JP4234130B2 - Resin molding method and resin molding apparatus - Google Patents

Description

  The present invention relates to a resin molding method and a resin molding apparatus for obtaining a resin molded product from a thermoplastic resin.

Thermoplastic resins are molded by various molding methods and used after being formed into molded products. Various molding methods such as injection molding, blow molding, extrusion molding, and press molding have been put into practical use in accordance with the crystallinity, amorphousness, or melt viscosity level, and further in accordance with the shape of the molded product.
By the way, depending on the type of the thermoplastic resin and the shape of the molded product, the temperature of the thermoplastic resin is lowered during molding, so that the melt viscosity becomes high, and it may be difficult to obtain the intended molded product. Therefore, in order to improve this, a method of heating a molding die (mold) for molding a molded product with a heater or the like is known.

  Further, for example, in the resin molding method of Patent Document 1, a molten thermoplastic resin is injected into a cavity of a molding die made of silicone rubber, and then the thermoplastic resin is cooled to obtain an injection molded product. Is disclosed. Then, the composition of the silicone rubber mold is devised for the purpose of easily producing a resin molded product having good surface accuracy and surface gloss.

However, in the conventional resin molding method described above, the temperature of the thermoplastic resin to be molded may decrease and the viscosity of the thermoplastic resin may increase, particularly at the end of the cavity filled with the thermoplastic resin. In this case, there is a risk of poor filling of the thermoplastic resin in the cavity of the mold.
In Patent Document 1, the heat resistant temperature of silicone rubber is, for example, about 200 ° C. If the heating temperature of a heater or the like is increased in order to prevent the temperature of the resin from being lowered, the silicone rubber mold is deteriorated. There is a possibility that the surface appearance of the molded product molded by the molding die is lowered.

  Further, for example, in the method and apparatus for producing a resin molded article of Patent Document 2, when obtaining a molded product by introducing granular or powdery metal aggregate and thermoplastic resin into a mold, a metal aggregate is used. A metal heating means that can be heated in a spot manner is used. In this manufacturing method, the metal aggregate in the mold is irradiated with microwaves or electromagnetic waves from the metal heating means to generate heat, and the heat generated from the metal aggregate is used to generate heat in the mold. After the thermoplastic resin is softened or dissolved, the resin molded product is pressure-molded.

  However, the technique of Patent Document 2 is a technique that selectively heats the metal aggregate, and is not a technique that can heat the thermoplastic resin itself. Further, when the metal aggregate is heated by the metal heating means, the mold is also heated at the same time. Therefore, it is not possible to selectively heat the thermoplastic resin without heating the formwork too much.

JP-A-7-178754 Japanese Patent Laid-Open No. 10-193370

  The present invention has been made in view of such conventional problems, and the thermoplastic resin in the cavity can be selectively heated with respect to a rubber mold, and a good resin molded product can be obtained. An object of the present invention is to provide a resin molding method and a resin molding apparatus that can be used.

A first invention is a resin molding method for obtaining a resin molded product by filling a thermoplastic resin in a cavity of a rubber mold, and cooling the thermoplastic resin.
When filling the cavity with a thermoplastic resin, the thermoplastic resin is irradiated with an electromagnetic wave having a peak wavelength of 0.4 to 2 μm from the surface of the mold (claim). 1).

The resin molding method of the present invention is a method capable of selectively heating a thermoplastic resin with respect to a molding die when molding a resin molded product made of a thermoplastic resin using a rubber molding die. is there.
That is, in molding a resin molded product, a thermoplastic resin is filled into the cavity of a rubber mold. During the filling, the thermoplastic resin is irradiated with electromagnetic waves having a peak wavelength of 0.4 to 2 μm (hereinafter referred to as near infrared rays) from the surface side of the mold. At this time, due to the difference in physical properties between the rubber and the thermoplastic resin constituting the mold, the thermoplastic resin can be greatly heated as compared with the rubber mold.

