent silicon rubber of 12mm to the chamber from the surface of near infrared ray irradiation side.
(invention product 2) thermoplastic resin 3: the ABS resin of black non transparent; Shaping mould 2: above-mentioned thickness T is the transparent silicon rubber of 25mm.
(invention product 3) thermoplastic resin 3: the ABS resin of black non transparent; Shaping mould 2: above-mentioned thickness T is the translucent silicon rubber of 12mm.
(invention product 4) thermoplastic resin 3: transparent ABS resin; Shaping mould 2: above-mentioned thickness T is the transparent silicon rubber of 12mm.
In addition, as the silicon rubber of invention product 1～4, use JIS-A hardness is the product of SHIN-ETSU HANTOTAI's silicon system of 40.
In addition, in order to compare, replace the above-mentioned near infrared electromagnetic wave generating mechanism 4 of irradiation, to having used far infrared halogen heater (the USHIO motor system QIR100V 600WYD of irradiation far infrared, rated voltage 100V, consume electric power 600W, the about 2.5 μ m of the peak wavelength of luminous intensity) relatively product 1,2 also carry out said determination equally with invention product 1～4.
(relatively product 1) thermoplastic resin 3 and shaping mould 2 constitute identical with foregoing invention product 1.
(relatively product 2) thermoplastic resin 3 and shaping mould 2 constitute identical with foregoing invention product 2.
To carry out the table 1 that the results are shown in of said determination.
[table 1]
(table 1)
Figure A20068004229600351
In this table, for the near infrared invention product 1～4 of irradiation, become 235～250 ℃ with respect to the temperature of thermoplastic resin 3, the temperature of shaping mould 2 only rises to 170～180 ℃.Relative therewith, for product 1,2 relatively, become 200～205 ℃ with respect to the temperature of thermoplastic resin 3, the temperature of shaping mould 2 rises to 220 ℃.
In addition, the temperature of the thermoplastic resin 3 after just being injected in the chamber 21 of pattern 2, being cooled by shaping mould 2 drops to 150～180 ℃.
By The above results as can be known, by surface irradiation near infrared ray (invention product 1～4) to the shaping mould 2 of silicon rubber system, can be with respect to shaping mould 2 heating thermoplastic resin 3 selectively.
In addition, the shaping mould 2 of silicon rubber system rises to 170～180 ℃ reason from normal temperature and can think, because shaping mould 2 obtains thermal energy by the heat transmission from the thermoplastic resin 3 that is filled in its chamber 21, and owing to the part of shaping mould 2 absorption near infrared rays makes temperature rise.
(validation test 2)
In this validation test, carry out affirmation test by the good action effect of resin molding method shown in the foregoing description 2 and 1 generation of resin forming device.
In this validation test, to following invention product 5～9, by wave filter 5 and shaping mould 2 irradiation thermoplastic resins 3, use the thermocouple monitor, the temperature of the temperature of mensuration shaping mould 2 and the thermoplastic resin 3 of in the chamber 21 of shaping mould 2, filling from above-mentioned electromagnetic wave generating mechanism 4A.
Shown in the thermoplastic resin 3 of invention product 5～9 and shaping mould 2 are constructed as follows.
(invention product 5) thermoplastic resin 3 and shaping mould 2 are identical with invention product 1.
(invention product 6) thermoplastic resin 3 and shaping mould 2 are identical with invention product 2.
(invention product 7) thermoplastic resin 3 and shaping mould 2 are identical with invention product 3.
(invention product 8) thermoplastic resin 3 and shaping mould 2 are identical with invention product 4.
(invention product 9) thermoplastic resin 3 and shaping mould 2 are identical with invention product 1.
In addition, as the silicon rubber of invention product 5～9, using JIS-A hardness is the product of SHIN-ETSU HANTOTAI's silicon manufacturing of 40.
In addition, identical with above-mentioned validation test 1 for invention product 5～8 in this validation test as electromagnetic wave generating mechanism 4, used the near infrared ray halogen heater.In addition, for invention product 9,, used far infrared halogen heater (USHIO motor system QIR100V 600WYD, rated voltage 100V consume electric power 600W, the about 2.5 μ m of the peak wavelength of luminous intensity) as electromagnetic wave generating mechanism 4.
In addition, in order to carry out the plasticization of preflood thermoplastic resin 3 in shaping mould 2, used injection (mo(u)lding) machine (the made NN30B of Nigata ironworker).
In addition, as above-mentioned wave filter 5, used the quartz glass that makes wavelength surpass the electromagnetic transit dose minimizing of 2 μ m.As this routine quartz glass, use the system HOMOSIL (trade name) of Shin-etsu Quartz Co., Ltd, its thickness is 8mm.In addition, used the thermocouple monitor for the temperature of measuring shaping mould 2 and the temperature of thermoplastic resin 3.
In addition, in this validation test, in the shaping mould 2 of room temperature (about 25 ℃), inject thermoplastic resin 3 from the molten condition (about 250 ℃) of injection (mo(u)lding) machine.Then, shine above-mentioned electromagnetic wave via wave filter 5 to shaping mould 2, the temperature of shaping mould 2 and the temperature of thermoplastic resin 3 when measuring through 3 minutes by electromagnetic wave generating mechanism 4.In addition, in electromagnetic wave irradiation, when the temperature of thermoplastic resin 3 became 250 ℃, irradiation was ended, and measured the temperature of the shaping mould 2 of this moment.
The result of table 2 expression carrying out said determination.
[table 2]
(table 2)
Figure A20068004229600361
In this table, for shining above-mentioned near infrared invention product 5～8, become 250 ℃ entirely with respect to the temperature of thermoplastic resin 3, the temperature of shaping mould 2 only rises to 150～170 ℃.In addition, for invention product 9, become 235 ℃ with respect to the temperature of thermoplastic resin 3, the temperature of shaping mould 2 rises to 180 ℃.
In addition, the temperature of the thermoplastic resin 3 after just being injected in the chamber 21 of pattern 2 drops to 150～180 ℃ by shaping mould 2 coolings.
According to The above results as can be known, by via wave filter 5 to the shaping mould 2 surface irradiation electromagnetic waves of silicon rubber system (invention product 5～9), shaping mould 2 heating thermoplastic resin 3 selectively relatively.
In addition we know, invention product 5～8 are compared with invention product 9, and the temperature of thermoplastic resin 3 sharply rises.Hence one can see that, is near infrared ray below 2 μ by the nearly all electromagnetic wave to shaping mould 2 irradiation being made wavelength, can be further heating thermoplastic resin 3 effectively.
In addition, the shaping mould 2 of silicon rubber system rises to 150～180 ℃ reason from normal temperature and can think, because shaping mould 2 obtains thermal energy by the heat transmission from the thermoplastic resin 3 that is filled in its chamber 21, and owing to the part of shaping mould 2 absorption near infrared rays makes temperature rise.
