CN101297238A - Multiple light emitting diodes with different secondary optics - Google Patents

Multiple light emitting diodes with different secondary optics Download PDF

Info

Publication number
CN101297238A
CN101297238A CNA2006800399848A CN200680039984A CN101297238A CN 101297238 A CN101297238 A CN 101297238A CN A2006800399848 A CNA2006800399848 A CN A2006800399848A CN 200680039984 A CN200680039984 A CN 200680039984A CN 101297238 A CN101297238 A CN 101297238A
Authority
CN
China
Prior art keywords
led wafer
lens
distribution patterns
led
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2006800399848A
Other languages
Chinese (zh)
Other versions
CN101297238B (en
Inventor
P·J·Q·范沃尔斯特瓦德
P·J·H·布洛门
N·B·普费弗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds LLC
Original Assignee
Philips Lumileds Lighing Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Lumileds Lighing Co LLC filed Critical Philips Lumileds Lighing Co LLC
Publication of CN101297238A publication Critical patent/CN101297238A/en
Application granted granted Critical
Publication of CN101297238B publication Critical patent/CN101297238B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00—Special procedures for taking photographs; Apparatus therefor
    • G03B15/02—Illuminating scene
    • G03B15/03—Combinations of cameras with lighting apparatus; Flash units
    • G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022—Pocket lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2215/00—Special procedures for taking photographs; Apparatus therefor
    • G03B2215/05—Combinations of cameras with electronic flash units
    • G03B2215/0514—Separate unit
    • G03B2215/0517—Housing
    • G03B2215/0525—Reflector
    • G03B2215/0535—Built-in diffusor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2215/00—Special procedures for taking photographs; Apparatus therefor
    • G03B2215/05—Combinations of cameras with electronic flash units
    • G03B2215/0514—Separate unit
    • G03B2215/0557—Multiple units, e.g. slave-unit
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2215/00—Special procedures for taking photographs; Apparatus therefor
    • G03B2215/05—Combinations of cameras with electronic flash units
    • G03B2215/0564—Combinations of cameras with electronic flash units characterised by the type of light source
    • G03B2215/0567—Solid-state light source, e.g. LED, laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Stroboscope Apparatuses (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

A plurality of light emitting diode dies (LED) with associated secondary optics, which produce different light distribution patterns, are combined to produce an efficient light source having a desired illumination pattern. By way of example, a first LED may include a lens that produces a light distribution pattern with a maximum intensity at the center while a second LED may use a lens that produces a light distribution pattern with a maximum intensity that surrounds the maximum intensity of the pattern produced by the first LED. The light from the LEDs can then be combined to produce a desired illumination pattern. Additional LEDs and lenses, e.g., having different light distribution patterns may be used if desired. Moreover, a variable current driver may be used to vary the amount of current to the different LEDs, such that the combined illumination pattern may be varied as desired.