Thereby, until the filling of the thermoplastic resin into the cavity is completed, the temperature of the thermoplastic resin in the cavity can be maintained higher than the temperature of the mold.
Therefore, according to the resin molding method of the present invention, it is possible to selectively heat the thermoplastic resin in the cavity with respect to the rubber mold, and the defective filling of the thermoplastic resin in the cavity occurs. Therefore, a good resin molded product can be obtained.

The said peak wavelength means the wavelength which shows the peak value of electromagnetic wave intensity in the electromagnetic waves irradiated to a shaping | molding die and a thermoplastic resin.
Further, the reason why the thermoplastic resin can be selectively heated by the near infrared rays as compared with the rubber mold is considered as follows.
That is, it is considered that the near infrared ray irradiated on the surface of the rubber mold has a high ratio of being reflected by the surface of the mold or being transmitted through the mold, while being absorbed by the thermoplastic resin. Therefore, it is considered that the energy of light by near infrared rays is preferentially absorbed by the thermoplastic resin, and the thermoplastic resin can be selectively heated.

A second invention is a resin molding method for obtaining a resin molded product by filling a thermoplastic resin into a cavity of a rubber mold and cooling the thermoplastic resin,
When filling the cavity with a thermoplastic resin, the thermoplastic resin is irradiated with an electromagnetic wave having a wavelength of 0.01 to 100 m from the surface of the mold (Claim 3). ).

The resin molding method of the present invention is also a method in which a thermoplastic resin can be selectively heated with respect to a mold when a resin molded product made of a thermoplastic resin is molded using a rubber mold. It is.
That is, in molding a resin molded product, a thermoplastic resin is filled into the cavity of a rubber mold. And in this filling, the electromagnetic wave (henceforth a microwave or a high frequency) with a wavelength of 0.01-100 m is irradiated to a thermoplastic resin from the surface of a shaping | molding die. At this time, due to the difference in physical properties between the rubber and the thermoplastic resin constituting the mold, the thermoplastic resin can be greatly heated as compared with the rubber mold.

Thereby, until the filling of the thermoplastic resin into the cavity is completed, the temperature of the thermoplastic resin in the cavity can be maintained higher than the temperature of the mold.
Therefore, even with the resin molding method of the present invention, it is possible to selectively heat the thermoplastic resin in the cavity with respect to the rubber mold, and to prevent defective filling of the thermoplastic resin in the cavity. Thus, a good resin molded product can be obtained.

Further, the reason why the thermoplastic resin can be selectively heated by the microwave or high frequency as compared with the rubber mold is considered as follows.
That is, when the microwave or high frequency is irradiated on the surface of the rubber mold, dielectric heating is performed on the mold and the thermoplastic resin, and the mold and the thermoplastic resin are caused by the dielectric loss generated in these. Exothermic and heated. And it thinks that a thermoplastic resin can be selectively (preferentially) heated because the dielectric loss in a thermoplastic resin is larger than the dielectric loss in a rubber mold.

According to a third aspect of the present invention, there is provided a rubber molding die formed with a cavity for filling a thermoplastic resin,
And an electromagnetic wave irradiation device for irradiating the thermoplastic resin with an electromagnetic wave having a peak wavelength of 0.4 to 2 μm from the surface of the mold when the cavity is filled with the thermoplastic resin. (9).

The resin molding apparatus of the present invention is an apparatus for molding a resin molded product made of a thermoplastic resin using a rubber mold, and can selectively heat the thermoplastic resin to the mold. Device.
That is, the resin molding apparatus of the present invention includes the rubber mold and the electromagnetic wave irradiation apparatus that irradiates electromagnetic waves (hereinafter referred to as near infrared rays) having a peak wavelength of 0.4 to 2 μm. When the thermoplastic resin is filled into the cavity of the rubber mold, the near-infrared ray is irradiated onto the thermoplastic resin from the surface of the mold by an electromagnetic wave irradiation device. At this time, due to the difference in physical properties between the rubber and the thermoplastic resin constituting the mold, the thermoplastic resin can be greatly heated as compared with the rubber mold.