(embodiment 5)
This routine resin forming device 1 comprises as Figure 10, shown in Figure 11: the shaping mould 2 that is formed for the rubber system that filling thermoplastic resin 3 chamber 21 forms; Ejaculation has the electromagnetic electromagnetic wave generating mechanism 4 of the peak value of intensity in 0.78～2 mum wavelength scope; Be configured between this electromagnetic wave generating mechanism 4 and the shaping mould 2 wave filter 5 that the electromagnetic wave transit dose that makes wavelength surpass 2 μ m reduces; Make the vacuum mechanism 6 that becomes vacuum state in the chamber 21.
As Figure 10, shown in Figure 12, this routine chamber 21 forms the space that makes the 3D shape that a plurality of tabular spaces 211 are cross-linked, in each tabular space 211, have the face direction s that forms its profile with the vertical thickness direction t of this face direction s.And, electromagnetic wave generating mechanism 4 constitutes, when filling thermoplastic resin 3 in chamber 21, shine through the electromagnetic wave that sees through behind the wave filter 5 to thermoplastic resin 3 via this shaping mould 2, the direction of the face direction s inclination from relative each tabular space 211 is shone above-mentioned through electromagnetic wave simultaneously.In addition, in Figure 10, Figure 12, represent electromagnetic direction of illumination with X.In addition, Figure 12 is the figure that is illustrated as the formation state in the chamber 21 in the pattern 2.
Below this routine resin forming device 1 and Figure 10～Figure 14 are elaborated together.
In this example, as thermoplastic resin 3, use be the amorphism thermoplastic resin be again the ABS resin (acrylonitrile butadiene styrene resin) of rubber modified thermoplastic resin simultaneously.
In addition, this routine shaping mould 2 is made up of silicon rubber, and the hardness of this silicon rubber is 25～80 in the JIS-A specification is measured.This shaping mould 2 can make this silicon rubber sclerosis by the main mould of the synthetic resin of moulding (home built material object etc.) being configured in the liquid silicon rubber, and silicon rubber takes out main mould and makes from hardening afterwards.
In addition, to wavelength is the absorbance (expression is to the yardstick of the absorption intensity of the light of specific wavelength) of the electromagnetic wave (light) (below be sometimes referred to as near infrared ray) of 0.78～2 μ m, and the ABS resin that uses as thermoplastic resin 3 likens to the silicon rubber of shaping mould 2 uses of rubber system big.
As shown in figure 10, this routine electromagnetic wave generating mechanism 4 have electromagnetic wave (light) generation source 41 and the electromagnetic wave that will produce by this generation source 41 to the reflector 42 (reflecting plate) of the direction guiding of shaping mould 2.Reflector 42 is configured in the rear (with the direction of the configuration direction opposition side of shaping mould 2) of electromagnetic wave generating source 41, has curved reflecting surface 421.This routine electromagnetic wave generating mechanism 4 constitutes, by reflector 42 the mode of the nearly all electromagnetic waveguide that penetrates from electromagnetic wave generating source 41 to the direction of shaping mould 2 and pressure vessel 61.
In addition,, use the near infrared ray halogen heater,, use near the near infrared ray Halogen lamp LED that near infra red region, has the peak value of luminous intensity about 1.2 μ m as electromagnetic wave generating source 41 as this routine electromagnetic wave generating mechanism 4.
In addition, in this routine resin forming device 1, the thermoplastic resin 3 of molten condition is injected in the chamber 21 of pattern 2, by shining above-mentioned near infrared ray to shaping mould 2, the viscosity that prevents the thermoplastic resin 3 of above-mentioned molten condition becomes more than the 5000Poise, obtains synthetic resin.
As shown in figure 11, this routine vacuum mechanism 6 has the pressure vessel 61 of accommodating shaping mould 2 and evacuated vavuum pumps 62 in this pressure vessel 61.Be provided with the mounting table 611 that is used to be placed to pattern 2 in pressure vessel 61, this mounting table 611 constitutes can lifting, and formation can be adjusted to the placement height of pattern 2.In addition, placed side 612 along continuous straight runs on mounting table 611 form, and shaping mould 2 is bearing in vertical direction.
As shown in the drawing, this routine electromagnetic wave generating mechanism 4 is configured in the side of pressure vessel 61 outsides.In pressure vessel 61,, be formed for making the electromagnetic wave that penetrates from electromagnetic wave generating mechanism 4 by the transparent window portion 613 in the pressure vessel 61 with electromagnetic wave generating mechanism 4 position (being the sidepiece of pressure vessel 61 in this example) in opposite directions.And the electromagnetic wave from electromagnetic wave generating mechanism 4 penetrates shines to shaping mould 2 by transparent window portion 613.This transparent window portion 613 forms on the two sides of pressure vessel 61 sides, and electromagnetic wave generating mechanism 4 disposes opposite to each other with the two sides of pressure vessel 61 sides.
In this example, the transparent window portion 613 in this pressure vessel 61 is made of above-mentioned wave filter 5.This routine wave filter 5 is to make wavelength surpass the quartz glass of the electromagnetic transit dose minimizing of 2 μ m.
As shown in figure 11, this routine shaping mould 2 has in the face of the placement datum level 201 above the mounting table 611 in pressure vessel 61.In addition, shaping mould 2 has the Nogata shape, in a pair of rubber pattern portion 25 each other, is formed for filling thermoplastic resin 3 chamber 21.
In addition, as shown in figure 12, the face direction s in all tabular spaces 211 in chamber 21 forms the state that datum level 201 staggered relatively tilts.The tabular space 211 of this example have in chamber 21 the mainboard shape space 212 that forms maximum profile and with the staggered direction in this mainboard shape space 212 on a plurality of subplate shapes space 213 of forming.A plurality of subplate shapes space 213 of this example is connected orthogonally with mainboard shape space 212.
In addition, as shown in figure 12, mainboard shape space 212 forms, and has 45 ° with interior tilt angle theta 1 (angle of inclination in 1～30 ° of scope more specifically) with respect to the side 202 with placement datum level 201 quadratures of shaping mould 2; Each subplate shape space 213 forms, and has 45 ° with interior tilt angle theta 2 (angle of inclination in 1～30 ° of scope more specifically) with respect to the placement datum level 201 of shaping mould 2.
In addition, as shown in figure 13, in above-mentioned each tabular space 211, the gauge of above-mentioned thickness direction t forms than the little size of minimum dimension among above-mentioned the direction s.