Description

A plurality of light emitting diodes with different secondary optics
Technical field
Present invention relates in general to light emitting diode, and relate to particularly and have the device that a plurality of light emitting diodes produce the desired illumination profile, wherein light emitting diode has different secondary optics (secondary optics).
Background technology
Light emitting diode (LED) device has ever-increasing application.Especially interested in the device that can produce white light (comprising R, G and B component), this is because they substitute the potentiality of conventional light source (as bulb).
Yet, utilize the relatively little size of LED also to be difficult to space and the lighting problem that overcomes even some application have.For example, (a large amount of light of some application needs on target of for example, in mobile phone) flash of light, some light or flashlamp and so on still only have littler space to can be used for device such as being used for little camera.Must satisfy many specifications because come the light of autoflash to distribute, so such application especially has problem.For example, for camera flash, expectation increases its efficient usually, so that the illumination intensity at viewing field of camera center is than bigger towards the illumination intensity at viewing field of camera edge.Typically, the horizontal edge place in the visual field, illumination intensity level should be the about 60% of central value, and at corner, about 30% value is acceptable.Distribute in order to increase illumination intensity level and to revise, generally use secondary optics, that is, and the optics between LED and the scene.If there is not secondary optics, the only part (for example, 20%) of the light that sends from LED can arrive field of view, and under the situation of using traditional secondary optics, about 40% light arrives scene.Utilize traditional flash module, can not will should value 40% increase more.If want to increase this value, for example,, can influence other specification unfriendly by light is collimated (collimate).For example, substantially exceed 40% if designs secondary optics is increased to this part of light, then the illumination intensity of edge will reduce, and cause the picture dark corners.
Application for having the variable focus scope has run into other problem.For example, for the how burnt camera that is commonly referred to the zoom lens camera, variable illumination profile is used in expectation, holds different focusing ranges.The use that has for the light-emitting device of the illumination profile of fixed range optimization is invalid in such application.Although can use mechanical solution, as increasing or minimizing source/electrical distance, such solution is difficult to realize and is expensive.In addition, comprise that electro-mechanical devices will need additional space, limited the space of LED matrix thus and saved advantage.
Summary of the invention
According to embodiments of the invention, combination is used to produce a plurality of LED wafers (LED) distribution patterns, that have the secondary optics that is associated of not sharing the same light, the combination lighting that has desired pattern with generation.In one embodiment, the one LED can comprise following lens, and it is created in the light distribution patterns that the center has maximum intensity, and the 2nd LED can use following lens simultaneously, it produces such light distribution patterns, and its maximum intensity is around the maximum intensity of the light distribution patterns that is produced by a LED.For example, if needed, can use additional LED and lens with the distribution patterns of not sharing the same light.Can produce the lighting pattern of expectation from the light of LED by combination.In one embodiment, can use variable current drive, change to the magnitude of current of one or more LED, so that can change the illumination intensity of this combination as required.
Description of drawings
Fig. 1 is the diagram that the illumination intensity of the traditional flash module that uses three identical light emitting diodes (LED) (each all uses identical secondary optics) not use secondary optics with using three identical LED is shown.
Fig. 2 illustrates the visual field and identifies quote among Fig. 1 vertical, level and diagonal edges.
Fig. 3 A illustrates according to an embodiment of the invention, comprises the side view of the device of a plurality of LED with different secondary optics, and wherein each LED produces different light distribution patterns.
Fig. 3 B illustrates the side view that is similar to the device shown in Fig. 3 A, wherein integrally forms optics.
Fig. 4 is the diagram that the illumination intensity of example device as shown in Figure 3A, that have three LED with dissimilar secondary optics is shown.
Fig. 5 illustrates the schematic representation of apparatus with a plurality of LED wafers (each all has different secondary optics) that the variable driver current elements utilized controls.
Fig. 6 and 7 illustrates the illumination intensity of the light distribution patterns of two LED.
Fig. 8 illustrates the combined illumination pattern with strong center peak.
Fig. 9 illustrates the combined illumination pattern with approximate even light distribution.
Figure 10 illustrates has wide photodistributed combined illumination pattern.
Figure 11 illustrates and can use cell phone body of the present invention.
Figure 12 A illustrates the monolithic devices of the array with the light-emitting diode assembly that uses according to the present invention and form.
Figure 12 B illustrate added optical element, along the simplification viewgraph of cross-section of the monolithic devices of Figure 12 of line A-A.
Specific embodiment
Fig. 1 is the diagram that the illumination intensity of traditional flash module is shown, and wherein transverse axis is represented the distance with respect to scene (wherein using symmetrical optics) center, and Z-axis is represented illumination intensity.Traditionally, flash module comprise single led, a plurality of LED of not having secondary optics with single lens or each all have separately but a plurality of LED of identical secondary optics.Fig. 1 shows first curve 12, and it has illustrated that each all has the illumination intensity of three LED of identical lens.The part that light arrives scene is about 40%, and satisfies the light distributions specifications, that is, in the illumination intensity at field of view edge place less than the center.In Fig. 1, the position that indicates " V " is corresponding to the vertical field of view edge, and " H " corresponding to horizontal field of view edge, " D " is corresponding to the position on the field of view edge diagonal line.Fig. 2 illustrates the visual field in the mode of example, and identifies vertical, level and diagonal edges.Fig. 1 also shows curve 14, and it has illustrated the illumination intensity of three LED that do not have secondary optics, and the light of indication only about 20% arrives scene.Utilize traditional flash module, can not increase this value 40% again can influence other specifications too much sharply, that is, and and the illumination intensity at field of view edge place.
Fig. 3 A shows the side view of devices in accordance with embodiments of the present invention 100.Device 100 comprises a plurality of light emitting diodes (LED) wafer 102,104 and 106 (being sometimes referred to as LED 102,104 and 106), and each all has dissimilar secondary optics.Therefore, the lens 105 that the lens 103 of the first kind are installed to LED wafer 102, the second types are installed to LED wafer 104, and the lens 107 of the 3rd type are installed to LED 106.Lens 103,105 and 107 are configured to produce different light distribution patterns from they LED 102,104 separately with 106.LED 102,104 and 106 close each other on substrate (submount) 101, but separate the distance of the optical centre that is suitable for distinguishing each LED wafer.Although three LED 102,104 and 106 have been shown in Fig. 3 A, should be appreciated that according to embodiments of the invention, can use still less (for example, two) or more (for example, four s' or more a plurality of) LED.If needed, can use a plurality of substrates.