Thereby, until the filling of the thermoplastic resin into the cavity is completed, the temperature of the thermoplastic resin in the cavity can be maintained higher than the temperature of the mold.
Therefore, according to the resin molding apparatus of the present invention, it is possible to selectively heat the thermoplastic resin in the cavity with respect to the rubber mold, and it is possible to cause poor filling of the thermoplastic resin in the cavity. Therefore, a good resin molded product can be obtained.
The reason why the thermoplastic resin can be selectively heated by the near-infrared light as compared with the rubber mold is considered as in the first invention.

According to a fourth aspect of the present invention, there is provided a rubber mold that forms a cavity for filling a thermoplastic resin,
An electromagnetic wave irradiation device that irradiates the thermoplastic resin with an electromagnetic wave having a wavelength of 0.01 to 100 m from the surface of the mold when the cavity is filled with the thermoplastic resin. In the resin molding apparatus.

The resin molding apparatus of the present invention is also an apparatus for molding a resin molded product made of a thermoplastic resin using a rubber mold, and can selectively heat the thermoplastic resin to the mold. It is a device that can.
That is, the resin molding apparatus of the present invention includes the rubber mold and an electromagnetic wave irradiation apparatus that irradiates an electromagnetic wave having a wavelength of 0.01 to 100 m (hereinafter referred to as microwave or high frequency). . When the thermoplastic resin is filled into the cavity of the rubber mold, the microwave or high frequency is irradiated to the thermoplastic resin from the surface of the mold by an electromagnetic wave irradiation device. At this time, due to the difference in physical properties between the rubber and the thermoplastic resin constituting the mold, the thermoplastic resin can be greatly heated as compared with the rubber mold.

Thereby, until the filling of the thermoplastic resin into the cavity is completed, the temperature of the thermoplastic resin in the cavity can be maintained higher than the temperature of the mold.
Therefore, even with the resin molding apparatus of the present invention, the thermoplastic resin in the cavity can be selectively heated with respect to the rubber mold, thus preventing a defective filling of the thermoplastic resin in the cavity. Thus, a good resin molded product can be obtained.
The reason why the thermoplastic resin can be selectively heated by the microwave or the high frequency as compared with the rubber mold is considered as in the second invention.

A preferred embodiment in the first to fourth inventions described above will be described.
In the first invention, the absorbance of the thermoplastic resin is preferably larger than the absorbance of the rubber mold (invention 2).
In this case, when the rubber mold and the thermoplastic resin are heated by the near infrared irradiation, the thermoplastic resin can be easily and selectively heated. The absorbance can be measured using, for example, Shimadzu UV3100.

In the second aspect of the invention, it is preferable that a dielectric power factor (tan δ) of the thermoplastic resin is larger than a dielectric power factor (tan δ) of the rubber mold (claim 4).
In this case, when dielectric heating is performed on the rubber mold and the thermoplastic resin by the microwave or high frequency irradiation, the dielectric power factor indicating the dielectric loss is higher than that of the mold. By being larger, the thermoplastic resin can be easily and selectively heated.

  The dielectric power factor of the thermoplastic resin and the dielectric power factor of the rubber constituting the mold generally vary depending on the temperature or the wavelength of electromagnetic waves (microwave or high frequency). In this case, the dielectric power factor is different from, for example, the temperature of the mold and the temperature of the molten thermoplastic resin when the thermoplastic resin is filled in the cavity of the mold, and the temperature changes respectively. Even in the case, the dielectric power factor of the thermoplastic resin is larger than the dielectric power factor of the mold through the entire temperature change.

In the first and second inventions, the thermoplastic resin is injected into the mold cavity in a melted state, and the mold is irradiated with the electromagnetic wave to thereby heat the melted state. It is preferable to prevent the viscosity of the plastic resin from exceeding 5000 poise (claim 5).
By injecting the molten thermoplastic resin into the cavity of the mold, it is easy to maintain the thermoplastic resin at a temperature higher than that of the mold. In addition, by preventing the molten thermoplastic resin from having a viscosity of 5000 poise or more, an increase in the melt viscosity of the thermoplastic resin is suppressed, and there is no poor filling of the thermoplastic resin in the mold cavity. It can be prevented more easily.