In addition, the subplate shape space 213 that this is routine, the face direction s in mainboard shape space 212 forms towards face direction s on a plurality of directions relatively.In this example, on the longitudinal direction d on the face direction s in mainboard shape space 212, formation towards thickness direction t from mainboard shape space the 212 upright first subplate shape space 213A that establish, on the transverse direction w on the face direction s in mainboard shape space 212, form towards thickness direction t from mainboard shape space the 212 upright second subplate shape space 213B that establish.In addition, Figure 13 is the stereogram that is illustrated as the formation state in the chamber 21 in the pattern 2.
As shown in the drawing, this routine chamber 21 forms its mainboard shape space 212 datum levels 201 staggered relatively (or side 202) is tilted to a plurality of directions.In this example, the face direction s in mainboard shape space 212 forms to both direction, promptly is the direction C1 of center rotation with the horizontal direction and is that the direction C2 of center rotation tilts with the vertical direction.Thereupon, the face direction s in each subplate shape space 213 also forms to both direction.
In addition,, make this silicon rubber sclerosis, can easily form the chamber 21 that datum level 201 staggered relatively tilts by under the state that above-mentioned main mould is tilted, it being configured in the liquid silicon rubber.
As Figure 10, shown in Figure 12, the electromagnetic wave generating mechanism 4 that this is routine, electromagnetic direction of illumination X are set to relative pressure vessel 61 and 2 one-tenth horizontal directions of shaping mould.
This routine chamber 21 forms the face direction s that makes mainboard shape space 212 and tilts to the electromagnetic direction of illumination X that electromagnetic wave generating mechanism 4 produces.Thus, the face direction s in a plurality of subplate shape space 213 also forms to above-mentioned direction of illumination X.
Like this, this routine shaping mould 2 forms its chamber 21 datum levels 201 staggered relatively and tilts, and the face direction s in each tabular space 211 forms the state that above-mentioned relatively direction of illumination X tilts, and is placed on the mounting table 611.
In addition, as Figure 10, shown in Figure 12, in the upper face side (with the opposition side of placing datum level 201) of shaping mould 2, the injection portion 22 that is formed in chamber 21, injecting the thermoplastic resin 3 of molten condition.The injection portion 22 of this example, formation is communicated with above-mentioned subplate shape space 213.
Because this routine shaping mould 2 is rubber systems, even when the synthetic resin after the moulding is formed with the so-called undercut portions part of shaping mould 2 interference (during the synthetic resin take out moulding in chamber 21 after with), while also can make synthetic resin after this undercut portions strain is taken out moulding.For this reason, can set the parting line that rubber pattern portion 25 mutually combines and forms arbitrarily.In Figure 14, be illustrated in the shaping mould 2 the shaping mould 2 of the formation position of parting line L as the centre position in the side surface direction of a pair of rubber pattern portion 25.
In addition, according to same reason, the die sinking direction (switch direction) of a pair of rubber pattern portion 25 can be set arbitrarily also.
Below, use resin forming device 1, the method for moulding resin moulding product is elaborated.
Carry out following vacuum process, filling work procedure and cooling in this example and take out operation, obtain synthetic resin by thermoplastic resin 3.
When making the synthetic resin moulding, at first, as shown in figure 11, as vacuum process, vacuumizing in the above-mentioned pressure vessel 61, making in the chamber 21 of shaping mould 2 of rubber system becomes vacuum state with above-mentioned vacuum mechanism 6.
Then, as shown in figure 11,, in chamber 21, inject the thermoplastic resin 3 of molten condition from the injection portion 22 of above-mentioned shaping mould 2 as filling work procedure.
Then, after in chamber 21, injecting thermoplastic resin 3, stop to vacuumize, make pressure vessel 61 simultaneously, become atmospheric pressure state in the pressure vessel 61 to atmosphere opening by vacuum mechanism 6.Thus, make each tabular space 211 that the thermoplastic resins 3 that inject in the chamber 21 fully spread all over chamber 21 on the whole.
Then, in this example, when carrying out above-mentioned filling work procedure, 0.78～2 mum wavelength scope, has the near infrared ray of the peak value of intensity to the surface irradiation of shaping mould 2 from above-mentioned electromagnetic wave generating mechanism 4.At this moment, in this routine shaping mould 2, shine above-mentioned near infrared ray with the direction that the face direction s of electromagnetic wave generating mechanism 4 from relative each tabular space 211 tilts.
Like this, the thermoplastic resin 3 from injection portion 22 flows down in chamber 21 can suppress temperature by near infrared ray and descend.
In addition, to the thermoplastic resin 3 that in chamber 21, flows, by shaping mould 2 irradiation near infrared rays.Then, the thermoplastic resin 3 of molten condition prevents that by the irradiation near infrared ray viscosity from reaching more than the 5000Poise.
In addition, when filling thermoplastic resin 3 in chamber 21, because it is different with the physical property of thermoplastic resin 3 to constitute the rubber of shaping mould 2, compare with the shaping mould 2 of rubber system, thermoplastic resin 3 can heat significantly.And, can be heated to the temperature higher to thermoplastic resin 3 than the shaping mould 2 of rubber system.
Thus, in during before the end-of-fill of filling thermoplastic resin 3 in above-mentioned chamber 21, can keep the temperature height of the temperature of the thermoplastic resin 3 in the chamber 21 than shaping mould 2.In addition, become vacuum state, can make thermoplastic resin 3 spread over the integral body in chamber 21 fully by making in the chamber 21.
Afterwards, take out operation, make thermoplastic resins 3 coolings in the chamber 21 as cooling, make the synthetic resin moulding after, be opened into pattern 2, take out the synthetic resin after the moulding in the chamber 21.
In addition, in this example, the synthetic resin of moulding by after the air cooling cooling, takes out in this chamber 21 in the chamber 21 of shaping mould 2.At this moment, because heating thermoplastic resin 3 selectively as described above, shaping mould 2 temperature can be kept lowlyer than the temperature of thermoplastic resin 3.For this reason, can shorten synthetic resin and cool off needed cool time.
In addition, by must be lower, can be suppressed to the deterioration of pattern 2, and can improve the durability of shaping mould 2 the temperature maintenance of shaping mould 2.
In addition, the electromagnetic wave that penetrates from electromagnetic wave generating mechanism 4, comprise the electromagnetic wave that wavelength surpasses 2 μ m, but by above-mentioned wave filter 5, the electromagnetic wave that wavelength surpasses 2 μ m can not shine shaping mould 2 as far as possible yet.Thus, can be effectively be near infrared ray below the 2 μ m to thermoplastic resin 3 illumination wavelength in the chamber 21 that is filled in shaping mould 2.For this reason, be the following near infrared rays of 2 μ m with wavelength, can within reasonly be heated into pattern 2, but heating thermoplastic resin 3 effectively.