Form or alternately form the lens 103,105 and 107 shown in Fig. 3 A separably, shown in Fig. 3 B, the device 100 ' that is similar to the device 100 shown in Fig. 3 A can use integrally formed lens 103 ', 105 ' and 107 ', for example, they can be moulded or other suitable manner forms by injection molding, casting and commentaries on classics.
LED 102,104 and 106 and substrate 101 can be for example to incorporate the type of discussing in the U.S. Patent No. 6885035 in full, that authorize people such as Bhat by reference at this.As finding out from Fig. 3 A, p and n contact point 110p and 110n are positioned on the same side of LED 102,104 and 106, and it often is called as flip-chip or upside-down mounting design.On a side relative, leave LED by LED 102,104 and 106 optically-coupled that generate with contact point.For example, LED 102,104 and 106 can be an III nitride type, and it has the composition that includes but not limited to GaN, AlGaN, AlN, GaInN, AlGaInN, InN, GaInAsN and GaInPN.Typical base material is sapphire, silit SiC or III nitride, because be easy to the III element nitride crystal of nucleation and growing high-quality in these substrates.LED 102,104 and 106 or LED 102,104 and 106 and separately lens 103,105 and 107 between the attachment material (not shown) can comprise the phosphorus coating, to produce the white light of expectation.For example, blue pump LED wafer can be coated with yellow phosphorus, and to produce the mixed light of blue light and gold-tinted, it looks like white.
Contact point 110n and 110p for example by au bump 114 be electrically connected to be positioned on the substrate 101 or among metal 112.Thus, because LED 102,104 and 106 has the upside-down mounting design, so for example by electrically contacting between the bottom surface of substrate 101 and LED 102,104 and 106 that salient point 108 forms.Salient point 108 on the substrate 101 and the interconnection between the metal 112 produce the electrical connection between LED and the substrate, are provided for taking away from LED during operation the hot path of heat simultaneously.Although shown embodiment relates to au bump, but this interconnection can (for example be led ointment (paste) or compound by base metal, metal alloy, semiconductor metal alloy, scolder, heat and electricity, epoxy material), the low clinkering point between the dissimilar materials between LED wafer and the substrate (for example, Pd-In-Pd) or solder dots constitute.
Substrate 101 can be formed by Si or pottery (as High Temperature Co Fired Ceramic) or other suitable materials (as thin film aluminum or other hot encapsulation material).Can comprise optional dielectric layer on substrate, for example the SiO2 (not shown) is used for the electrical isolation between LED wafer and substrate.If needed, other device can be installed in the circuit on the substrate 101 or on substrate 101 112.For example, the Electrostatic Discharge holding circuit can be installed on substrate 101.
Fig. 4 is the figure that is similar to Fig. 1, and shows the illumination intensity of the device with three LED, wherein LED for example shown in Figure 3, have dissimilar secondary optics.Fig. 4 has been shown in broken lines the illumination intensity of each LED, shows the summation of illumination intensity with solid line.For ease of relatively, show the illumination intensity of conventional apparatus with dot-and-dash line 12.
Shown in the curve among Fig. 4 122, a LED comprises and is created in the optics that the center has peaked illumination, and has high relatively collimation, and for example, 94% of the light that sends from a LED arrives scene.Shown in curve 124 and 126, the optics relevant with other two LED produces has such lighting pattern, and its maximum intensity is around the maximum intensity of the light distribution patterns that is produced by a LED (for example, curve 122).Lighting pattern shown in the curve 124 and 126, that produced by the second and the 3rd LED can have annular, square, oval or shape that other is suitable.Distribution patterns shown in the curve 126, that produced by the 3rd LED has also to the maximum intensity of small part around the distribution patterns (shown in the curve 124) that is produced by the 2nd LED.In addition, the distribution patterns shown in the curve 124 and 126 also has high collimation, and for example, 59% and 41% of the light that sends from other two LED arrives scene respectively.Curve 128 shows the summation of the illumination intensity of three LED.Because the high collimation of the light that sends from LED is compared with (it is to be approximately 40%) in the legacy system, more the light of volume (for example, being approximately 62%) arrives scene.
Employing shown in Fig. 3 A, 3B and 4, an important advantage with LED of the different optical that produces collimated light is, need less electric current to realize the illumination intensity identical with legacy system, in other words, use the electric current identical can realize higher illumination level with legacy system.In this example, use legacy system to obtain, obtain by operate all three LED with maximum current by the illumination profile shown in the curve 12 with three identical lens.On the other hand,, and can produce by the illumination intensity shown in curve 124 and 126 when two LED operate with 70% maximum current in addition can producing illumination intensity when only 46% maximum current is operated at a LED by curve 122 explanation.As can seeing from Fig. 4, although operate LED with the electric current that has reduced, by shown in the curve 128, resulting general ambient light intensity is approximate with by with the legacy system generation of maximum current operation, identical by the illumination intensity shown in the curve 12.Therefore, when comparing aspect lux (Lux) average in the field in the per unit watts, this means as shown in Figure 4 more effective 1.5 times of the present invention than legacy system.Therefore, use embodiments of the invention, can save battery electric power.
In another embodiment of the present invention, can utilize variable driver current to come independent addressing LED102,104 and 106, to control the light intensity that is produced.In this way, can produce different light distribution patterns as required.
In one embodiment, LED is connected to main current driver, and uses current regulator that separates and the on/off switch that is used for each LED to control LED discretely.Replacedly, variable driver circuit comprises the adjustable current driver of a plurality of separation.The adjustable current driver of each separation is connected to and controls one or more LED.In general, according to the disclosure, being designed for independent control through the electric current of a plurality of LED, to adjust the variable current driver circuit of the illumination intensity that is produced by each LED, is in those skilled in the art's limit of power.