In addition, when the relationship of the melt viscosity of the thermoplastic resin to the temperature is known in advance, the temperature of the thermoplastic resin is more than the temperature at which the melt viscosity becomes 5000 poise or more by irradiating the mold with electromagnetic waves. It is possible to fill the cavity with the thermoplastic resin.
In addition, when the viscosity of the molten thermoplastic resin in the cavity becomes 5000 poise or more, poor filling of the thermoplastic resin in the cavity may occur.

The thermoplastic resin is preferably an amorphous thermoplastic resin (claim 6).
By the way, in the said 1st invention, the cooling rate of a thermoplastic resin is often made comparatively slow. Therefore, the crystallinity of the thermoplastic resin may increase during cooling, which may reduce the dimensional accuracy of the resin molded product or the impact resistance of the resin molded product. On the other hand, by making the thermoplastic resin an amorphous thermoplastic resin, it is possible to prevent a decrease in dimensional accuracy and a decrease in impact resistance of the resin molded product.

  Examples of amorphous thermoplastic resins include styrene resins such as styrene / acrylonitrile copolymers, styrene / maleic anhydride copolymers, styrene / methyl methacrylate copolymers, and ABS resins (acrylonitrile / butadiene / styrene resins). ), AES resin (acrylonitrile / ethylene / styrene resin), ASA resin (acrylate / styrene / acrylonitrile resin), or other rubber-modified thermoplastic resin, or polymethyl methacrylate, polycarbonate resin (PC), PC / rubber-modified thermoplastic resin An alloy or the like can be used. Among these, it is particularly preferable to use a rubber-modified thermoplastic resin, and it is more preferable to use an ABS resin.

The thermoplastic resin is preferably a rubber-modified thermoplastic resin.
In this case, it is easier to selectively heat the thermoplastic resin to the rubber mold by the electromagnetic wave.

  Examples of rubber-modified thermoplastic resins include styrene resins such as styrene / acrylonitrile copolymers, styrene / maleic anhydride copolymers, styrene / methyl methacrylate copolymers, and ABS resins (acrylonitrile / butadiene / styrene resins). AES resin (acrylonitrile / ethylene / styrene resin), ASA resin (acrylate / styrene / acrylonitrile resin) and the like can be used. Among these, it is particularly preferable to use an ABS resin.

The mold is preferably made of silicone rubber.
In this case, the mold can be easily produced, and the thermoplastic resin can be selectively heated by the electromagnetic wave with little heating of the mold.
Moreover, it is preferable that the hardness of a silicone rubber is 25-80 in a JIS-A standard measurement.

Examples of the resin molding method and resin molding apparatus according to the present invention will be described below with reference to the drawings.
The resin molding method of this example is a method in which a thermoplastic resin 3 is filled in a cavity 21 of a rubber mold 2 and the thermoplastic resin 3 is cooled to obtain a resin molded product as shown in FIG. . Moreover, the resin molding method of this example is a method which can selectively heat the thermoplastic resin 3 with respect to the shaping | molding die 2 in shape | molding a resin molded product.

Specifically, as shown in the figure, in this example, when the cavity 21 is filled with the thermoplastic resin 3, the peak wavelength from the surface of the mold 2 to the thermoplastic resin 3 is 0.4 to 2 μm. The thermoplastic resin 3 is selectively heated with respect to the mold 2 by irradiating electromagnetic waves (hereinafter referred to as near infrared rays). Further, in this example, a resin molding apparatus 1 having the rubber mold 2 and the electromagnetic wave irradiation apparatus 4 for irradiating the near infrared ray is used.
Here, the peak wavelength means a wavelength indicating a peak value of electromagnetic wave intensity in the electromagnetic wave irradiated to the mold 2 and the thermoplastic resin 3 by the electromagnetic wave irradiation device 4.

Hereinafter, the resin molding method and the resin molding apparatus 1 of this example will be described in detail with reference to FIG.
In this example, as the thermoplastic resin 3, an ABS resin that is an amorphous thermoplastic resin and a rubber-modified thermoplastic resin is used.
Further, the mold 2 of this example is made of silicone rubber. This mold 2 is prepared by placing a master model of a resin molded product to be molded (handmade product etc.) in a liquid silicone rubber, curing the silicone rubber, and taking out the master model from the cured silicone rubber. can do.