And then the chamber 21 of this routine shaping mould 2 is not to form simple plane shape space, but forms the 3D shape space that a plurality of tabular spaces 211 of having of above-mentioned direction s and above-mentioned thickness direction t are cross-linked.And in this example, when filling thermoplastic resin 3 in chamber 21, by electromagnetic wave generating mechanism 4, the direction that the face direction s from relative each tabular space 211 tilts is shone above-mentioned near infrared ray.Thus, all tabular space 211 integral body that can synform coelosis 21 illumination wavelength effectively are the following near infrared rays of 2 μ m.For this reason, it is higher to keep thermoplastic resin 3 temperature of integral body in chamber 21.
In addition, in this example, used ABS resin as thermoplastic resin 3.As thermoplastic resin 3, in addition, to the above-mentioned near infrared ray of surface irradiation of above-mentioned shaping mould 2 time, can use to absorb the near infrared thermoplastic resin 3 that in shaping mould 2, is not absorbed and sees through.
Therefore, according to this routine resin forming device 1, the shaping mould 2 of the rubber system thermoplastic resin 3 in the heating chamber 21 selectively can make plastic resin 3 fully spread all in the chamber 21 relatively.Thus, can mold the good synthetic resin of high-qualitys such as appearance.
In addition, in this routine resin forming device 1, when filling thermoplastic resin 3 in the chamber 21 of shaping mould 2, can utilize the deadweight of thermoplastic resin 3 to fill.Therefore, thermoplastic resin 3 is not applied big pressure, in the synthetic resin of moulding, residual deformation takes place hardly.Therefore, can significantly improve synthetic resin characteristic such as drug resistance, hear resistance really.
(embodiment 6)
The following various concrete examples of this example expression promptly, constitute the direction that the face direction s from each tabular space 211 in the chamber 21 of relative shaping mould 2 tilts to the electromagnetic direction of illumination X that is produced by electromagnetic wave generating mechanism 4 and shine.
As one of concrete example, as shown in figure 15, electromagnetic wave generating mechanism 4 can constitute from being placed on the oblique side irradiation electromagnetic wave of the shaping mould 2 on the mounting table 611.In this example, penetrating the electromagnetic electromagnetic wave generating mechanism 4 from the two sides of pressure vessel 61 sides, the electromagnetic direction of illumination X that electromagnetic generation source 41 and reflector 42 are produced, the transparent window portion 613 in relative pressure vessel 61 sides tilts.At this moment, tilt by the relative shaping mould 2 of electromagnetic direction of illumination X that electromagnetic wave generating mechanism 4 is produced, the direction that the easy face direction s that forms from relative each tabular space 211 tilts is shone electromagnetic state.
In addition, as shown in figure 16, in resin forming device 1, also can use many electromagnetic wave generating mechanisms 4, also can make the electromagnetic direction of illumination X that produces by electromagnetic wave generating source 41 in many electromagnetic wave generating mechanisms 4 and reflector 42 different mutually.At this moment, with many electromagnetic wave generating mechanisms 4 relatively shaping mould 2 from a plurality of directions irradiation electromagnetic waves the tabular space 211 of the integral body of electromagnetic wave in the chamber 21 of shaping mould 2 is more easily arrived.
In addition,, also can constitute the shaping mould 2 and the electromagnetic wave generating mechanism 4 that are placed on the mounting table 611 are relatively moved, the direction irradiation electromagnetic wave that the face direction s from each tabular space 211 relatively tilts as another concrete example.More specifically, as shown in figure 17, can form the state that can make the electromagnetic direction of illumination X variation that produces by the electromagnetic wave generating mechanism 4 that on the two sides of pressure vessel 61 outside sides, disposes in opposite directions.
In this occasion, electromagnetic wave generating mechanism 4 can constitute can make the action of electromagnetic generation source 41 and reflector 42 unitary rotation, in addition, also can constitute and only makes the reflector 42 can rotational action.At this moment, electromagnetic direction of illumination X is changed arbitrarily, the tabular space 211 of the integral body in the chamber 21 of shaping mould 2 makes the easier arrival of electromagnetic wave.
In this example, other formation is also the same with the foregoing description 5, can receive the action effect the same with the foregoing description 5.
(embodiment 7)
This routine resin forming device 1 has as Figure 18, shown in Figure 19: be formed for filling thermoplastic resin 3 the shaping mould 2 of rubber system in chamber 21; Penetrating wavelength is the electromagnetic electromagnetic wave generating mechanism 4 of 0.78～4 μ m; Be configured in and make wavelength surpass the wave filter 5 of the electromagnetic transit dose minimizing of 2 μ m between electromagnetic wave generating mechanism 4 and the shaping mould 2.
As shown in figure 20, above-mentioned wave filter 5 is filled wave filter water 52 and is formed in the gap 511 that the transparent panel of being made up of transparent material 51 forms each other.In addition, wave filter 5 has the export department 513 that makes wave filter water 52 flow into the inlet portion 512 in the above-mentioned gap 511 and wave filter water 52 is flowed out from above-mentioned gap 511.And resin forming device 1 constitutes the electromagnetic wave transit dose that makes wavelength surpass 2 μ m by wave filter water 52 to be reduced, and simultaneously, wave filter water 52 can be changed by inlet portion 512 and export department 513.
In addition, as shown in figure 18, when electromagnetic wave generating mechanism 4 is formed in chamber 21 filling thermoplastic resin 3, after seeing through wave filter 5, thermoplastic resin 3 irradiations see through electromagnetic wave, heating thermoplastic resin 3 via this shaping mould 2.In addition, in Figure 18, Figure 20, represent electromagnetic direction of illumination with X.
Below this routine resin forming device 1 and Figure 18～Figure 24 are elaborated together.
In this example, as thermoplastic resin 3, use be amorphism thermoplastic resin 3 be again the ABS resin (acrylonitrile butadiene styrene resin) of rubber modified thermoplastic resin 3 simultaneously.
In addition, this routine shaping mould 2 is made up of silicon rubber, and the hardness of this silicon rubber is 25～80 in the JIS-A specification is measured.This shaping mould 2 can make this silicon rubber sclerosis by the main mould of the synthetic resin of moulding (home built material object etc.) being configured in the liquid silicon rubber, and silicon rubber takes out main mould and makes from hardening afterwards.
In addition, about to wavelength being the absorbance (expression is to the yardstick of the absorption intensity of the light of specific wavelength) of the electromagnetic wave (light) (below be sometimes referred to as near infrared ray) of 0.78～2 μ m, the ABS resin that uses as thermoplastic resin 3 likens to the silicon rubber of shaping mould 2 uses of rubber system big.