Fig. 5 shows the synoptic diagram of an embodiment of the device 150 with the variable current driver circuit 160 that is connected to LED wafer 152,154 and 156.Device 150 devices 100 that can be similar to as shown in Figure 3A wherein utilize variable current driver circuit 160 independently to control each LED in addition.As shown in Figure 5, device 150 comprises restrictor and charger 157, energy storage circuit 158 (as battery, capacitor or ultra-capacitor) and step-up driver 159.Step-up driver 159 is coupled to the anode and the negative electrode of LED wafer 152,154 and 156 by the circuit in the variable current driver circuit 160 162, with forward (forward) voltage of guaranteeing to provide suitable.The control circuit 164 that is shown as the part of variable current driver circuit 160 is connected to LED 152,154 and 156 via control element 166,167 and 168 respectively, and controls the electric current that passes through LED 152,154 and 156 respectively independently.For example, control circuit 164 can be the controller that is provided with in the CPU of mobile phone (or other is used) itself.For example, control element 166,167,168 can be to have FET operational amplifier and reference resistor, that make it possible to carry out active electric current control, but certainly, if needed, can use other circuit.The circuit component that the magnitude of current of circuit is flow through in change or control is known.For example, can use electronic switch or programmable driver, for example the I2C interface.Control circuit 164 can detect the state of another element (as magazine lens 170), and in response, appropriate signals is offered control element 166,167 and 168, with the flow through magnitude of current of LED of adjustment.
Although should be understood that each LED 152,154 and 156 is depicted as is independently controlled respectively by the control element 166,167 and 168 that separates, can surpass one LED by each variable driver current elements control.For example, LED 154 can be controlled by identical control element with 156.Replacedly, a plurality of LED can be controlled by each control element, and for example, a plurality of LED that produce same or similar smooth distribution patterns can be controlled by identical control element.
Fig. 6 to 10 shows the operation of the device with a plurality of LED wafers, and wherein each LED wafer has dissimilar lens, and is controlled by variable driver current elements independently.Yet opposite with three LED shown in Figure 5 for simplicity, Fig. 6 to 10 shows have two LED device of (for example, LED 152 and 154).According to the disclosure, those skilled in the art will know according to the operation embodiment of the invention, that have the device of three or more LED.
Fig. 6 and 7 shows respectively with respect to angle of distribution, with the LED 152 of arbitrary unit and 154 illumination intensity.As can be seeing in Fig. 6 and 7, lens on the LED 152 are created on the center and have strong relatively peak value, but the lighting pattern that sharply descends in edge, and the lens on the LED 154 generate the lighting pattern of annular, it is called as batswing tab light distribution patterns sometimes.
From the lighting pattern of LED 152 and LED 154 and change the illumination intensity (for example, being undertaken) of LED 152 and 154, can produce different lighting patterns by combination by changing electric current via variable current drive element 162 and 164.For example, as shown in Figure 8, by respectively shown in curve 202 and 204, provide the 154 more electric currents than LED to LED 152, produce the combined illumination pattern with strong central peak and relative little illuminated field, it is shown in curve 206.When expecting that irradiation is positioned at the object of relative distant place, for example when camera flash was carried out in long focus lens expectation, this lighting pattern may be especially favourable.In one embodiment, do not provide electric current, and provide all available battery currents, to produce the illumination that only has strong central peak to LED 152 to LED 154.
Replacedly, by shown in each curve 212 and 214 among Fig. 9, provide approximately uniform electric current to LED 152 and LED 154, produce the lighting pattern of relative equilibrium, it is shown in curve 216.When " normally " lens condition (that is, not using long Jiao also not use wide-angle) is used flash of light down, this lighting pattern may be especially favourable.
In another configuration, shown in the curve among Figure 10 222 and 224, provide electric current still less respectively than LED 154 to LED 152.The lighting pattern of gained (shown in curve 226) has wide light distribution patterns.For for example wide-angle or microspur performance, this lighting pattern may be especially favourable.
Certainly, other combined illumination pattern is possible.For example, the distribution patterns of near flat is possible,, wherein provides identical illumination intensity on the visual field that is.In addition, if needed, can use only LED, for example produce the LED 152 of strong central peak illumination, focused beam is provided, for example to be used as flashlamp or point-source lamp.Depend on expectation application of the present invention, for example, head lamp on cell phone flash, the automobile or reading lamp or camcorder illuminator, other optimization also is possible.
In addition, should be understood that the method that LED is attached to various lens can change.For example, in one embodiment, device 100 lens 103,105 and 107 can be laid, adhesion or suitably be directly connected to the LED of lower floor, it can be installed in the structure (for example, the cell phone body shown in Figure 11 300) of final application then.Replacedly, lens 103,105 and 107 can be laid, adhesion or be formed on the contrary in the structure of final application (for example, in the cell phone body 300), then, for example, can use adhering material or LED is attached on this structure by hasp (snap) device.
Although described the present invention as the LED matrix of the separation of installing generally on substrate, the present invention can use single monolithic devices.Figure 12 A shows monolithic devices 400 by the mode of example, has formed the array of light emitting diode on it.Device 400 shows 9 light emitting diodes altogether, but if needed, can use more or less device, shown in Figure 12 A, will for example connect/be coupled in together in parallel along the light emitting diode 402 of array girth, and be driven by contact 403.If needed, but all light-emitting diode assemblies 402 of coupled in series.Drive center light-emitting diode assembly 404 discretely by contact 405.Thus, can be independent of the electric current that all the other device electric currents of 402 control to center fixture 404.Produce suitable monolithic devices in the U.S.6547249 that this incorporates into, disclosing in more detail by reference.
Figure 12 B shows the simplification viewgraph of cross-section of the device 400 of the line A-A in Figure 12 A, has wherein added optical element 410.Shown in Figure 12 B, optical element 410 can comprise the separated lens elements 412 and 414 that is respectively applied for different light-emitting diode assembly 402 and 404.In one embodiment, single lens element can be used for all light- emitting diode assemblies 402 and 404, in the case, only passes through in the array variable current of different light-emitting diode assemblies and controls illumination intensity.
Although show the present invention in conjunction with the specific embodiment that instructs purpose, the invention is not restricted to this.Can carry out various reorganizations and modification, and can not depart from the scope of the present invention.In addition, although mainly the present invention is described as the flashlamp that is used for compact camera, the present invention can be used for other and uses, and for example is used for the flashlamp of other types of cameras, perhaps as the stable light source in the application that includes but not limited to flashlamp or point-source lamp.Thereby the spirit and scope of claims should not be limited to above stated specification.