As the electromagnetic wave irradiation device 4 of this example, a near-infrared halogen heater having a light intensity peak in the vicinity of about 1.2 μm in the near-infrared region is used.
Further, in this example, the molten thermoplastic resin 3 is injected into the cavity 21 of the mold 2 and the mold 2 is irradiated with the near-infrared rays, whereby the molten thermoplastic resin 3 is melted. A resin molded product is obtained by preventing the viscosity from reaching 5000 poise or more.

  In molding the resin molded product of this example, the ABS resin as the thermoplastic resin 3 is filled into the cavity 21 of the mold 2 made of silicone rubber. And in the case of this filling, the said infrared rays are irradiated to the thermoplastic resin 3 from the surface of the shaping | molding die 2 using the said electromagnetic wave irradiation apparatus 4. FIG. At this time, the ABS resin can be heated more greatly than the mold 2 due to the difference in physical properties between the silicone rubber and the ABS resin constituting the mold 2.

Thereby, the temperature of the ABS resin in the cavity 21 can be maintained higher than the temperature of the mold 2 until the filling of the ABS resin into the cavity 21 is completed.
Therefore, according to the resin molding method and the resin molding apparatus 1 of this example, the ABS resin can be selectively heated with respect to the silicone rubber mold 2, and the ABS resin is placed in the cavity 21 of the mold 2. Can be fully distributed. Thereby, a good resin molded product excellent in surface appearance and the like can be molded.

In this example, the molded resin molded product is cooled by air cooling in the cavity 21 of the mold 2 and then taken out from the cavity 21. At this time, since the thermoplastic resin 3 can be selectively heated as described above, the temperature of the mold 2 can be maintained lower than the temperature of the thermoplastic resin 3. Therefore, the cooling time required for cooling the resin molded product can be shortened.
Moreover, since the temperature of the shaping | molding die 2 can be maintained low, degradation of the shaping | molding die 2 can be suppressed and durability of the shaping | molding die 2 can be improved.

  In this example, an ABS resin was used as the thermoplastic resin 3. In addition to this, as the thermoplastic resin 3, when the surface of the mold 2 is irradiated with the near infrared rays, the thermoplastic resin 3 can absorb the near infrared rays transmitted without being absorbed into the mold 2. 3 can be used.

  FIG. 2 shows the light transmittance of each silicone rubber with the wavelength (nm) on the horizontal axis and the light transmittance (%) on the vertical axis for transparent silicone rubber and translucent silicone rubber. It is a graph. In the figure, it can be seen that each silicone rubber transmits light having a wavelength between 200 and 2200 (nm). Therefore, when near infrared rays having the wavelength region are irradiated on the surface of the silicone rubber mold 2, most of the near infrared rays can be transmitted through the mold 2 and absorbed by the thermoplastic resin 3.

  The electromagnetic wave irradiation device 4 irradiates an electromagnetic wave (microwave or high frequency) having a wavelength of 0.01 to 100 m in addition to an electromagnetic wave (near infrared ray) having a peak wavelength of 0.4 to 2 μm. You can also use what you want. Even in this case, the thermoplastic resin 3 can be selectively heated with respect to the mold 2, and the same effect as described above can be obtained.

(Confirmation test 1)
In the confirmation test 1, a confirmation test of excellent effects by the resin molding method and the resin molding apparatus 1 shown in Example 1 was performed.
In the confirmation test 1, as the electromagnetic wave irradiation device 4, a near-infrared halogen heater (USHIO spot heater unit UL-SH-01, rated voltage 100V, power consumption 500W, peak wavelength of light intensity: about 1.2 μm) Was used. Moreover, in order to plasticize the thermoplastic resin 3 before inject | pouring in the shaping | molding die 2, the injection molding machine (Niigata Iron Works NN30B) was used. In addition, a thermocouple monitor was used to measure the temperature of the mold 2 and the temperature of the thermoplastic resin 3.