As shown in figure 18, this routine electromagnetic wave generating mechanism 4 have the generation source 41 of electromagnetic wave (light) and the electromagnetic wave that will produce by this generation source 41 to the reflector (reflecting plate) 42 of the direction guiding of shaping mould 2.Reflector 42 is configured in the rear (with the direction of the direction opposition side of shaping mould 2 configuration) of electromagnetic wave generating source 41, has curved reflecting surface 421.This routine electromagnetic wave generating mechanism 4 constitutes by reflector 42 the direction of the nearly all electromagnetic waveguide that penetrates from electromagnetic wave generating source 41 to shaping mould 2 and pressure vessel 61.
In addition,, use the near infrared ray halogen heater,, used near the near infrared ray Halogen lamp LED that near infra red region, has the peak value of luminous intensity about 1.2 μ m as electromagnetic wave generating source 41 as this routine electromagnetic wave generating mechanism 4.
In addition, in this routine resin forming device 1, the thermoplastic resin 3 of molten condition is injected in the chamber 21 of pattern 2, by shining above-mentioned near infrared ray to shaping mould 2, the viscosity that prevents the thermoplastic resin 33 of above-mentioned molten condition becomes more than the 5000Poise, obtains synthetic resin.
As shown in figure 19, this routine resin forming device 1 has the pressure vessel 61 of accommodating shaping mould 2 and evacuated vavuum pumps 62 in this pressure vessel 61.And resin forming device 1 constitutes filling thermoplastic resin 3 in the chamber 21 of being caused vacuum state by vavuum pump 62.
In addition, configuration is used to be placed to the mounting table 611 of pattern 2 in pressure vessel 61, and this mounting table 611 constitutes liftable, the feasible placement height that can be adjusted to pattern 2.
This routine electromagnetic wave generating mechanism 4 is configured in the side of pressure vessel 61 outsides.In pressure vessel 61,, be formed for making the electromagnetic wave that penetrates from electromagnetic wave generating mechanism 4 by the transparent window portion 613 in the pressure vessel 61 with electromagnetic wave generating mechanism 4 position (being the sidepiece of pressure vessel 61 in this example) in opposite directions.
In addition, as shown in figure 20, the transparent window portion 613 that this routine wave filter 5 constitutes in the pressure vessel 61.This wave filter 5 at a pair of transparent panel of being made up of glass plate 51 each other, forms the gap 511 of about 1mm thickness, fills wave filter water 52 in this gap 511, forms moisture film.
And, when electromagnetic wave generating mechanism 4 is formed in the chamber 21 of being caused vacuum state by above-mentioned vavuum pump 62 filling thermoplastic resin 3,, after seeing through wave filter 5, shaping mould 2 irradiations see through electromagnetic wave by wave filter 5 as above-mentioned transparent window portion 613.
In addition, the transparent window portion 613 by wave filter 5 forms forms on the two sides of pressure vessel 61 sides, and electromagnetic wave generating mechanism 4 disposes opposite to each other with two sides, pressure vessel 61 side.
In addition, though diagram is omitted, this routine resin forming device 1 have the water tank of storing wave filter water 52, by the feedwater pipe arrangement the wave filter water in this water tank 52 supply with the inlet portion 512 in the wave filters 5 feed pump, be used for from the drainage piping of the wave filter water 52 of export department 513 after the water tank recovered temperature rises of wave filter 5.
And, the wave filter waters 52 in the gap in the wave filter 5 511 constitute by feed pump and water tank between circulate.
Like this, by the wave filter water 52 in the above-mentioned gap 511 is circulated one by one, absorption before the temperature of wave filter water 52 uprises, can be changed this wave filter water 52 from electromagnetic wave generating mechanism 4 irradiated electromagnetic wave parts energetically.
As shown in figure 21, this routine chamber 21 forms the 3D shape space that a plurality of tabular spaces 211 are cross-linked, in each tabular space 211, have the face direction s that forms its profile with the vertical thickness direction t of this face direction s.And, when electromagnetic wave generating mechanism 4 is formed in chamber 21 filling thermoplastic resin 3, the above-mentioned electromagnetic wave that sees through of direction irradiation that the face direction s from each tabular space 211 relatively tilts.
In addition, as shown in figure 18,, be formed in chamber 21, injecting the injection portion 22 of the thermoplastic resin 3 of molten condition at the upper face side of shaping mould 2.This injection portion 22 forms and is communicated with tabular space 211.
In addition, because this routine shaping mould 2 is rubber systems, even when forming the undercut portions part of shaping mould 2 interference (during the synthetic resin after in chamber 21, taking out moulding with) in the synthetic resin after moulding, while also can make synthetic resin after this undercut portions strain is taken out moulding.For this reason, can set the parting line (with reference to Figure 21) that rubber pattern portion 25 mutually combines and forms arbitrarily.
Below, use the method for 1 pair of moulding resin moulding of resin forming device product to be elaborated.
Carry out following vacuum process, filling work procedure and cooling in this example and take out operation, obtain synthetic resin by thermoplastic resin 3.
When making the synthetic resin moulding, at first, as shown in figure 19, as vacuum process, vacuumizing in the above-mentioned pressure vessel 61, making in the chamber 21 of shaping mould 2 of rubber system becomes vacuum state with above-mentioned vavuum pump 62.
Then, as shown in figure 18,, in chamber 21, inject the thermoplastic resin 3 of molten condition from the injection portion 22 of above-mentioned shaping mould 2 as filling work procedure.
Then, when carrying out filling work procedure, penetrating wavelength by electromagnetic wave generating mechanism 4 is the electromagnetic wave of 0.78～4 μ m, shines through the electromagnetic wave that sees through behind the wave filter 5 to thermoplastic resin 3 by shaping mould 2.The thermoplastic resin 3 that flows down in chamber 21 from injection portion 22 can suppress temperature decline by seeing through electromagnetic wave.
In addition, to the thermoplastic resin 3 that in chamber 21, flows, see through electromagnetic wave by shaping mould 2 irradiations.And the thermoplastic resin 3 of molten condition prevents that by being through electromagnetic wave irradiation viscosity from reaching more than the 5000Poise.
In addition, when filling thermoplastic resin 3 in chamber 21, because it is different with the physical property of thermoplastic resin 3 to constitute the rubber of shaping mould 2, compare with the shaping mould 2 of rubber system, thermoplastic resin 3 can be heated significantly.And, can be heated to the temperature higher to thermoplastic resin 3 than the shaping mould 2 of rubber system.
Thus, in during before the end-of-fill of filling thermoplastic resin 3 in above-mentioned chamber 21, can keep the temperature height of the temperature of the thermoplastic resin 3 in the chamber 21 than shaping mould 2.In addition, by becoming vacuum state in the chamber 21, can make thermoplastic resin 3 fully spread all over the integral body in chamber 21.
For this reason, the filling that prevents from chamber 21 to take place thermoplastic resin 3 is bad, can obtain the good synthetic resin of high-quality such as appearance.