Claims (36)

1, a kind of equipment comprises:
At least one substrate;
First LED wafer and second LED wafer are installed on described at least one substrate; And
Be coupled to optically described first LED wafer the first kind lens and be coupled to the lens of second type of described second LED wafer optically, wherein compare with the light distribution patterns that the lens of described second type produce, the lens of the described first kind are created in the light distribution patterns that the center has the greater strength peak value.
2, equipment as claimed in claim 1, the lens of the wherein said first kind are created in the first smooth distribution patterns that the center has highest luminance intensity and approximate collimation, and the lens of described second type produce the second such distribution patterns, and the highest luminance intensity of this second distribution patterns is around the highest luminance intensity of this first smooth distribution patterns.
3, equipment as claimed in claim 1 is wherein compared with the light distribution patterns that the lens of the described first kind produce, and the lens of described second type produce the light distribution patterns with bigger angle of distribution.
4, equipment as claimed in claim 1, the lens of the lens of the wherein said first kind and described second type are integrally formed.
5, equipment as claimed in claim 1, the lens of the lens of the wherein said first kind and described second type are formed separately.
6, equipment as claimed in claim 1, also comprise the lens that are installed in the 3rd LED wafer on described at least one substrate and are coupled to the 3rd type of described the 3rd LED wafer optically, wherein compare with the light distribution patterns that the lens of described the 3rd type produce, the lens of the described first kind are created in the light distribution patterns that the center has the greater strength peak value.
7, equipment as claimed in claim 1, wherein said at least one substrate comprises first substrate and second substrate, described first LED wafer is installed to described first substrate, and described second LED wafer is installed to described second substrate.
8, equipment as claimed in claim 1, also comprise a plurality of additional LED wafer that is installed to described at least one substrate and the lens that are coupled to one or more types of described a plurality of additional LED wafers, wherein compare with the light distribution patterns that the lens of the described one or more types that are coupled to described a plurality of additional LED wafers produce, the lens of the described first kind are created in the light distribution patterns that the center has the greater strength peak value.
9, equipment as claimed in claim 1, also comprise at least one the variable driver current circuit that electrically is coupled in described first LED wafer and described second LED wafer, described variable driver current circuit provides electric current, and this electric current can change to change described first LED wafer that described variable driver current circuit electrically is coupled to and at least one the illumination intensity in described second LED wafer.
10, equipment as claimed in claim 9, wherein said variable driver current circuit provides first variable current to described first LED wafer, to change the illumination intensity of the light that produces by described first LED wafer, and provide second variable current to described second LED wafer, to change the illumination intensity of the light that produces by described second LED wafer.
11, equipment as claimed in claim 9, wherein said variable driver current circuit comprise first variable driver current elements that electrically is coupled to described first LED wafer and the control circuit that electrically is coupled to second variable driver current elements of described second LED wafer and electrically is coupled to described first variable driver current elements and described second variable driver current elements.
12, equipment as claimed in claim 9, at least one in described first LED wafer and described second LED wafer of wherein said variable driver current circuit provides pulse current, to produce sparkle of illumination.
13, equipment as claimed in claim 9, also comprise adjustable lens, wherein said variable driver current circuit is coupled to described adjustable lens, and changes at least one the electric current that flows in described first LED wafer and described second LED wafer in response to the adjustment of described adjustable lens.
14, equipment as claimed in claim 1, wherein said substrate is included on the surface of described at least one substrate or in inner at least one metal that forms of described at least one substrate, one of wherein said a plurality of LED wafers are electrically connected to described metal.
15, equipment as claimed in claim 1, in wherein said first LED wafer and described second LED wafer at least one is the upside-down mounting type, have a plurality of electric contacts on the bottom surface, wherein said a plurality of electric contacts are between described at least one substrate and described bottom surface.
16, equipment as claimed in claim 1, also comprise cell phone body, the lens of the lens of the wherein said first kind and described second type are coupled to described cell phone, and wherein said substrate, described first LED wafer and described second LED wafer are coupled to described cell phone, so as the optics of lens that is coupled to described first LED wafer and described second type optically of the described first kind be coupled to described second LED wafer.
17, a kind of method comprises:
Produce light from first LED wafer;
Use first lens be associated with described first LED wafer, be created on the first smooth distribution patterns that the center has maximum intensity;
Produce light from second LED wafer; And
Use second lens be associated with described second LED wafer, generate the second smooth distribution patterns that its maximum intensity centers on the maximum intensity of the described first smooth distribution patterns;
Wherein make up the described first smooth distribution patterns and the described second smooth distribution patterns, to produce the light distribution patterns of combination.
18, method as claimed in claim 17 also comprises:
Produce light from the 3rd LED wafer; And
Use the 3rd lens be associated with described the 3rd LED wafer, generate the 3rd smooth distribution patterns that its maximum intensity centers on the maximum intensity of the described second smooth distribution patterns at least in part;
Wherein make up the described the 3rd smooth distribution patterns and the described first smooth distribution patterns and the described second smooth distribution patterns, to produce the light distribution patterns of described combination.
19, method as claimed in claim 17, wherein said first lens and described second lens are integrally formed.
20, method as claimed in claim 17, wherein said first lens and described second lens are formed separately.
21, method as claimed in claim 17, wherein, carry out from described first LED wafer producing light and producing light from described second LED wafer by providing the electric current that lacks than maximum current to described first LED wafer and described second LED wafer.
22, method as claimed in claim 17 also comprises change at least one electric current that provides in described first LED wafer and described second LED wafer, to change the light distribution patterns of described combination.
23, method as claimed in claim 22 wherein in response to the adjustment of magazine adjustable lens, is carried out the change electric current.
24, method as claimed in claim 17 wherein produces light and has produced sparkle of illumination from described second LED wafer generation light from described first LED wafer.
25, a kind of method comprises:
At least one substrate is provided;
On described at least one substrate, locate and install a plurality of LED wafers;
A plurality of lens are provided, and wherein each lens produces different light distribution patterns; And
Described a plurality of LED wafer optics are coupled to described a plurality of lens, so that each lens in described a plurality of lens align with corresponding LED wafer.
26, method as claimed in claim 25 comprises also the variable driver current circuit is coupled to described a plurality of LED wafer that wherein at least one LED wafer is coupled to described variable driver current circuit, to receive variable current.
27, method as claimed in claim 26, wherein at least the first LED wafer and second LED wafer are coupled to described variable driver current circuit, to receive different variable currents, wherein said variable driver current circuit provides different variable currents, to change the illumination intensity that is produced by described first LED wafer and described second LED wafer.
28, method as claimed in claim 25, wherein said a plurality of lens are to form separately.
29, method as claimed in claim 25, wherein said a plurality of lens are integrally formed.
30, method as claimed in claim 25, wherein said a plurality of lens are coupled to a structure, and wherein described a plurality of LED wafers being coupled to described a plurality of lens optically comprises: described a plurality of LED wafers are installed to described structure, so that described a plurality of LED wafer aligns with described a plurality of lens.
31, method as claimed in claim 25 is wherein compared with the second smooth distribution patterns, and the first smooth distribution patterns has the peak value in the center greater strength.
32, a kind of method comprises:
Produce light from first LED wafer;
Use the lens be associated with described first LED wafer, be created on the first smooth distribution patterns that the center has maximum intensity;
Produce light from least one additional LED wafer; And
Use the lens that are associated with described at least one additional LED wafer, generate the second smooth distribution patterns of its maximum intensity around the maximum intensity of the described first smooth distribution patterns;
Wherein make up the described first smooth distribution patterns and the described second smooth distribution patterns, to produce the light distribution patterns of combination.
33, method as claimed in claim 32, wherein identical lens are associated with described first LED wafer and described at least one LED wafer.
34, method as claimed in claim 32, wherein the lens of Fen Liing are associated with described first LED wafer and described at least one LED wafer.
35, method as claimed in claim 32, wherein, carry out from described first LED wafer producing light and producing light from described at least one additional LED wafer by providing the electric current that lacks than maximum current to described first LED wafer and described second LED wafer.
36, method as claimed in claim 32 also comprises at least one electric current that provides in described first LED wafer and described at least one additional LED wafer of change, to change the light distribution patterns of described combination.
CN2006800399848A 2005-10-25 2006-10-13 Multiple light emitting diodes with different secondary optics Expired - Fee Related CN101297238B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/260,713 2005-10-25
US11/260,713 US7461948B2 (en) 2005-10-25 2005-10-25 Multiple light emitting diodes with different secondary optics
PCT/IB2006/053770 WO2007049176A1 (en) 2005-10-25 2006-10-13 Multiple light emitting diodes with different secondary optics