  As shown in FIG. 3, the near-infrared halogen heater is of a spot irradiation type that concentrates and concentrates the light rays to be irradiated, and has a focal length X1 of light rays from the emission position of 75 mm. In this example, the distance X2 from the light emission position to the surface of the mold 2 was 225 mm, and the light was crossed and irradiated onto the mold 2.

Then, as the thermoplastic resin 3 and the mold 2, the surface of the mold 2 is irradiated with near infrared light having a peak wavelength of about 1.2 μm from the electromagnetic wave irradiation device 4 using the following four invention products 1 to 4. Using a thermocouple monitor, the temperature of the mold 2 and the temperature of the thermoplastic resin 3 filled in the cavity 21 of the mold 2 were measured.
Further, in the confirmation test 1, the thermoplastic resin 3 in a molten state (about 250 ° C.) was injected from the injection molding machine into the mold 2 at room temperature (about 25 ° C.). And the said near infrared ray was irradiated to this shaping | molding die 2 from the electromagnetic wave irradiation apparatus 4, and the temperature of the shaping | molding die 2 and the temperature of the thermoplastic resin 3 at the time of progress for 3 minutes were measured. When the temperature of the thermoplastic resin 3 reached 250 ° C. during irradiation with near infrared rays, the irradiation was stopped and the temperature of the mold 2 at that time was measured.

The structures of the thermoplastic resin 3 and the mold 2 of the inventive products 1 to 4 were as follows.
(Invention 1) Thermoplastic resin 3; black opaque ABS resin, mold 2; transparent silicone rubber having a thickness T of 12 mm from the surface on the side irradiated with near infrared rays to cavity 21.
(Invention 2) Thermoplastic resin 3; black opaque ABS resin, mold 2; transparent silicone rubber having a thickness T of 25 mm.

(Invention 3) Thermoplastic resin 3; black opaque ABS resin, mold 2; translucent silicone rubber having a thickness T of 12 mm.
(Invention 4) Thermoplastic resin 3; transparent ABS resin, mold 2; transparent silicone rubber having a thickness T of 12 mm.
In addition, as the silicone rubber of the inventive products 1 to 4, Shin-Etsu silicone rubber having a JIS-A hardness of 40 was used.

For comparison, instead of the electromagnetic wave irradiation device 4 that irradiates near infrared rays, a far infrared halogen heater that irradiates far infrared rays (QIR100V 600WYD manufactured by USHIO, rated voltage 100V, power consumption 600W, peak wavelength of light intensity. Comparative product 1 and 2 using about 2.5 μm) were measured in the same manner as the inventive products 1 to 4.
(Comparative product 1) The structure of the thermoplastic resin 3 and the shaping | molding die 2 is the same as the said invention product 1. FIG.
(Comparative product 2) The structure of the thermoplastic resin 3 and the shaping | molding die 2 is the same as the said invention product 2.
Table 1 shows the results of the above measurements.

In the table, for Inventions 1 to 4 irradiated with near infrared rays, the temperature of the thermoplastic resin 3 became 235 to 250 ° C., whereas the temperature of the mold 2 increased only to 170 to 180 ° C. There wasn't. On the other hand, for the comparative products 1 and 2, the temperature of the thermoplastic resin 3 was 200 to 205 ° C., whereas the temperature of the mold 2 was increased to 220 ° C.
The temperature of the thermoplastic resin 3 immediately after being injected into the cavity 21 of the mold 2 was cooled by the mold 2 and decreased to 150 to 180 ° C.

From the said result, it turned out that the thermoplastic resin 3 can be selectively heated with respect to the shaping | molding die 2 by irradiating the near infrared rays to the surface of the shaping | molding die 2 made from silicone rubber (invention products 1-4).
The reason why the mold 2 made of silicone rubber rose from room temperature to 170 to 180 ° C. is that the mold 2 received heat energy from the thermoplastic resin 3 filled in the cavity 21 by heat transfer and the molding. This is considered to be because the mold 2 absorbed a part of near infrared rays and the temperature rose.