In addition, after in chamber 21, injecting thermoplastic resin 3, stop to vacuumize,, make to become atmospheric pressure state in the pressure vessel 61 simultaneously to atmosphere opening pressure vessel 61 with vavuum pump 62.Thus, the thermoplastic resin 3 that in chamber 21, injects can fully spread all over chamber 21 each tabular space 211 on the whole.
Afterwards, take out operation, make thermoplastic resins 3 coolings in the chamber 21 as cooling, make the synthetic resin moulding after, be opened into pattern 2, take out the synthetic resin after the moulding in the chamber 21.
In addition, in this example, the synthetic resin of moulding by after the air cooling cooling, takes out in this chamber 21 in the chamber 21 of shaping mould 2.At this moment, because heating thermoplastic resin 3 selectively as described above, shaping mould 2 temperature can be kept lowlyer than the temperature of thermoplastic resin 3.For this reason, can shorten synthetic resin and cool off needed cool time.
In addition, by must be lower, can be suppressed to the deterioration of pattern 2, and can improve the durability of shaping mould 2 the temperature maintenance of shaping mould 2.
In addition, in this example, the electromagnetic wave that penetrates from electromagnetic wave generating mechanism 4, comprise the electromagnetic wave that wavelength surpasses 2 μ m, but by above-mentioned wave filter 5, the electromagnetic wave that wavelength surpasses 2 μ m can not shine shaping mould 2 as far as possible yet.Thus, chamber 21 interior thermoplastic resin 3 illumination wavelength of filling of subtend shaping mould 2 are the following near infrared rays of 2 μ m effectively.For this reason, be the following near infrared rays of 2 μ m with wavelength, can not can excessive heat shaping mould 2, but heating thermoplastic resin 3 effectively.
And then this routine wave filter 5 is filled wave filter water 52 to the gap 511 that forms each other at transparent panel 51 and is formed.Then, the electromagnetic wave that is penetrated by electromagnetic wave generating mechanism 4 is by seeing through the moisture film of being made by wave filter water 52, the electromagnetic transit dose that makes wavelength surpass 2 μ m reduces, and by through the electromagnetic wave that sees through after the wave filter water 52, shines to thermoplastic resin 3 by shaping mould 2.
For this reason, can easily constitute the wave filter 5 that makes wavelength surpass the electromagnetic transit dose minimizing of 2 μ m.
In addition, wave filter water 52 can circulate by the inlet portion 512 and the export department 513 that form on wave filter 5.Thus, absorb from electromagnetic wave generating mechanism 4 irradiated electromagnetic wave parts, rise even be positioned at the temperature of the wave filter water 52 in gap 511, the wave filter water 52 after also can rising temperature is replaced with other wave filter water 52 lower than its temperature.
For this reason, the temperature of rejects trap 5 rises effectively, realizes the structure of cooling wave filter 5 with simple structure.
Therefore, according to this routine resin forming device 1, the shaping mould 2 of the rubber system thermoplastic resin 3 in the heating chamber 21 selectively relatively can be used in and improve this wave filter 5 that adds thermal effect and have refrigerating function and can constitute simply.
In addition, as above-mentioned wave filter 5, beyond moisture film, the glass plate of the electromagnetic wave transit dose minimizing of also considering to make wavelength surpass 2 μ m etc.But at this moment, glass plate is owing to absorb electromagnetic wave heating, swollen rising.Therefore, when using the wave filter of glass plate system, must use the special O shape ring of heat-resisting specification etc. especially, might make the device high price and become complicated in the part that keeps glass plate as the transparent window portion 613 of pressure vessel 61.
In addition, in this example, used ABS resin as thermoplastic resin 3.As thermoplastic resin 3, in addition, to above-mentioned shaping mould 2 surface irradiations are above-mentioned when seeing through electromagnetic wave, can also use can be absorbed in be not absorbed in the shaping mould 2 and see through see through electromagnetic thermoplastic resin 3.
Figure 22, Figure 23 are result's the curve maps of assimilation effect that expression confirms to be surpassed by the wavelength that wave filter 5 produces the electromagnetic wave (light) of 2 μ m.Two figure form the wave filter 5 (solid lines in two figure) of the state of moisture film and do not put into the curve map that transparent panel 51 (dotted lines in two figure) before wave filter water 52 forms moisture film is represented the transmitance of light in gaps 511 getting wavelength (nm) on the transverse axis, get the transmitance (%) of light on the longitudinal axis, fill in to transparent panel 51 gap of being made up of glass plate 511 each other wave filter water 52.
In addition, Figure 22 represents that the thickness in gap 511 (moisture film) makes the situation of 1mm, and Figure 23 represents that the thickness in gap 511 (moisture film) makes the situation of 3mm.In two figure, show, only the transparent panel of being made up of glass plate 51 (dotted lines in two figure) absorbs the electromagnetic wave that comprises near infrared large-scale wavelength (about 500～about 2500nm), relative therewith, with the wave filter 5 with the moisture film that generates by wave filter water 52 effectively absorbing wavelength surpass the electromagnetic major part of about 1400 (nm).Hence one can see that, with the wave filter 5 that has used wave filter water 52 effectively absorbing wavelength surpass the electromagnetic wave (light) of 2 μ m.
In addition, shown also that as shown in figure 23, when moisture film was 3mm, the light transmission rate that comprises near infrared integral body reduces, and was relative therewith, as shown in figure 22, when moisture film is 1mm, especially can see through the following near infrared major part of about 1400mm.Therefore as can be known, the thickness of the thickness in the gap 511 that above-mentioned a pair of transparent panel 51 forms each other, the moisture film that promptly become with wave filter water 52 preferably makes about 1mm.
In addition, in this routine resin forming device 1, when filling thermoplastic resin 3 in the chamber 21 of shaping mould 2, can utilize the deadweight of thermoplastic resin 3 to fill.Therefore, thermoplastic resin 3 is not applied big pressure, in the synthetic resin of moulding, residual deformation takes place hardly.Therefore, can significantly improve the characteristic such as drug resistance, hear resistance of synthetic resin.
In addition, above-mentioned pressure vessel 61 and wave filter 5 also can followingly constitute.
That is, as shown in figure 24, form the transparent window portion 613A that is made up of withstand voltage glass in pressure vessel 61, wave filter 5 also can be configured in the external container side of transparent window portion 613A.In addition, as withstand voltage glass, the various glass that can use the energy vacuum-resistant to press.And electromagnetic wave generating mechanism 4 also can see through electromagnetic wave to shaping mould 2 irradiations via wave filter 5 and transparent window portion 613A.At this moment, by constitute the transparent window portion 613A of pressure vessel 61 with withstand voltage glass, can keep the high strength of pressure vessel 61 easily.