Publications (2)

Publication Number Publication Date
CN101297238A true CN101297238A (en) 2008-10-29
CN101297238B CN101297238B (en) 2011-08-03

Family

ID=37845265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800399848A Expired - Fee Related CN101297238B (en) 2005-10-25 2006-10-13 Multiple light emitting diodes with different secondary optics

Country Status (6)

Country Link
US (1) US7461948B2 (en)
EP (1) EP1943560A1 (en)
JP (1) JP2007180520A (en)
CN (1) CN101297238B (en)
TW (1) TW200728885A (en)
WO (1) WO2007049176A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102084854A (en) * 2009-11-09 2011-06-08 日亚化学工业株式会社 Fishing lamp
US8246200B2 (en) 2009-09-09 2012-08-21 Foxsemicon Integrated Technology, Inc. Illumination device
CN102954406A (en) * 2011-08-15 2013-03-06 通用电气公司 LED light module for backlighting
CN103109126A (en) * 2010-04-09 2013-05-15 欧司朗股份有限公司 Lighting device
CN103797781A (en) * 2011-09-13 2014-05-14 高智83基金会有限责任公司 Zoom flash with no moving parts
CN103969920A (en) * 2013-02-04 2014-08-06 英飞凌科技奥地利有限公司 Spatial intensity distribution controlled flash
CN105627171A (en) * 2016-03-07 2016-06-01 欧普照明股份有限公司 Optical element, light sources module and lighting device
CN110320728A (en) * 2019-07-09 2019-10-11 林璧光 A kind of light-emitting angle can multi-gear adjustment LED photography luminaire