(Confirmation test 2)
In this confirmation test 2, instead of using the near-infrared halogen heater that irradiates the electromagnetic wave (near infrared ray) having the wavelength of 0.4 to 2 μm as the electromagnetic wave irradiation device 4, the wavelength is 1 m (300 MHz) to 100 m (3 MHz). Using the high frequency generator which irradiates the electromagnetic wave (high frequency), the following measurements 5 to 8 were carried out in the same manner as in the above confirmation test 1.

Further, in the confirmation test 2 and the confirmation test 3 described later, the dielectric power factor (tan δ) of the ABS resin (both black opaque and transparent) is the dielectric power factor (both transparent and translucent) ( tan δ).
As a reference, for example, at a wavelength of 100 m (frequency 1 MHz), the dielectric power factor of ABS resin is about 0.008 to 0.14, and the dielectric power factor of silicone rubber is about 0.002 to 0.005. is there.

Here, the dielectric power factor of the ABS resin and the dielectric power factor of the silicone rubber differ depending on the temperature or the wavelength of the electromagnetic wave (microwave or high frequency).
In this case, for example, when the thermoplastic resin 3 is filled in the cavity 21 of the mold 2, the dielectric power factor is different from, for example, the temperature of the mold 2 and the temperature of the molten thermoplastic resin 3. Even when the temperature changes, the dielectric power factor of the thermoplastic resin 3 is larger than the dielectric power factor of the mold 2 throughout the temperature change.

  That is, the state where the dielectric power factor of the thermoplastic resin 3 is larger than the dielectric power factor of the mold 2 is, for example, that the thermoplastic resin is injected into the cavity 21 of the mold 2 while irradiating the electromagnetic wave with the electromagnetic wave irradiation device 4. When the temperature of the thermoplastic resin 3 is changed from 160 ° C. to 240 ° C. and the temperature of the mold 2 is changed from room temperature (25 ° C.) to 170 ° C. in the process of filling the resin 3, 160 ° C. to 240 ° C. It shows that the dielectric power factor of the thermoplastic resin 3 is larger than the dielectric power factor of the mold 2 at 25 ° C to 170 ° C.

(Invention product 5) The configurations of the thermoplastic resin 3 and the mold 2 are the same as those of the invention product 1 described above.
(Invention product 6) The configurations of the thermoplastic resin 3 and the mold 2 are the same as those of the invention product 2 described above.
(Invention product 7) The configurations of the thermoplastic resin 3 and the mold 2 are the same as those of the invention product 3 described above.
(Invention product 8) The configurations of the thermoplastic resin 3 and the mold 2 are the same as those of the invention product 4 described above.

As the high-frequency generator of this confirmation test 2, a device manufactured by Seiki Co., Ltd. having a peak wavelength of electromagnetic wave intensity of 80 MHz (3.75 m) was used. Moreover, the output of the high frequency generator at the time of high frequency irradiation was 1 kW. Also in this confirmation test 2, other test configurations and test methods are the same as those in the confirmation test 1.
Table 2 shows the results of measurements performed on the temperature of the thermoplastic resin 3 and the temperature of the mold 2 in the confirmation test 2.

In the table, for Inventions 5 to 8 irradiated with near infrared rays, the temperature of the thermoplastic resin 3 was all 250 ° C., whereas the temperature of the mold 2 increased only to 120 to 130 ° C. It was.
From this, it was found that the thermoplastic resin 3 can be selectively heated with respect to the mold 2 by irradiating the surface of the mold 2 made of silicone rubber with high frequency (invention products 5 to 8).
The reason why the silicone rubber mold 2 has been raised from room temperature to 120 to 130 ° C. is considered in the same manner as in the confirmation test 1.

(Confirmation test 3)
In this confirmation test 3, as the electromagnetic wave irradiation device 4, a microwave oven that emits electromagnetic waves (microwaves) having a wavelength of 0.01 m (30000 MHz) to 1 m (300 MHz) is used. Measurements similar to those in the confirmation test 1 were performed.
As the high-frequency generator of this confirmation test 3, an apparatus made by Seiki Co., Ltd. having a peak wavelength of electromagnetic wave intensity of 2450 MHz (0.12 m) was used.