Claims (27)

1. resin molding method, filling thermoplastic resin in the chamber of the shaping mould of rubber system cools off this thermoplastic resin and obtains synthetic resin; It is characterized in that,
When filling thermoplastic resin in above-mentioned chamber, to the electromagnetic wave that above-mentioned thermoplastic resin illumination wavelength is 0.78～2 μ m, heat this thermoplastic resin from the surface of this shaping mould.
2. resin molding method as claimed in claim 1, it is characterized in that, when filling thermoplastic resin in above-mentioned chamber, use ejaculation wavelength is the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and makes wavelength surpass the wave filter of the electromagnetic transit dose minimizing of 2 μ m, make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, make through the electromagnetic wave that sees through behind this wave filter and shine to above-mentioned thermoplastic resin, heat this thermoplastic resin via above-mentioned shaping mould.
3. resin molding method as claimed in claim 1 is characterized in that, comprising:
To form the vacuum process of vacuum state in the chamber of the shaping mould of rubber system,
In the chamber of above-mentioned vacuum state, fill the filling work procedure of the thermoplastic resin of molten condition,
Cool off the thermoplastic resin in the above-mentioned chamber and obtain the refrigerating work procedure of synthetic resin;
In above-mentioned filling work procedure, to the electromagnetic wave that above-mentioned thermoplastic resin illumination wavelength is 0.78～2 μ m, heat this thermoplastic resin via above-mentioned shaping mould.
4. resin molding method as claimed in claim 1 is characterized in that, comprising:
To form the vacuum process of vacuum state in the chamber of the shaping mould of rubber system,
In the chamber of above-mentioned vacuum state, fill the filling work procedure of the thermoplastic resin of molten condition,
Cool off the thermoplastic resin in the above-mentioned chamber and obtain the refrigerating work procedure of synthetic resin;
In above-mentioned filling work procedure, use ejaculation wavelength is the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and makes wavelength surpass the wave filter of the electromagnetic transit dose minimizing of 2 μ m, make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, shine through the electromagnetic wave that sees through behind this wave filter to above-mentioned thermoplastic resin via above-mentioned shaping mould, heat this thermoplastic resin.
5. as claim 2 or 4 described resin molding methods, it is characterized in that above-mentioned wave filter is to make wavelength surpass the quartz glass of the electromagnetic transit dose minimizing of 2 μ m.
6. as each described resin molding method in the claim 1 to 4, it is characterized in that above-mentioned electromagnetic wave has the peak value of intensity in the wave-length coverage of 0.78～2 μ m.
7. as each described resin molding method in the claim 1 to 4, it is characterized in that, heat above-mentioned thermoplastic resin with the temperature higher than above-mentioned shaping mould.
8. as each described resin molding method in the claim 1 to 4, it is characterized in that above-mentioned thermoplastic resin injects in the chamber of above-mentioned shaping mould under molten condition,
The viscosity that prevents the thermoplastic resin of above-mentioned molten condition reaches more than the 5000Poise.
9. as claim 3 or 4 described resin molding methods, it is characterized in that, above-mentioned shaping mould be pre-configured in can reduce pressure and the pressure vessel of supercharging in,
In above-mentioned vacuum process, make above-mentioned pressure vessel inner pressure relief, make to form vacuum state in the above-mentioned chamber, in above-mentioned filling work procedure, after in above-mentioned chamber, injecting above-mentioned thermoplastic resin, make above-mentioned pressure vessel inside from above-mentioned vacuum state supercharging.
10. as each described resin molding method in the claim 1 to 4, it is characterized in that the above-mentioned thermoplastic resin before filling is the resin solid bodies that forms more than the capacity of filling above-mentioned chamber in above-mentioned chamber,
Utilize the deadweight of this thermoplastic resin to be filled in the above-mentioned chamber thermoplastic resin after the fusion of above-mentioned resin solid bodies.
11., it is characterized in that the absorbance of above-mentioned thermoplastic resin is bigger than the absorbance of the shaping mould of above-mentioned rubber system as each described resin molding method in the claim 1 to 4.
12., it is characterized in that above-mentioned thermoplastic resin is the amorphism thermoplastic resin as each described resin molding method in the claim 1 to 4.
13., it is characterized in that above-mentioned thermoplastic resin is rubber modified thermoplastic resin as each described resin molding method in the claim 1 to 4.
14., it is characterized in that above-mentioned shaping mould is made of silicon rubber as each described resin molding method in the claim 1 to 4.
15. a resin forming device is characterized in that having:
The shaping mould of rubber system, this shaping mould is formed for filling thermoplastic resin's chamber; With
Electromagnetic wave generating mechanism, this electromagnetic wave generating mechanism to the electromagnetic wave that above-mentioned thermoplastic resin illumination wavelength is 0.78～2 μ m, heat this thermoplastic resin from the surface of this shaping mould when filling above-mentioned thermoplastic resin in above-mentioned chamber.
16. resin forming device as claimed in claim 15, it is characterized in that having that to penetrate wavelength be the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and be configured between this electromagnetic wave generating mechanism and the above-mentioned shaping mould and wave filter that the electromagnetic transit dose that makes wavelength surpass 2 μ m reduces;
When in above-mentioned chamber, filling above-mentioned thermoplastic resin, make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, make through the electromagnetic wave that sees through behind this wave filter and shine to above-mentioned thermoplastic resin via above-mentioned shaping mould.
17. resin forming device as claimed in claim 15 is characterized in that, having the vacuum mechanism that makes formation vacuum state in the above-mentioned chamber and penetrating wavelength is the electromagnetic electromagnetic wave generating mechanism of 0.78～2 μ m;
When utilizing above-mentioned vacuum mechanism to form to fill above-mentioned thermoplastic resin in the above-mentioned chamber of vacuum state, shine above-mentioned electromagnetic wave to above-mentioned thermoplastic resin via this shaping mould.
18. resin forming device as claimed in claim 15, it is characterized in that having to make the vacuum mechanism that becomes vacuum state in the above-mentioned chamber, penetrate wavelength and be the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and be configured between this electromagnetic wave generating mechanism and the above-mentioned shaping mould and wave filter that the electromagnetic transit dose that makes wavelength surpass 2 μ m reduces;
When in the above-mentioned chamber that utilizes above-mentioned vacuum mechanism formation vacuum state, filling above-mentioned thermoplastic resin, make the above-mentioned electromagnetic wave that penetrates from above-mentioned electromagnetic wave generating mechanism see through above-mentioned wave filter, after above-mentioned thermoplastic resin irradiation has seen through this wave filter, see through electromagnetic wave via above-mentioned shaping mould.