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1689148B1 (en) * 2005-02-03 2009-04-01 Sony Ericsson Mobile Communications AB An optical device
KR100649765B1 (en) * 2005-12-21 2006-11-27 삼성전기주식회사 Led package and back light unit using the same
US8434912B2 (en) 2006-02-27 2013-05-07 Illumination Management Solutions, Inc. LED device for wide beam generation
WO2007100837A2 (en) * 2006-02-27 2007-09-07 Illumination Management Solutions, Inc. An improved led device for wide beam generation
TWI288281B (en) * 2006-08-15 2007-10-11 Au Optronics Corp Backlight source
KR101266490B1 (en) 2006-09-08 2013-05-23 삼성디스플레이 주식회사 Backlight assembly and liquid crystal display having the same
US7896521B2 (en) * 2007-05-04 2011-03-01 Abl Ip Holding Llc Adjustable light distribution system
CA2684214C (en) 2007-05-21 2012-04-17 Illumination Management Solutions, Inc. An improved led device for wide beam generation and method of making the same
DE102007046339A1 (en) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Light source with variable emission characteristics
US8136961B2 (en) * 2007-11-28 2012-03-20 Global Oled Technology Llc Electro-luminescent area illumination device
JP5451634B2 (en) * 2007-12-18 2014-03-26 コーニンクレッカ フィリップス エヌ ヴェ Photonic crystal LED
JP2009266434A (en) * 2008-04-22 2009-11-12 Koito Mfg Co Ltd Light source module and lighting fixture for vehicle
MX2011001685A (en) 2008-08-14 2011-08-17 Cooper Technologies Co Led devices for offset wide beam generation.
US20110187284A1 (en) * 2008-10-15 2011-08-04 Jiayou Liu Apparatus and method capable of changing illumination region
ES2339209B1 (en) * 2008-11-10 2011-03-28 Lledo Iluminacion S.A. MOBILE OPTICAL SYSTEM THAT ALLOWS TO MODIFY THE BEAM COMING FROM A LINEAR LED STRIP BY LONGITUDINAL DISPLACEMENT OF THE OPTICAL SYSTEM.
WO2010065663A2 (en) 2008-12-03 2010-06-10 Illumination Management Solutions, Inc. An led replacement lamp and a method of replacing preexisting luminaires with led lighting assemblies
US8317369B2 (en) * 2009-04-02 2012-11-27 Abl Ip Holding Llc Light fixture having selectively positionable housing
EP2449540A1 (en) * 2009-06-30 2012-05-09 Siemens Aktiengesellschaft Method and device for monitoring road traffic
US8622569B1 (en) 2009-07-17 2014-01-07 Musco Corporation Method, system and apparatus for controlling light distribution using swivel-mount led light sources
US8662704B2 (en) * 2009-08-14 2014-03-04 U.S. Pole Company, Inc. LED optical system with multiple levels of secondary optics
JP5536615B2 (en) 2009-11-09 2014-07-02 日亜化学工業株式会社 Fish light
WO2011066421A2 (en) 2009-11-25 2011-06-03 Cooper Technologies Company Systems, methods, and devices for sealing led light sources in a light module
US20110149560A1 (en) * 2009-12-23 2011-06-23 Ivus Industries, Llc System and method for interfacing portable hand-held devices
CN102918662B (en) * 2010-05-31 2015-11-25 日亚化学工业株式会社 Light-emitting device and manufacture method thereof
US8616728B2 (en) 2010-08-19 2013-12-31 Micron Technology, Inc. Array solid state lighting device package
US8388198B2 (en) 2010-09-01 2013-03-05 Illumination Management Solutions, Inc. Device and apparatus for efficient collection and re-direction of emitted radiation
US20120135387A1 (en) * 2010-11-29 2012-05-31 Stage Front Presentation Systems Dental educational apparatus and method
EP2490439B1 (en) * 2011-02-18 2013-07-03 Axis AB Illumination device for a monitoring camera
HUE065169T2 (en) 2011-02-28 2024-05-28 Signify Holding Bv Method and system for managing light from a light emitting diode
US9140430B2 (en) 2011-02-28 2015-09-22 Cooper Technologies Company Method and system for managing light from a light emitting diode
US8947527B1 (en) 2011-04-01 2015-02-03 Valdis Postovalov Zoom illumination system
DE102011078572B4 (en) * 2011-07-04 2016-06-02 Osram Gmbh lighting device
EP2769143B1 (en) 2011-10-23 2016-09-21 Martin Professional A/S Illumination device with multi-colored light beam
US20130107524A1 (en) * 2011-11-01 2013-05-02 Ormand Gilbert Anderson, Jr. Light engines for luminaires
WO2013065408A1 (en) * 2011-11-04 2013-05-10 コニカミノルタ株式会社 Led light emitting device, and lens for led light emitting device
JP6574090B2 (en) * 2012-01-17 2019-09-11 ルミレッズ ホールディング ベーフェー Semiconductor light-emitting element lamp that emits light at a large angle
JP2013211198A (en) * 2012-03-30 2013-10-10 Mitsubishi Chemicals Corp Luminaire
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
US9080739B1 (en) 2012-09-14 2015-07-14 Cooper Technologies Company System for producing a slender illumination pattern from a light emitting diode
US9200765B1 (en) 2012-11-20 2015-12-01 Cooper Technologies Company Method and system for redirecting light emitted from a light emitting diode
EP3052858B1 (en) 2013-10-05 2018-04-25 Martin Professional ApS Illumination device with spinning zoom lens
US9195281B2 (en) 2013-12-31 2015-11-24 Ultravision Technologies, Llc System and method for a modular multi-panel display
CN106462033A (en) * 2014-06-17 2017-02-22 皇家飞利浦有限公司 A flash module containing an array of reflector cups for phosphor-converted leds
US9625119B2 (en) * 2014-07-31 2017-04-18 Excelitas Canada, Inc. Non-uniform lens array for illumination profile modification
US9699865B2 (en) * 2015-09-03 2017-07-04 Milwaukee Electric Tool Corporation Spotlight and method of controlling thereof
DE202016008588U1 (en) * 2015-10-23 2018-07-18 Opple Lighting Co. Ltd. Lens combination and this comprehensive lighting device
CN108386817B (en) * 2015-10-23 2020-05-01 欧普照明股份有限公司 Lens combination and lighting device using same
TWI576631B (en) * 2015-11-19 2017-04-01 晶睿通訊股份有限公司 Light emitting device and image surveillance apparatus thereof
KR102608421B1 (en) * 2016-02-23 2023-12-01 삼성디스플레이 주식회사 Display apparatus
KR102427049B1 (en) * 2016-05-19 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Flash module and Mobile Device
US10400994B2 (en) 2016-12-19 2019-09-03 Whelen Engineering Company, Inc. LED illumination module with fixed optic and variable emission pattern
US10420177B2 (en) 2016-12-19 2019-09-17 Whelen Engineering Company, Inc. LED illumination module with fixed optic and variable emission pattern
US10845026B2 (en) 2016-12-29 2020-11-24 Lumileds Llc Lighting device including a transparent structure with groups of diffusing lenslets on an emission surface having a different aspect ratio
WO2018122059A1 (en) * 2016-12-29 2018-07-05 Lumileds Holding B.V. Lighting device including a transparent structure
DE102017103882A1 (en) 2017-02-24 2018-08-30 Osram Opto Semiconductors Gmbh Method of operating a camera system and camera system
WO2019084247A1 (en) * 2017-10-25 2019-05-02 Lumileds Llc Source sensitive optic with reconfigurable chip-on-board light emitting diode array
JP7132502B2 (en) * 2018-03-09 2022-09-07 日亜化学工業株式会社 Light source device
US10770632B2 (en) * 2018-03-09 2020-09-08 Nichia Corporation Light source device
JP7206628B2 (en) * 2018-04-27 2023-01-18 セイコーエプソン株式会社 Light-emitting device and projector
KR20200037628A (en) * 2018-10-01 2020-04-09 삼성전자주식회사 Display apparatus and manufacturing method for the same
US11168875B2 (en) * 2019-08-30 2021-11-09 Xiamen Eco Lighting Co. Ltd. Downlight apparatus
US20220034497A1 (en) * 2020-02-18 2022-02-03 Exposure Illumination Architects, Inc. Light emitting heat dissipating structure
IT202000003566A1 (en) * 2020-02-20 2021-08-20 Arianna S P A LED LIGHTING APPLIANCE
EP4153454A1 (en) 2020-05-18 2023-03-29 Lumileds LLC Adapting drive current for emitters based on characteristics of a cover
EP4166844A1 (en) * 2021-10-13 2023-04-19 Top Victory Investments Limited Lighting module and light projecting device including the same
WO2023101825A1 (en) * 2021-12-01 2023-06-08 Lumileds Llc Led die having centrally peaked surface luminance