(Invention product 9) The structures of the thermoplastic resin 3 and the mold 2 are the same as those of the invention product 1, and the output of the microwave oven is 0.5 kW.
(Invention product 10) The configurations of the thermoplastic resin 3 and the mold 2 were the same as those of the invention product 9, and the output of the microwave oven was 1 kW.
(Invention product 11) The structures of the thermoplastic resin 3 and the mold 2 are the same as those of the invention product 2, and the output of the microwave oven is 1 kW.
(Invention product 12) The structures of the thermoplastic resin 3 and the mold 2 are the same as those of the invention product 4, and the output of the microwave oven is 0.5 kW.
(Invention product 13) The configurations of the thermoplastic resin 3 and the mold 2 were the same as those of the invention product 4, and the output of the microwave oven was 1 kW.

Also in this confirmation test 3, other test configurations and test methods are the same as those in the confirmation test 1.
Table 3 shows the results of measurements performed on the temperature of the thermoplastic resin 3 and the temperature of the mold 2 in the confirmation test 3.

In the table, for Inventions 9 to 13 irradiated with near-infrared rays, the temperature of the mold 2 increased only to 110 to 125 ° C, whereas the temperature of the thermoplastic resin 3 was all 250 ° C. It was.
From this, it was found that the thermoplastic resin 3 can be selectively heated with respect to the mold 2 by irradiating the surface of the mold 2 made of silicone rubber with microwaves (Inventions 9 to 13).
The reason why the mold 2 made of silicone rubber has risen from room temperature to 110 to 125 ° C. is considered in the same manner as in the confirmation test 1.

Explanatory drawing which shows the resin molding apparatus in an Example. In an Example, the wavelength (nm) is taken on a horizontal axis and the light transmittance (%) is taken on the vertical axis | shaft, and the graph which shows the light transmittance about transparent silicone rubber and translucent silicone rubber. Explanatory drawing which shows the resin molding apparatus used in the confirmation tests 1-3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin molding apparatus 2 Mold 21 Cavity 3 Thermoplastic resin 4 Electromagnetic wave irradiation apparatus

Claims (10)

A resin molding method for filling a thermoplastic resin into a cavity of a rubber mold and cooling the thermoplastic resin to obtain a resin molded product,
A resin molding method characterized by irradiating the thermoplastic resin with an electromagnetic wave having a peak wavelength of 0.4 to 2 μm from the surface of the mold when filling the cavity with the thermoplastic resin.   2. The resin molding method according to claim 1, wherein the absorbance of the thermoplastic resin is larger than the absorbance of the rubber mold. A resin molding method for filling a thermoplastic resin into a cavity of a rubber mold and cooling the thermoplastic resin to obtain a resin molded product,
A resin molding method comprising irradiating the thermoplastic resin with an electromagnetic wave having a wavelength of 0.01 to 100 m from the surface of the mold when filling the cavity with the thermoplastic resin.   4. The resin molding method according to claim 3, wherein a dielectric power factor (tan δ) of the thermoplastic resin is larger than a dielectric power factor (tan δ) of the rubber mold. In any one of Claims 1-4, the said thermoplastic resin is inject | poured in the cavity of the said shaping | molding die in the molten state,
A resin molding method comprising preventing the molten thermoplastic resin from having a viscosity of 5000 poise or more by irradiating the molding die with the electromagnetic wave.   The resin molding method according to claim 1, wherein the thermoplastic resin is an amorphous thermoplastic resin.   The resin molding method according to claim 1, wherein the thermoplastic resin is a rubber-modified thermoplastic resin.   The resin molding method according to claim 1, wherein the mold is made of silicone rubber. A rubber molding die formed with a cavity for filling a thermoplastic resin;
And an electromagnetic wave irradiation device for irradiating the thermoplastic resin with an electromagnetic wave having a peak wavelength of 0.4 to 2 μm from the surface of the mold when the cavity is filled with the thermoplastic resin. Resin molding equipment. A rubber molding die formed with a cavity for filling a thermoplastic resin;
An electromagnetic wave irradiation device that irradiates the thermoplastic resin with an electromagnetic wave having a wavelength of 0.01 to 100 m from the surface of the mold when the cavity is filled with the thermoplastic resin. Resin molding equipment.

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