19. resin forming device as claimed in claim 15 is characterized in that, having the wavelength of ejaculation is the electromagnetic electromagnetic wave generating mechanism of 0.78～2 μ m;
Above-mentioned chamber forms the space that a plurality of tabular spaces are cross-linked the 3D shape that forms, and has the face direction and the thickness direction vertical with this face direction that form its profile in above-mentioned each tabular space;
Above-mentioned electromagnetic wave generating mechanism constitutes, when in above-mentioned chamber, filling above-mentioned thermoplastic resin, shine above-mentioned electromagnetic wave via this shaping mould to above-mentioned thermoplastic resin, and direction or vertical direction that above-mentioned direction from above-mentioned relatively each tabular space tilts are shone above-mentioned electromagnetic wave.
20. resin forming device as claimed in claim 15, it is characterized in that having that to penetrate wavelength be the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and be configured between this electromagnetic wave generating mechanism and the above-mentioned shaping mould and wave filter that the electromagnetic transit dose that makes wavelength surpass 2 μ m reduces;
Above-mentioned chamber forms the space of the 3D shape that is cross-linked a plurality of tabular spaces, has the face direction and the thickness direction vertical with this face direction that form its profile in above-mentioned each tabular space;
Above-mentioned electromagnetic wave generating mechanism constitutes, when in above-mentioned chamber, filling above-mentioned thermoplastic resin, shine through the electromagnetic wave that sees through behind the above-mentioned wave filter to above-mentioned thermoplastic resin via this shaping mould, and, direction that above-mentioned direction from above-mentioned relatively each tabular space tilts or the vertical above-mentioned electromagnetic wave that sees through of direction irradiation.
21. resin forming device as claimed in claim 15, it is characterized in that having that to penetrate wavelength be the electromagnetic electromagnetic wave generating mechanism of 0.78～4 μ m and be configured between this electromagnetic wave generating mechanism and the above-mentioned shaping mould and wave filter that the electromagnetic transit dose that makes wavelength surpass 2 μ m reduces;
This wave filter is filled the wave filter water and is formed in being formed at the transparent panel gap each other that is made of transparent material, and, have the export department that makes this wave filter water flow into the inlet portion in above-mentioned gap and above-mentioned wave filter water is flowed out from above-mentioned gap;
Reduce the electromagnetic transit dose that above-mentioned wavelength surpasses 2 μ m by above-mentioned wave filter water, and, can change above-mentioned wave filter water via above-mentioned inlet portion and above-mentioned export department;
Above-mentioned electromagnetic wave generating mechanism constitutes, and when filling above-mentioned thermoplastic resin in above-mentioned chamber, shines through the electromagnetic wave that sees through behind the above-mentioned wave filter to above-mentioned thermoplastic resin via this shaping mould, heats above-mentioned thermoplastic resin.
22., it is characterized in that above-mentioned wave filter is to make wavelength surpass the quartz glass of the electromagnetic transit dose minimizing of 2 μ m as each described resin forming device in the claim 16,18 or 20.
23., it is characterized in that above-mentioned electromagnetic wave has intensity in 0.78～2 mum wavelength scope peak value as each described resin forming device in the claim 15～21.
24., it is characterized in that having and make in the above-mentioned chamber vacuum mechanism that forms vacuum state as each described resin forming device in the claim 19～21, fill above-mentioned thermoplastic resin to utilizing above-mentioned vacuum mechanism to form in the above-mentioned chamber of vacuum state.
25. as claim 17,18 or 24 described resin forming devices, it is characterized in that, above-mentioned shaping mould be configured in can reduce pressure and the pressure vessel of supercharging in;
This pressure vessel inside utilized the above-mentioned vacuum mechanism vacuum state that reduces pressure before the injection of carrying out in above-mentioned chamber injecting above-mentioned thermoplastic resin, be pressurized to the pressure state more than the atmospheric pressure after carrying out above-mentioned injection.
26., it is characterized in that the described thermoplastic resin before filling is to form the above resin solid bodies of capacity of filling above-mentioned chamber as each described resin forming device in the claim 15～21 in above-mentioned chamber;
Above-mentioned resin forming device has the heating that keeps and heat above-mentioned resin solid bodies and keeps container, keeps in container the resin solid bodies insertion of semi-molten state is configured in the resin acceptance division on the top that is located at above-mentioned chamber from this heating.
27. resin forming device as claimed in claim 26 is characterized in that, above-mentioned resin solid bodies has by bottom and the upright in the form of a ring side wall portion of establishing forms from this bottom hollow shape;
Above-mentioned heating keeps container to have the periphery heater of the periphery that heats above-mentioned side wall portion and heats interior all heaters in the interior week of above-mentioned side wall portion.
CN2006800422967A 2005-11-15 2006-11-15 Resin molding process and resin molding apparatus Expired - Fee Related CN101304857B (en)

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JP2005330672A JP4234130B2 (en) 2005-11-15 2005-11-15 Resin molding method and resin molding apparatus
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JP037674/2006 2006-02-15
JP037675/2006 2006-02-15
JP2006037674A JP4234142B2 (en) 2006-02-15 2006-02-15 Resin molding method and resin molding apparatus
JP2006037675A JP4234143B2 (en) 2006-02-15 2006-02-15 Resin molding method and resin molding apparatus
JP189411/2006 2006-07-10
JP2006189411A JP4252586B2 (en) 2006-07-10 2006-07-10 Resin molding equipment
JP2006223352A JP2008044271A (en) 2006-08-18 2006-08-18 Resin molding apparatus
JP223352/2006 2006-08-18
PCT/JP2006/322703 WO2007058184A1 (en) 2005-11-15 2006-11-15 Resin molding process and resin molding apparatus

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Cited By (3)

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CN103917926A (en) * 2011-10-04 2014-07-09 Eta瑞士钟表制造股份有限公司 Shaping of an integral transparent clock component
CN104114346A (en) * 2011-11-16 2014-10-22 Jsr株式会社 Molding device and manufacturing method for thermoplastic molding
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JPH024503A (en) * 1988-06-23 1990-01-09 Tokai Kogyo Kk Molding tool for plastics
JPH03251409A (en) * 1990-02-28 1991-11-08 Hashimoto Forming Ind Co Ltd Manufacture of resin molding by high frequency molding mold
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JP4549562B2 (en) * 2001-03-16 2010-09-22 晏夫 黒崎 Method and apparatus for removing molecular orientation of resin molded product
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CN103917926A (en) * 2011-10-04 2014-07-09 Eta瑞士钟表制造股份有限公司 Shaping of an integral transparent clock component
CN104114346A (en) * 2011-11-16 2014-10-22 Jsr株式会社 Molding device and manufacturing method for thermoplastic molding
TWI505924B (en) * 2012-10-15 2015-11-01 Sharp Kk Molding device, molding device unit, and molding method

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