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58162185U (en) * 1982-04-23 1983-10-28 ロ−ム株式会社 light emitting diode display device
JPH02962Y2 (en) * 1984-09-27 1990-01-11
JPH0744029Y2 (en) * 1990-12-28 1995-10-09 株式会社小糸製作所 LED module
JPH07211943A (en) * 1994-01-25 1995-08-11 Nikon Corp Light source device
US5896093A (en) * 1998-04-03 1999-04-20 Sjobom; Fritz C. L.E.D. light assembly for traffic arrowboards
US6885035B2 (en) * 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
AU2001245787A1 (en) * 2000-03-17 2001-10-03 Zograph, Llc High acuity lens system
US6547249B2 (en) * 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
US7331681B2 (en) * 2001-09-07 2008-02-19 Litepanels Llc Lighting apparatus with adjustable lenses or filters
US6773139B2 (en) * 2001-09-17 2004-08-10 Gelcore Llp Variable optics spot module
JP4168617B2 (en) * 2001-10-03 2008-10-22 カシオ計算機株式会社 Flash device for imaging device, imaging device with flash device, and imaging method
JP2003114463A (en) * 2001-10-03 2003-04-18 Casio Comput Co Ltd Imaging device with flashing function and method of controlling light emission of imaging device
JP4366923B2 (en) * 2002-04-10 2009-11-18 日亜化学工業株式会社 Lighting device and control method thereof
JP3923867B2 (en) * 2002-07-26 2007-06-06 株式会社アドバンスト・ディスプレイ Planar light source device and liquid crystal display device using the same
JP2004071409A (en) * 2002-08-07 2004-03-04 Denso Corp Vehicular lighting fixture and light distribution control method for same
JP2004135177A (en) * 2002-10-11 2004-04-30 Sharp Corp Cellular phone
DE60318611T2 (en) * 2002-11-05 2008-06-05 Matsushita Electric Industrial Co., Ltd., Kadoma Light emitting diode
JP2004191446A (en) * 2002-12-09 2004-07-08 Showa Electric Wire & Cable Co Ltd Led dot matrix
JP2004193451A (en) * 2002-12-13 2004-07-08 Citizen Electronics Co Ltd Light emitting diode
JP2004199891A (en) * 2002-12-16 2004-07-15 Matsushita Electric Works Ltd Luminaire
JP2004253436A (en) * 2003-02-18 2004-09-09 Citizen Electronics Co Ltd Light emitting diode
JP2004317891A (en) * 2003-04-17 2004-11-11 Nec Saitama Ltd Mobile electronic equipment with camera
US7237924B2 (en) * 2003-06-13 2007-07-03 Lumination Llc LED signal lamp
JP2005017349A (en) * 2003-06-23 2005-01-20 Kyocera Corp Mobile information terminal having led flash function
JP4079840B2 (en) * 2003-06-30 2008-04-23 Ｎｅｃインフロンティア株式会社 Bar code reader and POS system
JP2005148200A (en) * 2003-11-12 2005-06-09 Pentax Corp Light quantity controller for photography
TWI263356B (en) * 2003-11-27 2006-10-01 Kuen-Juei Li Light-emitting device
JP2005215635A (en) * 2004-02-02 2005-08-11 Fujinon Corp Light emitting apparatus and photographing apparatus
US7553051B2 (en) * 2004-03-18 2009-06-30 Brasscorp Limited LED work light
JP2005274635A (en) * 2004-03-23 2005-10-06 Nec Access Technica Ltd Light lens holding structure for camera of mobile terminal
JP2006010745A (en) * 2004-06-22 2006-01-12 Sony Corp Illuminator
US7404652B2 (en) * 2004-12-15 2008-07-29 Avago Technologies Ecbu Ip Pte Ltd Light-emitting diode flash module with enhanced spectral emission
US7284871B2 (en) * 2005-08-08 2007-10-23 Avago Technologies Ecb4 Ip (Singapore) Pte Ltd Light-emitting diode module for flash and auto-focus application

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8246200B2 (en) 2009-09-09 2012-08-21 Foxsemicon Integrated Technology, Inc. Illumination device
CN102084854A (en) * 2009-11-09 2011-06-08 日亚化学工业株式会社 Fishing lamp
CN102084854B (en) * 2009-11-09 2015-03-18 日亚化学工业株式会社 Fishing lamp
CN103109126A (en) * 2010-04-09 2013-05-15 欧司朗股份有限公司 Lighting device
US9068737B2 (en) 2010-04-09 2015-06-30 CSRAM GmbH Lighting device
CN103109126B (en) * 2010-04-09 2015-11-25 欧司朗股份有限公司 Lighting device
CN102954406A (en) * 2011-08-15 2013-03-06 通用电气公司 LED light module for backlighting
CN103797781A (en) * 2011-09-13 2014-05-14 高智83基金会有限责任公司 Zoom flash with no moving parts
CN103969920A (en) * 2013-02-04 2014-08-06 英飞凌科技奥地利有限公司 Spatial intensity distribution controlled flash
CN103969920B (en) * 2013-02-04 2018-12-11 英飞凌科技奥地利有限公司 The flash lamp of spatial intensity distribution control
CN105627171A (en) * 2016-03-07 2016-06-01 欧普照明股份有限公司 Optical element, light sources module and lighting device
CN110320728A (en) * 2019-07-09 2019-10-11 林璧光 A kind of light-emitting angle can multi-gear adjustment LED photography luminaire

Also Published As

Publication number Publication date
TW200728885A (en) 2007-08-01
US7461948B2 (en) 2008-12-09
US20070091602A1 (en) 2007-04-26
WO2007049176A1 (en) 2007-05-03
EP1943560A1 (en) 2008-07-16
JP2007180520A (en) 2007-07-12
CN101297238B (en) 2011-08-03

Similar Documents

Publication Publication Date Title
CN101297238B (en) Multiple light emitting diodes with different secondary optics
US8729571B2 (en) Multiple die LED and lens optical system
US10412806B2 (en) Multi-color micro-LED array light source
US7717587B2 (en) Light source device
US10750588B2 (en) Light fixture with dynamically controllable light distribution
US20210091137A1 (en) Light engines with dynamically controllable light distribution
US20160381749A1 (en) Variable-beam light source and related methods
JP2021507530A (en) Segment LED array architecture with reduced phosphor light emitting surface area
TWI742589B (en) Color tunable light emitting diode (led) systems, led lighting systems, and methods
TW201234678A (en) Multi-chip LED devices
US8941335B2 (en) Semiconductor light-emitting element and flash-light device
US20070111347A1 (en) Surface emitting device, manufacturing method thereof and projection display device using the same
US11808444B2 (en) Wide beam angle LED assembly
US20200313053A1 (en) High power led assembly and method of forming a high power led assembly
US10964866B2 (en) LED device, system, and method with adaptive patterns
US20200313057A1 (en) High power led assembly and method of forming a high power led assembly
WO2020205754A1 (en) High power led assembly and method of forming a high power led assembly
WO2024129759A1 (en) Non uniform led placement in rgb multi-optics
WO2024129390A1 (en) Multi-die package with shaped luminance

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110803

Termination date: 20131013